SN54LVC138A, SN74LVC138A 3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS www.ti.com SCAS291T – MARCH 1993 – REVISED JULY 2005 FEATURES • • • • • • Operate From 1.65 V to 3.6 V Inputs Accept Voltages to 5.5 V Max tpd of 5.8 ns at 3.3 V Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 3.3 V, TA = 25°C Typical VOHV (Output VOH Undershoot) > 2 V at VCC = 3.3 V, TA = 25°C Latch-Up Performance Exceeds 250 mA Per JESD 17 ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101) • BRK BRK 15 3 14 4 5 13 12 6 11 7 10 8 9 B C G2A G2B G1 Y7 16 B A NC VCC Y0 1 2 15 3 14 4 13 5 12 6 11 10 7 8 9 SN54LVC138A . . . FK PACKAGE (TOP VIEW) C G2A NC G2B G1 Y0 Y1 Y2 Y3 Y4 Y5 4 3 2 1 20 19 18 5 17 6 16 7 8 15 14 9 10 11 12 13 Y1 Y2 NC Y3 Y4 Y7 GND NC Y6 Y5 2 VCC Y0 Y1 Y2 Y3 Y4 Y5 Y6 VCC 16 Y6 1 A A B C G2A G2B G1 Y7 GND SN74LVC138A . . . RGY PACKAGE (TOP VIEW) GND SN54LVC138A . . . J OR W PACKAGE SN74LVC138A . . . D, DB, DGV, NS, OR PW PACKAGE (TOP VIEW) NC - No internal connection DESCRIPTION/ORDERING INFORMATION The SN54LVC138A 3-line to 8-line decoder/demultiplexer is designed for 2.7-V to 3.6-V VCC operation, and the SN74LVC138A 3-line to 8-line decoder/demultiplexer is designed for 1.65-V to 3.6-V VCC operation. ORDERING INFORMATION PACKAGE (1) TA QFN – RGY SOIC – D –40°C to 85°C SN74LVC138ARGYR Tube of 40 SN74LVC138AD Reel of 2500 SN74LVC138ADR LC138A LVC138A Reel of 250 SN74LVC138ADT Reel of 2000 SN74LVC138ANSR LVC138A SSOP – DB Reel of 2000 SN74LVC138ADBR LC138A Tube of 90 SN74LVC138APW Reel of 2000 SN74LVC138APWR Reel of 250 SN74LVC138APWT Reel of 2000 SN74LVC138ADGVR TVSOP – DGV VFBGA – GQN VFBGA – ZQN (Pb-free) (1) Reel of 1000 TOP-SIDE MARKING SOP – NS TSSOP – PW –55°C to 125°C ORDERABLE PART NUMBER Reel of 1000 SN74LVC138AGQNR SN74LVC138AZQNR LC138A LC138A LC138A CDIP – J Tube of 25 SNJ54LVC138AJ SNJ54LVC138AJ CFP – W Tube of 150 SNJ54LVC138AW SNJ54LVC138AW LCCC – FK Tube of 55 SNJ54LVC138AFK SNJ54LVC138AFK Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1993–2005, Texas Instruments Incorporated On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters. SN54LVC138A, SN74LVC138A 3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS www.ti.com SCAS291T – MARCH 1993 – REVISED JULY 2005 DESCRIPTION/ORDERING INFORMATION (CONTINUED) The 'LVC138A devices are designed for high-performance memory-decoding or data-routing applications requiring very short propagation delay times. In high-performance memory systems, these decoders minimize the effects of system decoding. When employed with high-speed memories utilizing a fast enable circuit, delay times of these decoders and the enable time of the memory usually are less than the typical access time of the memory. This means that the effective system delay introduced by the decoders is negligible. The conditions at the binary-select inputs and the three enable inputs select one of eight output lines. Two active-low enable inputs and one active-high enable input reduce the need for external gates or inverters when expanding. A 24-line decoder can be implemented without external inverters, and a 32-line decoder requires only one inverter. An enable input can be used as a data input for demultiplexing applications. Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of these devices as translators in a mixed 3.3-V/5-V system environment. GQN OR ZQN PACKAGE (TOP VIEW) TERMINAL ASSIGNMENTS 1 2 3 4 A B A VCC Y0 A B C NC (1) NC (1) Y1 B C G2B G2A Y3 Y2 C D G1 NC (1) NC (1) Y4 D E GND Y7 Y6 Y5 1 2 3 4 E (1) NC - No internal connection SDFGDFGDFG FUNCTION TABLE ENABLE INPUTS 2 SELECT INPUTS OUTPUTS G1 G2A G2B C B A Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7 X H X X X X H H H H H H H H X X H X X X H H H H H H H H L X X X X X H H H H H H H H H L L L L L L H H H H H H H H L L L L H H L H H H H H H H L L L H L H H L H H H H H H L L L H H H H H L H H H H H L L H L L H H H H L H H H H L L H L H H H H H H L H H H L L H H L H H H H H H L H H L L H H H H H H H H H H L SN54LVC138A, SN74LVC138A 3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS www.ti.com SCAS291T – MARCH 1993 – REVISED JULY 2005 LOGIC DIAGRAM (POSITIVE LOGIC) 15 A 1 14 Select Inputs B C 13 3 12 10 Enable Inputs 6 4 G2A G2B Y1 2 11 G1 Y0 9 7 Y2 Y3 Data Outputs Y4 Y5 Y6 Y7 5 Pin numbers shown are for the D, DB, DGV, J, NS, PW, RGY, and W packages. 3 SN54LVC138A, SN74LVC138A 3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS www.ti.com SCAS291T – MARCH 1993 – REVISED JULY 2005 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range –0.5 6.5 V VI Input voltage range (2) –0.5 6.5 V –0.5 VCC + 0.5 range (2) (3) UNIT VO Output voltage IIK Input clamp current VI < 0 –50 mA IOK Output clamp current VO < 0 –50 mA IO Continuous output current ±50 mA ±100 mA Continuous current through VCC or GND D package (4) 73 DB package (4) 82 DGV package (4) θJA Package thermal impedance 120 GQN/ZQN package (4) 78 NS package (4) 64 PW package (4) 108 RGY package (5) Tstg (1) (2) (3) (4) (5) 4 Storage temperature range V °C/W 39 –65 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed. The value of VCC is provided in the recommended operating conditions table. The package thermal impedance is calculated in accordance with JESD 51-7. The package thermal impedance is calculated in accordance with JESD 51-5. SN54LVC138A, SN74LVC138A 3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS www.ti.com SCAS291T – MARCH 1993 – REVISED JULY 2005 Recommended Operating Conditions (1) SN54LVC138A VCC Supply voltage VIH High-level input voltage Operating Data retention only MIN MAX MIN MAX 2 3.6 1.65 3.6 1.5 1.5 VCC = 2.3 V to 2.7 V 1.7 2 Low-level input voltage Input voltage VO Output voltage IOH High-level output current 0.7 0.8 Low-level output current 0 5.5 0 5.5 V 0 VCC 0 VCC V VCC = 1.65 V –4 VCC = 2.3 V –8 VCC = 2.7 V –12 –12 VCC = 3 V –24 –24 (1) Operating free-air temperature mA 4 VCC = 2.3 V 8 mA VCC = 2.7 V 12 12 VCC = 3 V 24 24 10 10 ns/V 85 °C ∆t/∆v Input transition rise or fall rate TA V 0.8 VCC = 1.65 V IOL V 0.35 × VCC VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V VI V 2 VCC = 1.65 V to 1.95 V VIL UNIT 0.65 × VCC VCC = 1.65 V to 1.95 V VCC = 2.7 V to 3.6 V SN74LVC138A –55 125 -40 All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 5 SN54LVC138A, SN74LVC138A 3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS www.ti.com SCAS291T – MARCH 1993 – REVISED JULY 2005 Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS (1) MAX UNIT VCC – 0.2 1.65 V 1.2 IOH = –8 mA 2.3 V 1.7 2.7 V 2.2 2.2 3V 2.4 2.4 3V 2.2 2.2 V 1.65 V to 3.6 V IOL = 100 µA 0.2 2.7 V to 3.6 V 0.2 IOL = 4 mA 1.65 V 0.45 IOL = 8 mA 2.3 V 0.7 IOL = 12 mA 2.7 V 0.4 0.4 IOL = 24 mA 3V 0.55 0.55 3.6 V ±5 ±5 µA 3.6 V 10 10 µA 2.7 V to 3.6 V 500 500 µA II VI = 5.5 V or GND ICC VI = VCC or GND, IO = 0 One input at VCC – 0.6 V, Other inputs at VCC or GND Ci TYP (1) VCC – 0.2 2.7 V to 3.6 V IOH = –24 mA ∆ICC MIN IOH = –4 mA IOH = –12 mA VOL SN74LVC138A TYP (1) MAX MIN 1.65 V to 3.6 V IOH = –100 µA VOH SN54LVC138A VCC VI = VCC or GND 3.3 V 5 5 V pF All typical values are at VCC = 3.3 V, TA = 25°C. Switching Characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) SN54LVC138A FROM (INPUT) PARAMETER TO (OUTPUT) VCC = 2.7 V MIN A or B or C tpd G2A or G2B Y G1 VCC = 