E2G0025-17-42 ¡ Semiconductor MSM514900C/CSL ¡ Semiconductor This MSM514900C/CSL version: Jan. 1998 Previous version: May 1997 524,288-Word ¥ 9-Bit DYNAMIC RAM : FAST PAGE MODE TYPE DESCRIPTION The MSM514900C/CSL is a 524,288-word ¥ 9-bit dynamic RAM fabricated in Oki's silicon-gate CMOS technology. The MSM514900C/CSL achieves high integration, high-speed operation, and low-power consumption because Oki manufactures the device in a quadruple-layer polysilicon/ single-layer metal CMOS process. The MSM514900C/CSL is available in a 28-pin plastic SOJ or 28pin plastic TSOP. The MSM514900CSL (the self-refresh version) is specially designed for lowerpower applications. FEATURES • 524,288-word ¥ 9-bit configuration • Single 5 V power supply, ±10% tolerance • Input : TTL compatible, low input capacitance • Output : TTL compatible, 3-state • Refresh : 1024 cycles/16 ms, 1024 cycles/128 ms (SL version) • Fast page mode, read modify write capability • CAS before RAS refresh, hidden refresh, RAS-only refresh capability • CAS before RAS self-refresh capability (SL version) • Package options: 28-pin 400 mil plastic SOJ (SOJ28-P-400-1.27) (Product : MSM514900C/CSL-xxJS) 28-pin 400 mil plastic TSOP (TSOPII28-P-400-1.27-K) (Product : MSM514900C/CSL-xxTS-K) xx indicates speed rank. PRODUCT FAMILY Family Access Time (Max.) tRAC tAA tCAC tOEA Power Dissipation Cycle Time (Min.) Operating (Max.) Standby (Max.) MSM514900C/CSL-60 60 ns 35 ns 20 ns 20 ns 110 ns 770 mW MSM514900C/CSL-70 70 ns 35 ns 20 ns 20 ns 130 ns 715 mW MSM514900C/CSL-80 80 ns 40 ns 20 ns 20 ns 150 ns 660 mW 5.5 mW/ 1.1 mW (SL version) 1/16 ¡ Semiconductor MSM514900C/CSL PIN CONFIGURATION (TOP VIEW) VCC 1 28 VSS VCC 1 28 VSS DQ1 2 27 DQ9 DQ1 2 27 DQ9 DQ2 3 26 DQ8 DQ2 3 26 DQ8 DQ3 4 25 DQ7 DQ3 4 25 DQ7 DQ4 5 24 DQ6 DQ4 5 24 DQ6 DQ5 6 23 CAS DQ5 6 23 CAS WE 7 22 OE WE 7 22 OE RAS 8 21 NC RAS 8 21 NC A9R 9 20 A8 A9R 9 20 A8 A0 10 19 A7 A0 10 19 A7 A1 11 18 A6 A1 11 18 A6 A2 12 17 A5 A2 12 17 A5 A3 13 16 A4 A3 13 16 A4 VCC 14 15 VSS VCC 14 15 VSS 28-Pin Plastic SOJ 28-Pin Plastic TSOP (K Type) Pin Name A0 - A8, A9R Function Address Input RAS Row Address Strobe CAS Column Address Strobe DQ1 - DQ9 Data Input / Data Output OE Output Enable WE Write Enable VCC Power Supply (5 V) VSS Ground (0 V) NC No Connection Note: The same power supply voltage must be provided to every VCC pin, and the same GND voltage level must be provided to every VSS pin. 2/16 ¡ Semiconductor MSM514900C/CSL BLOCK DIAGRAM RAS Timing Generator Timing Generator CAS 9 Column Address Buffers 9 Write Clock Generator Column Decoders WE OE 9 Internal Address Counter A0 - A8 Refresh Control Clock Sense Amplifiers 9 I/O Selector A9R 1 Row Address Buffers 10 Row Decoders Word Drivers 9 9 9 9 9 Output Buffers Input Buffers DQ1 - DQ9 9 Memory Cells VCC On Chip VBB Generator VSS 3/16 ¡ Semiconductor