SM9103M DVDRAM Head Amplifier LSI NIPPON PRECISION CIRCUITS INC. OVERVIEW PINOUT The SM9103M is a photodiode photoelectric current-to-voltage conversion head amplifier LSI for optical disk pickups in DVDRAM/DVDROM equipment. It sums the photodiode current data signals and then converts the signals to a differential signal for output. The output tracking servo and focusing servo signals are derived from built-in sum and difference circuits, and the gain for these servo signals can be adjusted using serial interface controls. Each of the signals from the photodiodes, used to generate DPD (Differential Phase Detection) tracking servo signal, is current-to-voltage converted and then also output. It operates from a single 5 V supply, and is available in 36-pin plastic SSOP packages. 36-pin SSOP ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ RAM/ROM gain switching, low-noise RF signal generator (differential output) ROM tracking DPD signal output Variable-gain RAM tracking push-pull signal output Address signal, high-speed push-pull signal output Variable-gain focus error signal output Tracking PD sum signal output Focus PD sum signal output Offset correction timing output (logic) Temperature monitor function Serial interface to control internal parameter settings Sleep-mode function Single 5 V supply 36-pin plastic SSOP MODE 1 36 SCLK WRITE 2 35 SDATA DGND 3 34 SENB DVCC 4 33 CALREQ TEMPO 5 32 TADD TEMPI 6 31 TADDB T1 7 30 CAPAP T2 8 29 CAPAN T3 9 28 TSUB T4 10 27 TSUBB F1 11 26 DATAP F2 12 25 DATAN AGND 13 24 DPDA SM9103M NPC FEATURES (Top view) VREF 14 23 DPDB FSUBB 15 22 DPDC FSUB 16 21 DPDD FADDB 17 20 AVCC FADD 18 19 AGND TYPICAL APPLICATIONS ■ ■ Double-speed DVDROM equipment Double-speed DVDRAM equipment ORDERING INFORMATION Device Package SM9103M 36-pin SSOP NIPPON PRECISION CIRCUITS—1 SM9103M PACKAGE DIMENSIONS (Unit: mm) 15.20 to 15.40 0 to 8° 0.85 0.51 ± 0.20 45° 10.11 to 10.51 7° 7.40 to 7.60 R0.63 to 0.89 0.51 to 1.01 7° 0.63 ± 0.10 0.23 to 0.32 0.10 to 0.30 2.44 to 2.64 0.80 0.29 to 0.39 BLOCK DIAGRAM AVCC VREF AGND DVCC DGND SCLK SENB SDATA MODE WRITE +5V Serial interface to each block T1 T2 T3 T4 A+B+C+D Gain switching amplifier (RAM read/write, ROM read) Differential output buffer DATAP DATAN Amplifier TADDB TADD (A+B)-(C+D) Analog Signal processor A B C D Differential output buffer Gain switch (2dB step) CAPAP CAPAN TSUBB TSUB Offset canceller TEMPI TEMPO Buffer DPDA Buffer DPDB Buffer DPDC Buffer Gain switch (2dB step) DPDD CALREQ FSUB FSUBB Amplifier FADDB FADD +5V Thermal sensor Canceller control Offset canceller F1 F2 Gain switching amplifier Analog Signal processor NIPPON PRECISION CIRCUITS—2 SM9103M PIN DESCRIPTION Number Name I/O1 1 MODE Ipd Mode switching/offset correction control input 1 2 WRITE Ipd Mode switching/offset correction control input 2 3 DGND – Logic circuit ground. Connect to the analog ground if there is no dedicated pickup or logic ground. 4 DVCC – Logic circuit supply. Connect to the analog supply if there is no dedicated pickup or logic supply. 