AGERE E2560

Advance Data Sheet
January 1999
E2560/E2580-Type 10 Gbits/s EML Modules
Features
■
Integrated electroabsorptive modulator
■
1.5 µm wavelength
■
Characterized for 10 Gbits/s operation
■
For use up to 80 km at 10 Gbits/s
■
Low modulation voltage
■
Temperature stabilized
■
Available with and without integral driver IC
■
Wavelength selectable to ITU-T standards
■
Ultrastable wavelength aging for DWDM
Applications
■
SONET/SDH applications
■
Ultrahigh capacity WDM system application
■
High-speed data communication
■
Digitized video
Description
The E2560 (without integral driver IC) and E2580
(with integral driver IC) are devices for 10 Gbits/s
DWDM or TDM transmission applications, which integrate a CW laser with an electroabsorptive modulator
in the same semiconductor chip, and are an extension of Lucent Technologies Microelectronics
Groups’ existing E2500 series of devices. Both types
use a small-profile Gilbert GPO connector to handle
the RF signal. The device is typically coupled with a
number of erbium-doped fiber amplifiers, such as
Lucent Technologies' 1724-series, in order to ensure
that sufficient optical power reaches the receiver.
These devices can replace external modulators
which are often bulkier, more expensive, and require
more complex drive electronics than the EML. Both
E2560 and E2580 are available for transmission distances of 40 km and 80 km. The package also contains a thermoelectric cooler, thermistor, rear facet
monitor photodiode, and an optical isolator.
Advance Data Sheet
January 1999
E2560/E2580-Type 10 Gbits/s EML Modules
Description (continued)
The nominal input impedance of the E2560 version is 50 Ω. The package is qualified to the Bellcore TA-TSY000468 standard.
Both E2560 and E2580 are available in a range of ITU-T wavelengths for use in DWDM systems operating at 10
Gbits/s per channel. The device has excellent wavelength stability, supporting operation at 100 GHz channel spacing over 20 years (assuming an end-of-life aging condition of <±100 pm). Typically, no external wavelength stabilization is required in systems of this type, using Lucent's E2500 series EMLs. The package also offers excellent
stability of wavelength vs. case temperature, with a maximum coefficient of 0.5 pm/ °C.
Module Characteristics
Table 1. Module Characteristics
Package Type
E2560: 7-pin package with GPO connector RF input.
E2580: 13-pin package with GPO connector RF input.
Fiber
Standard single-mode fiber.
Connector
ST ®; other connectors available on request.
RF Input Impedance
50 Ω.
Bit Rate
10 Gbits/s.
Pin Information
Table 2. Pin Descriptions
E2560
Pin
Abbreviation
—
—
—
—
—
—
7
6
5
4
3
2
1
—
—
—
—
—
—
E2580
Definition
—
—
—
—
—
—
TEC–
Themoelectric cooler–
TEC+
Thermoelectric cooler+
BACK DET+
Monitor cathode (+)
BACK DET–
Monitor anode (–)
LASER+
Laser anode
THERM
Thermistor
THERM, LASER–, Combined thermistor/
CASE
laser cathode/case
Pin
Abbreviation
Definition
13
12
11
10
9
8
7
6
5
4
3
2
1
TEC–
TEC+
VSS
DCA
OA
NC
NC
VEA
BACK DET+
BACK DET–
LASER+
THERM
THERM, LASER–,
CASE
Themoelectric cooler–
Thermoelectric cooler+
Voltage supply to the IC
Duty cycle adjust
Optical amplitude adjust
No connect/reserved
No connect/reserved
Modular offset (on-state)
Monitor cathode (+)
Monitor anode (–)
Laser anode
Thermistor
Combined thermistor/
laser cathode/case
Note: For full details of pin functions and required bias levels for the version with the IC, refer to E2580 EML with Integral Driver IC: Pin
Definitions And Operation Application Note (TBD):
2
Lucent Technologies Inc.
Advance Data Sheet
January 1999
E2560/E2580-Type 10 Gbits/s EML Modules
Target Specifications
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are
absolute stress ratings only. Functional operation of the device is not implied at these or any other conditions in
excess of those given in the operational sections of the data sheet. Exposure to absolute maximum ratings for
extended periods can adversely affect device reliability.
