SGLS284F − OCTOBER 2005 − REVISED APRIL 2007
D Qualified for Automotive Applications
D ±3% Output Voltage Variation Across Load
and Temperature
D Load-Dump Protection
D 500-mV Maximum Dropout Voltage at
D
500 mA (3.3-V Option)
Fixed 1.8-V, 2.5-V, and 3.3-V Outputs
Can Be Supported Along With
Major-Change Approval
TLE4274 Alternative
KTT (TO-263) PACKAGE
(TOP VIEW)
OUTPUT
GND
GND
D
D Internal Thermal-Overload Protection
D Internal Overvoltage Protection
D Customer-Specific Configuration Control
INPUT
description/ordering information
The TL760M family of low-dropout regulators offers a variety of fixed-voltage options that offer a maximum
continuous input voltage of 26 V. Utilizing a pnp pass element, these regulators are capable of sourcing 500
mA of current, with a specified maximum dropout of 500 mV (3.3-V and 2.5-V options), making these regulators
ideal for low-voltage applications. Additionally, the TL760M regulators offer very tight output accuracy of ±3%
across operating load and temperature ranges. Other convenient features the regulators provide are internal
overcurrent limiting, thermal-overload protection, and overvoltage protection. The TL760M is load−dump
protected to its maximum operating condition of 45 V. Stability has been optimized for typical automotive
applications and low-cost capacitors. The TL760M family of regulators is available in fixed voltages of 1.8 V,
2.5 V, and 3.3 V.
ORDERING INFORMATION
TJ
−40°C
−40
C to 125
125°C
C
VO
(NOM)
PACKAGE†
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
1.8 V
TO-263 − KTT
Reel of 500
TL760M18QKTTRQ1‡
TL760M18Q1
2.5 V
TO-263 − KTT
Reel of 500
TL760M25QKTTRQ1
TL760M25Q1
3.3 V
TO-263 − KTT
Reel of 500
TL760M33QKTTRQ1
TL760M33Q1
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
‡ Product preview
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerFLEX and PowerPAD are trademarks of Texas Instruments.
Copyright 2007, Texas Instruments Incorporated
!"#$%&'(!$" !) *+%%,"( ') $# -+./!*'(!$" 0'(,1
%$0+*() *$"#$%& ($ )-,*!#!*'(!$") -,% (2, (,%&) $# ,3') ")(%+&,"()
)('"0'%0 4'%%'"(51 %$0+*(!$" -%$*,))!"6 0$,) "$( ",*,))'%!/5 !"*/+0,
(,)(!"6 $# '// -'%'&,(,%)1
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1
SGLS284F − OCTOBER 2005 − REVISED APRIL 2007
absolute maximum ratings over operating virtual junction temperature range (unless otherwise
noted)†
Maximum input voltage, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 V
Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
package thermal data (see Note 1)
PACKAGE
θJA
26.9 C/W
BOARD
TO-263 (KTT)
High K, JESD 51-5
NOTE 1: Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
recommended operating conditions
MIN
VI§
IO
MAX
UNIT
Input voltage
3
26
V
Output current
0
500
mA
−40
125
°C
TJ
Operating virtual junction temperature range
§ Minimum VI is equal to 3 V or VO(max) + 0.6 V, whichever is greater.
TL760M33 electrical characteristics at VI = 6 V, IO = 500 mA, TJ = −40°C to 1255C
(unless otherwise noted)
Output voltage
Current consumption,
Iq = II − IO
Line regulation
Power-supply ripple rejection
Load regulation
Dropout voltage#
TL760M33
TEST CONDITIONS¶
PARAMETER
IO = 5 mA to 500 mA,
VIN = 6 V
VI = 3.8 V to 26 V
IO = 250 mA
IO = 500 mA
VI = 3 V to 28 V
f = 100 Hz,
Vripple = 0.5 VPP,
VI = 6 V
IO = 5 mA to 500 mA
IO = 250 mA
MIN
TYP
MAX
3.2
3.3
3.4
8
15
20
30
10
25
62
5
UNIT
V
mA
mV
dB
30
400
mV
mV
IO = 500 mA
500
¶ Pulse-testing techniques are used to maintain the virtual junction temperature as close to the ambient temperature as possible. Thermal effects
must be taken into account separately. All characteristics are measured with a 0.1-µF capacitor across the input and a 22-µF tantalum capacitor,
with equivalent series resistance of 1.5 Ω on the output.
# Measured when the output voltage, VO, has dropped 100 mV from the nominal value obtained when VI = 6 V
2
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SGLS284F − OCTOBER 2005 − REVISED APRIL 2007
TL760M25 electrical characteristics at VI = 6 V, IO = 500 mA, TJ = −40°C to 1255C
(unless otherwise noted)
Output voltage
Current consumption,
Iq = II − IO
Line regulation
Power-supply ripple rejection
Load regulation
Dropout voltage‡
TL760M25
TEST CONDITIONS†
PARAMETER
IO = 5 mA to 500 mA,
VIN = 6 V
VI = 3 V to 26 V
IO = 250 mA
MIN
TYP
MAX
2.425
2.5
2.575
8
15
20
30
10
25
IO = 500 mA
VI = 3 V to 28 V
f = 100 Hz,
Vripple = 0.5 VPP,
VI = 6 V
62
IO = 5 mA to 500 mA
IO = 250 mA
4
UNIT
V
mA
mV
dB
23
mV
400
mV
IO = 500 mA
500
† Pulse-testing techniques are used to maintain the virtual junction temperature as close to the ambient temperature as possible. Thermal effects
must be taken into account separately. All characteristics are measured with a 0.1-µF capacitor across the input and a 22-µF tantalum capacitor,
with equivalent series resistance of 1.5 Ω on the output.