5 TEMPO O Thermal sensor test output. Leave open for normal operation 6 TEMPI I Thermal sensor test input. Leave open for normal operation 7 T1 I Tracking PD input A 8 T2 I Tracking PD input B 9 T3 I Tracking PD input C 10 T4 I Tracking PD input D 11 F1 I Focus PD input E 12 F2 I Focus PD input F 13 AGND – Analog circuit ground 14 VREF I 2.0 V reference voltage input 15 FSUBB I Focus error signal feedback input 16 FSUB O Focus error signal output 17 FADDB I Focus sum signal feedback input 18 FADD O Focus sum signal output 19 AGND – Analog circuit ground 20 AVCC – Analog circuit supply 21 DPDD O Buffered tracking signal output D for DPD servo 22 DPDC O Buffered tracking signal output C for DPD servo 23 DPDB O Buffered tracking signal output B for DPD servo 24 DPDA O Buffered tracking signal output A for DPD servo 25 DATAN O Phase-modulated data signal differential inverting output 26 DATAP O Phase-modulated data signal differential non-inverting output 27 TSUBB I Tracking push-pull signal feedback input 28 TSUB O Tracking push-pull signal output 29 CAPAN O ID data signal differential inverting output 30 CAPAP O ID data signal differential non-inverting output 31 TADDB I Tracking PD sum signal feedback input 32 TADD O Tracking PD sum signal output 33 CALREQ O Offset correction status/request output 34 SENB I Serial interface enable input 35 SDATA I/O 36 SCLK I Function Serial interface data input/acknowledge output Serial interface clock input 1. I = input, Ipd = Input with built-in pull-down resistor, I/O = input/output, O = output NIPPON PRECISION CIRCUITS—3 SM9103M SPECIFICATIONS Absolute Maximum Ratings GND = 0 V Parameter Symbol Condition Rating Unit Supply voltage range V CC −0.5 to 7.0 V Input voltage range V IN − 0.5 to V CC + 0.5 V Input current range IIN − 3.0 to +3.0 mA Operating temperature range Topr 0 to 70 °C Storage temperature range Tstg −40 to 125 °C Power dissipation PD 250 mW Soldering temperature Tsld 260 °C Soldering time tsld 10 s Rating Unit Recommended Operating Conditions GND = 0 V Parameter Symbol Condition Specs-guaranteed supply voltage range V CC 4.75 to 5.25 V Operating supply voltage range V CC 4.5 to 5.5 V Reference voltage input V REF 1.89 to 2.11 V Operating temperature range Topr 0 to 70 °C NIPPON PRECISION CIRCUITS—4 SM9103M DC Electrical Characteristics VCC = 5 V ± 5%, GND = 0 V, Ta = 0 to 70 °C Rating Parameter Symbol Current consumption1 Condition Unit min typ max ICC1 Operating mode – 24 30 ICC2 Sleep mode – – 1 mA MODE, WRITE, SENB, SDATA, SCLK HIGH-level input voltage V IH 0.8VCC – – V MODE, WRITE, SENB, SDATA, SCLK LOW-level input voltage V IL – – 0.2VCC V MODE, WRITE HIGH-level input current IIH1 V IN = V CC 50 100 200 µA SENB, SDATA, SCLK HIGH-level input current IIH2 V IN = V CC – – 3 µA MODE, WRITE, SENB, SDATA, SCLK LOW-level input current IIL V IN = 0 V −3 – – µA V CC − 0.2 – – V CALREQ HIGH-level output voltage VOH IOH = −0.2 mA CALREQ LOW-level output voltage VOL1 IOL = 0.8 mA – – 0.4 V SDATA LOW-level output voltage VOL2 IOL = 7 mA – – 1.0 V VREF input current IREF V REF = 2.0 V – – 250 µA 1. 18 kΩ resistor connected between TSUB and TSUBB 47 kΩ resistor connected between TADD and TADDB 22 kΩ resistor connected between FSUB and FSUBB 27 kΩ resistor connected between FADD and FADDB SENB, SDATA, SCLK connected to GND; All other pins (excluding supply and ground pins) open circuit. Tracking PD Input Characteristics (T1, T2, T3, T4) VCC = 5 V ± 5%, GND = 0 V, Ta = 0 to 70 °C Rating Parameter Input impedance Input conversion noise current Pin voltage Condition Unit No signal typ max – – 250 RAM read1 – 0.035 – ROM read1 – 0.27 – – – 1.5 100 kHz to 10 MHz No signal min Ω µA rms V 1. DATAP − DATAN output difference operation when 