MSM514900C/CSL ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings Parameter Symbol Rating Unit Voltage on Any Pin Relative to VSS VT –1.0 to 7.0 V Short Circuit Output Current IOS 50 mA Power Dissipation PD* 1 W Operating Temperature Topr 0 to 70 °C Storage Temperature Tstg –55 to 150 °C *: Ta = 25°C Recommended Operating Conditions Parameter Power Supply Voltage (Ta = 0°C to 70°C) Symbol Min. Typ. Max. Unit VCC 4.5 5.0 5.5 V VSS 0 0 0 V Input High Voltage VIH 2.4 — 6.5 V Input Low Voltage VIL –1.0 — 0.8 V Capacitance (VCC = 5 V ±10%, Ta = 25°C, f = 1 MHz) Parameter Symbol Typ. Max. Unit Input Capacitance (A0 - A8, A9R) CIN1 — 7 pF Input Capacitance (RAS, CAS, WE, OE) CIN2 — 7 pF Output Capacitance (DQ1 - DQ9) CI/O — 8 pF 4/16 ¡ Semiconductor MSM514900C/CSL DC Characteristics (VCC = 5 V ±10%, Ta = 0°C to 70°C) Parameter Symbol Condition MSM514900 MSM514900 MSM514900 C/CSL-70 C/CSL-60 C/CSL-80 Unit Note Min. Max. Min. Max. Min. Max. Output High Voltage VOH IOH = –5.0 mA 2.4 VCC 2.4 VCC 2.4 VCC V Output Low Voltage VOL IOL = 4.2 mA 0 0.4 0 0.4 0 0.4 V Input Leakage Current ILI –10 10 –10 10 –10 10 mA –10 10 –10 10 –10 10 mA — 140 — 130 — 120 mA 1, 2 — 2 — 2 — 2 — 1 — 1 — 1 — 200 — 200 — — 140 — 130 — 5 — — 140 — 0 V £ VI £ 6.5 V; All other pins not under test = 0 V Output Leakage Current ILO Average Power Supply Current ICC1 (Operating) DQ disable 0 V £ VO £ 5.5 V RAS, CAS cycling, tRC = Min. RAS, CAS = VIH Power Supply Current (Standby) ICC2 RAS, CAS ≥ VCC –0.2 V 1 200 mA 1, 5 — 120 mA 1, 2 5 — 5 — 130 — 120 mA 1, 2 130 — 120 — 110 mA 1, 3 — 300 — 300 — 300 mA — 300 — 300 — 300 mA RAS cycling, Average Power Supply Current mA ICC3 CAS = VIH, (RAS-only Refresh) tRC = Min. RAS = VIH, Power Supply Current (Standby) ICC5 CAS = VIL, ICC6 (CAS before RAS Refresh) RAS cycling, CAS before RAS RAS = VIL, Average Power Supply Current ICC7 CAS cycling, (Fast Page Mode) tPC = Min. Average Power tRC = 125 ms, Supply Current 1 DQ = enable Average Power Supply Current mA ICC10 CAS before RAS, tRAS £ 1 ms (Battery Backup) 1, 4, 5 Average Power Supply Current (CAS before RAS ICCS RAS £ 0.2 V, CAS £ 0.2 V 1, 5 Self-Refresh) Notes: 1. 2. 3. 4. 5. ICC Max. is specified as ICC for output open condition. The address can be changed once or less while RAS = VIL. The address can be changed once or less while CAS = VIH. VCC – 0.2 V £ VIH £ 6.5 V, –1.0 V £ VIL £ 0.2 V. SL version. 5/16 ¡ Semiconductor MSM514900C/CSL AC Characteristics (1/2) (VCC = 5 V ±10%, Ta = 0°C to 70°C) Note 1, 2, 3 Parameter Symbol MSM514900 MSM514900 MSM514900 C/CSL-60 C/CSL-70 C/CSL-80 Unit Note Min. Max. Min. Max. Min. Max. tRWC tPC 110 155 40 — — — 130 185 45 — — — 150 205 50 — — — ns ns ns tPRWC 85 — 100 — 105 — ns Access Time from RAS tRAC — 60 — 70 — 80 ns 4, 5, 6 Access Time from CAS tCAC — 20 — 20 — 20 ns 4, 5 Access Time from Column