SN74F163A SYNCHRONOUS 4-BIT BINARY COUNTER SDFS088A – MARCH 1987 – REVISED AUGUST 2001 D D D D, DB, OR N PACKAGE (TOP VIEW) Internal Look-Ahead Circuitry for Fast Counting Carry Output for N-Bit Cascading Fully Synchronous Operation for Counting CLR CLK A B C D ENP GND description 1 16 2 15 3 14 4 13 5 VCC RCO QA QB QC QD ENT LOAD 12 This synchronous, presettable, 4-bit binary 6 11 counter has internal carry look-ahead circuitry 7 10 for use in high-speed counting designs. 8 9 Synchronous operation is provided by having all flip-flops clocked simultaneously so that the outputs change coincident with each other when so instructed by the count-enable (ENP, ENT) inputs and internal gating. This mode of operation eliminates the output counting spikes that normally are associated with asynchronous (ripple-clock) counters. However, counting spikes can occur on the ripple-carry (RCO) output. A buffered clock (CLK) input triggers the four flip-flops on the rising (positive-going) edge of CLK. This counter is fully programmable. That is, it can be preset to any number between 0 and 15. Because presetting is synchronous, a low logic level at the load (LOAD) input disables the counter and causes the outputs to agree with the setup data after the next clock pulse, regardless of the levels of ENP and ENT. The clear function is synchronous, and a low logic level at the clear (CLR) input sets all four of the flip-flop outputs to low after the next low-to-high transition of the clock, regardless of the levels of ENP and ENT. This synchronous clear allows the count length to be modified easily by decoding the Q outputs for the maximum count desired. The active-low output of the gate used for decoding is connected to the clear input to synchronously clear the counter to 0000 (LLLL). The carry look-ahead circuitry provides for cascading counters for n-bit synchronous applications, without additional gating. This function is implemented by the ENP and ENT inputs and an RCO output. Both ENP and ENT must be high to count, and ENT is fed forward to enable RCO. RCO, thus enabled, produces a high-logic-level pulse while the count is 15 (HHHH). The high-logic-level overflow ripple-carry pulse can be used to enable successive cascaded stages. Transitions at ENP or ENT are allowed, regardless of the level of CLK. The SN74F163A features a fully independent clock circuit. Changes at ENP, ENT, or LOAD that modify the operating mode have no effect on the contents of the counter until clocking occurs. The function of the counter (whether enabled, disabled, loading, or counting) is dictated solely by the conditions meeting the setup and hold times. ORDERING INFORMATION PACKAGE† TA PDIP – N 0°C to 70°C SOIC – D SSOP – DB ORDERABLE PART NUMBER Tube SN74F163AN Tube SN74F163AD Tape and reel SN74F163ADR Tape and reel SN74F163ADBR TOP-SIDE MARKING SN74F163AN F163A F163A † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2001, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SN74F163A SYNCHRONOUS 4-BIT BINARY COUNTER SDFS088A – MARCH 1987 – REVISED AUGUST 2001 state diagram 0 2 3 4 15 5 14 6 13 7 12 2 1 11 POST OFFICE BOX 655303 10 9 • DALLAS, TEXAS 75265 8 SN74F163A SYNCHRONOUS 4-BIT BINARY COUNTER SDFS088A – MARCH 1987 – REVISED AUGUST 2001 logic diagram (positive logic) CLR LOAD ENT ENP 1 9 10 7 15 RCO 3R 14 CLK A 2 3 G2 QA 1, 2T/C3 1, 3D M1 3R 13 G2 QB 1, 2T/C3 B 4 1, 3D M1 3R 12 G2 QC 1, 2T/C3 C 5 1, 3D M1 3R G2 11 QD 1, 2T/C3 D 6 1, 3D M1 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SN74F163A SYNCHRONOUS 4-BIT BINARY COUNTER SDFS088A – MARCH 1987 – REVISED AUGUST 2001 logic symbol, each flip-flop R 3R TE G2 Q1 1, 2T/C3 CLK D Q1 Q2 1, 3D Q2 LOAD M1 logic diagram, each flip-flop (positive logic) R TE (Toggle Enable) Q1 CLK Q2 D LOAD 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN74F163A SYNCHRONOUS 4-BIT BINARY COUNTER SDFS088A – MARCH 1987 – REVISED AUGUST 2001 typical clear, preset, count, and inhibit sequences The following timing sequence is illustrated below: 1. Clear outputs to zero 2. Preset to binary 12 3. Count to 13, 14, 15, 0, 1, and 2 4. Inhibit CLR LOAD A Data Inputs B C D CLK ENP ENT QA Data Outputs QB QC QD RCO 12 13 14 15 0 1 2 Count Inhibit Sync Preset Clear Async Clear POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 SN74F163A SYNCHRONOUS 4-BIT BINARY COUNTER SDFS088A – MARCH 1987 – REVISED AUGUST 2001 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 1.2 V to 7 V Input current range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 30 mA to 5 mA Voltage