10 pF capacitors are connected to T1, T2, T3, T4 NIPPON PRECISION CIRCUITS—5 SM9103M Data Signal Processor Characteristics VCC = 5 V ± 5%, GND = 0 V, Ta = 0 to 70 °C Rating Parameter Condition DATAP −DATAN current-to-voltage converter coefficient1 CAPAP −CAPAN current-to-voltage converter coefficient2 Unit min typ max RAM read 10.0 12.5 15.0 ROM read 2.50 3.12 3.74 RAM read 11.3 14.1 16.9 kΩ – – 100 Ω DATAP, DATAN, CAPAP, CAPAN output impedance kΩ DATAP, DATAN, CAPAP, CAPAN output center voltage3 No signal 0.9VREF – 1.1VREF V CAPAP, CAPAN output center voltage difference3 No signal – – ±50 mV DATAP, DATAN, CAPAP, CAPAN output operating output voltage 10 kΩ load, output center voltage reference −0.7 – +0.7 V Variable coefficient switching time RAM ↔ ROM read – – 10 ms Saturation output reset time4 RAM write → RAM read – – 500 ns DATAP, DATAN signal bandwidth5 f = 100 kHz −3 dB frequency 19 – – MHz CAPAP, CAPAN signal bandwidth5 f = 100 kHz −3 dB frequency 20 – – MHz DATAP −DATAN, CAPAP −CAPAN gain peaking5 f = 100 kHz −3 dB frequency −3 – +0.5 dB DATAP −DATAN, CAPAP −CAPAN group delay time5 f = 1 to 10 MHz – – ±1.0 ns 1. 2. 3. 4. 5. [DATAP − DATAN] = K × [IT1 + IT2 + IT3 + IT4] [CAPAP − CAPAN] = K × {[IT1 + IT2] − [IT3 + IT4]} 5 kΩ load connected to ground to prevent abnormal operation Converging to within final value ± 10% 10 pF input load capacitors connected to T1, T2, T3, T4. DATAP, DATAN, CAPAP, CAPAN output load conditions shown below. 0.01µF 0.01µF DATAP CAPAP 5pF 5pF 10pF 5pF 10kΩ 10kΩ 0.01µF 0.01µF CAPAN DATAN 5pF 5pF 10pF 5pF NIPPON PRECISION CIRCUITS—6 SM9103M Tracking Signal Processor Characteristics VCC = 5 V ± 5%, GND = 0 V, Ta = 0 to 70 °C Rating Parameter Condition typ max 10.64 11.95 13.26 2.67 2.99 9.92 RAM write 1.78 1.99 2.20 RAM read 27.82 31.25 34.68 6.95 7.80 8.65 RAM write 4.63 5.20 5.77 RAM read 40.0 50.0 60.0 ROM read 10.0 12.5 15.0 – – ±2 % – – 100 Ω RAM read TSUB current-to-voltage converter coefficient1 TADD current-to-voltage converter coefficient2 DPDA, DPDB, DPDC, DPDD current-to-voltage converter coefficient3 T1, T2, T3, T4 converter coefficient relative error Unit min ROM read ROM read R f = 18 kΩ, VOUT = V REF ± 0.8 V R f = 47 kΩ kΩ kΩ kΩ TSUB output, RAM/ROM read TSUB, TADD, DPDA, DPDB, DPDC, DPDD output impedance TSUB operating output voltage 10 kΩ load connected to VREF 1 – 3 V TADD, DPDA, DPDB, DPDC, DPDD operating output voltage 10 kΩ load connected to VREF V REF – 3 V RAM read ↔ ROM read – – 10 ms Converter coefficient switching time RAM write ↔ RAM read – – 3 µs TSUB, TADD signal bandwidth4 DC to −3 dB frequency 1 – – MHz DPDA, DPDB, DPDC, DPDD signal bandwidth4 f = 100 kHz to −3 dB frequency 5 – – MHz TSUB, TADD gain peaking4 f = 10 kHz to −3 dB frequency −3 – +0.5 dB DPDA, DPDB, DPDC, DPDD gain peaking4 f = 100 kHz to −3 dB frequency −3 – +4.0 dB TSUB phase response4 @ f = 100 kHz – – 10 ° f = 1 to 5 MHz group delay differential absolute value – – 5 Relative error between 4 pins – – 1.0 RAM read/write max gain – – ±10.0 RAM read, min to max gain – – ±26 RAM read/write differential gain max. – – ±4 ROM read, gain min/max – – ±100 RAM read – – ±30 ROM read – – ±300 −550 – +50 mV – – ±0.4 mV/°C −16 – +14 dB – 2 – dB DPDA, DPDB, DPDC, DPDD group delay4 TSUB offset voltage TADD offset voltage No input signal, V REF reference, post-correction, Ta = 25°C, R f = 18 kΩ No input signal, V REF reference DPDA, DPDB, DPDC, DPDD offset voltage No input signal, V REF reference TSUB offset voltage temperature coefficient R f = 18 kΩ TSUB variable gain range TSUB variable gain step width ns mV mV RAM/ROM read NIPPON PRECISION CIRCUITS—7 SM9103M Rating Parameter TSUB gain switching absolute accuracy 1. 