Address Access Time from CAS Precharge tAA tCPA — — 30 35 — — 35 40 — — 40 45 ns ns 4, 6 4 Access Time from OE Output Low Impedance Time from CAS tOEA tCLZ — 0 20 — — 0 20 — — 0 20 — ns ns 4 4 CAS to Data Output Buffer Turn-off Delay Time OE to Data Output Buffer Turn-off Delay Time Transition Time Refresh Period Refresh Period (SL version) tOFF tOEZ tT tREF tREF 0 0 3 — — 15 15 50 16 128 0 0 3 — — 20 0 0 3 — — 20 20 50 16 128 20 50 16 128 ns ns ns ms ms 7 7 3 RAS Precharge Time tRP 40 — 50 — 60 — ns RAS Pulse Width tRAS 60 10,000 70 10,000 80 10,000 ns RAS Pulse Width (Fast Page Mode) tRASP 60 100,000 70 100,000 80 100,000 ns RAS Hold Time RAS Hold Time referenced to OE tRSH tROH 15 15 — — 20 20 — — 20 20 — — ns ns CAS Precharge Time (Fast Page Mode) tCP 10 — 10 — 10 — ns CAS Pulse Width tCAS 20 10,000 20 10,000 20 10,000 ns CAS Hold Time CAS to RAS Precharge Time tCSH tCRP 60 10 — — 70 10 — — 80 10 — — ns tRHCP tRCD tRAD 35 20 15 — 40 30 40 20 15 — 50 35 45 20 15 — 60 40 ns ns ns Random Read or Write Cycle Time tRC Read Modify Write Cycle Time Fast Page Mode Cycle Time Fast Page Mode Read Modify Write Cycle Time RAS Hold Time from CAS Precharge RAS to CAS Delay Time RAS to Column Address Delay Time 11 ns 5 6 Row Address Set-up Time tASR 0 — 0 — 0 — ns Row Address Hold Time tRAH 10 — 10 — 10 — ns Column Address Set-up Time tASC 0 — 0 — 0 — ns Column Address Hold Time tCAH 15 — 15 — 15 — ns Column Address Hold Time from RAS 50 — 55 — 60 — ns Column Address to RAS Lead Time tAR tRAL 30 — 35 — 40 — ns Read Command Set-up Time tRCS 0 — 0 — 0 — ns Read Command Hold Time tRCH 0 — 0 — 0 — ns 8 tRRH 0 — 0 — 0 — ns 8 Read Command Hold Time referenced to RAS 6/16 ¡ Semiconductor MSM514900C/CSL AC Characteristics (2/2) (VCC = 5 V ±10%, Ta = 0°C to 70°C) Note 1, 2, 3 Parameter Symbol MSM514900 MSM514900 MSM514900 C/CSL-60 C/CSL-70 C/CSL-80 Unit Note Min. Max. Min. Max. Min. Max. — 0 — 0 — ns Write Command Set-up Time tWCS 0 Write Command Hold Time tWCH 15 — 15 — 15 — ns Write Command Hold Time from RAS tWCR 50 — 55 — 60 — ns Write Command Pulse Width tWP 15 — 15 — 15 — ns OE Command Hold Time tOEH 15 — 20 — 20 — ns Write Command to RAS Lead Time tRWL 15 — 20 — 20 — ns Write Command to CAS Lead Time tCWL 15 — 20 — 20 — ns Data-in Set-up Time tDS 0 — 0 — 0 — ns 10 Data-in Hold Time tDH 15 — 15 — 15 — ns 10 Data-in Hold Time from RAS tDHR 50 — 55 — 60 — ns OE to Data-in Delay Time tOED 15 — 20 — 20 — ns CAS to WE Delay Time tCWD 40 — 50 — 50 — ns 9 Column Address to WE Delay Time tAWD 60 — 65 — 70 — ns 9 RAS to WE Delay Time tRWD 90 — 100 — 110 — ns 9 CAS Precharge WE Delay Time tCPWD 65 — 70 — 75 — ns 9 CAS Active Delay Time from RAS Precharge tRPC 10 — 10 — 10 — ns RAS to CAS Set-up Time (CAS before RAS) tCSR 10 — 10 — 10 — ns RAS to CAS Hold Time (CAS before RAS) tCHR 15 — 15 — 15 — ns RAS Pulse Width (CAS