NEC SVSP1C334M

DATA SHEET
SOLID TANTALUM CAPACITOR
SVS SERIES
Surface mount resin molded, Ultra miniaturized chip
The SVS series is a line-up of high performance ultra miniaturized tantalum chip capacitors.
The case dimensions are 2.0 mm × 1.25 mm × 1.2 mm as shown below.
FEATURES
™ The smallest molded chip tantalum capacitor (half size of the EIA standard A case)
™ Available up to 10 µ F with case dimension of 2.0 mm × 1.25 mm × 1.2 mm (case code P)
APPLICATIONS
™ Portable stereos
™ VCR cameras
™ Hearing aids
DIMENSIONS
2.0 ± 0.2
1.25 ± 0.2
1.2 max.
0.5 ± 0 . 2
0.5 ± 0 . 2
0.9 ± 0 . 1
(Unit : mm)
The information in this document is subject to change without notice.
Document No. EC0062EJ6V0DS00 (6th edition)
Date Published February 1998 M
Printed in Japan
©
1992(1996)
SVS SERIES
PRODUCT LINE-UP AND MARKING CODE
UR
(Vdc)
2.5
Capacitance
(µ F)
4
6.3
10
16
0.33
CN
0.47
CS
0.68
AW
CW
JA
AA
CA
GE
JE
AE
1
1.5
2.2
eJ
GJ
JJ
AJ
3.3
eN
GN
JN
AN
4.7
eS
GS
JS
6.8
eW
GW
JW
7eA
7GA
7JA
10
U R : Rated voltage
Marking detail
up to 6.8 µ F
10 µ F
Polarity +
JA
∗∗ Production date code
(indicated by dots)
7JA
Marking code
(corresponding to rated
voltage and capacitance)
∗∗ Implement date code on trial.
PART NUMBER SYSTEM
[BULK]
SVS
[TAPE & REEL]
P
0J
105
M
TE SVSP0J105M 8 R
Capacitance tolerance ±20%
Capacitance code in pF
First two digits represent significant
figures. Third digit specifies number
of zeros to follow.
Rated voltage
0E : 2.5 V, 0G : 4 V, 0J : 6.3 V
1A : 10 V, 1C : 16 V
Case code
SVS series
2
Packing orientation
Part number of bulk
(see left)
R : (Standard)
Orientation
Feed direction
Tape
⊕ Polarity mark
Tape and reel
L : (Non-Standard)
Orientation
Feed direction
Tape
⊕ Polarity mark
Tape width 8 mm
SVS SERIES
RATINGS
Rated Voltage
(Vdc)
2.5
Capacitance
(µ F)
Tangent of loss angle
Leakage Current
(µ A)
Part Number
2.2
0.1
0.5
SVSP0E225M
3.3
0.1
0.5
SVSP0E335M
4.7
0.2
0.5
SVSP0E475M
6.8
0.2
0.5
SVSP0E685M
10
0.2
0.5
SVSP0E106M
1.5
0.1
0.5
SVSP0G155M
2.2
0.1
0.5
SVSP0G225M
3.3
0.2
0.5
SVSP0G335M
4.7
0.2
0.5
SVSP0G475M
6.8
0.2
0.5
SVSP0G685M
10
0.2
0.5
SVSP0G106M
1
0.1
0.5
SVSP0J105M
1.5
0.1
0.5
SVSP0J155M
2.2
0.2
0.5
SVSP0J225M
3.3
0.2
0.5
SVSP0J335M
4.7
0.2
0.5
SVSP0J475M
6.8
0.2
0.5
SVSP0J685M
10
0.2
0.6
SVSP0J106M
0.68
0.1
0.5
SVSP1A684M
1
0.1
0.5
SVSP1A105M
1.5
0.2
0.5
SVSP1A155M
2.2
0.2
0.5
SVSP0A225M
3.3
0.2
0.5
SVSP0A335M
0.33
0.1
0.5
SVSP1C334M
0.47
0.1
0.5
SVSP1C474M
0.68
0.1
0.5
SVSP1C684M
1
0.2
0.5
SVSP1C105M
4
6.3
10
16
3
SVS SERIES
SPECIFICATIONS
No.