range applied to any output in the high state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.5 V to VCC Current into any output in the low state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 mA Package thermal impedance, θJA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82°C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input voltage ratings may be exceeded provided the input current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 3) MIN NOM MAX 4.5 5 5.5 UNIT VCC VIH Supply voltage VIL IIK Low-level input voltage 0.8 V Input clamp current –18 mA IOH IOL High-level output current –1 mA Low-level output current 20 mA High-level input voltage 2 V V TA Operating free-air temperature 0 70 °C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK VOH VOL II IIH TEST CONDITIONS VCC = 4.5 V, VCC = 4.5 V, II = – 18 mA IOH = – 1 mA VCC = 4.75 V, VCC = 4.5 V, IOH = – 1 mA IOL = 20 mA VCC = 5.5 V, VCC = 5.5 V, VI = 7 V VI = 2.7 V MIN 2.5 TYP‡ ENT, LOAD 0.3 V 0.5 V 0.1 mA 20 µA – 0.6 VCC = 5.5 V, VI = 0.5 V – 1.2 mA – 1.2 VCC = 5.5 V, VCC = 5.5 V VO = 0 – 60 37 ‡ All typical values are at VCC = 5 V, TA = 25°C. § Not more than one output should be shorted at a time, and the duration of the short circuit should not exceed one second. 6 V 2.7 CLR IOS§ ICC UNIT – 1.2 3.4 ENP, CLK, A, B, C, D IIL MAX POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 –150 mA 55 mA SN74F163A SYNCHRONOUS 4-BIT BINARY COUNTER SDFS088A – MARCH 1987 – REVISED AUGUST 2001 timing requirements over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) VCC = 5 V, TA = 25°C fclock Clock frequency tw Pulse duration CLK high or low (loading) CLK (counting) Data before CLK↑ tsu ENP and ENT before CLK↑ Data after CLK↑ th Hold time LOAD and CLR after CLK↑ ENP and ENT after CLK↑ MAX 0 100 MIN 0 5 5 High 4 4 Low 6 7 High or low LOAD and CLR before CLK↑ Setup time MIN 5 5 High 11 11.5 Low 8.5 9.5 High 11 11.5 Low 5 5 High or low 2 2 High 2 2 Low 0 0 High or low 0 0 MAX UNIT 90 MHz ns ns ns switching characteristics (see Note 4) PARAMETER fmax tPLH FROM (INPUT) TO (OUTPUT) VCC = 5 V, CL = 50 PF, RL = 500 Ω, TA = 25°C MIN TYP MAX VCC = 4.5 V TO 5.5 V, CL = 50 PF, RL = 500 Ω, TA = MIN TO MAX† MIN MAX 100 120 2.7 5.1 7.5 2.7 8.5 2.7 7.1 10 2.7 11 3.2 5.6 8.5 3.2 9.5 3.2 5.6 8.5 3.2 9.5 4.2 9.6 14 4.2 15 4.2 9.6 14 4.2 15 1.7 4.1 7.5 1.7 ENT RCO tPHL 1.7 4.1 7.5 1.7 † For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions. NOTE 4: Load circuits and waveforms are shown in Figure 1. 8.5 tPHL tPLH tPHL tPLH tPHL tPLH CLK (LOAD high) Any Q CLK (LOAD low) Any Q CLK RCO POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 90 UNIT MHz 8.5 ns ns ns ns 7 SN74F163A SYNCHRONOUS 4-BIT BINARY COUNTER SDFS088A – MARCH 1987 – REVISED AUGUST 2001 PARAMETER MEASUREMENT INFORMATION From Output Under Test CL (see Note A) From Output Under Test CL (see Note A) Test Point 500 Ω 7V Open 500 Ω S1 500 Ω TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open Collector Open 7V Open 7V LOAD CIRCUIT FOR 3-STATE AND OPEN-DRAIN OUTPUTS LOAD CIRCUIT FOR TOTEM-POLE OUTPUTS 3V 1.5 V Timing Input 0V tw 3V 1.5 V Input 1.5 V th tsu 3V 1.5 V Data Input 1.5 V 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES 3V 1.5 V Input 1.5 V 0V tPLH In-Phase Output tPHL 1.5 V 1.5 V VOL tPHL Out-of-Phase Output VOH Output Waveform 1 S1 at 7 V (see Note B) 1.5 V VOH 1.5 V VOL 1.5 V 0V tPZL tPLZ ≈3.5 V 1.5 V tPZH tPLH 1.5 V 3V Output Control Output Waveform 2 S1 at GND (see Note B) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS VOL + 0.3 V VOL tPHZ 1.5 V VOH – 0.3 V VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns, duty cycle = 50%. D. The outputs are measured one at a time with one input transition per measurement. Figure 1. Load Circuit and Voltage Waveforms 8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74F163AD ACTIVE SOIC D 16 SN74F163ADBR ACTIVE SSOP DB SN74F163ADBRE4 ACTIVE SSOP SN74F163ADE4 ACTIVE SN74F163ADR 40 Lead/Ball Finish MSL Peak Temp (3) Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SOIC D 16 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F163ADRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F163AN ACTIVE PDIP N 16 CU NIPDAU N / A for Pkg Type 40 25 Pb-Free (RoHS) TBD Call TI 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74F163AN3 OBSOLETE PDIP N 16 SN74F163ANE4 ACTIVE PDIP N 16 Call TI SN74F163ANSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F163ANSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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