PRELIMINARY DATA SHEET MOS INTEGRATED CIRCUIT µPD72874 IEEE1394 OHCI 1.1 COMPLIANT 3PORT PHY-LINK 1-CHIP HOST CONTROLLER The µPD72874 is the LSI that integrated OHCI-Link and PHY function into a single chip. The µPD72874 complies with the 1394 OHCI Specification 1.1 and the IEEE Std 1394a-2000 specifications, and works up to 400 Mbps. It makes design so compact for PC and PC card application. FEATURES • Compliant with Link Layer Services as defined in 1394 Open Host Controller Interface specification release 1.1 • Compliant with Physical Layer Services as defined in IEEE Std 1394a-2000 • Provides three cable ports at 100/200/400 Mbps • Super Low power consumption for Physical Layer • Compliant with protocol enhancement as defined in IEEE Std1394a-2000 • Modular 32-bit host interface compliant to PCI Specification release 2.2 • Supports PCI-Bus Power Management Interface Specification release 1.1 • Modular 32-bit host interface compliant to Card Bus Specification • Cycle Master and Isochronous Resource Manager capable • Built-in FIFOs for isochronous transmit (2048 bytes), asynchronous transmit (2048 bytes), and receive (3072 bytes) • Supports D0, D1, D2, D3hot • Supports wake up function from D3cold • 32-bit CRC generation and checking for receive/transmit packets • 4 isochronous transmit DMAs and 4 isochronous receive DMAs supported • 32-bit DMA channels for physical memory read/write • Clock generation by 24.576 MHz X’tal • 2-wire Serial EEPROM TM interface supported • Separate power supply Link and PHY • Programmable latency timer from serial EEPROM in Cardbus mode (CARD_ON = 1) ORDERING INFORMATION Part number µPD72874GC-YEB Package 120-pin plastic TQFP (Fine pitch) (14 x 14) The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. S15306EJ2V0DS00 (2nd edition) Date Published April 2002 NS CP (K) Printed in Japan The mark shows major revised points. 2001 µPD72874 Firewarden™ ROADMAP Firewarden Series OHCI Link µPD72862 IEEE1394-1995 Core Development OHCI Link µPD72861 OHCI Link µPD72860 1-Chip OHCI+PHY µPD72872 1-Chip OHCI+PHY µPD72870A, 72870B 1-Chip OHCI+PHY µPD72870 Link Core 2 Preliminary Data Sheet S15306EJ2V0DS 1-Chip OHCI 1.1+PHY µPD72874 1-Chip OHCI 1.1+PHY µPD72873 Preliminary Data Sheet S15306EJ2V0DS CARD_ON D3CSUP PME PCI Configuration Register Power Management Controller PCI Controller DMA Controller Comand FIFO CSR IR FIFO AT FIFO IT FIFO ROM Interface I/O Register Link Core State Machine Logic PHY Interface Cable Power Status Link Interface Transmit Data Encoder Receive Data Decoder and Retimer Arbitration and Control State Machine Logic PC0 PC1 PC2 REQ GNT FRAME CBE0 to CBE3 IRDY DEVSEL TRDY IDSEL STOP INTA AD0 to AD31 PAR PERR SERR CLKRUN L_VDD PCI Interface I/O PCI_VDD TpBias0 TpBias1 TpBias2 R0 R1 Voltage and Current Generator XI XO TpA2p TpA2n TpB2p TpB2n Cable Port2 Crystal Oscillator PLL System and Transmit Clock Generator TpA1p TpA1n TpB1p TpB1n TpA0p TpA0n TpB0p TpB0n Cable Port1 Cable Port0 P_AVDD PCLK PRST RSMRST GND PHY BLOCK P_DVDD LINK BLOCK µPD72874 BLOCK DIAGRAMS P_RESET CPS GND GROM_EN GROM_SCL GROM_SDA 3 µPD72874 PIN CONFIGURATION (TOP VIEW) • 120-pin plastic TQFP (Fine pitch) (14 x 14) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 L_VDD AD17 AD16 CBE2 FRAME IRDY TRDY GND DEVSEL STOP PERR SERR L_VDD PAR CBE1 GND AD15 AD14 AD13 AD12 L_VDD AD11 AD10 GND AD9 AD8 CBE0 AD7 AD6 PCI_VDD 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 L_VDD CLKRUN PME INTA PRST PCLK GNT REQ AD31 AD30 GND AD29 AD28 L_VDD AD27 AD26 AD25 AD24 PCI_VDD GND CBE3 IDSEL AD23 AD22 L_VDD AD21 AD20 AD19 AD18 GND 120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105 104 103 102 101 100 99 98 97 96 95 94 93 92 91 GND CARD_ON GROM_EN GROM_SCL GROM_SDA IC(L) D3CSUP GND P_AVDD TpBias2 TpA2p TpA2n TpB2p TpB2n GND TpA1p TpA1n TpB1p TpB1n TpA0p TpA0n TpB0p TpB0n TpBias1 TpBias0 P_AVDD GND CPS RI1 RI0 µPD72874GC-YEB 4 Preliminary Data Sheet S15306EJ2V0DS 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 P_AVDD GND XO XI P_AVDD IC(N) GND GND P_DVDD P_RESET IC(L) P_DVDD IC(L) IC(L) IC(L) IC(H) RSMRST P_DVDD PC2 PC1 PC0 GND AD0 AD1 AD2 AD3 L_VDD AD4 AD5 GND µPD72874 PIN NAME AD0 to AD31 : PCI Multiplexed Address and Data P_AVDD : PHY Analog VDD CARD_ON : PCI/Card Select P_DVDD : PHY Digital VDD CBE0 to P_RESET : PHY Power on Reset Input : Command/Byte Enables CBE3 REQ : Bus_master Request : PCICLK Running RI0 : Resistor0 for Reference Current Setting CPS : Cable Power Status Input RI1 : Resistor1 for Reference Current Setting D3CSUP : D3cold Support RSMRST : Resume Reset DEVSEL : Device Select SERR : System Error FRAME : Cycle Frame STOP : PCI Stop GND : GND TpA0n : Port-1 Twisted Pair A Negative Input/Output GNT : Bus_master Grant TpA0p : Port-1 Twisted Pair A Positive Input/Output CLKRUN GROM_EN : Serial EEPROM Enable TpA1n : Port-2 Twisted Pair A Negative Input/Output GROM_SCL : Serial EEPROM Clock Output TpA1p : Port-2 Twisted Pair A Positive Input/Output GROM_SDA : Serial EEPROM Data Input / Output TpA2n : Port-3 Twisted Pair A Negative Input/Output IC(H) : Internally Connected (High Clamped) TpA2p : Port-3 Twisted Pair A Positive Input/Output IC(L) : Internally Connected (Low Clamped) TpB0n : Port-1 Twisted Pair B Negative Input/Output IC(N) : Internally Connected (Open) TpB0p : Port-1 Twisted Pair B Positive Input/Output IDSEL : ID Select TpB1n : Port-2 Twisted Pair B Negative Input/Output INTA : Interrupt TpB1p : Port-2 Twisted Pair B Positive Input/Output IRDY : Initiator Ready TpB2n : Port-3 Twisted Pair B Negative Input/Output L_VDD : VDD for Link Digital Core and Link I/Os TpB2p : Port-3 Twisted Pair B Positive Input/Output PAR : Parity TpBias0 : Port-1 Twisted Pair Bias Voltage Output PC0 to PC2 : Power Class Input TpBias1 : Port-2 Twisted Pair Bias Voltage Output PCI_VDD : VDD for PCI I/Os TpBias2 : Port-3 Twisted Pair Bias Voltage Output PCLK : PCI Clock TRDY : Target Ready PERR : Parity Error XI : X’tal XI PME : PME Output XO : X’tal XO PRST : Reset Preliminary Data Sheet S15306EJ2V0DS 5 µPD72874 CONTENTS 1. PIN 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 FUNCTIONS..................................................................................................................................... 8 PCI/Cardbus Interface Signals: (52 pins) ...................................................................................... 8 PHY Signals: (20 pins) .................................................................................................................. 10 PHY Control Signals: (4 pins)....................................................................................................... 10 PCI/Cardbus Select Signal: (1 pin)............................................................................................... 10 Serial ROM Interface Signals: (3 pins)......................................................................................... 