2. 3. 4. Condition VOUT = V REF ± 0.8 V Unit min typ max −16 to +8 dB – – ±0.5 +10 to +14 dB – – ±1.0 dB TSUB = K × {[IT1 + IT2] − [IT3 + IT4]}, gain = 0 dB TADD = K × [IT1 + IT2 + IT3 + IT4] DPDA = K × IT1, DPDB = K × IT2, DPDC = K × IT3, DPDD = K × IT4 T1, T2, T3, T4: 10 pF input load capacitance TSUB, TADD, DPDA, DPDB, DPDC, DPDD: 10 pF output load capacitance TSUB, TADD: 10 kΩ load resistance DPDA, DPDB, DPDC, DPDD: 100 kΩ load resistance Focus PD Input Characteristics (F1, F2) VCC = 5 V ± 5%, GND = 0 V, Ta = 0 to 70 °C Rating Parameter Input impedance Condition Unit No signal Input conversion noise current Pin voltage DC to 10 kHz min typ max – – 250 RAM read1 – – 24 ROM read1 – – 96 RAM write1 – – 150 – – ±50 No signal, V REF reference Ω nArms mV 1. Conversion from FSUB output noise value when 14 pF capacitors connected to F1 and F2 Focus Signal Processor Characteristics VCC = 5 V ± 5%, GND = 0 V, Ta = 0 to 70 °C Rating Parameter Condition typ max 370 415 460 94 105 116 RAM write 58 65 72 RAM read 223 250 277 56.1 63 69.9 35.6 40 44.1 – – ±2 % – – 100 Ω RAM read FSUB current-to-voltage converter coefficient1 FADD current-to-voltage converter coefficient2 ROM read ROM read R f = 22 kΩ, VOUT = V REF ± 0.35 V R f = 27 kΩ RAM write F1, F2 converter coefficient relative error Unit min FSUB output, RAM/ROM read FSUB, FADD output impedance kΩ kΩ FSUB operating output voltage 10 kΩ load connected to VREF 1 – 3 V FADD operating output voltage 10 kΩ load connected to VREF V REF – 3 V RAM read ↔ ROM read – – 10 ms RAM write ↔ RAM read – – 3 µs DC to −3 dB frequency 200 – – kHz f = 10 kHz to −3 dB frequency −3 – +0.5 dB @ f = 10 kHz – – 5 ° Converter coefficient switching time FSUB, FADD signal bandwidth3 FSUB, FADD gain peaking3 FSUB, FADD phase response3 NIPPON PRECISION CIRCUITS—8 SM9103M Rating Parameter Condition No input signal, V REF reference, post-correction, Ta = 25°C FSUB offset voltage Unit min typ max RAM read/write, ROM read max gain – – ±7.0 RAM read, min to max gain – – ±21 RAM read/write differential gain max. – – ±4 – – ±50 mV – – ±0.22 mV/°C −16 – +14 dB – 2 – dB −16 to +8 dB – – ±0.5 +10 to +14 dB – – ±1.0 No input signal, VREF reference FADD offset voltage FSUB offset voltage temperature coefficient FSUB variable gain range FSUB variable gain step width FSUB gain switching absolute accuracy VOUT = V REF ± 0.35 V mV dB 1. FSUB = K × [IF1 − IF2], gain = 0 dB 2. FADD = K × [IF1 + IF2] 3. F1, F2: 14 pF input load capacitance FSUB, FADD: 10 pF output load capacitance, 10 kΩ load resistance Mode Control Logic Control input Operating mode WRITE MODE LOW or open LOW or open RAM read LOW or open HIGH ROM read HIGH LOW or open HIGH HIGH Offset correction Active RAM write Inactive Offset Correction Characteristics VCC = 5 V ± 5%, GND = 0 V, Ta = 0 to 70 °C Rating Parameter Symbol Condition Unit min typ max TSUB offset residual V REF reference, Ta = 25 °C – – ±8.5 mV FSUB offset residual V REF reference, Ta = 25 °C – – ±5.5 mV Supply voltage droop detect level V1 1.9 2.8 3.7 V Correction circuit startup supply voltage V2 3.2 3.8 4.4 V