SN74AUC06 HEX INVERTER BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS www.ti.com SCES471 – AUGUST 2003 – REVISED AUGUST 2005 FEATURES • VCC 1 14 2 13 6A 3 12 6Y 4 11 5A 5 6 10 5Y 9 4A 7 8 4Y • • • • • 1Y 2A 2Y 3A 3Y 1A • RGY PACKAGE (TOP VIEW) Optimized for 1.8-V Operation and Is 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation Ioff Supports Partial-Power-Down Mode Operation Sub-1-V Operable Max tpd of 2.2 ns at 1.8 V Low Power Consumption, 10-µA Max ICC ±8-mA Output Drive at 1.8 V Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101) GND • DESCRIPTION/ORDERING INFORMATION This hex inverter buffer/driver is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC operation. The outputs of the SN74AUC06 are open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. ORDERING INFORMATION PACKAGE (1) TA –40°C to 85°C (1) QFN – RGY ORDERABLE PART NUMBER Tape and reel SN74AUC06RGYR TOP-SIDE MARKING MS06 Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. FUNCTION TABLE (EACH INVERTER) INPUT A OUTPUT Y H L L H lOGIC DIAGRAM, EACH BUFFER/DRIVER (POSITIVE LOGIC) A Y Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2003–2005, Texas Instruments Incorporated SN74AUC06 HEX INVERTER BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS www.ti.com SCES471 – AUGUST 2003 – REVISED AUGUST 2005 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range –0.5 3.6 V VI Input voltage range (2) –0.5 3.6 V range (2) –0.5 UNIT VO Output voltage 3.6 V IIK Input clamp current VI < 0 –50 mA IOK Output clamp current VO < 0 –50 mA IO Continuous output current ±20 mA ±100 Continuous current through VCC or GND θJA Package thermal impedance (3) Tstg Storage temperature range (1) (2) (3) –65 mA 47 °C/W 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. The package thermal impedance is calculated in accordance with JESD 51-5. Recommended Operating Conditions (1) VCC Supply voltage VCC = 0.8 V VIH High-level input voltage VCC = 1.1 V to 1.95 V VCC = 2.3 V to 2.7 V MIN MAX 0.8 2.7 Low-level input voltage V VCC 0.65 × VCC V 1.7 VCC = 0.8 V VIL UNIT 0 0.35 × VCC VCC = 1.1 V to 1.95 V VCC = 2.3 V to 2.7 V V 0.7 VI Input voltage 0 3.6 V VO Output voltage 0 3.6 V IOL Low-level output current VCC = 0.8 V 0.7 VCC = 1.1 V 3 VCC = 1.4 V 5 VCC = 1.65 V 8 VCC = 2.3 V ∆t/∆v Input transition rise or fall rate TA Operating free-air temperature (1) 2 mA 9 –40 20 ns/V 85 °C All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. SN74AUC06 HEX INVERTER BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS www.ti.com SCES471 – AUGUST 2003 – REVISED AUGUST 2005 Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VOL VCC MIN TYP (1) MAX IOL = 100 µA 0.8 V to 2.7 V IOL = 0.7 mA 0.8 V IOL = 3 mA 1.1 V 0.3 IOL = 5 mA 1.4 V 0.4 IOL = 8 mA 1.65 V 0.45 2.3 V 0.6 IOL = 9 mA UNIT 0.2 0.25 V VI = VCC or GND 0 to 2.7 V ±5 µA Ioff VI or VO = 2.7 V 0 ±10 µA ICC VI = VCC or GND, 10 µA Ci VI = VCC or GND II (1) A inputs IO = 0 0.8 V to 2.7 V 2.5 V 2.5 pF All typical values are at TA = 25°C. Switching