11 D3cold Wake Up Function Signals: (2 pins) ............................................................................... 11 IC: (7 pins) ...................................................................................................................................... 11 VDD ................................................................................................................................................... 12 GND................................................................................................................................................. 12 2. PHY REGISTERS................................................................................................................................... 13 2.1 Complete Structure for PHY Registers........................................................................................ 13 2.2 Port Status Page (Page 000)......................................................................................................... 16 2.3 Vendor ID Page (Page 001) ........................................................................................................... 17 2.4 Vendor Dependent Page (Page 111 : Port_select 0001) ............................................................ 17 3. CONFIGURATION REGISTERS .......................................................................................................... 18 3.1 PCI Bus Mode Configuration Register (CARD_ON = Low)........................................................ 18 3.1.1 Offset_00 Vendor ID Register ........................................................................................................... 19 3.1.2 Offset_02 Device ID Register............................................................................................................ 19 3.1.3 Offset_04 Command Register ........................................................................................................... 19 3.1.4 Offset_06 Status Register ................................................................................................................. 20 3.1.5 Offset_08 Revision ID Register ......................................................................................................... 21 3.1.6 Offset_09 Class Code Register......................................................................................................... 21 3.1.7 Offset_0C Cache Line Size Register................................................................................................. 21 3.1.8 Offset_0D Latency Timer Register .................................................................................................... 21 3.1.9 Offset_0E Header Type Register ...................................................................................................... 21 3.1.10 Offset_0F BIST Register .................................................................................................................. 21 3.1.11 Offset_10 Base Address 0 Register ................................................................................................ 22 3.1.12 Offset_2C Subsystem Vendor ID Register ...................................................................................... 22 3.1.13 Offset_2E Subsystem ID Register................................................................................................... 22 3.1.14 Offset_34 Cap_Ptr Register ............................................................................................................ 22 3.1.15 Offset_3C Interrupt Line Register.................................................................................................... 22 3.1.16 Offset_3D Interrupt Pin Register ..................................................................................................... 23 3.1.17 Offset_3E Min_Gnt Register ........................................................................................................... 23 3.1.18 Offset_3F Max_Lat Register ........................................................................................................... 23 3.1.19 Offset_40 PCI_OHCI_Control Register ........................................................................................... 23 3.1.20 Offset_60 Cap_ID & Next_Item_Ptr Register .................................................................................. 23 3.1.21 Offset_62 Power Management Capabilities Register...................................................................... 24 3.1.22 Offset_64 Power Management Control/Status Register.................................................................. 25 3.2 CardBus Mode Configuration Register (CARD_ON = High)...................................................... 26 3.2.1 Offset_14/18 6 Base Address 1/2 Register (Cardbus Status Registers).............................................. 27 3.2.2 Offset_28 Cardbus CIS Pointer......................................................................................................... 28 3.2.3 Offset_80 CIS Area ........................................................................................................................... 28 Preliminary Data Sheet S15306EJ2V0DS µPD72874 4. PHY FUNCTION.................................................................................................................................... 29 4.1 Cable Interface............................................................................................................................... 29 4.1.1 Connections ......................................................................................................................................... 29 4.1.2 Cable Interface Circuit.......................................................................................................................... 30 4.1.3 CPS ...................................................................................................................................................... 30 4.1.4 Unused Ports........................................................................................................................................ 30 4.2 PLL and Crystal Oscillation Circuit ............................................................................................. 30 4.2.1 Crystal Oscillation Circuit ..................................................................................................................... 30 4.2.2 PLL ....................................................................................................................................................... 30 4.3 PC0 to PC2 ..................................................................................................................................... 30 4.4 P_RESET ........................................................................................................................................ 30 4.5 RI0, RI1 ........................................................................................................................................... 