V2 − V1 0.7 1.0 1.3 V Correction thermal sensor detect temperature 15 20 25 °C Offset correction time – – 150 ms V 1 and V 2 difference NIPPON PRECISION CIRCUITS—9 SM9103M Serial Interface Characteristics VCC = 5 V ± 5%, GND = 0 V, Ta = 0 to 70 °C Rating Parameter Symbol Condition Unit min typ max SCLK pulse cycle tcySCK 100 – – ns SCLK HIGH-level pulsewidth twhSCK 40 – – ns SCLK LOW-level pulsewidth twlSCK 40 – – ns SENB setup time tsSEN 20 – – ns SENB hold time thSEN 40 – – ns SDATA setup time tsSDA 15 – – ns SDATA hold time thSDA 15 – – ns ACK setup time1 tsACK 0 – 20 ns ACK hold time1 thACK – – 50 ns SENB interval tinSEN 100 – – ns 1. ACK is the acknowledge output (n-channel open-drain). LOW-level output when the data received is valid. SDATA load capacitance is 15 pF. tinSEN SENB tsSEN twhSCK twlSCK thSEN tcySCK SCLOCK thACK tsSDA thSDA SDATA Controller SDATA Port bit 0 LSB tsACK bit 1 bit 15 MSB ACK High Impedance NIPPON PRECISION CIRCUITS—10 SM9103M FUNCTIONAL DESCRIPTION Serial Interface The SM9103M uses a serial interface comprising 2 ports to control and set TSUB/FSUB output gain switching, sleep mode to reduce current consump- tion, and TSUB/FSUB offset correction. The address and bit configuration of each port is shown in table 1. Table 1. Port address and bit configuration1 Bit number 15 14 13 12 11 10 9 8 7 6 5 Data 4 3 2 1 0 Address MSB LSB TG3 TG2 TG1 TG0 FG3 FG2 FG1 FG0 × LOW LOW LOW LOW LOW × × SL1 CS1 – – – – – – × LOW LOW LOW LOW HIGH × × 1. × = don’t care, – = unassigned TG3 to TG0: TSUB gain set bits. Default = 0111 (0 dB) FG3 to FG0: FSUB gain set bits. Default = 0111 (0 dB) SL1: sleep mode set bit. Sleep mode when 1, normal operation when 0. Default = 0. CS1: offset correction control. Offset correction when 1, normal operation when 0. Default = 0. Serial data is input on SDATA with the LSB first in sync with the falling edge of the SCLK clock. After the 16th SCLK falling edge and 16 bits of valid data has been input, the SDATA n-channel open-drain output goes LOW to perform the function of an acknowledge signal. If the number of SCLK cycles which occur when SENB (serial interface enable) is HIGH is less than 16, the received data is ignored and the internal port is not updated. If the number of SCLK cycles is greater than 16, the data is still considered value up to the 16th SCLK falling edge, the data is latched into the internal port, and the acknowledge signal is output. The acknowledge signal is held until SENB goes LOW again. Data Signal Processor This stage creates the data signal and ID signal for output. The weak current from the tracking PD cells (T1, T2, T3, T4) are input to the front-end amplifier where the signals are current-to-voltage converted at fixed gain. The gain setting is controlled by pins WRITE and MODE. WRITE switches between read/write, and MODE switches the gain between values corresponding to high-reflectivity and low-reflectivity discs. These signals control the settings for RAM (low-reflectivity disc) read/write and ROM (high-reflectivity disc) read. The front-end amplifier outputs are processed by the signal processor block to generate intermediate signals. The data signal, (A + B + C + D), is converted to a difference signal by a differential output buffer and output on DATAP and DATAN. The ID signal, generated from the difference between 2 signals, (A + B) and (C + D), is