Data Sheet February 2000 1.3 µm D2300-Type Laser Isolated DFB Laser Module Features D2 30 0 The 1.3 µm D2300-Type Laser Module is offered in a 14-pin, hermetic, butterfly package. ■ Integrated optical isolator ■ SONET/SDH compatible up to OC-48/STM-16 ■ High-performance, distributed-feedback (DFB) laser ■ High optical power available ■ Industry-standard, 14-pin butterfly package ■ Characterized at 2.488 Gbits/s (NRZ) ■ Wide operating case temperature range: –40 °C to +80 °C ■ InGaAs, PIN photodetector back-facet monitor ■ Low threshold current ■ High reliability ■ Qualified to meet the intent of Telcordia Technologies * 468 * Telcordia Technologies is a trademark of Bell Communications Research, Inc. Applications ■ Telecommunications: — SONET/SDH — Long reach — Interexchange ■ Digital video 1.3 µm D2300-Type Digital Isolated DFB Laser Module Description The D2300-Type Digital Isolated DFB Laser Module contains an internally cooled, InGaAsP, distributedfeedback (DFB) laser designed for 1.3 µm applications. The laser is designed to be used in OC-12/STM-4 (622 Mbits/s) and OC-48/STM-16 (2.488 Gbits/s) for longreach and extended-reach applications. The device is available with an average output power of 0 dBm (3 dBm peak), which meets the SONET/SDH standard. Data Sheet February 2000 Lucent Technologies Microelectronics Group optoelectronic components are qualified to rigorous internal standards that are consistent with Telcordia Technologies TR-NWT-000468. All design and manufacturing operations are ISO * 9001 certified. The module is fully qualified for central office applications. * ISO is a registered trademark of The International Organization for Standardization. Pin Information Pin 1 2 3 4 5 6 7 8 9 10 11 Controlled Feedback The module contains an internal optical isolator that suppresses optical feedback in laser-based, fiber-optic systems. Light reflected back to the laser is attenuated a minimum of 30 dB. Controlled Temperature An integral thermoelectric cooler (TEC) provides stable thermal characteristics. The TEC allows for heating and cooling of the laser chip to maintain a temperature of 25 °C for case temperatures from –40 °C to +80 °C. The laser temperature is monitored by the internal thermistor, which can be used with external circuitry to control the laser chip temperature. Name Thermistor Thermistor Laser dc Bias (cathode) (–) Back-facet Monitor Anode (–) Back-facet Monitor Cathode (+) Thermoelectric Cooler (+)* Thermoelectric Cooler (–)* Case Ground Case Ground Case Ground Laser Anode† (+) RF Laser Input Cathode (–) 12 13 Laser Anode† (+) Case Ground 14 Controlled Power An internal, InGaAs, PIN photodiode functions as the back-facet monitor. The photodiode monitors emission from the rear facet of the laser and, when used in conjunction with control circuitry, can control optical power launched into the fiber. Normally, this configuration is used in a feedback arrangement to maintain the average laser output power. * A positive current through the thermoelectric heat pump cools the laser. † Both leads should be grounded for optimum performance. 7 6 – 2 + 4 3 – 2 TH TEC 10 kΩ R1 20 Ω PACKAGE GROUNDS + 8 9 1 – L1 160 nH Standard Package The laser module is fabricated in a 14-pin, hermetic, metal/ceramic butterfly package. The package also incorporates a bias tee that separates the dc-bias path from the RF input. The RF input has a nominal 25 Ω impedance. The laser module is equipped with a single-mode fiber. The pigtail has an 8 µm core and 125 µm cladding with a 900 µm tight buffer coating. 