30 5. ELECTRICAL SPECIFICATIONS......................................................................................................... 31 6. PACKAGE DRAWING .......................................................................................................................... 34 7. RECOMMENDED SOLDERING CONDITIONS................................................................................... 35 Preliminary Data Sheet S15306EJ2V0DS 7 µPD72874 1. PIN FUNCTIONS 1.1 PCI/Cardbus Interface Signals: (52 pins) (1/2) Name PAR I/O I/O Pin No. 44 IOL Volts(V) Function Block * PCI/Cardbus 5/3.3 Parity is even parity across AD0 to AD31 and CBE0 Link to CBE3. It is an input when AD0 to AD31 is an input; it is an output when AD0 to AD31 is an output. AD0 to AD31 I/O 9, 10, 12, 13, PCI/Cardbus 5/3.3 PCI Multiplexed Address and Data Link - 5/3.3 Command/Byte Enables are multiplexed bus Link 15 to18, 23, 24, 26 to 29, 32, 33, 47 to 50, 52, 53, 55, 56, 58, 59, 62, 63, 65 to 68 CBE0 to I/O 21, 34, 45, 57 CBE3 FRAME commands & byte enables. I/O 35 PCI/Cardbus 5/3.3 Frame is asserted by the initiator to indicate the Link cycle beginning and is kept asserted during the burst cycle. If Cardbus mode (CARD_ON = 1), this pin should be pulled up to VDD. TRDY I/O 37 PCI/Cardbus 5/3.3 Target Ready indicates that the current data phase IRDY I/O 36 PCI/Cardbus 5/3.3 Initiator Ready indicates that the current bus Link of the transaction is ready to be completed. Link master is ready to complete the current data phase. During a write, its assertion indicates that the initiator is driving valid data onto the data bus. During a read, its assertion indicates that the initiator is ready to accept data from the currentlyaddressed target. REQ O 8 PCI/Cardbus 5/3.3 GNT I 7 - 5/3.3 IDSEL I 22 - 5/3.3 Bus_master Request indicates to the bus arbiter Link that this device wants to become a bus master. Bus_master Grant indicates to this device that Link access to the bus has been granted. Initialization Device Select is used as chip select Link for configuration read/write transaction during the phase of device initialization. If Cardbus mode (CARD_ON = 1), this pin should be pulled up to VDD. DEVSEL I/O 39 PCI/Cardbus 5/3.3 Device Select when actively driven, indicates that Link the driving device has decoded its address as the target of the current access. STOP I/O 40 PCI/Cardbus 5/3.3 PCI Stop when actively driven, indicates that the Link target is requesting the current bus master to stop the transaction. PME O 3 PCI/Cardbus 5/3.3 PME Output for power management event. Remark *: If the Link pin is pulled up, it should be connected to L_VDD. 8 Preliminary Data Sheet S15306EJ2V0DS Link µPD72874 (2/2) Name I/O CLKRUN I/O Pin No. 2 IOL Volts(V) PCI/Cardbus 5/3.3 Function PCICLK Running as input, to determine the status Block * Link of PCLK; as output, to request starting or speeding up clock. INTA O 4 PCI/Cardbus 5/3.3 Interrupt the PCI interrupt request A. Link PERR I/O 41 PCI/Cardbus 5/3.3 Parity Error is used for reporting data parity errors Link during all PCI transactions, except a special cycle. It is an output when AD0 to AD31 and PAR are both inputs. It is an input when AD0 to AD31 and PAR are both outputs. SERR O 42 PCI/Cardbus 5/3.3 System Error is used for reporting address parity Link errors, data parity errors during the special cycle, or any other system error where the effect can be catastrophic. When reporting address parity errors, it is an output. PRST I 5 - 5/3.3 Reset PCI reset Link PCLK I 6 - 5/3.3 PCI Clock 33 MHz system bus clock. Link Remark *: If the Link pin is pulled up, it should be connected to L_VDD. Preliminary Data Sheet S15306EJ2V0DS 9 µPD72874 1.2 PHY Signals: (20 pins) Name TpA0p I/O I/O Pin No. 101 IOL - Volts(V) Function Block * Note 1 - Port-1 Twisted Pair A Positive Input/Output PHY Analog PHY Analog TpA0n I/O 100 - - Port-1 Twisted Pair A Negative Input/Output Note 1 TpB0p I/O 99 - - Port-1 Twisted Pair B Positive Input/Output Note 1 TpB0n I/O 98 - Note 1 - Port-1 Twisted Pair B Negative Input/Output PHY Analog PHY Analog TpA1p I/O 105 - - Port-2 Twisted Pair A Positive Input/Output Note 1 TpA1n I/O 104 - - Port-2 Twisted Pair A Negative Input/Output Note 1 TpB1p I/O TpB1n I/O 103 - 102 - - Port-2 Twisted Pair B Positive Input/Output Note 1 Note 1 PHY Analog PHY Analog I/O 110 - - TpA2n I/O 109 - - Port-3 Twisted Pair A Negative Input/Output Note 1 TpB2n CPS TpBias0 108 - Note 1 Port-3 Twisted Pair B Positive Input/Output PHY Analog PHY Digital I/O 107 - - I 93 - - Cable Power Status Input Note2 96 - PHY Analog - Port-3 Twisted Pair B Negative Input/Output Note 1 O PHY Analog Port-2 Twisted Pair B Negative Input/Output TpA2p I/O PHY Analog - Port-3 Twisted Pair A Positive Input/Output Note 1 TpB2p PHY Analog - PHY Analog Port-1 Twisted Pair Bias Voltage Output Note 1 PHY Analog Note 1 PHY Analog TpBias1 O 97 - - Port-2 Twisted Pair Bias Voltage Output TpBias2 O 111 - - Port-3 Twisted Pair Bias Voltage Output Note 1 PHY Analog - Resistor0 for Reference Current Setting Note 3 PHY Analog Note 3 PHY Analog RI0 - 91 - RI1 - 92 - - Resistor1 for Reference Current Setting XI I 87 - - X’tal XI PHY Analog XO O 88 - - X’tal XO PHY Analog Notes 1. If unused port, please refer to 4.1.4 Unused Ports. 2. Please refer to 4.1.3 CPS. 3. Please refer to 4.5 RI0, RI1. Remark *: If the PHY Digital pin is pulled up, it should be connected to P_DVDD. If the PHY Analog pin is pulled up, it should be connected to P_AVDD. 1.3 PHY Control Signals: (4 pins) Name I/O Pin No. IOL Volts(V) PC0 to PC2 I 70 to 72 - 3.3 P_RESET I 81 - - Function Power Class Input Note 1 PHY Power on Reset Input Note 2 Block * PHY Digital PHY Digital Notes 1. Please refer to 4.3 PC0 to PC2. 2. Please refer to 4.4 P_RESET. Remark *: If the PHY Digital pin is pulled up, it should be connected to P_DVDD. 1.4 PCI/Cardbus Select Signal: (1 pin) Name CARD_ON I/O I Pin No. 119 IOL Volts(V) - 3.3 Function PCI/CardBus Select 1:Cardbus mode 0:PCI bus mode Remark *: If the Link pin is pulled up, it should be connected to L_VDD. 10 Preliminary Data Sheet S15306EJ2V0DS Block * Link µPD72874 1.5 Serial ROM Interface Signals: (3 pins) Name I/O Pin No. IOL Volts(V) Function Block * GROM_SDA I/O 116 6 mA 3.3 Serial EEPROM Data Input / Output Link GROM_SCL O 117 6 mA 3.3 Serial EEPROM Clock Output Link GROM_EN I 118 - 3.3 Serial EEPROM Enable Link 1: GUID Load enable 0: GUID Load disable Remark *: If the Link pin is pulled up, it should be connected to L_VDD. 1.6 D3cold Wake Up Function Signals: (2 pins) Name D3CSUP I/O I Pin No. 114 IOL Volts(V) - 5/3.3 Function D3cold Support Block * Link 1: D3cold wake up enable 0: D3cold wake up disable RSMRST I 74 - 5/3.3 Link Resume Reset D3cold support (114 pin) = ‘1’ As this mode supports D3cold wake up, RSMRST must connect system RSMRST signal. D3cold support (114 pin) = ‘0’ As this mode is the µPD72872 