converted to a difference signal by a differential output buffer and output on CAPAP and CAPAN. The data signal (DATAP, DATAN) and ID signal (CAPAP, CAPAN) DC components are removed using output stage capacitive networks. T1, T2, T3 and T4 have a hold function to provide the appropriate reverse bias required by the tracking PD to ensure the data read bandwidth. NIPPON PRECISION CIRCUITS—11 SM9103M Tracking Signal Processor The tracking stage generates the push-pull tracking error signal and output signal for DPD servo, as well as a push-pull sum signal used as an auxiliary signal. The [(A + B) − (C + D)] signal from the common-data front-end amplifier and signal processor block is sent to the gain switching block. The gain switching block amplifies the difference signal using one of 16 preset gain settings in 2 dB steps to form a push-pull signal output on TSUB. A feedback resistor connected to TSUBB is used to ensure gain setting stability. The gain of the gain switching block is controlled by serial interface control bits as shown in table 2. Each signal from T1, T2, T3, T4 is buffered and then output on DPDA, DPDB, DPDC, DPDD, respectively, for DPD servos. The auxiliary signal is generated from the push-pull sum signal (A + B + C + D). This signal is buffered (TAB) and output on TADD. A feedback resistor connected to TADDB is used to ensure gain setting stability. Table 2. TSUB gain setting TG3 TG2 TG1 TG0 Gain (dB)1 0 0 0 0 +14 0 0 0 1 +12 0 0 1 0 +10 0 0 1 1 +8 0 1 0 0 +6 0 1 0 1 +4 0 1 1 0 +2 0 1 1 1 0 1 0 0 0 −2 1 0 0 1 −4 1 0 1 0 −6 1 0 1 1 −8 1 1 0 0 −10 1 1 0 1 −12 1 1 1 0 −14 1 1 1 1 −16 1. Default is 0 dB Focus Signal Processor The focus stage generates the focus error signal from the focus PD, and a sum signal. The weak focus PD current signals (F1, F2) are input to the front-end amplifier and then current-to-voltage converted at fixed gain. The front-end amplifier output is sent to the signal processor block where the focus error signal (F1 − F2) and the sum signal (F1 + F2) are generated. The focus error signal is sent to the gain switching block. The gain switching block amplifies the difference signal using one of 16 preset gain settings in 2 dB steps with output on FSUB. A feedback resistor connected to FSUBB is used to ensure gain setting stability. The gain of the gain switching block is controlled by serial interface control bits as shown in table 3. The sum is buffered and output on FADD. A feedback resistor connected to FADDB is used to ensure gain setting stability. Table 3. FSUB gain setting FG3 FG2 FG1 FG0 Gain (dB)1 0 0 0 0 +14 0 0 0 1 +12 0 0 1 0 +10 0 0 1 1 +8 0 1 0 0 +6 0 1 0 1 +4 0 1 1 0 +2 0 1 1 1 0 1 0 0 0 −2 1 0 0 1 −4 1 0 1 0 −6 1 0 1 1 −8 1 1 0 0 −10 1 1 0 1 −12 1 1 1 0 −14 1 1 1 1 −16 1. Default is 0 dB NIPPON PRECISION CIRCUITS—12 SM9103M Offset Correction The SM9103M has built-in offset correction circuits for tracking and focus. During offset correction, the internal the device operates in RAM read mode, and FSUB and TSUB operate at maximum gain (+14 dB). The outputs on FSUB, FADD and TSUB are indeterminate. Also, inputs T1, T2, T3, T4 and F1, F2 may be ignored. After correction is complete, the FSUB and TSUB gain settings return to their default values (0 dB). Offset correction is performed under the following conditions: ■ ■ ■ ■ When power is applied. When the supply drops below 2.8 ± 0.9 V and