‡ Measured when the output voltage, VO, has dropped 100 mV from the nominal value obtained when VI = 6 V
TL760M18 electrical characteristics at VI = 6 V, IO = 500 mA, TJ = −40°C to 1255C
(unless otherwise noted)
Output voltage
Current consumption,
Iq = II − IO
Line regulation
Power-supply ripple rejection
Load regulation
Dropout voltage
TL760M18
TEST CONDITIONS†
PARAMETER
IO = 5 mA to 500 mA,
VIN = 6 V
VI = 3 V to 26 V
IO = 250 mA
IO = 500 mA
VI = 3 V to 28 V
f = 100 Hz,
Vripple = 0.5 VPP,
VI = 6 V
IO = 5 mA to 500 mA
IO = 250 mA
MIN
TYP
MAX
1.746
1.8
1.854
8
15
20
30
10
25
62
3
UNIT
V
mA
mV
dB
17
‡
mV
mV
‡
IO = 500 mA
† Pulse-testing techniques are used to maintain the virtual junction temperature as close to the ambient temperature as possible. Thermal effects
must be taken into account separately. All characteristics are measured with a 0.1-µF capacitor across the input and a 22-µF tantalum capacitor,
with equivalent series resistance of 1.5 Ω on the output.
‡ Dropout voltage is limited by the input voltage range, with minimum VI = 3 V.
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SGLS284F − OCTOBER 2005 − REVISED APRIL 2007
COMPENSATION-CAPACITOR SELECTION INFORMATION
The TL760M is a low-dropout regulator. This means that the capacitance loading is important to the performance of
the regulator because it is a vital part of the control loop. The capacitor value and the equivalent series resistance
(ESR) both affect the control loop and must be defined for the load range. Figure 1 can be used to establish the
capacitance value and ESR range for the best regulator performance.
TL760Mxx
ESR OF OUTPUT CAPACITOR
vs
LOAD CURRENT
10
ESR − Equivalent Series Resistance − Ω
9
CQ = 10 µF
Region of
Instability
8
7
6
Region of
Stability
5
4
3
2
Region of
Instability
1
0
0.2
1
10
100
500
IL − Load Current − mA
Figure 1
typical application schematic
TL760M33
INPUT
OUTPUT
VO = 3.3 V
GND
6V
0.1 µF
10 µF
Figure 2
4
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SGLS284F − OCTOBER 2005 − REVISED APRIL 2007
TYPICAL CHARACTERISTICS
OUTPUT VOLTAGE
vs
JUNCTION TEMPERATURE
(M33 VERSION)
3.5
OUTPUT VOLTAGE
vs
JUNCTION TEMPERATURE
(M25 VERSION)
ÎÎÎ
ÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
2.7
VI = 6 V
2.6
VO – Output Voltage – V
VO – Output Voltage – V
3.4
VI = 6 V
3.3
3.2
3.1
2.5
2.4
2.3
2.2
3
2.9
−40
0
40
80
120
2.1
−40
160
0
TJ − Junction Temperature − °C
40
Figure 3
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎ
3.5
Iq – Input Current – mA
VO – Output Voltage – V
3
1.9
1.85
1.8
1.75
1.7
1.65
1.6
−40
160
INPUT CURRENT
vs
INPUT VOLTAGE
(M33 VERSION)
VI = 6 V
1.95
120
Figure 4
OUTPUT VOLTAGE
vs
JUNCTION TEMPERATURE
(M18 VERSION)
2
80
TJ − Junction Temperature − °C
RL = 3.3 kΩ
TJ = 25°C
2.5
2
1.5
1
0.5
0
0
40
80
120
160
–0.5
−50 −40 −30 −20 −10
TJ − Junction Temperature − °C
0
10
20
30
40
50
VI − Input Voltage – V
Figure 6
Figure 5
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SGLS284F − OCTOBER 2005 − REVISED APRIL 2007
TYPICAL CHARACTERISTICS
INPUT CURRENT
vs
INPUT VOLTAGE
(M25 VERSION)
INPUT CURRENT
vs
INPUT VOLTAGE
(M18 VERSION)
ÎÎÎÎÎ
ÎÎÎÎÎ
5
5
RL = 3.3 kΩ
TJ = 25°C
4.5
4
4
3.5
3.5
Iq – Input Current – mA
Iq – Input Current – mA
4.5
3
2.5
2
1.5
1
2.5
2
1.5
1
0.5
0
0
0
10
20
30
40
50
RL = 3.3 kΩ
TJ = 25°C
3
0.5
–0.5
−50 −40 −30 −20 −10
ÎÎÎÎ
ÎÎÎÎ
–0.5
−50 −40 −30 −20 −10
Figure 8
Figure 7
POST OFFICE BOX 655303
10
20
VI − Input Voltage – V
VI − Input Voltage – V
6
0
• DALLAS, TEXAS 75265
30
40
50
PACKAGE OPTION ADDENDUM
www.ti.com
26-Jun-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
TL760M33QKTTRQ1
ACTIVE
DDPAK/
TO-263
KTT
Pins Package Eco Plan (2)
Qty
3
500
Green (RoHS &
no Sb/Br)
Lead/Ball Finish
CU SN
MSL Peak Temp (3)
Level-3-245C-168 HR
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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Addendum-Page 1
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