before RAS Self-Refresh) tRASS 100 — 100 — 100 — ms 11 RAS Precharge Time (CAS before RAS Self-Refresh) tRPS 110 — 130 — 150 — ns 11 CAS Hold Time (CAS before RAS Self-Refresh) tCHS –40 — –50 — –60 — ns 11 9 7/16 ¡ Semiconductor Notes: MSM514900C/CSL 1. A start-up delay of 200 µs is required after power-up, followed by a minimum of eight initialization cycles (RAS-only refresh or CAS before RAS refresh) before proper device operation is achieved. 2. The AC characteristics assume tT = 5 ns. 3. VIH (Min.) and VIL (Max.) are reference levels for measuring input timing signals. Transition times (tT) are measured between VIH and VIL. 4. This parameter is measured with a load circuit equivalent to 2 TTL loads and 100 pF. 5. Operation within the tRCD (Max.) limit ensures that tRAC (Max.) can be met. tRCD (Max.) is specified as a reference point only. If tRCD is greater than the specified tRCD (Max.) limit, then the access time is controlled by tCAC. 6. Operation within the tRAD (Max.) limit ensures that tRAC (Max.) can be met. tRAD (Max.) is specified as a reference point only. If tRAD is greater than the specified tRAD (Max.) limit, then the access time is controlled by tAA. 7. tOFF (Max.) and tOEZ (Max.) define the time at which the output achieves the open circuit condition and are not referenced to output voltage levels. 8. tRCH or tRRH must be satisfied for a read cycle. 9. tWCS, tCWD, tRWD, tAWD and tCPWD are not restrictive operating parameters. They are included in the data sheet as electrical characteristics only. If tWCS ≥ tWCS (Min.), then the cycle is an early write cycle and the data out will remain open circuit (high impedance) throughout the entire cycle. If tCWD ≥ tCWD (Min.) , tRWD ≥ tRWD (Min.), tAWD ≥ tAWD (Min.) and tCPWD ≥ tCPWD (Min.), then the cycle is a read modify write cycle and data out will contain data read from the selected cell; if neither of the above sets of conditions is satisfied, then the condition of the data out (at access time) is indeterminate. 10. These parameters are referenced to the CAS leading edge in an early write cycle, and to the WE leading edge in an OE control write cycle, or a read modify write cycle. 11. Only SL version. 8/16 E2G0096-17-41I , ,, , ,,,, ¡ Semiconductor MSM514900C/CSL TIMING WAVEFORM Read Cycle tRC tRP tRAS RAS VIH – VIL – tAR tCSH tCRP CAS tRCD VIH – VIL – VIH – VIL – tRSH tCAS tRAD tASR Address tCRP tRAH tASC tRAL tCAH Column Row tRCS WE VIH – VIL – tAA tROH tOEA VIH – OE VIL – tCAC tRAC DQ tRCH tRRH VOH – tOEZ Open VOL – tOFF Valid Data-out tCLZ "H" or "L" Write Cycle (Early Write) tRC tRP tRAS RAS VIH – VIL – tAR tCRP VIH – CAS VIL – WE VIH – VIL – tCSH tRCD tRSH tCAS tRAD tRAH tASR Address tCRP tASC Row tCAH Column tWCS tWCH VIH – tRWL VIH – VIL – tDS DQ tCWL tWP VIL – tWCR OE tRAL VIH – VIL – tDHR tDH Valid Data-in Open "H" or "L" 