then rises to above 3.8 ± 0.6 V. When sleep mode operation is cancelled. When the serial interface bit CS1 is 1. Note that if SL1 is also 1, then SL1 has priority. Table 4. Offset correction setting CS1 Offset correction1 0 No correction 1 Correction 1. Default is No correction If the voltage falls below 2.8 ± 0.9 V during offset correction, then correction stops and does not restart until the supply recovers to above 3.8 ± 0.6 V. During offset correction, the CALREQ output is held HIGH. CALREQ goes LOW after correction stops. The SM9103M also incorporates a temperature detect function which detects temperature changes of 20 ± 5 °C from the time the initial correction is performed. If a temperature change is detected, CALREQ goes HIGH and the device waits for an offset correction instruction. Note that when both WRITE and MODE are HIGH, offset correction is inactive and the output appears uncorrected. However, if a correction start condition occurs when correction is inactive, such as the correction flag CS1 set to 1, then correction operation is initiated internally but does not appear at the output unless correction is activated prior to correction operation finishing. Once correction has been made inactive, the output remains uncorrected even if correction is subsequently reactivated. In this case, the output remains uncorrected until a valid correction start condition is detected. Sleep Mode The SM9103M features a sleep mode which can be used when the device is not operating to significantly reduce current consumption. The sleep mode is controlled by serial interface bit SL1. Table 5. Sleep mode settings SL1 Sleep mode1 Mode description LOW OFF Normal operation HIGH ON Sleep condition 1. Default is OFF Preset Function When power is applied or after offset correction, all serial interface flags are reset to their default values. Flags TG3 to TG0 and FG3 to FG0 are also set to their default values in sleep mode. NIPPON PRECISION CIRCUITS—13 SM9103M NIPPON PRECISION CIRCUITS INC. reserves the right to make changes to the products described in this data sheet in order to improve the design or performance and to supply the best possible products. Nippon Precision Circuits Inc. assumes no responsibility for the use of any circuits shown in this data sheet, conveys no license under any patent or other rights, and makes no claim that the circuits are free from patent infringement. Applications for any devices shown in this data sheet are for illustration only and Nippon Precision Circuits Inc. makes no claim or warranty that such applications will be suitable for the use specified without further testing or modification. The products described in this data sheet are not intended to use for the apparatus which influence human lives due to the failure or malfunction of the products. Customers are requested to comply with applicable laws and regulations in effect now and hereinafter, including compliance with export controls on the distribution or dissemination of the products. Customers shall not export, directly or indirectly, any products without first obtaining required licenses and approvals from appropriate government agencies. NIPPON PRECISION CIRCUITS INC. NIPPON PRECISION CIRCUITS INC. 4-3, Fukuzumi 2-chome Koto-ku, Tokyo 135-8430, Japan Telephone: 03-3642-6661 Facsimile: 03-3642-6698 NC9806AE 1998.12 NIPPON PRECISION CIRCUITS—14