compatible, RSMRST clamp to ‘1’. Remark *: If the Link pin is pulled up, it should be connected to L_VDD. 1.7 IC: (7 pins) IOL Volts(V) IC(H) Name I/O I 75 Pin No. - - Internally Connected (High clamped) Function Block * Link IC(L) I 76 to 78, 80, 115 - - Internally Connected (Low clamped) - IC(N) - 85 - - Internally Connected (Open) - Remark *: If the Link pin is pulled up, it should be connected to L_VDD. Preliminary Data Sheet S15306EJ2V0DS 11 µPD72874 1.8 VDD Name I/O Pin No. IOL Volts(V) PCI_VDD - 19, 60 - 5/3.3 L_VDD - 1, 14, 25, 31, 43, - 3.3 Function Block * VDD for PCI I/Os Link VDD for Link digital Core and Link I/Os Link To use D3cold wake up function, L_VDD must switch 51, 64 VDD to Vaux when the system suspend. P_DVDD - 73, 79, 82 - 3.3 PHY digital VDD PHY Digital P_AVDD - 86, 90, 95, 112 - 3.3 PHY Analog VDD PHY Analog Remark *: If the Link pin is pulled up, it should be connected to L_VDD. If the PHY Digital pin is pulled up, it should be connected to P_DVDD. If the PHY Analog pin is pulled up, it should be connected to P_AVDD. 1.9 GND Name GND I/O Pin No. IOL Volts(V) - 11, 20, 30, 38, 46, - - Function GND 54, 61, 69, 83, 84, 89, 94, 106, 113, 120 12 Preliminary Data Sheet S15306EJ2V0DS Block - µPD72874 2. PHY REGISTERS 2.1 Complete Structure for PHY Registers Figure 2-1. Complete Structure of PHY Registers 0 1 2 0000 0001 3 4 5 Physical_ID RHB IBR 6 7 R PS Gap_count 0010 Extended (7) Reserved Total_ports 0011 Max_speed Reserved Delay Jitter 0100 Link_active Contender 0101 Watchdog ISBR Loop Pwr_class Pwr_fail 0110 Timeout Port_event Enab_accel Enab_multi Reserved 0111 Page_select Reserved 1000 Register0 (page_select) 1001 Register1 (page_select) 1010 Register2 (page_select) 1011 Register3 (page_select) 1100 Register4 (page_select) 1101 Register5 (page_select) 1110 Register6 (page_select) 1111 Register7 (page_select) Port_select Table 2-1. Bit Field Description (1/3) Size R/W Reset value Physical_ID Field 6 R 000000 R 1 R 0 Description Physical_ID value selected from Self_ID period. If this bit is 1, the node is root. 1: Root 0: Not root PS 1 R Cable power status. 1: Cable power on 0: Cable power off RHB 1 R/W 0 Root Hold -off bit. If 1, becomes root at the bus reset. IBR 1 R/W 0 Initiate bus reset. Setting to 1 begins a long bus reset. Long bus reset signal duration: 166 µsec. Returns to 0 at the beginning of bus reset. Gap_count 6 R/W 111111 Gap count value. It is updated by the changes of transmitting and receiving the PHY configuration packet Tx/Rx. The value is maintained after first bus reset. After the second bus reset it returns to reset value. Extended 3 R 111 Shows the extended register map. Preliminary Data Sheet S15306EJ2V0DS 13 µPD72874 Table 2-1. Bit Field Description (2/3) Field Total_ports Size R/W Reset value 4 R 0011 Description Supported port number. 0011: 3 ports Max_speed 3 R 010 Indicate the maximum speed that this node supports. 010: 98.304, 196.608 and 393.216 Mbps Delay 4 R 0000 Link_active 1 R/W 1 Indicate worst case repeating delay time. 144 + (Delay x 20) = 144 nsec Link active. 1: Enable 0: Disable The logical AND status of this bit and LPS. State will be referred to “L bit” of Self-ID Packet#0. The LPS is a PHY/Link interface signal and is defined in P1394a-2000. It is an internal signal in the µPD72874. Contender 1 R/W 0 Contender. “1” indicate this node support bus manager function. This bit will be referred to “C bit” of Self-ID Packet#0. Jitter 3 R Pwr_class 3 R/W 010 The difference of repeating time (Max.-Min.). (2+1) x 20=60 nsec See Power class. Description Please refer to IEEE1394a-2000 [4.3.4.1]. This bit will be referred to Pwr field of Self-ID Packet#0. Watchdog 1 R/W 0 Watchdog Enable. This bit serves two purposes. When set to 1, if any one port does resume, the Port_event bit becomes 1. To determine whether or not an interrupt condition shall be indicated to the link. On condition of LPS = 0 and Watchdog = 0, LKON as interrupt of Loop, Pwr_fail, Timeout is not output. ISBR 1 R/W 0 Initiate short (arbitrated) bus reset. Setting to 1 acquires the bus and begins short bus reset. Short bus reset signal output : 1.3 µsec Returns to 0 at the beginning of the bus reset. Loop 1 R/W 0 Loop detection output. 1: Detection Writing 1 to this bit clears it to 0. Writing 0 has no effect. Pwr_fail 1 R/W 1 Power cable disconnect detect. It becomes 1 when there is a change from 1 to 0 in the CPS bit. Writing 1 to this bit clears it to 0. Writing 0 has no effect. 14 Preliminary Data Sheet S15306EJ2V0DS µPD72874 Table 2-1. Bit Field Description (3/3) Field Timeout Size R/W Reset value 1 R/W 0 Description Arbitration state machine time-out. Writing 1 to this bit clears it to 0. Writing 0 has no effect. Port_event 1 R/W 0 Set to 1 when the Int_enable bit in the register map of each port is 1 and there is a change in the ports connected, Bias, Disabled and Fault bits. Set to 1 when the Watchdog bit is 1 and any one port does resume. Writing 1 to this bit clears it to 0. Writing 0 has no effect. Enab_accel 1 R/W 0 Enables arbitration acceleration. Ack-acceleration and Fly-by arbitration are enabled. 1: Enabled 0: Disabled If this bit changes while the bus request is pending, the operation is not guaranteed. Enab_multi 1 R/W 0 Enable multi-speed packet concatenation. Setting this bit to 1 follows multi-speed transmission. When this bit is set to 0,the packet will be transmitted with the same speed as the first packet. Page_select 3 R/W 000 Select page address between 1000 to 1111. 000: Port Status Page 001: Vendor ID Page 111: Vendor Dependent Page Others: Unused Port_select 4 R/W 0000 Port Selection. Selecting 000 (Port Status Page) with the Page_select selects the port. Selecting 111 (Vendor Dependent Page) with the Page_select have to select the Port 1. 0000: Port 0 0001: Port 1 0010: Port 2 Others: Unused Reserved - R 000… Reserved. Read as 0. Preliminary Data Sheet S15306EJ2V0DS 15 µPD72874 2.2 Port Status Page (Page 000) Figure 2-2. Port Status Page 0 1 1000 2 AStat 1001 3 BStat Negotiated_speed Int_enable 4 5 6 7 Child Connected Bias Disabled Fault 1010 Reserved 1011 Reserved 1100 Reserved 1101 Reserved 1110 Reserved 1111 Reserved Reserved Table 2-2. Bit Field Description Field AStat Size R/W Reset value 2 R XX Description A port status value. 00: invalid, 10: “0” 01: “1”, 11: “Z” BStat 2 R XX B port status value. 00: invalid, 10: “0” 01: “1”, 11: “Z” Child 1 R Child node status value. 1: Connected to child node 0: Connected to parent node Connected 1 R 0 Connection status value. 1: Connected 0: Disconnected Bias 1 R Bias voltage status value. 