9/16 , ,, ¡ Semiconductor MSM514900C/CSL Read Modify Write Cycle tRWC tRAS RAS VIH – VIL – tRP tAR tCRP tCSH tCRP tRCD tRSH tCAS VIH – CAS VIL – tASR VIH – Address VIL – WE VIH – VIL – OE VIH – VIL – tRAH tASC tCAH Column Row tRAD tRWD tAA tAWD tRCS tOEA tOED tCAC tRAC DQ VI/OH– VI/OL– tCWL tRWL tWP tCWD tCLZ tOEZ Valid Data-out tOEH tDS tDH Valid Data-in "H" or "L" 10/16 ,,, , ,, , ¡ Semiconductor MSM514900C/CSL Fast Page Mode Read Cycle tRASP VIH – RAS V – IL VIH – CAS VIL – Address WE VIH – VIL – tRP tAR tCRP tRHCP tPC tRCD tCP tASR tCP tCAS tCAS tRAD tRAH tASC tCSH tCAH tASC Column Row VIH – VIL – tCAC VOH – DQ VOL – Column tRCS tRCH tRRH tCPA tOEA tOFF tOEZ tRCH tAA tAA tCAC tOEA tOFF tCAC tOEZ tCLZ Valid Data-out tCLZ tRCS tCPA tOEA tRAC tRAL tCAH tASC Column tAA VIH – OE VIL – tCAS tCAH tRCH tRCS tCRP tRSH tCLZ tOFF tOEZ Valid Data-out Valid Data-out "H" or "L" Fast Page Mode Write Cycle (Early Write) tRASP tAR VIH – RAS V – IL tCRP VIH – CAS VIL – Address VIH – VIL – tRAH tASC Row tWCS tDS VIH – VIL – tCSH tCAH Column tCWL tWCH tWP tRAD tRHCP tRSH tRCD VIH – WE VIL – DQ tPC tCAS tASR tRP tWCR tDH Valid Data-in tDHR tCP tCRP tCP tCAS tASC tCAH tASC Column tCWL tWCS tWCH tWP tDS tDH Valid Data-in tCAS tCAH tRAL Column tRWL tCWL tWCS tWCH tWP tDS tDH Valid Data-in Note: OE = "H" or "L" "H" or "L" 11/16 ¡ Semiconductor RAS VIH – VIL – CAS Address VIH – VIL – VIH – VIL – MSM514900C/CSL , 12/16 ,, , ,, ¡ Semiconductor MSM514900C/CSL CAS before RAS Refresh Cycle tRC tRP RAS VIH – VIL – DQ tRP tRPC tRPC tCSR tCP CAS tRAS VIH – VIL – tCHR tOFF VOH – VOL – Open Note: WE, OE, Address = "H" or "L" "H" or "L" Hidden Refresh Read Cycle tRC tRAS RAS VIH – tRP tAR VIH – VIL – VIH – VIL – tRSH tRCD tRAD tASC tRAH tASR Address tRAS tRP VIL – tCRP CAS tRC Row tCHR tCAH Column tRCS tRAL VIH – WE V IL – tRRH tAA tROH tOEA VIH – OE V IL – tRAC DQ VOH – VOL – tCAC tCLZ tOFF tOEZ Valid Data-out "H" or "L" 13/16 ¡ Semiconductor MSM514900C/CSL ,,, , Hidden Refresh Write Cycle tRC tRAS VIH – RAS VIL – CAS tRP tAR tCRP tRCD VIH – VIL – tCAH tRAH Row tWCS V WE IH – VIL – tCHR tRSH tRAD tASC tASR Address VIH – VIL – tRC tRAS tRP tRAL Column tRWL tWCH tWP tWCR VIH – OE VIL – tDS DQ VIH – VIL – tDH Valid Data-in tDHR "H" or "L" CAS before RAS Self-Refresh Cycle tRASS tRP RAS VIH – VIL – tRPC tCP CAS tRPS tRPC tCSR tCHS VIH – VIL – tOFF DQ VOH – VOL – Open Note: WE, OE, Address = "H" or "L" Only SL version "H" or "L" 14/16 ¡ Semiconductor MSM514900C/CSL PACKAGE DIMENSIONS (Unit : mm) SOJ28-P-400-1.27 Mirror finish Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 1.30 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 15/16 ¡ Semiconductor MSM514900C/CSL (Unit : mm) TSOPII28-P-400-1.27-K Mirror finish Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.51 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 16/16