3.3 V ± 0.3 V UNIT MAX MIN MAX 7.9 1 6.7 7.4 1 6.5 6.4 1 5.8 ns Switching Characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) SN74LVC138A PARAMETER FROM (INPUT) TO (OUTPUT) A or B or C tpd G2A or G2B G1 tsk(o) 6 Y VCC = 1.8 V ± 0.15 V VCC = 2.5 V ± 0.2 V VCC = 2.7 V VCC = 3.3 V ± 0.3 V UNIT MIN MAX MIN MAX MIN MAX MIN MAX 1 22 1 9.9 1 7.9 1 6.7 1 21 1 9.4 1 7.4 1 6.5 1 20.3 1 8.4 1 6.4 1 5.8 1 ns ns SN54LVC138A, SN74LVC138A 3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS www.ti.com SCAS291T – MARCH 1993 – REVISED JULY 2005 Operating Characteristics TA = 25°C PARAMETER Cpd Power dissipation capacitance TEST CONDITIONS VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V TYP TYP TYP f = 10 MHz 25 26 27 UNIT pF 7 SN54LVC138A, SN74LVC138A 3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS www.ti.com SCAS291T – MARCH 1993 – REVISED JULY 2005 PARAMETER MEASUREMENT INFORMATION VLOAD S1 RL From Output Under Test CL (see Note A) Open GND RL TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open VLOAD GND LOAD CIRCUIT INPUTS VCC 1.8 V ± 0.15 V 2.5 V ± 0.2 V 2.7 V 3.3 V ± 0.3 V VI tr/tf VCC VCC 2.7 V 2.7 V ≤2 ns ≤2 ns ≤2.5 ns ≤2.5 ns VM VLOAD CL RL V∆ VCC/2 VCC/2 1.5 V 1.5 V 2 × VCC 2 × VCC 6V 6V 30 pF 30 pF 50 pF 50 pF 1 kΩ 500 Ω 500 Ω 500 Ω 0.15 V 0.15 V 0.3 V 0.3 V VI Timing Input VM 0V tw tsu VI Input VM VM th VI Data Input VM VM 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VI VM Input VM 0V tPLH VM VM VOL tPHL VM VM 0V Output Waveform 1 S1 at VLOAD (see Note B) tPLH tPLZ VLOAD/2 VM tPZH VOH Output VM tPZL tPHL VOH Output VI Output Control VM VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS Output Waveform 2 S1 at GND (see Note B) VOL + V∆ VOL tPHZ VM VOH − V∆ VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms 8 PACKAGE OPTION ADDENDUM www.ti.com 21-Dec-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 5962-9752601Q2A ACTIVE LCCC FK 20 1 TBD 5962-9752601QEA ACTIVE CDIP J 16 1 TBD 5962-9752601QFA ACTIVE CFP W 16 1 TBD 5962-9752601V2A ACTIVE LCCC FK 20 1 TBD 5962-9752601VEA ACTIVE CDIP J 16 1 TBD 5962-9752601VFA ACTIVE CFP W 16 1 SN74LVC138AD ACTIVE SOIC D 16 40 SN74LVC138ADBLE OBSOLETE SSOP DB 16 SN74LVC138ADBR ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC138ADBRE4 ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC138ADBRG4 ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC138ADE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC138ADG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC138ADGVR ACTIVE TVSOP DGV 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC138ADGVRE4 ACTIVE TVSOP DGV 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC138ADGVRG4 ACTIVE TVSOP DGV 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC138ADR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC138ADRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC138ADRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC138ADT ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC138ADTE4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC138ADTG4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC138AGQNR NRND GQN 20 1000 TBD SNPB Level-1-240C-UNLIM SN74LVC138ANSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC138ANSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC138ANSRG4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC138APW ACTIVE TSSOP PW 16 CU NIPDAU Level-1-260C-UNLIM BGA MI CROSTA R JUNI OR Addendum-Page 1 A42 N / A for Pkg Type A42 N / A for Pkg Type POST-PLATE N / A for Pkg Type A42 N / A for Pkg Type TBD A42 N / A for Pkg Type Green (RoHS & no Sb/Br) CU NIPDAU TBD 90 POST-PLATE N / A for Pkg