1: Bias voltage 0: No bias voltage Disabled 1 R/W See The reset value is set to 0: Enabled. Description Negotiated_ 3 R Shows the maximum data transfer rate of the node connected to this port. Speed 000: 100 Mbps 001: 200 Mbps 010: 400 Mbps Int_enable 1 R/W 0 When set to 1, the Port_event is set to 1 if any of this port's Connected, Bias, Disabled or Fault bits change state. Fault 1 R/W 0 Set to 1 if an error occurs during Suspend/Resume. Writing 1 to this bit clears it to 0. Writing 0 has no effect. Reserved 16 - R 000… Reserved. Read as 0. Preliminary Data Sheet S15306EJ2V0DS µPD72874 2.3 Vendor ID Page (Page 001) Figure 2-3. Vendor ID Page 0 1 2 3 4 1000 Compliance_level 1001 Reserved 5 6 7 6 7 1010 Vendor_ID 1011 1100 1101 Product_ID 1110 1111 Table 2-3. Bit Field Description Field Size R/W Reset value Compliance_level 8 R 00000001 According to IEEE1394a-2000. Vendor_ID 24 R 00004CH Company ID Code value, NEC IEEE OUI. Product_ID 24 R - R Reserved Description Product code. 000… Reserved. Read as 0. 2.4 Vendor Dependent Page (Page 111 : Port_select 0001) Figure 2-4. Vendor Dependent Page 0 1 2 3 4 5 1000 1001 1010 1011 Reg_array 1100 1101 1110 1111 Table 2-4. Bit Field Description Field Reg_array Size R/W Reset value 64 R/W 0 Description This register array is possible R/W. Preliminary Data Sheet S15306EJ2V0DS 17 µPD72874 3. CONFIGURATION REGISTERS 3.1 PCI Bus Mode Configuration Register (CARD_ON = Low) 31 24 23 16 15 08 07 00 Device ID Vendor ID 00H Status Command 04H Class Code BIST Header Type Latency Timer Revision ID 08H Cache Line Size 0CH Base Address 0 10H Reserved 14H Reserved 18H Reserved 1CH Reserved 20H Reserved 24H Reserved 28H Subsystem ID Subsystem Vendor ID 30H Reserved Reserved Cap_Ptr Min_Gnt Interrupt Pin Interrupt Line 3CH PCI_OHCI_Control 40H Reserved 44H Reserved 48H Reserved 4CH Reserved 50H Reserved 54H Reserved 58H Reserved 5CH Power Management Capabilities Next_Item_Ptr Reserved Cap_ID Power Management Control/Status Reserved 18 34H 38H Reserved Max_Lat 2CH Preliminary Data Sheet S15306EJ2V0DS 60H 64H 68H FCH µPD72874 3.1.1 Offset_00 Vendor ID Register This register identifies the manufacturer of the µPD72874. The ID is assigned by the PCI_SIG committee. Bits 15-0 R/W R Description Constant value of 1033H. 3.1.2 Offset_02 Device ID Register This register identifies the type of the device for the µPD72874. The ID is assigned by NEC Corporation. Bits 15-0 R/W R 3.1.3 Offset_04 Description Constant value of 00F2H. Command Register The register provides control over the device’s ability to generate and respond to PCI cycles. Bits R/W Description 0 R I/O enable Constant value of 0. The µPD72874 does not respond to PCI I/O accesses. 1 R/W Memory enable Default value of 1. It defines if the µPD72874 responds to PCI memory accesses. This bit should be set to one upon power-up reset. 0: The µPD72874 does not respond to PCI memory cycles 1: The µPD72874 responds to PCI memory cycles 2 R/W Master enable Default value of 1. It enables the µPD72874 as bus-master on the PCI-bus. 0: The µPD72874 cannot generate PCI accesses by being a bus-master 1: The µPD72874 is capable of acting as a bus-master 3 R Special cycle monitor enable Constant value of 0. The special cycle monitor is always disabled. 4 R/W Memory write and invalidate enable Default value of 0. It enables Memory Write and Invalid Command generation. 0: Memory write must be used 1: The µPD72874, when acts as PCI master, can generate the command 5 R VGATM color palette invalidate enable Constant value of 0. VGA color palette invalidate is always disabled. 6 R/W Parity error response Default value of 0. It defines if the µPD72874 responds to PERR. 0: Ignore parity error 1: Respond to parity error 7 R 8 R/W Stepping enable Constant value of 0. Stepping is always disabled. System error enable Default value of 0. It defines if the µPD72874 responds to SERR. 0: Disable system error checking 1: Enable system error checking 9 R Fast back-to-back enable Constant value of 0. Fast back-to-back transactions are only allowed to the same agent. 15-10 R Reserved Constant value of 000000. Preliminary Data Sheet S15306EJ2V0DS 19 µPD72874 3.1.4 Offset_06 Status Register This register tracks the status information of PCI-bus related events which are relevant to the µPD72874. “Read” and “Write” are handled somewhat differently. Bits R/W Description 3-0 R Reserved Constant value of 0000. 4 R New capabilities 6,5 R Reserved Constant value of 00. 7 R Fast back-to-back capable Constant value of 1. It indicates that the µPD72874, as a target, Constant value of 1. It indicates the existence of the Capabilities List. cannot accept fast back-to-back transactions when the transactions are not to the same agent. 8 R/W Signaled parity error Default value of 0. It indicates the occurrence of any “Data Parity”. 0: No parity detected (default) 1: Parity detected 10,9 R DEVSEL timing Constant value of 01. These bits define the decode timing for DEVSEL. 0: Fast (1 cycle) 1: Medium (2 cycles) 2: Slow (3 cycles) 3: undefined 11 R/W Signaled target abort Default value of 0. This bit is set by a target device whenever it terminates a transaction with “Target Abort”. 0: The µPD72874 did not terminate a transaction with Target Abort 1: The µPD72874 has terminated a transaction with Target Abort 12 R/W Received target abort Default value of 0. This bit is set by a master device whenever its transaction is terminated with a “Target Abort”. 0: The µPD72874 has not received a Target Abort 1: The µPD72874 has received a Target Abort from a bus-master 13 R/W Received master abort Default value of 0. This bit is set by a master device whenever its transaction is terminated with “Master Abort”. The µPD72874 asserts “Master Abort” when a transaction response exceeds the time allocated in the latency timer field. 0: Transaction was not terminated with a Master Abort 1: Transaction has been terminated with a Master Abort 14 R/W Signaled system error Default value of 0. It indicates that the assertion of SERR by the µPD72874. 0: System error was not signaled 1: System error was signaled 15 R/W Received parity error Default value of 0. It indicates the occurrence of any PERR. 0: No parity error was detected 1: Parity error was detected 20 Preliminary Data Sheet S15306EJ2V0DS µPD72874 3.1.5 Offset_08 Revision ID Register This register specifies a revision number assigned by NEC Corporation for the µPD72874. Bits R/W 7-0 R Description Default value of 01H. It specifies the silicon revision. It will be incremented for subsequent silicon revisions. 3.1.6 Offset_09 Class Code Register This register identifies the class code, sub-class code, and programming interface of the µPD72874. Bits R/W 7-0 Description R Constant value of 10H. It specifies an IEEE1394 OHCI-compliant Host Controller. 15-8 R Constant value of 00H. It specifies an “IEEE1394” type. 23-16 R Constant value of 0CH. It specifies a “Serial Bus Controller”. 