Items
Test Conditions
–55 to +125˚C
Over 85˚C, applied voltage shall be derated
on the basis of the Derated Voltage at
125˚C specified in this table item no.4.
1
Operating Temp. Range
2
Rated Voltage
2.5
4
6.3
3
Surge Voltage
3.3
5.2
4
Derated Voltage
1.6
2.5
5
Capacitance Range
6
Capacitance Tolerance
7
Leakage Current
8
Tangent of loss angle
9
Surge Voltage Resistance
10
Characteristics at high
and low
temperature
10
16
Vdc
up to 85˚C
8
13
4
6.3
20
Vdc
up to 85˚C
10
Vdc
at 125˚C
0.33 to 10 µ F
at 120 Hz
±20%
at 120 Hz
0.5 µ A max.
Temp.
∆ C /C
Tangent of
loss angle
Leakage
Current
5 min. after rated voltage applied
0.1 max. / 0.2 max. (Refer to ratings)
at 25˚C, 120 Hz
: ±20%
∆ C /C
Tangent of loss angle : Initial requirement
Leakage Current
: Initial requirement
–55˚C
0
– 20
%
150% of initial
requirement
––
+85˚C
+20
0
%
at 85˚C
Surge voltage for 30 sec. (Rs = 1 kΩ)
Discharge for 5 min. 30 sec.
1 000 cycles
+125˚C
+20
0
%
Initial
requirement
150%of initial
requirement
0.1 CV or 5 µ A
whichever is
greater
0.125 CV or 6.25 µ A
whichever is
greater
Step1 : +25˚C
Step2 : –55˚C
Step3 : +25˚C
Step4 : +85˚C
Step5 : +125˚C
Step6 : +25˚C
11
Rapid change of temperature
: ±20%
∆ C /C
Tangent of loss angle : Initial requirement
Leakage Current
: Initial requirement
IEC68-2-14 Test N and IEC68-2-33
Guidance
–55 to +125˚C
5 cycles
12
Resistance to soldering
: ±20%
∆ C /C
Tangent of loss angle : Initial requirement
Leakage Current
: Initial requirement
IEC68-2-58 Test Td
Fully immersion to solder at 260˚C for
5 sec
13
Damp Heat (Steady state)
: ±20%
∆ C /C
Tangent of loss angle : 150% of Intial requirement
Leakage Current
: Initial requirement
IEC68-2-3 Test Ca
at 40˚C, 90 to 95% RH, for 500H
14
Endurance
: ±20%
∆ C /C
Tangent of loss angle : Initial requirement
Leakage Current
: 200% of Initial requirement
at 85˚C & 125˚C (Derated Voltage),
rated voltage applied for 2 000 H
15
Failure Rate
∆ C /C : Capacitance change ratio
4
Specifications
λ 0 = 1% / 1 000 h
at 85˚C & 125˚C (Derated Voltage),
rated voltage applied for 1 000 H
SVS SERIES
TAPE AND REEL SPECIFICATION
[Carrier Tape Specification and Packing Quantity]
sprocket hole
embossed cavity
D0
E
F
W
B0
t
P1
A0
P0
P2
K
Feed direction
(Unit : mm)
A0 ±0.2
B0 ±0.2
W±0.3
F±0.05
E±0.1
P1 ±0.1
P 2 ±0.05
P0 ±0.1
1.4
2.2
8.0
3.5
1.75
4.0
2.0
4.0
D
+0.1
0 0
φ 1.5
K±0.2
t
Q'ty/Reel
1.4
0.2
3000
[Reel Specification]
W1
B
D
C
N
A
R
W2
(Unit : mm)
Tape width
A
N
C
D
B
W1
W2
R
8
φ 178 ±2.0
φ 50 min.
φ 13 ±0.5
φ 21±0.5
2.0 ±0.5
10.0 ±1.0
14.5 max.