5 + 10 11 – 12 ISOLATOR + 13 14 1-567 Top view. Figure 1. Circuit Schematic Lucent Technologies Inc. 1.3 µm D2300-Type Digital Isolated DFB Laser Module Data Sheet February 2000 Absolute Maximum Ratings Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess of those given in the performance characteristics of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect device reliability. Parameter Symbol Min Max Unit Laser Reverse Voltage VRLMAX — 2 V dc Forward Current IFLMAX — 150 mA Operating Case Temperature Range TC – 40 80 °C Storage Case Temperature Range* Tstg – 40 85 °C Photodiode Reverse Voltage VRPDMAX — 10 V Photodiode Forward Current IFPDMAX — 1 mA * Does not apply to shipping container. Handling Precautions Mounting Instructions Power Sequencing The minimum fiber bend radius is 1.18 in. (30 mm). To avoid the possibility of damage to the laser module from power supply switching transients, follow this turnon sequence: 1. All ground connections 2. Most negative supply 3. Most positive supply 4. All remaining connections Reverse the order for the proper turn-off sequence. Electrostatic Discharge CAUTION: This device is susceptible to damage as a result of electrostatic discharge. Take proper precautions during both handling and testing. Follow guidelines such as JEDEC Publication No. 108-A (Dec. 1988). Lucent employs a human-body model (HBM) for ESDsusceptibility testing and protection-design evaluation. ESD voltage thresholds are dependent on the critical parameters used to define the model. A standard HBM (resistance = 1.5 kΩ, capacitance = 100 pF) is widely used and, therefore, can be used for comparison purposes. The HBM ESD threshold presented here was obtained using these circuit parameters: To avoid degradation in performance, mount the module on the board as follows: 1. Place the bottom flange of the module on a flat heat sink at least 0.5 in. x 1.180 in. (12.7 mm x 30 mm) in size. The surface finish of the heat sink should be better than 32 µin. (0.8 µm), and the surface flatness must be better than 0.001 in. (25.4 µm). Using thermal conductive grease is optional; however, thermal performance can be improved by up to 5% if conductive grease is applied between the bottom flange and the heat sink. 2. Mount four #2-56 screws with Fillister heads (M2-3 mm) at the four screw-hole locations (see Outline Diagram). The Fillister head diameter must not exceed 0.140 in. (3.55 mm). Do not apply more than 1 in.-lb. of torque to the screws. 0.062 (1.58) 0.118 (3.00) 0.086 (2.18) 0.031 (0.79) 0.140 (3.56) 0.129 (3.28) R 0.041 (1.04) 1-532 Note: Dimensions are in inches and (millimeters). Figure 2. Fillister Head Screw Parameter Value Unit Human-body Model >400 V Lucent Technologies Inc. 3 1.3 µm D2300-Type Digital Isolated DFB Laser Module Data Sheet February 2000 Characteristics Minimum and maximum values are testing requirements. Typical values are characteristics of the device and are the result of engineering evaluations. Typical values are for information purposes only and are not part of the testing requirements. Table 1. Electrical Characteristics (at 25 °C Laser Temperature) Parameter Symbol Test Conditions Min Typ Max Unit VLF LF = 2 mW (CW) — 1.3 1.8 V η LF = 2 mW (CW) 0.025 0.06 — mW/mA ITH — — 15 50 mA Monitor Reverse-bias Voltage* VRMON — 3 5 10 V Monitor Current IRMON PO = 1 mW (CW) 0.1 1.0 2.0 mA Monitor Dark Current ID IF = 0, VRMON = 5 V — 0.01 0.1 µA Input Impedance ZIN — — 25 — Ω Thermistor Current ITC — 10 — 100 µA Resistance Ratio† — — 8.6 — 9.6 — Thermistor Resistance RTH TL = 25 °C 9.5 — 10.5 kΩ TEC Current ITEC TL = 25 °C, TC = 70 °C — — 1.0 A TEC Voltage VTEC TL = 25 °C, TC = 70 °C — — 2.0 V TEC Capacity ∆T TC = 80 °C 55 — — °C Laser Forward Voltage Slope Efficiency Threshold Current * Standard operating condition is 5.0 V reverse bias. † Ratio of thermistor resistance at 0 °C to thermistor resistance at 50 °C. Table 2. Optical Characteristics (at 25 °C Laser Temperature) Parameter Symbol Test Conditions Min Typ Max Unit PPEAK — 2.0 — — mW Center Wavelength λC — 1290 1310 1330 nm Spectral Width: Full Width at –3 dB Full Width at –20 dB ∆λ Modulated at 2.5 Gbits/s at rated power — — 0.20 0.8 0.30 1.0 nm nm Peak Optical Output Power Side-mode Suppression Ratio Optical Isolation 4 SMSR Modulated at 2.5 Gbits/s 30 — — dB — 0 °C to 65 °C 30 — — dB Lucent Technologies Inc. 1.3 µm D2300-Type Digital Isolated DFB Laser Module Data Sheet February 2000 Outline Diagram Dimensions are in inches and (millimeters). Tolerances are ±0.005 in. (±0.127 mm). 