3.1.7 Offset_0C Cache Line Size Register This register specifies the system cache line size, which is PC-host system dependent, in units of 32-bit words. The following cache line sizes are supported: 2, 4, 8, 16, 32, 64, and 128. All other values will be recognized as 0, i.e. cache disabled. Bits 7-0 R/W R/W Description Default value of 00H. 3.1.8 Offset_0D Latency Timer Register This register defines the maximum amount of time that the µPD72874 is permitted to retain ownership of the bus after it has acquired bus ownership and initiated a subsequent transaction. Bits 7-0 R/W R/W Description Default value of 00H. It specifies the number of PCI-bus clocks that the µPD72874 may hold the PCI bus as a bus-master. 3.1.9 Offset_0E Bits 7-0 Header Type Register R/W R Description Constant value of 00H. It specifies a single function device. 3.1.10 Offset_0F BIST Register Bits 7-0 R/W R Description Constant value of 00H. It specifies whether the device is capable of Built-in Self Test. Preliminary Data Sheet S15306EJ2V0DS 21 µPD72874 3.1.11 Offset_10 Base Address 0 Register This register specifies the base memory address for accessing all the “Operation registers” (i.e. control, configuration, and status registers) of the µPD72874, while the BIOS is expected to set this value during power-up reset. Bits R/W 11-0 R 31-12 R/W Description Constant value of 000H. These bits are “read-only”. - 3.1.12 Offset_2C Subsystem Vendor ID Register This register identifies the subsystem that contains the NEC’s µPD72874 function. While the ID is assigned by the PCI_SIG committee, the value should be loaded into the register from the external serial ROM after power-up reset. Access to this register through PCI-bus is prohibited. Bits 15-0 R/W R Description Default value of 1033H. 3.1.13 Offset_2E Subsystem ID Register This register identifies the type of the subsystem that contains the NEC’s µPD72874 function. While the ID is assigned by the manufacturer, the value should be loaded into the register from the external serial EEPROM after power-up reset. Access to this register through PCI-bus is prohibited. Bits 15-0 R/W R Description Default value of 00F2H. 3.1.14 Offset_34 Cap_Ptr Register This register points to a linked list of additional capabilities specific to the µPD72874, the NEC’s implementation of the 1394 OHCI specification. Bits 7-0 R/W Description R Constant value of 60H. The value represents an offset into the µPD72874’s PCI Configuration Space for the location of the first item in the New Capabilities Linked List. 3.1.15 Offset_3C Interrupt Line Register This register provides the interrupt line routing information specific to the µPD72874, the NEC’s implementation of the 1394 OHCI specification. Bits 7-0 R/W R/W Description Default value of 00H. It specifies which input of the host system interrupt controller the interrupt pin of the µPD72874 is connected to. 22 Preliminary Data Sheet S15306EJ2V0DS µPD72874 3.1.16 Offset_3D Interrupt Pin Register This register provides the interrupt line routing information specific to the µPD72874, the NEC’s implementation of the 1394 OHCI specification. Bits 7-0 R/W R Description Constant value of 01H. It specifies PCI INTA is used for interrupting the host system. 3.1.17 Offset_3E Min_Gnt Register This register specifies how long of a burst period the µPD72874 needs, assuming a clock rate of 33 MHz. Resolution is in units of ¼ µs. The value should be loaded into the register from the external serial EEPROM upon power-up reset, and access to this register through PCI-bus is prohibited. Bits 7-0 R/W R Description Default value of 00H. Its value contributes to the desired setting for Latency Timer value. 3.1.18 Offset_3F Max_Lat Register This register specifies how often the µPD72874 needs to gain access to the PCI-bus, assuming a clock rate of 33 MHz. Resolution is in units of ¼ µs. The value should be loaded into the register from the external serial EEPROM after hardware reset, and access to this register through PCI-bus is prohibited. Bits 7-0 R/W R 3.1.19 Offset_40 Description Default value of 00H. Its value contributes to the desired setting for Latency Timer value. PCI_OHCI_Control Register This register specifies the control bits that are IEEE1394 OHCI specific. Vendor options are not allowed in this register. It is reserved for OHCI use only. Bits 0 R/W Description R/W PCI global SWAP Default value of 0. When this bit is 1, all quadrates read from and written to the PCI Interface are byte swapped, thus a “PCI Global Swap”. PCI addresses for expansion ROM and PCI Configuration registers, are, however, unaffected by this bit. This bit is not required for motherboard implementations. 31-1 R 3.1.20 Offset_60 Reserved Constant value of all 0. Cap_ID & Next_Item_Ptr Register The Cap_ID signals that this item in the Linked List is the registers defined for PCI Power Management, while the Next_Item_Ptr describes the location of the next item in the µPD72874’s Capability List. Bits 7-0 R/W Description R Cap_ID Constant value of 01H. The default value identified the Link List item as being the PCI Power Management registers, while the ID value is assigned by the PCI SIG. 15-8 R Next_Item_Ptr Constant value of 00H. It indicated that there are no more items in the Link List. Preliminary Data Sheet S15306EJ2V0DS 23 µPD72874 3.1.21 Offset_62 Power Management Capabilities Register This is a 16-bit read-only register that provides information on the power management capabilities of the µPD72874. Bits R/W Description 2-0 R Version Constant value of 010. The power management registers are implemented as 3 R PME clock Constant value of 0. 4 R Reserved Constant value of 0. 5 R DSI Constant value of 0. 8-6 R Auxiliary Power Default value of 000. This field reports the Vaux power requirements for the defined in revision 1.1 of PCI Bus Power Management Interface Specification. µPD72874. This data is programable from EEPROM. 111 – 375 mA maximum current required for a 3.3 Vaux, 110 – 320 mA maximum current required for a 3.3 Vaux, 101 – 270 mA maximum current required for a 3.3 Vaux, 100 – 220 mA maximum current required for a 3.3 Vaux, 011 – 160 mA maximum current required for a 3.3 Vaux, 010 – 100 mA maximum current required for a 3.3 Vaux, 001 – 55 mA maximum current required for a 3.3 Vaux, 000 – 0 (self powered) 9 R D1_support Constant value of 1. The µPD72874 supports the D1 Power Management state. 10 R D2_support Constant value of 1. The µPD72874 supports the D2 Power Management state. 15-11 R PME_support D3SUP = ‘High’ : Constant value of 11111. D3SUP = ‘Low’ : Constant value of 01111. This field indicates the power states in which the µPD72874 may assert PME. A value of “0” for any bit indicates that the function is not capable of asserting the PME signal while in that power state. bit (11) – PME_D0. PME can be asserted from D0. bit (12) – PME_D1. PME can be asserted from D1. bit (13) – PME_D2. PME can be asserted from D2. bit (14) – PME_D3hot. PME can be asserted from D3hot. bit (15) – PME_D3cold. PME can be asserted from D3cold. 24 Preliminary Data Sheet S15306EJ2V0DS µPD72874 3.1.22 Offset_64 Power Management Control/Status Register This is a 16-bit register that provides control status information of the µPD72874. Bits 1,0 R/W Description R/W PowerState Default value is undefined. This field is used both to determine the current power state of the µPD72874 and to set the µPD72874 into a new power state. 