1
5
SVS SERIES
CHARACTERISTICS DATA
30
20
20
10
10
∆ C / C (%)
30
0
–10
–10
–30
–30
Tangent of loss angle (tan δ )
–20
0.08
0.06
0.04
0.02
0
0.1
0.01
0.001
25˚C –55˚C 25˚C 85˚C 125˚C 25˚C
2.5 V/2.2 µ F
6
0
–20
Leakage current ( µ A)
Leakage current ( µ A)
Tangent of loss angle (tan δ )
∆ C / C (%)
Characteristics at high and low temperature
0.08
0.06
0.04
0.02
0
0.1
0.01
0.001
25˚C –55˚C 25˚C 85˚C 125˚C 25˚C
6.3 V/1 µ F
SVS SERIES
Resistance to soldering (immersing for 10 sec. at 260˚C)
15
10
10
5
5
∆ C / C (%)
15
0
–5
0
–5
–10
–15
–15
Tangent of loss angle (tan δ )
–10
0.08
0.06
0.04
0.02
0
Leakage current ( µ A)
Leakage current ( µ A)
Tangent of loss angle (tan δ )
∆ C / C (%)
(reference data)
0.1
0.01
0.001
Final
Initial
2.5 V / 2.2 µ F
0.08
0.06
0.04
0.02
0
0.1
0.01
0.001
Final
Initial
6.3 V / 1 µ F
7
SVS SERIES
Damp heat, steady state (65˚C, 90 to 90% RH)
15
10
10
5
5
∆ C / C (%)
15
0
–5
–5
–15
–15
Tangent of loss angle (tan δ )
–10
0.08
0.06
0.04
0.02
0
0.1
0.01
0.001
0h
500 h
2.5 V / 2.2 µ F
8
0
–10
Leakage current ( µ A)
Leakage current ( µ A)
Tangent of loss angle (tan δ )
∆ C / C (%)
(reference data)
1 000 h
0.08
0.06
0.04
0.02
0
0.1
0.01
0.001
0h
500 h
6.3 V / 1 µ F
1 000 h
SVS SERIES
Endurance (85˚C, Rated voltage × 1.3 applied)
30
20
20
10
10
∆ C / C (%)
30
0
–10
0
–10
–20
–30
–30
Tangent of loss angle (tan δ )
–20
0.08
0.06
0.04
0.02
0
Leakage current ( µ A)
Leakage current ( µ A)
Tangent of loss angle (tan δ )
∆ C / C (%)
(reference data)
0.1
0.01
0.001
0h
500 h
2.5 V / 2.2 µ F
1 000 h
0.08
0.06
0.04
0.02
0
0.1
0.01
0.001
0h
500 h
1 000 h
6.3 V / 1 µ F
9
SVS SERIES
Impedance – Frequency characteristics (reference data)
1k
 Z (Ω)
100
10
1
1k
6.3 V/1 µ F
10 k
100 k
Frequency (Hz)
10
1M
10 M
SVS SERIES
GUIDE TO APPLICATIONS FOR TANTALUM CHIP CAPACITORS
The failure of the solid tantalum capacitor is mostly classified into a short-circuiting mode and a large leakage
current mode. Refer to the following for reliable circuit design.
1. Expecting Reliability
SVS series tantalum chip capacitors are typically applied to decoupling, blocking, bypassing and filtering.
The SVS series has a very high reliability (low failure rate) in the field. For example, the maximum field failure
rate of an SVS series capacitor with a DC rated voltage of 16 V is 0.0004% / 1000 hour (4 Fit) at an applied voltage
of 5 V, operating temperature of 25˚C and series resistance of 3 Ω.
The maximum failure rate in the field is estimated by the following expression :
3
λ = λ0
V
V0
×2
T-T0
10
λ : Maximum field failure rate
λ 0 : 1% /1000 hour (The failure rate of the SVS series at the full DC rated voltage at operating
temperature of 85˚C and series resistance of 3 Ω.)
V : Applied voltage in actual use
V0 : DC Rated voltage
T : Operating temperature in actual use
T0 : 85˚C
The nomograph is provided for quick estimation of
maximum field failure rates.
120
100
10 1
7
4
Operating temperature T (˚C)
2
Connect operating temperature T and applied
voltage ratio V/V0 of interest with a straight line.
The failure rate multiplier F is given at the intersection of this line with the model scale. The failure
rate is obtained as λ = λ 0 •F.
