SN54HCT14, SN74HCT14 HEX SCHMITT-TRIGGER INVERTERS SCLS225E – JULY 1995 – REVISED JULY 2003 D D D D Operating Voltage Range of 4.5 V to 5.5 V Outputs Can Drive Up To 10 LSTTL Loads Low Power Consumption, 20-µA Max ICC Typical tpd = 18 ns D D D ±4-mA Output Drive at 5 V Low Input Current of 1 µA Max Inputs Are TTL-Voltage Compatible SN54HCT14 . . . FK PACKAGE (TOP VIEW) 1 14 2 13 3 12 4 11 5 10 6 9 7 8 VCC 6A 6Y 5A 5Y 4A 4Y 2A NC 2Y NC 3A 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 6Y NC 5A NC 5Y 3Y GND NC 4Y 4A 1A 1Y 2A 2Y 3A 3Y GND 1Y 1A NC VCC 6A SN54HCT14 . . . J OR W PACKAGE SN74HCT14 . . . D, DB, DGV, N, OR PW PACKAGE (TOP VIEW) NC – No internal connection description/ordering information The ’HCT14 devices contain six independent inverters. The devices perform the Boolean function Y = A in positive logic. ORDERING INFORMATION PDIP – N SN74HCT14N Tube of 50 SN74HCT14D Reel of 2500 SN74HCT14DR Reel of 250 SN74HCT14DT Reel of 2000 SN74HCT14DBR Reel of 2000 SN74HCT14PWR Reel of 250 SN74HCT14PWT TVSOP – DGV Reel of 2000 SN74HCT14DGVR HT14 CDIP – J Tube of 25 SNJ54HCT14J SNJ54HCT14J CFP – W Tube of 150 SNJ54HCT14W SNJ54HCT14W LCCC – FK Tube of 55 SNJ54HCT14FK SSOP – DB TSSOP – PW –55°C to 125°C TOP-SIDE MARKING Tube of 25 SOIC – D –40°C 40°C to 85°C ORDERABLE PART NUMBER PACKAGE† TA SN74HCT14N HCT14 HT14 HT14 SNJ54HCT14FK † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. FUNCTION TABLE (each inverter) INPUT A OUTPUT Y H L L H Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2003, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SN54HCT14, SN74HCT14 HEX SCHMITT-TRIGGER INVERTERS SCLS225E – JULY 1995 – REVISED JULY 2003 logic diagram (positive logic) A Y absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V Input clamp current, IIK (VI < 0 or VI > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Package thermal impedance, θJA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96°C/W DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127°C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 3) SN54HCT14 SN74HCT14 UNIT MIN MAX MIN MAX 4.5 5.5 4.5 5.5 V VCC VI Supply voltage Input voltage 0 0 0 VCC VCC V Output voltage VCC VCC 0 VO TA –55 125 –40 85 °C Operating free-air temperature V NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN54HCT14, SN74HCT14 HEX SCHMITT-TRIGGER INVERTERS SCLS225E – JULY 1995 – REVISED JULY 2003 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC TA = 25°C TYP MAX MIN SN54HCT14 SN74HCT14 MIN MAX MIN MAX VT+ Positive-going Positive going threshold 4.5 V 1.2 1.5 1.9 1.2 1.9 1.2 1.9 5.5 V 1.4 1.7 2.1 1.4 2.1 1.4 2.1 VT– Negative-going Negative going threshold 4.5 V 0.5 0.9 1.2 0.5 1.2 0.5 1.2 5.5 V 0.6 1 1.4 0.6 1.4 0.6 1.4 ∆VT Hysteresis (VT+ – VT–) 4.5 V 0.4 0.6 1.4 0.4 1.4 0.4 1.4 5.5 V 0.4 0.65 1.5 0.4 1.5 0.4 1.5 UNIT V V V VOH IOH = –20 µA IOH = –4 mA 4.5 V 4.4 4.49 4.4 4.4 4.5 V 3.98 4.3 3.7 3.84 VOL IOL = 20 µA IOL = 4 mA 4.5 V 0.001 0.1 0.1 0.1 4.5 V 0.17 0.26 0.4 0.33 II ICC VI = VCC or GND VI = VCC or GND, 5.5 V ±0.1 ±1 ±1 µA 5.5 V 2 40 20 µA 2.4 3 2.9 mA 10 pF ∆ICC† IO = 0 One input at 0.5 V or 2.4 V, Other inputs at GND or VCC 5.5 V 0.2 V Ci VI = VCC or GND 5V 3 10 10 † This is the increase in supply current for each input that is at one of the specified TTL voltage levels, rather than 0 V or VCC. V switching characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) tpd d A Y tt Y VCC MIN TA = 25°C TYP MAX SN54HCT14 MIN MAX SN74HCT14 MIN MAX 4.5 V 20 32 48 40 5.5 V 18 30 45 38 4.5 V 7 15 22 19 5.5 V 6 14 20 17 UNIT ns ns operating characteristics, TA = 25°C PARAMETER Cpd TEST CONDITIONS Power dissipation capacitance No load POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TYP 10 UNIT pF 3 SN54HCT14, SN74HCT14 HEX SCHMITT-TRIGGER INVERTERS SCLS225E – JULY 1995 – REVISED JULY 2003 PARAMETER MEASUREMENT INFORMATION From Output Under Test 3V Test Point Input 1.3 V 1.3 V 0V CL = 50 pF (see Note A) tPLH In-Phase Output LOAD CIRCUIT 1.3 V 10% tPHL 90% 90% tr Input 1.3 V 10% 90% tPHL VCC 90% 1.3 V 10% 0 V tr Out-of-Phase Output 90% VOLTAGE WAVEFORM INPUT RISE AND FALL TIMES tPLH 1.3 V 10% tf tf VOH 1.3 V 10% V OL tf 1.3 V 10% 90% VOH VOL tr VOLTAGE WAVEFORMS PROPAGATION DELAY AND OUTPUT RISE AND FALL TIMES NOTES: A. CL includes probe and test-fixture capacitance. B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns. C. The outputs are measured one at a time with one input transition per measurement. D. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN54HCT14, SN74HCT14 HEX SCHMITT-TRIGGER INVERTERS SCLS225E – JULY 1995 – REVISED JULY 2003 TYPICAL CHARACTERISTICS SUPPLY CURRENT vs INPUT VOLTAGE SUPPLY CURRENT vs INPUT VOLTAGE 0.5 0.5 VCC = 5.5 V 0.45 0.45 0.4 0.4 I CC – Supply Current – mA I CC – Supply Current – mA VCC = 4.5 V 0.35 0.3 VI = 0 to VCC 0.25 VI = VCC to 0 ÁÁ ÁÁ 0.35 VI = VCC to 0 0.3 0.25 ÁÁ ÁÁ 0.2 0.15 0.1 0.2 0.15 0.1 0.05 0 VI = 0 to VCC 0.05 0 3.16 3.61 0.45 0.9 1.35 1.8 2.26 2.7 0 4 0 0.55 1.1 1.66 2.2 2.76 3.3 VI – Input Voltage – V VI – Input Voltage – V OUTPUT VOLTAGE vs INPUT VOLTAGE OUTPUT VOLTAGE vs INPUT VOLTAGE 6 6 VCC = 4.5 V VCC = 5.5 V 5 VO – Output Voltage – V 5 VO – Output Voltage – V 3.86 4.4 4.97 4 VI = Down 3 VI = Up 2 1 0 4 VI = Down 3 VI = Up 2 1 0 –1 –1 0 0.75 1.5 2.27 3 3.77 0 VI – Input Voltage – V POST OFFICE BOX 655303 0.92 1.84 2.76 3.68 4.6 VI – Input Voltage – V • DALLAS, TEXAS 75265 5 PACKAGE OPTION ADDENDUM www.ti.com 9-Apr-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 5962-86890012A ACTIVE LCCC FK 20 1 TBD 5962-8689001CA ACTIVE CDIP J 14 1 TBD 5962-8689001DA ACTIVE CFP W 14 1 SN74HCT14D ACTIVE SOIC D 14 50 SN74HCT14DBLE OBSOLETE SSOP DB 14 SN74HCT14DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT14DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT14DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT14DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT14DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT14DGVR ACTIVE TVSOP DGV 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT14DGVRE4 ACTIVE TVSOP DGV 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT14DGVRG4 ACTIVE TVSOP DGV 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT14DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT14DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT14DRG3 PREVIEW SOIC D 14 2500 SN74HCT14DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT14DT ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT14DTE4 ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT14DTG4 ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT14N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74HCT14NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74HCT14PWLE OBSOLETE TSSOP PW 14 TBD Call TI SN74HCT14PWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT14PWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT14PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT14PWT ACTIVE TSSOP PW 14 250 CU NIPDAU Level-1-260C-UNLIM A42 N / A for Pkg Type TBD A42 N / A for Pkg Type Green (RoHS & no Sb/Br) CU NIPDAU TBD Addendum-Page 1 POST-PLATE N / A for Pkg Type TBD Green (RoHS & no Sb/Br) Call TI Call TI Level-1-260C-UNLIM Call TI Call TI Call TI PACKAGE OPTION ADDENDUM www.ti.com 9-Apr-2010 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74HCT14PWTE4 ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT14PWTG4 ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SNJ54HCT14FK ACTIVE LCCC FK 20 1 TBD SNJ54HCT14J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54HCT14W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type Lead/Ball Finish MSL Peak Temp (3) POST-PLATE N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN54HCT14, SN74HCT14 : • Automotive: SN74HCT14-Q1 NOTE: Qualified Version Definitions: • Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74HCT14DBR SSOP DB 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1 SN74HCT14DGVR TVSOP DGV 14 2000 330.0 12.4 6.8 4.0 1.6 8.0 12.0 Q1 SN74HCT14DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74HCT14DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74HCT14PWR TSSOP PW 14 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74HCT14DBR SSOP DB 14 2000 346.0 346.0 33.0 SN74HCT14DGVR TVSOP DGV 14 2000 346.0 346.0 29.0 SN74HCT14DR SOIC D 14 2500 333.2 345.9 28.6 SN74HCT14DR SOIC D 14 2500 346.0 346.0 33.0 SN74HCT14PWR TSSOP PW 14 2000 346.0 346.0 29.0 Pack Materials-Page 2 MECHANICAL DATA MLCC006B – OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0°–8° 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. Falls within JEDEC: 24/48 Pins – MO-153 14/16/20/56 Pins – MO-194 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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