00: D0 (DMA contexts: ON, Link Layer: ON, PME will be asserted upon INTA being active.) 01: D1 (DMA contexts: OFF, Link Layer: ON, PME will be asserted upon INTA being active) 10: D2 (DMA contexts: OFF, Link Layer: OFF, LPS: OFF, PME will be asserted upon LinkON being active) 11: D3 (DMA contexts: OFF, Link Layer: OFF, LPS: OFF, PME will be asserted upon LinkON being active) The LPS is a PHY/Link interface signal and is defined in P1394a-2000. It is an internal signal in the µPD72874. 7-2 8 R R/W Reserved Constant value of 000000. PME_En Default value of 0. This field is used to enable the specific power management features of the µPD72874. 12-9 14,13 15 R Data_Select Constant value of 0000. R Data_Scale Constant value of 00. R/W PME_Status Default value is undefined. A write of ‘1’ clears this bit, while a write of ‘0’ is ignored. Preliminary Data Sheet S15306EJ2V0DS 25 µPD72874 3.2 CardBus Mode Configuration Register (CARD_ON = High) 31 24 23 16 15 08 07 00 Device ID Vendor ID 00H Status Command 04H Class Code BIST Header Type Latency Timer Revision ID 08H Cache Line Size 0CH Base Address 0 10H Base Address 1 (Cardbus Status Reg) Note 14H Base Address 2 (Cardbus Status Reg) 18H Note Reserved 1CH Reserved 20H Reserved 24H Cardbus CIS Pointer Note 28H Subsystem ID Subsystem Vendor ID 30H Reserved Reserved Cap_Ptr Min_Gnt Interrupt Pin Interrupt Line 3CH PCI_OHCI_Control 40H Reserved 44H Reserved 48H Reserved 4CH Reserved 50H Reserved 54H Reserved 58H Reserved 5CH Power Management Capabilities Next_Item_Ptr Reserved Cap_ID Power Management Control/Status 60H 64H Reserved 68H Reserved 6CH Reserved 70H Reserved 74H Reserved 78H Reserved 7CH CIS Area Note 80H FCH Note Different from PCI Bus Mode Configuration Register. 26 34H 38H Reserved Max_Lat 2CH Preliminary Data Sheet S15306EJ2V0DS µPD72874 3.2.1 Offset_14/18 Bits Base Address 1/2 Register (Cardbus Status Registers) R/W 7-0 R 31-8 R/W Description Constant value of 00. - (1) Function Event Register (FER) (Base Address 1 (2) + 0H) Bits 0 R/W R Description Write Protect (No Use). Read only as ‘0’ 1 R Ready Status (No Use). Read only as ‘0’ 2 R Battery Voltage Detect 2 (No Use). 3 R Battery Voltage Detect 1 (No Use). 4 R/W Read only as ‘0’ Read only as ‘0’ 14-5 R 15 R/W 31-16 R General Wake Up Reserved. Read only as ‘0’ Interrupt Reserved. Read only as ‘0’ (2) Function Event Mask Register (FEMR) (Base Address 1 (2) + 4H) Bits R/W 0 R 1 R Description Write Protect (No Use). Read only as ‘0’ Ready Status (No Use). Read only as ‘0’ 2 R Battery Voltage Detect 2 (No Use). Read only as ‘0’ 3 R Battery Voltage Detect 1 (No Use). Read only as ‘0’ 4 R/W 5 R BAM. Read only as ‘0’ 6 R PWM. Read only as ‘0’ 13-7 R Reserved. Read only as ‘0’ 14 R/W 15 R/W 31-16 R General Wake Up Mask Wake Up Mask Interrupt Reserved. Read only as ‘0’ Preliminary Data Sheet S15306EJ2V0DS 27 µPD72874 (3) Function Reset Status Register (FRSR) (Base Address 1 (2) + 8H) Bits R/W Description 0 R Write Protect (No Use). 1 R Ready Status (No Use). 2 R Battery Voltage Detect 2 (No Use). Read only as ‘0’ Read only as ‘0’ Read only as ‘0’ 3 R Battery Voltage Detect 1 (No Use). Read only as ‘0’ 4 R/W 14-5 R 15 R/W 31-16 R General Wake Up Mask Reserved. Read only as ‘0’ Interrupt Reserved. Read only as ‘0’ (4) Function Force Event Register (FFER) (Base Address 1 (2) + CH) Bits 0 R/W R Description Write Protect (No Use). Read only as ‘0’ 1 R Ready Status (No Use). 2 R Battery Voltage Detect 2 (No Use). 3 R Battery Voltage Detect 1 (No Use). Read only as ‘0’ Read only as ‘0’ Read only as ‘0’ 4 R/W 14-5 15 31-16 No Use R/W Interrupt R 3.2.2 Offset_28 General Wake Up Mask - Reserved. Read only as ‘0’ Cardbus CIS Pointer This register specifies start memory address of the Cardbus CIS Area. Bits 31-0 R/W R Description Starting Pointer of CIS Area. Constant value of 00000080H. 3.2.3 Offset_80 CIS Area The µPD72874 supports external Serial ROM (AT24C02 compatible) interface. CIS Area Register can be loaded from external Serial ROM in the CIS area when CARD_ON is 1. 28 Preliminary Data Sheet S15306EJ2V0DS µPD72874 4. PHY FUNCTION 4.1 Cable Interface 4.1.1 Connections Figure 4-1. Cable Interface Connection Detection Current Connection Detection Comparator Common Mode Speed Current driver TpBias + - TpAp Driver Receiver + - TpBp 7 kΩ 56 Ω 56 Ω 7 kΩ 7 kΩ TpAn 56 Ω 56 Ω 7 kΩ TpBn 1 µF 0.01 µF 5.1 kΩ 270 pF Arbitration Comparators + - Driver Receiver + Arbitration Comparators + - + - + - Common Mode Comparators + - Common Mode Comparator + - + - Connection Detection Current Connection Detection Comparator Common Mode Speed Current Driver TpBias TpBp Driver TpAp 7 kΩ 56 Ω 56 Ω 7 kΩ 7 kΩ TpBn 56 Ω 56 Ω 7 kΩ TpAn Receiver + - 270 pF + - 5.1 kΩ 0.01 µF 1 µF Driver Receiver + Arbitration Comparators + - Arbitration Comparators + + - + - Common Mode Comparator + - Common Mode Comparators + + - Preliminary Data Sheet S15306EJ2V0DS 29 µPD72874 4.1.2 Cable Interface Circuit Each port is configured with two twisted-pairs of TpA and TpB. TpA and TpB are used to monitor the state of the Transmit/Receive line, control signals, data and cables. During transmission to the IEEE1394 bus, the Data/Strobe signal received from the Link layer controller is encoded, converted from parallel to serial and transmitted. While receiving from the IEEE1394 bus, the Data/Strobe signal from TpA, TpB is converted from serial to parallel after synchronization by SCLK Note, then transmitted to the Link layer controller in 2/4/8 bits according to the data rate of 100/200/400 Mbps. The bus arbitration for TpA and TpB and the state of the line are monitored by the built-in comparator. The state of the 1394 bus is transmitted to the state machine in the LSI. Note The SCLK is a PHY/Link interface signal and is defined in P1394a-2000. It is an internal signal in the µPD72874. 4.1.3 CPS Connect an external resistor of 390 kΩ between the CPS pin and the power cable, and an external resistor of 100 kΩ between the CPS pin and the GND to monitor the power of the power cable. If the cable power falls under 7.5 V there is an indication to the Link layer that the power has failed. 4.1.4 Unused Ports TpAp, TpAn : Not connected TpBp, TpBn : AGND TpBias : Not connected 4.2 PLL and Crystal Oscillation Circuit 4.2.1 Crystal Oscillation Circuit To supply the clock of 24.576 MHz ± 100 ppm, use an external capacitor of 10 pF and a crystal of 50 ppm. 4.2.2 PLL The crystal oscillator multiplies the 24.576 MHz frequency by 16 (393.216 MHz). 4.3 PC0 to PC2 The PC0 to PC2 pin corresponds to the power field of the Self_ID packet and Pwr_class in the PHY register. Refer to Section 4.3.4.1 of the IEEE1394-1995 specification for information regarding the Pwr_class. The value of Pwr can be changed with software through the Link layer; this pin sets the initial value during Power-on Reset. Use a pull-up or pull-down resistor of 1 kΩ based on the application. 