1.0
0.9
0.8
90
10 0
7
4
80
2
0.6
70
10 –1
7
4
2
0.4
60
0.7
0.5
10 –2
7
4
0.3
2
50
40
30
10 –3
7
4
Applied voltage ratio V/ V0
2
Failure rate multiplier F
110
10 2
7
4
Examples :
Given V/V0 = 0.4 and T = 45˚C. read
F = 4 × 10 –3
Hence, λ = 0.004%/1000 hour (40 Fit).
Given V/V0 = 0.3 and T = 25˚C, read
F = 4 × 10 –4
Hence, λ = 0.0004%/1000 hour (4 Fit).
0.2
2
10 –4
7
4
2
0.1
10 –5
20
11
SVS SERIES
2. Series resistance
As shown in Figure 1, reliability is increased by inserting a series resistance of at least 3 Ω/ V into circuits
where current flow is momentary (switching circuits, charge/discharge circuits, etc).
If the capacitor is in a low-impedance circuit, the voltage applied to the capacitor should be less than 1/2 to
1/3 of the DC rated voltage.
Magnification of failure
10
1
0.1
0.1
1
10
Series Resistance (Ω / V)
100
Figure 1 Effects of series resistance
3. Ripple voltage
The sum of DC voltage and peak ripple voltage should not exceed the DC rated voltage of the capacitor.
Ripple voltage (Vrms)
100
Case : P @ 25˚C
10
16 V
10 V
6.3 V
1
4V
2.5 V
0.1
0.1
1
Frequency (kHz)
10
100
Figure 2 Permissible ripple voltage vs. frequency
Figure 2 is based on an ambient temperature of 25˚C. For higher temperature, permissible ripple voltage shall
be derated as follows.
Permissible voltage at 50˚C = 0.7 × permissible voltage at 25˚C
Permissible voltage at 85˚C = 0.5 × permissible voltage at 25˚C
Permissible voltage at 125˚C = 0.3 × permissible voltage at 25˚C
4. Reverse voltage
Because the capacitors are polarized, reverse voltage should not be applied.
If reverse voltage cannot be avoided because of circuit design, the voltage application should be for a very
short time and should not exceed the following.
10% of DC rated voltage at 25˚C
5% of DC rated voltage at 85˚C
1% of DC rated voltage at 125˚C
12
SVS SERIES
5. Mounting
(1) Direct soldering
Keep in mind the following points when soldering the capacitor by means of jet soldering or dip soldering:
(a) Temporarily fixing resin
Because the SVS series solid tantalum capacitors are larger in size and subject to more force than the chip
multilayer ceramic capacitors or chip resistors, more resin is required to temporarily secure the solid tantalum
capacitors. However, if too much resin is used, the resin adhering to the patterns on a printed circuit board
may adversely affect the solderability.
(b) Pattern design
b
a
c
a
Case
a
b
c
P
2.2
1.4
0.7
The above dimensions are for reference only. If the capacitor is to be mounted by this method, and if the
pattern is too small, the solderability may be degraded.
(e) Temperature and time
Keep the peak temperature and time to within the following values:
Solder temperature ....... 260˚C max.
Time ....... 5 seconds max.
Whenever possible, perform preheating (at 150˚C max.) for smooth temperature profile. To maintain the
reliability, mount the capacitor at a low temperature and in a short time whenever possible.
(d) Component layout
If many types of chip components are mounted on a printed circuit board which is to be soldered by means
of jet soldering, solderability may not be uniform over the entire board depending on the layout and
density of the components on the board (also take into consideration generation of flux gas).
(e) Flux
Use resin-based flux. Do not use flux with strong acidity.
13
SVS SERIES
(2)
Reflow soldering
Keep in mind the following points when soldering the capacitor in a soldering oven or with a hot plate:
(a) Pattern design (In accordance with IEC1182)
X
G
Z
Case
G max.
Z min.
X min.
P
0.5
2.6
1.2
The above dimensions are recommended. Note that if the pattern is too big, the component may not be
mounted in place.
(b) Temperature and time
Keep the peak temperature and time to within the following values:
Solder temperature …… 260˚C max.
Time : 10 seconds max.