Table 3. Absolute Maximum Ratings
Parameter
Conditions
Limit
Unit
CW
CW
CW
—
—
—
—
—
—
2
150
10
5
1
10
1
–40 to +85
–10 to +70
V
mA
mW
V
V
V
V
°C
°C
Laser Diode Reverse Voltage
Laser Diode Forward Current
Optical Output Power
Modulator Reverse Voltage
Modulator Forward Voltage
Monitor Diode Reverse Voltage
Monitor Diode Forward Voltage
Storage Temperature
Operating Temperature
Characteristics
Table 4. Optical and Electrical Specifications (Chip operating temp. = 15 °C to 35 °C, except where noted.)
Parameter
Symbol
Conditions
Min
Max
Unit
Threshold Current (BOL)
Forward Voltage
Operating Current
Threshold Power
Ith
VF
Iop
Pth
5
—
50
—
35
2.2
100
80
mA
V
mA
µW
Fiber Output Power (Peak)
Ppk
1
—
dBm
Peak Wavelength
(Wavelength can be specified
to the ITU wavelength
channels.)
Side-mode Suppression Ratio
λ0
—
If = Iop @ Top
—
If – Ith
Vm = Iop
Vm = 0 V
If = Iop
Vm = 0 V
Tlaser chip = Top
If = Iop
1530
1563
nm
30
—
dB
—
2.0
dB
Dispersion Penalty
BER = 10–10
SMSR
DP
Vm = 0 V
If = Iop, Top
10 Gbits/s*
Vlow = –1.5 to –3.0 V,
Vhigh = 0 V to –1 V
If = lop @ Top
* Over 720 ps/nm (40 km version), 1440 ps/nm (80 km version).
Lucent Technologies Inc.
3
Advance Data Sheet
January 1999
E2560/E2580-Type 10 Gbits/s EML Modules
Target Specifications (continued)
Table 4. Optical and Electrical Specifications (Chip operating temp. = 15 °C to 35 °C, except
where noted.)(continued)
Parameter
Modulator/Driver
Extinction Ratio
RF Return Loss (E2560)
(0 GHz to 6 GHz)
RF Return Loss (E2560)
(6 GHz to 8 GHz)
RF Return Loss (E2560)
(8 GHz to 10 GHz)
–3 dB Bandwidth (E2560)
RF Return Loss (E2560)
(0 GHz to 10 GHz)
Input Voltage (E2580)
(Peak to Peak)
(ac coupled input)
Rise/Fall Time
(20%—80%)
Monitor Diode
Monitor Current
Dark Current
Capacitance
Thermistor
Resistance
Thermistor Current
Thermistor B Constant
Thermoelectric Cooler
TEC Current
TEC Voltage
TEC Power
TEC Capacity
Optical Isolation
Optical Isolation
Package
Wavelength vs. Case Temp.
Symbol
Conditions
Min
Max
Unit
ERRF
11
—
dB
10
—
dB
7
—
dB
5
—
dB
11
—
GHz
10
—
dB
VIN
Vin = 0.5 Vp-p to 1.0 Vp-p
10 Gbits/s (E2580)
Vm = 0 V to –2.5 V
10 Gbits/s (E2560)
Vm = –1 V
If = Iop
Vm = –1 V
If = Iop
Vm = –1 V
If = Iop
Vm = –1 V
If = Iop
Vin = 0.5 Vp-p to 1.0 Vp-p
10 Gbits/s
—
0.5
1.0
V
tr/tf
—
—
40
ps
Ibd
Vbd = 5 V
If = Iop
Vbd = 5 V
Vbd = 5 V
f = 1 MHz
40
1100
µA
—
—
0.1
25
µA
pF
Rtherm
Itc
B
T = 25 °C
—
—
9.5
10
3700
10.5
100
4100
kΩ
µA
—
ITEC
VTEC
PTEC
∆T
†
—
—
—
55
1.1
2.6
2.9
—
A
V
W
C
—
†
30
—
dB
dλ/ dT
Tcase = –10 °C to 70 °C
—
0.5
pm/°C
S11
S11
S11
BW
S11
Id
C
†
†
†
* Over 720 ps/nm (40 km version), 1440 ps/nm (80 km version).
† Tcase = 70 °C, Tlaser chip = 15 °C to 35 °C (E2560), 20 °C to 35 °C (E2580).