Type Green (RoHS & no Sb/Br) Call TI Level-1-260C-UNLIM Call TI PACKAGE OPTION ADDENDUM www.ti.com 21-Dec-2009 Orderable Device Status (1) Package Type Package Drawing SN74LVC138APWE4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC138APWG4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC138APWLE OBSOLETE TSSOP PW 16 SN74LVC138APWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC138APWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC138APWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC138APWT ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC138APWTE4 ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC138APWTG4 ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC138ARGYR ACTIVE VQFN RGY 16 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SN74LVC138ARGYRG4 ACTIVE VQFN RGY 16 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SN74LVC138AZQNR ACTIVE ZQN 20 1000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM SNJ54LVC138AFK ACTIVE LCCC FK 20 1 TBD SNJ54LVC138AJ ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type SNJ54LVC138AW ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type BGA MI CROSTA R JUNI OR Pins Package Eco Plan (2) Qty TBD Lead/Ball Finish Call TI MSL Peak Temp (3) Call TI POST-PLATE N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 21-Dec-2009 reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN54LVC138A, SN54LVC138A-SP, SN74LVC138A : SN74LVC138A-Q1 • Automotive: • Enhanced Product: SN74LVC138A-EP NOTE: Qualified Version Definitions: - Q100 devices qualified for high-reliability automotive applications targeting zero defects • Automotive • Enhanced Product - Supports Defense, Aerospace and Medical Applications Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 30-Jul-2010 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 6.6 2.5 12.0 16.0 Q1 SN74LVC138ADBR SSOP DB 16 2000 330.0 16.4 8.2 SN74LVC138ADGVR TVSOP DGV 16 2000 330.0 12.4 6.8 4.0 1.6 8.0 12.0 Q1 SN74LVC138ADR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 SN74LVC138AGQNR BGA MI CROSTA R JUNI OR GQN 20 1000 330.0 12.4 3.3 4.3 1.5 8.0 12.0 Q1 SN74LVC138AGQNR BGA MI CROSTA R JUNI OR GQN 20 1000 330.0 12.4 3.3 4.3 1.6 8.0 12.0 Q1 SN74LVC138ANSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 SN74LVC138APWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 SN74LVC138ARGYR VQFN RGY 16 3000 330.0 12.4 3.8 4.3 1.5 8.0 12.0 Q1 SN74LVC138AZQNR BGA MI CROSTA R JUNI OR ZQN 20 1000 330.0 12.4 3.3 4.3 1.6 8.0 12.0 Q1 SN74LVC138AZQNR BGA MI CROSTA R JUNI ZQN 20 1000 330.0 12.4 3.3 4.3 1.5 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 30-Jul-2010 Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant OR *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LVC138ADBR SSOP DB 16 2000 346.0 346.0 33.0 SN74LVC138ADGVR TVSOP DGV 16 2000 346.0 346.0 29.0 SN74LVC138ADR SOIC D 16 2500 333.2 345.9 28.6 SN74LVC138AGQNR BGA MICROSTAR JUNIOR GQN 20 1000 346.0 346.0 29.0 SN74LVC138AGQNR BGA MICROSTAR JUNIOR GQN 20 1000 340.5 338.1 20.6 SN74LVC138ANSR SO NS 16 2000 346.0 346.0 33.0 SN74LVC138APWR TSSOP PW 16 2000 346.0 346.0 29.0 SN74LVC138ARGYR VQFN RGY 16 3000 346.0 346.0 29.0 SN74LVC138AZQNR BGA MICROSTAR JUNIOR ZQN 20 1000 340.5 338.1 20.6 SN74LVC138AZQNR BGA MICROSTAR JUNIOR ZQN 20 1000 346.0 346.0 29.0 Pack Materials-Page 2 MECHANICAL DATA MLCC006B – OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0°–8° 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. Falls within JEDEC: 24/48 Pins – MO-153 14/16/20/56 Pins – MO-194 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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