Whenever possible, perform preheating (at 150˚C max.) for smooth temperature profile. To maintain the
reliability, mount the capacitor at a low temperature and in a short time whenever possible. The peak
temperature and time shown above are applicable when the capacitor is to be soldered in a soldering oven
or with a hot plate. When the capacitor is soldered by means of infrared reflow soldering, the internal
temperature of the capacitor may rise beyond the surface temperature.
(3) Using soldering iron
When soldering the capacitor with a soldering iron, controlling the temperature at the tip of the soldering iron
is very difficult. However, it is recommended that the following temperature and time be observed to maintain
the reliability of the capacitor:
lron temperature …… 300˚C max.
Time ……………………… 3 seconds max.
Iron power …………… 30 W max.
14
SVS SERIES
6. Cleaning
Generally, several organic solvents are used for flux cleaning of an electronic component after soldering.
Many cleaning methods, such as immersion cleaning, rinse cleaning, brush cleaning, shower cleaning, vapor
cleaning, and ultrasonic cleaning, are available, and one of these cleaning methods may be used alone or two
or more may be used in combination. The temperature of the organic solvent may vary from room temperature
to several 10˚C, depending on the desired effect. If cleaning is carried out with emphasis placed only on cleaning
effect, however, the marking on the electronic component cleaned may be erased, the appearance of the component may be damaged, and in the worst case, the component may be functionally damaged. It is therefore
recommended that the SVS series solid tantalum capacitor be cleaned under the following conditions:
[Recommended conditions of flux cleaning]
(1) Cleaning solvent ……… Chlorosen, isopropyl alcohol
(2) Cleaning method …… Shower cleaning, rinse cleaning, vapor cleaning
(3) Cleaning time ………… 5 minutes max.
∗ Ultrasonic cleaning
This cleaning method is extremely effective for eliminating dust that has been generated as a result of mechanical processes, but may pose a problem depending on the condition. As a result of an experiment conducted
by NEC, it was confirmed that the external terminals of the capacitor were cut when it was cleaned with some
ultrasonic cleaning machines. The cause of this phenomenon is considered metal fatigue of the capacitor terminals that occurred due to ultrasonic cleaning. To prevent the terminal from being cut, decreasing the output
power of the ultrasonic cleaning machine or shortening the cleaning time may be a possible solution. However,
it is difficult to specify the safe cleaning conditions because there are many factors involved such as the conversion efficiency of the ultrasonic oscillator, transfer efficiency of the cleaning bath, difference in cleaning effect
depending on the location in the cleaning bath, the size and quantity of the printed circuit boards to be cleaned,
and the securing states of the components on the boards. It is therefore recommended that ultrasonic cleaning
be avoided as much as possible.
If ultrasonic cleaning is essential, make sure through experiments that no abnormality occur as a result of the
cleaning. For further information, consult NEC.
7. Others
(1) Do not apply excessive vibration and shock to the capacitor.
(2) The solderability of the capacitor may be degraded by humidity. Store the capacitor at (–5 to +40˚C) room
temperature and (40 to 60% RH) humidity.
(3) Exercise care that no external force is applied to the tape packaged products (if the packaging material is
deformed, the capacitor may not be automatically mounted by a chip mounter).
15
SVS SERIES
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
NEC Corporation does not assume any liability for infringement of patents. copyrights or other intellectual
property rights of third parties by or arising from use of a device described herein or any other liability arising
from use of such device. No license, either express, implied or otherwise, is granted under any patents,
copyrights or other intellectual property rights of NEC Corporation or others.
While NEC Corporation has been making continuous effort to enhance the reliability of its Electronic Conponents,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC Electronic Conponents, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
“Standard”, “Special”, and “Specific”. The Specific quality grade applies only to devices developed based on
a customer designated “quality assurance program” for a specific application. The recommended applications
of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each
device before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and
visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life
support)
Specific: Aircrafis, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support
systems or medical equipment for life support, etc.
The quality grade of NEC devices is “Standard” unless otherwise specified in NEC's Data Sheets or Data
Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality
grade, they should contact an NEC sales representative in advance.
Anti-radioactive design is not implemented in this product.