4
Lucent Technologies Inc.
Advance Data Sheet
January 1999
E2560/E2580-Type 10 Gbits/s EML Modules
Outline Diagram
E2560:
0.020
(0.508)
0.100
(2.54)
0.291
(7.384)
LEAD 1
LEAD 7
0.50
(12.7)
MIN
TRADEMARK CODE LASER SERIAL NUMBER
AND DATE CODE LABEL IN AREA SHOWN
BEND LIMITER
0.551
(13.99)
0.500
(12.7)
0.350
(8.89)
∅ 0.106
(2.7)
PLACES
0.078
(1.98)
0.498
(12.64)
1.025
(26.04)
E2580:
0.020
(0.51)
3 PLACES
0.190
(4.822)
0.215
(5.45)
0.050
(1.27)
12 PLACES
0.010 ± 0.002
(0.25 ± 0.064)
0.291
(7.38)
LEAD 1
LEAD 13
50
(12.7)
TRADEMARK CODE LASER SERIAL NUMBER
AND DATE CODE LABEL IN AREA SHOWN
BEND LIMITER
0.551
(13.99)
0.500
(12.7)
0.350
(8.89)
0.200
(5.08)
∅ 0.106
(2.7)
4 PLACES
0.498
(12.64)
1.025
(26.04)
0.190
(4.82)
0.078
(1.98)
2.032
(51.61)
0.180
(4.56)
0.820
(20.83)
TBD
0.98
(2.5)
0.260
(6.6)
0.365
(9.27)
0.56
(1.42)
1.180
(29.97)
0.030
(0.75)
0.228
(5.78)
0.215
(5.47)
CONNECTOR TYPE
AS SPECIFIED
1-1006(F).r1
Lucent Technologies Inc.
5
Advance Data Sheet
January 1999
E2560/E2580-Type 10 Gbits/s EML Modules
Laser Safety Information
Class IIIb Laser Product
This product complies with 21 CFR 1040.10 and 1040.11.
Single-mode connector
Wavelength = 1.5 µm
Maximum power = 10 mW
Because of size constraints, laser safety labeling is not affixed to the module but attached to the outside of the shipping carton.
Product is not shipped with power supply.
Caution: Use of controls, adjustments, and procedures other than those specified herein may result in hazardous
laser radiation exposure.
For additional information, contact your Microelectronics Group Account Manager or the following:
http://www.lucent.com/micro, or for Optoelectronics information, http://www.lucent.com/micro/opto
INTERNET:
[email protected]
E-MAIL:
N. AMERICA: Microelectronics Group, Lucent Technologies Inc., 555 Union Boulevard, Room 30L-15P-BA, Allentown, PA 18103
1-800-372-2447, FAX 610-712-4106 (In CANADA: 1-800-553-2448, FAX 610-712-4106)
ASIA PACIFIC: Microelectronics Group, Lucent Technologies Singapore Pte. Ltd., 77 Science Park Drive, #03-18 Cintech III, Singapore 118256
Tel. (65) 778 8833, FAX (65) 777 7495
CHINA:
Microelectronics Group, Lucent Technologies (China) Co., Ltd., A-F2, 23/F, Zao Fong Universe Building, 1800 Zhong Shan Xi Road,
Shanghai 200233 P. R. China Tel. (86) 21 6440 0468, ext. 316, FAX (86) 21 6440 0652
JAPAN:
Microelectronics Group, Lucent Technologies Japan Ltd., 7-18, Higashi-Gotanda 2-chome, Shinagawa-ku, Tokyo 141, Japan
Tel. (81) 3 5421 1600, FAX (81) 3 5421 1700
EUROPE:
Data Requests: MICROELECTRONICS GROUP DATALINE: Tel. (44) 1189 324 299, FAX (44) 1189 328 148
Technical Inquiries: OPTOELECTRONICS MARKETING: (44) 1344 865 900 (Ascot UK)
Lucent Technologies Inc. reserves the right to make changes to the product(s) or information contained herein without notice. No liability is assumed as a result of their use or application. No
rights under any patent accompany the sale of any such product(s) or information. ST is a registered trademark of Lucent Technologies Inc.
Copyright © 1999 Lucent Technologies Inc.
All Rights Reserved
January 1999
DS99-078LWP
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