1.025 (26.04) PIN 1 0.508 ± 0.008 (12.90 ± 0.2) 0.10 ± 0.002 (0.25 ± 0.064) 0.020 (0.51) TYP TRADEMARK, CODE, LASER SERIAL NUMBER, AND DATE CODE IN APPROX. AREA SHOWN STRAIN RELIEF 0.036 (0.91) 0.500 (12.70) 0.605 0.350 (15.37) (8.89) MAX 0.200 (5.08) 0.078 (1.98) 0.105 (2.67) DIA TYP (4) PLACES PIN 14 0.213 (5.40) TYP 0.100 (2.54) TYP 39.37 (1000.00) MIN 2.03 (51.6) 0.180 (4.56) 0.820 (20.83) 0.700 (17.78) 0.863 (21.91) 0.575 (14.61) 0.10 (2.5) 0.260 (6.60) 0.056 (1.42) 0.365 (9.27) MAX 0.030 (0.75) 1.180 (29.97) HEAT SINK 0.215 (5.47) REF 0.215 (5.45) 1-520.g Lucent Technologies Inc. 5 1.3 µm D2300-Type Digital Isolated DFB Laser Module Data Sheet February 2000 Class IIIb Laser Product FDA/CDRH Class IIIb laser product. All versions are Class IIIb laser products per CDRH, 21 CFR 1040 Laser Safety requirements. All versions are Class IIIb laser products per IEC * 60825-1:1993. The device has been certified with the FDA under accession number 8720010. This product complies with 21 CFR 1040.10 and 1040.11. 8 µm/125 µm single-mode fiber pigtail with 900 µm tight buffer jacket and connector Wavelength = 1.3 µm Maximum power = 10 mW Because of size constraints, labeling is not affixed to the module but is contained in the shipping carton. Product is not shipped with power supply. Caution: Use of controls, adjustments, and procedures other than those specified herein may result in hazardous laser radiation exposure. * IEC is a registered trademark of The International Electrotechnical Commission. 10 mW 6 1.3 µm Lucent Technologies Inc. 1.3 µm D2300-Type Digital Isolated DFB Laser Module Data Sheet February 2000 Ordering Information Table 3. Ordering Information Device Code D2304G Connector Comcode FC-PC* 107912990 * Other connector options are available. Lucent Technologies Inc. 7 For additional information, contact your Microelectronics Group Account Manager or the following: INTERNET: http://www.lucent.com/micro, or for Optoelectronics information, http://www.lucent.com/micro/opto E-MAIL: [email protected] N. AMERICA: Microelectronics Group, Lucent Technologies Inc., 555 Union Boulevard, Room 30L-15P-BA, Allentown, PA 18103 1-800-372-2447, FAX 610-712-4106 (In CANADA: 1-800-553-2448, FAX 610-712-4106) ASIA PACIFIC: Microelectronics Group, Lucent Technologies Singapore Pte. Ltd., 77 Science Park Drive, #03-18 Cintech III, Singapore 118256 Tel. (65) 778 8833, FAX (65) 777 7495 CHINA: Microelectronics Group, Lucent Technologies (China) Co., Ltd., A-F2, 23/F, Zao Fong Universe Building, 1800 Zhong Shan Xi Road, Shanghai 200233 P. R. China Tel. (86) 21 6440 0468, ext. 316, FAX (86) 21 6440 0652 JAPAN: Microelectronics Group, Lucent Technologies Japan Ltd., 7-18, Higashi-Gotanda 2-chome, Shinagawa-ku, Tokyo 141, Japan Tel. (81) 3 5421 1600, FAX (81) 3 5421 1700 EUROPE: Data Requests: MICROELECTRONICS GROUP DATALINE: Tel. (44) 7000 582 368, FAX (44) 1189 328 148 Technical Inquiries:OPTOELECTRONICS MARKETING: (44) 1344 865 900 (Ascot UK) Lucent Technologies Inc. reserves the right to make changes to the product(s) or information contained herein without notice. No liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information. Copyright © 2000 Lucent Technologies Inc. All Rights Reserved February 2000 DS00-167OPTO (Replaces MN97068-5)