4.4 P_RESET Connect an external capacitor of 0.1 µF between the pins P_RESET and GND. If the voltage drops below 0 V, a reset pulse is generated. All of the circuits are initialized, including the contents of the PHY register. 4.5 RI0, RI1 Connect an external resistor of 9.1 kΩ ± 0.5 % to limit the LSI’s current. 30 Preliminary Data Sheet S15306EJ2V0DS µPD72874 5. ELECTRICAL SPECIFICATIONS Absolute Maximum Ratings Parameter Power supply voltage Symbol Condition VDD Input voltage VI Output voltage VO Rating Unit –0.5 to +4.6 V LVTTL @ (VI < 0.5 V + VDD) –0.5 to +4.6 V PCI @ (VI < 3.0 V + VDD) –0.5 to +6.6 V LVTTL @ (VO < 0.5 V + VDD) –0.5 to +4.6 V PCI @ (VO < 3.0 V + VDD) –0.5 to +6.6 V Operating ambient temperature TA 0 to +70 °C Storage temperature Tstg –65 to +150 °C Caution Product quality may suffer if the absolute maximum rating is exceeded even momentarily for any parameter. That is, the absolute maximum ratings are rated values at which the product is on the verge of suffering physical damage, and therefore the product must be used under conditions that ensure that the absolute maximum ratings are not exceeded. Recommended Operating Ranges Parameter Power supply voltage Operating ambient temperature Symbol Condition Rating Unit VDD Used to clamp reflection on PCI bus. 4.5 to 5.5 V 3.0 to 3.6 V 0 to +70 °C TA Preliminary Data Sheet S15306EJ2V0DS 31 µPD72874 DC Characteristics (VDD = 3.3 V ± 10 %, VSS = 0 V, TA = 0 to +70°°C) Parameter Symbol Condition MIN. TYP. MAX. Unit High-level input voltage VIH 2.0 VDD+0.5 V Low-level input voltage VIL –0.5 +0.8 V High-level output current IOH Low-level output current IOL Input leakage current IL VOH = 2.4 V, –6 mA 6 mA GROM_SDA, GROM_SCL VOL = 0.4 V, GROM_SDA, GROM_SCL ±10.0 µA 2.0 5.5 V –0.5 +0.8 VIN = VDD or GND PCI interface High-level input voltage VIH Low-level input voltage VIL High-level output current IOH VOH = 2.4 V –2 mA V Low-level output current IOL VOL = 0.4 V 9 mA Input leakage current IL VIN = VDD or GND ±10.0 µA Cable interface Differential input voltage VID TpB common mode input voltage VICM Cable input, 100 Mbps operation 142 260 mV Cable input, 200 Mbps operation 132 260 mV Cable input, 400 Mbps operation 118 260 mV 100 Mbps speed signaling off 1.165 2.515 V 200 Mbps speed signaling 0.935 2.515 V 400 Mbps speed signaling 0.523 2.515 V Differential output voltage VOD Cable output (Test load 55 Ω) 172.0 265.0 mV TpA common mode output voltage VOCM 100 Mbps speed signaling off 1.665 2.015 V 200 Mbps speed signaling 1.438 2.015 V 400 Mbps speed signaling 1.030 2.015 V 100 Mbps speed signaling off –0.81 +0.44 mA 200 Mbps speed signaling –4.84 –2.53 mA 400 Mbps speed signaling –12.40 –8.10 mA 7.5 V 1.665 2.015 V TpA common mode output current Power status threshold voltage TpBias output voltage ICM VTH CPS VTPBIAS Remarks 1. Digital core runs at 3.3 V. 2. PCI Interface can run at 5 or 3.3 V, depending on the choice of 5 V-PCI or 3.3 V-PCI. 3. All other I/Os are 3.3 V driving, and 5 V tolerant. 4. 5 V are used only for 5 V-PCI clamping diode. 3.3 V 5.0 V Protection Circuit 32 Preliminary Data Sheet S15306EJ2V0DS I/O Buffer µPD72874 AC Characteristics PCI Interface See PCI local bus specification Revision 2.2. Serial ROM Interface See AT24C01A/02/04/08/16 Spec. Sheet. Preliminary Data Sheet S15306EJ2V0DS 33 µPD72874 6. PACKAGE DRAWING 120-PIN PLASTIC TQFP (FINE PITCH) (14x14) A B 90 91 61 60 detail of lead end C D S P T 120 1 R 31 30 U F G L Q H I J M K S N S M NOTE Each lead centerline is located within 0.07 mm of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS A 16.00±0.20 B 14.00±0.20 C D 14.00±0.20 16.00±0.20 F 1.20 G H 1.20 0.18±0.05 I 0.07 J 0.40 (T.P.) K 1.00±0.20 L 0.50 M 0.17 +0.03 −0.07 N 0.08 P 1.00±0.05 Q 0.10±0.05 R 3° +4° −3° S 1.20MAX. T 34 Preliminary Data Sheet S15306EJ2V0DS 0.25 P120GC-40-YEB µPD72874 7. RECOMMENDED SOLDERING CONDITIONS The µPD72874 should be soldered and mounted under the following recommended conditions. For the details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting Technology Manual (C10535E). For soldering methods and conditions other than those recommended below, contact your NEC sales representative. Table 7-1. Surface Mounting Type Soldering Conditions µPD72874GC-YEB: 120-pin plastic TQFP (Fine pitch) (14 x 14) Soldering Soldering Conditions Method Infrared reflow Recommended Condition Symbol Package peak temperature: 235°C, Time: 30 sec. Max. (at 210°C or higher). IR35-103-3 Count: three times or less Exposure limit: 3 daysNote (after that prebake at 125°C for 10 hours) Partial heating Pin temperature: 300°C Max., Time: 3 sec. Max. (per pin row) — Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period. Preliminary Data Sheet S15306EJ2V0DS 35 µPD72874 [MEMO] 36 Preliminary Data Sheet S15306EJ2V0DS µPD72874 [MEMO] Preliminary Data Sheet S15306EJ2V0DS 37 µPD72874 [MEMO] 38 Preliminary Data Sheet S15306EJ2V0DS µPD72874 NOTES FOR CMOS DEVICES 1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS Note: Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it once, when it has occurred. Environmental control must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using insulators that easily build static electricity. Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work bench and floor should be grounded. The operator should be grounded using wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for PW boards with semiconductor devices on it. 2 HANDLING OF UNUSED INPUT PINS FOR CMOS Note: No connection for CMOS device inputs can be cause of malfunction. If no connection is provided to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused pin should be connected to V DD or GND with a resistor, if it is considered to have a possibility of being an output pin. All handling related to the unused pins must be judged device by device and related specifications governing the devices. 3 STATUS BEFORE INITIALIZATION OF MOS DEVICES Note: Power-on does not necessarily define initial status of MOS device. Production process of MOS does not define the initial operation status of the device. Immediately after the power source is turned ON, the devices with reset function have not yet been initialized. Hence, power-on does not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the reset signal is received. Reset operation must be executed immediately after power-on for devices having reset function. Preliminary Data Sheet S15306EJ2V0DS 39 µPD72874 EEPROM and Firewarden are trademarks of NEC Corporation. VGA is a trademark of IBM Corporation. • The information in this document is current as of April, 2002. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. • NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. • While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. • NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above). M8E 00. 4