Characteristics over recommended operating free-air temperature range, CL = 15 pF (unless otherwise noted) (see Figure 1) PARAMETER VCC = 1.2 V ± 0.1 V VCC = 1.5 V ± 0.1 V VCC = 1.8 V ± 0.15 V VCC = 2.5 V ± 0.2 V FROM (INPUT) TO (OUTPUT) VCC = 0.8 V TYP MIN MAX MIN MAX MIN TYP MAX MIN MAX A Y 4.2 0.8 3.6 0.5 2.6 0.5 1.4 3.1 0.4 2.2 tpd UNIT ns Switching Characteristics over recommended operating free-air temperature range, CL = 30 pF (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) A Y tpd VCC = 1.8 V ± 0.15 V VCC = 2.5 V ± 0.2 V UNIT MIN TYP MAX MIN MAX 0.8 1.7 2.8 0.8 1.3 ns Operating Characteristics TA = 25°C PARAMETER Cpd Power dissipation capacitance TEST CONDITIONS VCC = 0.8 V VCC = 1.2 V VCC = 1.5 V VCC = 1.8 V VCC = 2.5 V TYP TYP TYP TYP TYP f = 10 MHz 2 2 2 3 3 UNIT pF 3 SN74AUC06 HEX INVERTER BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS www.ti.com SCES471 – AUGUST 2003 – REVISED AUGUST 2005 PARAMETER MEASUREMENT INFORMATION (OPEN DRAIN) VLOAD S1 RL From Output Under Test Open TEST GND RL CL (see Note A) S1 tPZL (see Notes E and F) VLOAD tPLZ (see Notes E and G) VLOAD tPHZ/tPZH VLOAD LOAD CIRCUIT INPUT VCC VI 0.8 V 1.2 V ± 0.1 V 1.5 V ± 0.1 V 1.8 V ± 0.15 V 2.5 V ± 0.2 V 1.8 V ± 0.15 V 2.5 V ± 0.2 V tr/tf ≤ 2 ns ≤ 2 ns ≤ 2 ns ≤ 2 ns ≤ 2 ns ≤ 2 ns ≤ 2 ns VCC VCC VCC VCC VCC VCC VCC VI VM Input VM 0V 2 × VCC 2 × VCC 2 × VCC 2 × VCC 2 × VCC 2 × VCC 2 × VCC VM VM VOL tPHL V∆ 15 pF 15 pF 15 pF 15 pF 15 pF 30 pF 30 pF 2 kΩ 2 kΩ 2 kΩ 2 kΩ 2 kΩ 1 kΩ 500 Ω 0.1 V 0.1 V 0.1 V 0.15 V 0.15 V 0.15 V 0.15 V VM VM 0V Output Waveform 1 S1 at VLOAD (see Note B) tPLZ VLOAD/2 VM tPZH VOH VM VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS RL VI Output Control tPLH VM CL tPZL VOH Output VCC/2 VCC/2 VCC/2 VCC/2 VCC/2 VCC/2 VCC/2 VLOAD tPHL tPLH Output VM Output Waveform 2 S1 at VLOAD (see Note B) VOL + V∆ VOL tPHZ VM VLOAD/2 − V∆ VLOAD/2 ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω. D. The outputs are measured one at a time, with one transition per measurement. E. Since this device has open-drain outputs, tPLZ and tPZL are the same as tpd. F. tPZL is measured at VM. G. tPLZ is measured at VOL + V∆. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms 4 PACKAGE OPTION ADDENDUM www.ti.com 21-May-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74AUC06RGYR ACTIVE QFN RGY 14 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SN74AUC06RGYRG4 ACTIVE QFN RGY 14 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 4-Oct-2007 TAPE AND REEL BOX INFORMATION Device SN74AUC06RGYR Package Pins RGY 14 Site Reel Diameter (mm) Reel Width (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) SITE 41 180 12 3.85 3.85 1.35 8 Pack Materials-Page 1 W Pin1 (mm) Quadrant 12 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 4-Oct-2007 Device Package Pins Site Length (mm) Width (mm) Height (mm) SN74AUC06RGYR RGY 14 SITE 41 190.0 212.7 31.75 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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