DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT µPC1093 ADJUSTABLE PRECISION SHUNT REGULATORS DESCRIPTION The µPC1093 are adjustable precision shunt regulators with guaranteed thermal stability. The output voltage can be set to any value between reference voltage (2.495 V) and 36 V by two external resistors. These ICs can apply to error amplifier of switching regulators. FEATURES • High Accuracy VREF = 2.495 V ± 2 % • Low Temperature Coefficient ∆VREF/∆T ≤ 100 ppm/°C • Adjustable Output Voltage by two External Resistors VREF ≤ VO ≤ 36 V • Low Dynamic Impedance | ZKA | = 0.1 ΩTYP. ORDERING INFORMATION Part Number Package µPC1093J 3-pin plastic SIP (TO-92) µPC1093G 8-pin plastic SOP (225 mil) µPC1093T Power mini mold (SOT-89) µPC1093TA 5-pin plastic mini mold (SC-74A) The information in this document is subject to change without notice. Document No. G10634EJ5V0DS00 (5th edition) (Previous No. IC-1791) Date Published September 1998 N CP(K) Printed in Japan The mark shows major revised points. © 1986 µPC1093 EQUIVALENT CIRCUIT K R6 R5 REF Q12 Q13 Q14 Q15 Q16 Q17 Q6 Q1 Q5 C2 Q10 R9 Q2 Q7 R1 Q11 R10 R7 C1 D1 R2 R3 Q8 Q3 Q4 R8 Q9 R4 A PIN CONFIGURATION (Marking Side) 3-pin plastic SIP (TO-92) • µPC1093J 1 2 8-pin plastic SOP (225 mil) • µPC1093G 3 K 1 8 REF NC 2 7 NC NC 3 6 A NC 4 5 NC 1 : REF 2:A 3:K Power mini mold (SOT-89) • µPC1093T • µPC1093TA NC 5 A 2 5-pin plastic mini mold (SC-74A) 1 2 K A REF A 4 3 1 2 REF A 3 K REF : Reference A : Anode K : Cathode NC : No Connection µPC1093 ABSOLUTE MAXIMUM RATING (TA = 25 °C, unless otherwise specified.) Ratings Unit Cathode Voltage Parameter VKA Symbol 37 V Cathode Current IK 150 mA Cathode-Anode Reverse Current –IK –100 mA Reference Voltage VREF 7 V Reference Input Current IREF 50 µA Reference-Anode Reverse Current –IREF –10 mA PT 700 mW µPC1093J Power Dissipation µPC1093G 480 µPC1093T 400/2 000Note 1 µPC1093TA 180/510Note 2 Operating Ambient Temperature TA –20 ~ +85 °C Storage Temperature Tstg –65 ~ +150 °C Notes 1. with 16 cm2 × 0.7 mm ceramic substrate 2. with 75 mm2 × 0.7 mm ceramic substrate Caution Exposure to Absolute Maximum Ratings for extended periods may affect device reliability; exceeding the ratings could cause permanent damage. The parameters apply independently. The device should be operated within the limits specified under DC and AC Characteristics. RECOMMENDED OPERATING CONDITIONS Parameter Symbol Cathode Voltage VKA Cathode Current IK Power Dissipation µPC1093J MIN. TYP. MAX. Unit VREF 5 36 V 1 10 100 mA 50 220 mW PT µPC1093G 50 150 µPC1093T 50 125/640Note 1 µPC1093TA 50 58/160Note 2 Operating Ambient Temperature TA –20 +85 °C Notes 1. with 16 cm2 × 0.7 mm ceramic substrate 2. with 75 mm2 × 0.7 mm ceramic substrate 3 µPC1093 ELECTRICAL CHARACTERISTICS (TA = 25 °C, IK = 10 mA, unless otherwise specified.) Parameter Symbol Conditions MIN. TYP. MAX. Unit 2.440 2.495 2.550 V 7 17 mV | VREF | ≤ VKA ≤ 10 V 1.2 2.7 mV/V 10 V ≤ VKA ≤ 36 V 0.7 2 mV/V Reference Voltage VREF VKA = VREF Reference Voltage Deviation Over Temperature ∆VREF 0 °C ≤ TA ≤ 70 °C, VKA = VREF Reference Voltage Deviation Over ∆VREF/∆V Cathode Voltage Reference Input Current IREF VKA = VREF, R1 = 10 kΩ, R2 = ∞ 1 4 µA Reference Input Current Deviation Over Temperature ∆IREF 0 °C ≤ TA ≤ 70 °C, VKA = VREF, R1 = 10 kΩ, R2 = ∞ 0.4 1.2 µA Minimum Cathode Current IK min. VKA = VREF, ∆VREF = 2 % 0.4 1 mA Off-state Cathode Current IK off VKA = 36 V, VREF = 0 0.1 1 µA Dynamic Impedance | ZKA | VKA = VREF, f ≤ 1 kHz 1 mA ≤ IK ≤ 100 mA 0.1 0.5 Ω TEST AND APPLICATION CIRCUIT VIN R0 VOUT R1 K REF R2 GND 4 VOUT A (1+ R1 . ) VREF R2 µPC1093 TYPICAL CHARACTERISTICS Pd vs TA ( I ) Pd vs TA ( II ) 0.8 µPC1093J 2.0 Pd - Power Dissipation - W Pd - Power Dissipation - W 180 °C/W 0.6 µPC1093G 260 °C/W 0.4 µPC1093T 315 °C/W 0.2 µPC1093TA µ PC1093T 62.5 °C/W 1.6 1.2 0.8 µ PC1093TA (with 75 mm2×0.7 mm ceramic substrate) 0 100 20 40 60 80 TA - Operating Ambient Temperature - °C 20 40 60 80 100 TA - Operating Ambient Temperature - °C VREF vs TA IK vs VKA ( I ) 1.2 TA = 25 °C VKA = VREF IK = 10 mA VKA = VREF 1.0 10 IK - Cathode Current - mA VREF - Reference Voltage Deviation - mV 20 0 –10 –20 0.8 0.6 0.4 0.2 –30 –25 0 0 50 75 100 25 TA - Operating Ambient Temperature - °C 1 2 VKA - Cathode Voltage - V 3 IK vs VKA ( II ) VREF vs VKA 20 150 TA = 25 °C IK = 10 mA TA = 25 °C VKA = VREF 10 100 IK - Cathode Current - mA VREF - Reference Voltage Deviation - mV 245 °C/W 0.4 695 °C/W 0 (with 16 cm2×0.7 mm ceramic substrate) 0 –10 –20 50 0 –50 –30 0 10 20 30 VKA - Cathode Voltage - V 40 –100 –2 –1 0 1 2 VKA - Cathode Voltage - V 3 5 µPC1093 IREF vs TA IK off vs TA 0.3 IREF - Reference Input Current - µA VKA = VREF, IK = 10 mA R1 = 10 kΩ , R2 = ∞ 2 1 0 –25 0 25 50 75 IK off - Off-state Cathode Current - µ A 3 VKA = 36 V VREF = 0 0.2 0.1 0 –25 100 TA -Operating Ambient Temperature - °C 0 10 1 0.1 100 k 10 k f - Frequency - Hz 1M Av vs f Av - Voltage Gain - dB 60 40 20 220 Ω IK νo νin 10 kΩ 0 ~ –20 1k 6 10 kΩ (IK = 10 mA) 10 k 100 k 1M f - Frequency - Hz 10 M VREF - Reference Voltage - V ZKAI - Dynamic Impedance - Ω TA = 25 °C VKA = VREF 1 mA≤IK≤100 mA 1k 50 75 100 Pulse Response VIN - Input Voltage - V ZKA vs f 100 0.01 100 25 TA -Operating Ambient Temperature - °C TA = 25 °C VKA = VREF RO = 220 Ω 5 0 3 2 1 0 0 2 4 6 T - Time - µ s 8 10 µPC1093 STABILITY AREA TEST CIRCUIT a a : VKA = VREF 90 b : VKA = 5 V 80 c : VKA = 10 V d : VKA = 15 V 70 60 150 Ω a b IKA a c c Stable d 50 b CKA Stable IKA - Cathode Current - mA 100 b, c, d 40 150 Ω 30 Unstable 20 IKA R CKA 10 0 0.001 10 kΩ 0.01 0.1 1 10 CKA - Load Capacitance - µF CKA : Monolithic Ceramic Capacitors Caution of Stability Area If the Aluminum electrolytic capacitor is used, it should be kept CKA ≥ 2.2 µF. When using plural different types of capacitors, each capacitor is needed to be stable independently. When designing a circuit, take the characteristic variation among devices into consideration, so that the designed circuit has an enough characteristic margin supporting the standard specifications described above. 7 µPC1093 PACKAGE DRAWINGS 3 PIN PLASTIC SIP (TO-92) A N M 1 3 Y V J H F G U M NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS A 5.0±0.2 F 0.5 +0.3 −0.1 G 0.12 H 1.27 J 1.33 MAX. M 5.0±0.5 N 4.0±0.2 U V 2.8 MAX. 0.5±0.1 Y 15.0±0.7 P3J-127B-2 8 µPC1093 8 PIN PLASTIC SOP (225 mil) 8 5 detail of lead end P 4 1 A H F I G J S B C E D M L N K S M NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS A 5.2 +0.17 −0.20 B 0.78 MAX. C 1.27 (T.P.) D 0.42 +0.08 −0.07 E F 0.1±0.1 1.59±0.21 G 1.49 H 6.5±0.3 I 4.4±0.15 J 1.1±0.2 K 0.17 +0.08 −0.07 L M 0.6±0.2 0.12 N 0.10 P 3° +7° −3° S8GM-50-225B-5 9 µPC1093 POWER MINI MOLD (SOT-89) (Unit: mm) 4.5±0.1 1.6±0.2 0.8 MIN. 0.42±0.06 0.42±0.06 0.47 ±0.06 1.5 3.0 10 4.0±0.25 2.5±0.1 1.5±0.1 0.41+0.03 −0.05 µPC1093 5 PIN PLASTIC MINI MOLD detail of lead end F G R L E A H I B J S N C D M M K S ITEM A MILLIMETERS B 2.9±0.2 0.3 C 0.95 (T.P.) D 0.32 +0.05 −0.02 E 0.05±0.05 F 1.4 MAX. G 1.1+0.2 −0.1 H 2.8±0.2 I 1.5+0.2 −0.1 J 0.65 +0.1 −0.15 K 0.16 +0.1 −0.06 L 0.4±0.2 M N 0.19 0.1 R 5°±5° S5TA-95-15A 11 µPC1093 RECOMMENDED SOLDERING CONDITIONS When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering processes are used, or if the soldering is performed under different conditions, please make sure to consult with our sales offices. For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL” (C10535E). Through-hole device µPC1093J: 3-pin plastic SIP (TO-92) Process Wave soldering (only to leads) Conditions Solder temperature: 260 °C or below, Flow time: 10 seconds or less. Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure that the package body does not get jet soldered. Surface mount devices µPC1093G: 8-pin plastic SOP (225 mil) Process Infrared ray reflow Conditions Peak temperature: 230 °C or below (Package surface temperature), Reflow time: 30 seconds or less (at 210 °C or higher), Symbol IR30-00-1 Maximum number of reflow processes: 1 time. VPS Peak temperature: 215 °C or below (Package surface temperature), Reflow time: 40 seconds or less (at 200 °C or higher), Maximum number of reflow processes: 1 time. VP15-00-1 Wave soldering Solder temperature: 260 °C or below, Flow time: 10 seconds or less, Maximum number of flow processes: 1 time, Pre-heating temperature: 120 °C or below (Package surface temperature). WS60-00-1 Caution Apply only one kind of soldering condition to a device, or the device will be damaged by heat stress. 12 µPC1093 µPC1093T: Power mini mold (SOT-89) Process Conditions Symbol Infrared ray reflow Peak temperature: 235 °C or below (Package surface temperature), Reflow time: 30 seconds or less (at 210 °C or higher), Maximum number of reflow processes: 2 times. IR35-00-2 VPS Peak temperature: 215 °C or below (Package surface temperature), Reflow time: 40 seconds or less (at 200 °C or higher), Maximum number of reflow processes: 2 times. VP15-00-2 Wave soldering Solder temperature: 260 °C or below, Flow time: 10 seconds or less, Maximum number of flow processes: 1 time, Pre-heating temperature: 120 °C or below (Package surface temperature). WS60-00-1 Caution Apply only one kind of soldering condition to a device, or the device will be damaged by heat stress. µPC1093TA: 5-pin plastic mini mold (SC-74A) Process Conditions Symbol Infrared ray reflow Peak temperature: 235 °C or below (Package surface temperature), Reflow time: 30 seconds or less (at 210 °C or higher), Maximum number of reflow processes: 3 times. IR35-00-3 VPS Peak temperature: 215 °C or below (Package surface temperature), Reflow time: 40 seconds or less (at 200 °C or higher), Maximum number of reflow processes: 3 times. VP15-00-3 Wave soldering Solder temperature: 260 °C or below, Flow time: 10 seconds or less, Maximum number of flow processes: 1 time, Pre-heating temperature: 120 °C or below (Package surface temperature). WS60-00-1 Caution Apply only one kind of soldering condition to a device, or the device will be damaged by heat stress. 13 µPC1093 REFERENCE DOCUMENTS Quality Grades on NEC Semiconductor Devices C11531E Semiconductor Device Mounting Technology Manual C10535E IC Package Manual C10943X Semiconductors Selection Guide X10679E NEC Semiconductor Device Reliability/Quality Control System IEI-1212 -Three Terminal Regulator REMARK OF THE PACKAGE MARK The package marks of the µPC1093T and the µPC1093TA are the symbols as follows. Part Number 14 Mark µPC1093T 93 µPC1093TA K93 µPC1093 [MEMO] 15 µPC1093 [MEMO] The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96.5