E2D0039-39-21 This version: Feb. 1999 MSM6596A-xxx Previous version: May. 1997 ¡ Semiconductor MSM6596A-xxx ¡ Semiconductor 2-Mbit Serial Voice ROM GENERAL DESCRIPTION The MSM6596A is the shorter-TAT processing version of the MSM6596. The MSM6596A is a serial voice ROM with a 1,048,576-word ¥ 1-bit ¥ 2-bank configuration. The MSM6596A has a built-in internal address-generating circuit. A single, external clock input allows continuous, serial read operations. The internal addresses are automatically incremented by 1 by read operation. 1024 words in X direction and 1024 words in Y direction can be addressed by inputting external serial addresses. Banks are switched with CS1 and CS2. A read and playback device with predetermined messages can easily be configured by storing the voice data into the MSM6596A and combining it with one of OKI's recording and playback ICs and serial register IC. A serial register is required to drive the MSM6596A by the MSM6388 or MSM6588. (The MSM6596A does not operate without a serial register.) The major functional differences between the MSM6596A and MSM6596 are shown below. MSM6596A DC Characteristics Parameter Current consumption (1) Current consumption (2) VDD = 2.7 to 5.5 V, Ta = –40 to +85°C Symbol Condition Min. Typ. Max. Unit IDD tRDC = 2.5 ms — 9 20 mA — — 10 IDS CS1 = CS2 = VDD – 0.2 V Ta = –40 to +70°C mA Ta = –40 to +85°C — — 50 Typical values are at VDD = 5.0 V, Ta = 25°C. MSM6596 DC Characteristics Parameter Symbol VDD = 3.5 to 5.5 V, Ta = –40 to +85C° Condition Min. Typ. Max. Unit Current consumption (1) IDD tRDC = 2.5 ms — — 15 mA Current consumption (2) IDS CS1 = CS2 = VDD–0.2 V — — 10 mA Typical values are at VDD = 5.0 V, Ta = 25°C. For other details, refer to individual sections in this data sheet. FEATURES • Configuration : • Serial access : • Shorter-TAT processing • Power-supply voltage : • Package options : 18-pin plastic QFJ (QFJ18-P-R290-1.27) 24-pin plastic SOP (SOP24-P-430-1.27-K) 18-pin plastic DIP (DIP18-P-300-2.54) 30-pin plastic SSOP (SSOP30-P-56-0.65-K) 1,048,576 words ¥ 1 bit ¥ 2 banks Read cycle time of 2.5 ms 2.7 to 5.5 V (Product name : MSM6596A-xxxJS) (Product name : MSM6596A-xxxGS-K) (Product name : MSM6596A-xxxRS) (Product name : MSM6596A-xxxGS-AK) 1/12 ¡ Semiconductor MSM6596A-xxx BLOCK DIAGRAM SASX 1 1 10 CK Y-ADDRESS COUNTER Sin Y-ADDRESS REGISTER Memory Cell Matrix 262144 ¥ 8 VDD GND LD CK CK SADY SASY X-DECODER 10 10 LD CK 6 3 Y-DECODER X-ADDRESS REGISTER Sin X-ADDRESS COUNTER SADX MULTIPLEXER TEST TESTO1 TESTO2 MULTIPLEXER DOUT TAS RDCK CS2 CS CONTROL CS1 2/12 ¡ Semiconductor MSM6596A-xxx 2 DOUT GND 1 18 17 3 4 5 6 7 16 15 14 13 12 TESTO1 NC NC RDCK NC TESTO2 9 10 11 TEST TAS 8 VDD CS2 CS1 NC SADX SASX SADY SASY PIN CONFIGURATIONS (TOP VIEW) SADY SASY CS2 CS1 NC NC NC NC SADX SASX TAS VDD 1 2 3 4 5 6 7 8 9 10 11 12 NC: No connection NC: No connection 18-Pin Plastic QFJ 24-Pin Plastic SOP SADY 1 18 GND SASY 2 17 DOUT CS2 3 16 TESTO1 CS1 4 15 NC NC 5 14 NC SADX 6 13 RDCK SASX 7 12 NC TAS 8 11 TESTO2 VDD 9 10 TEST SADY SASY CS2 NC CS1 NC NC NC NC NC NC SADX SASX TAS VDD 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 24 23 22 21 20 19 18 17 16 15 14 13 GND NC DOUT TESTO1 NC NC NC NC NC RDCK TESTO2 TEST 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 GND NC DOUT TESTO1 NC NC NC NC NC NC NC NC RDCK TESTO2 TEST NC: No connection NC: No connection 18-Pin Plastic DIP 30-Pin Plastic SSOP 3/12 ¡ Semiconductor MSM6596A-xxx PIN DESCRIPTIONS Pin QFJ SOP DIP SSOP Symbol Type Description 9 12 9 15 VDD — Power supply pin. Insert a bypass capacitor of 0.1 mF or more between this pin and the GND pin. 18 24 18 30 GND — Ground pin 6 9 6 12 SADX I (SERIAL ADDRESS) This pin inputs the starting X address of a read operation. Addressing in units of 1024 words is possible. The 1024-word address data can be input as 10-bit (AX0 - AX9) serial data via the SADX pin. 1 1 1 1 SADY I (SERIAL ADDRESS) This pin inputs the starting Y address of a read operation. Addressing in units of 1024 words is possible. The 1024-word address data can be input as 10-bit (AY0 - AY9) serial data via the SADY pin. 7 10 7 13 SASX I (SERIAL ADDRESS STROBE) This is the clock input pin which is used to store the serial address data of the X address into the device's internal register. 2 2 2 2 SASY I (SERIAL ADDRESS STROBE) This is the clock input pin which is used to store the serial address data of the Y address into the device's internal register. I (TRANSFER ADDRESS STROBE) This is the input pin for loading the serial address data into the internal address counter. The X and Y addresses are stored at the falling edge of TAS. 8 11 8 14 TAS 13 15 13 18 RDCK I (READ CLOCK) This is the clock input pin for reading information out of the data register. Internal operation starts at the falling edge of RDCK. The information in the data register is output on the DOUT pin. The internal address counter is automatically incremented at the falling edge of RDCK. 17 22 17 28 DOUT O (DATA OUT) The data output pin is always kept in a high-impedance state when RDCK or CS is kept "H". This pin reflects the "H" or "L" level data being read, and the current data is hold until ROCK is asserted "H". 4 4 4 5 CS1 I 3 3 3 3 CS2 (CHIP SELECT) When CS1 is set to "L", bank 1 is selected. When CS2 is set to "L", bank 2 is selected. Setting both CS1 and CS2 to "H" disables all input and output pins. These pins enable parallel use of multiple serial voice ROMs by connecting the data output pins. 10 13 10 16 TEST I Pin for testing. Apply a "L" level. 16 21 16 27 TESTO1 11 14 11 17 TESTO2 O Pins for testing. Leave these pins open. ABSOLUTE MAXIMUM RATINGS Symbol Condition Rating Unit Power Supply Voltage Parameter VDD Ta = 25°C –0.3 to +7.0 V Input Voltage VIN Ta = 25°C –0.3 to VDD+0.3 V Storage Temperature TSTG — –55 to +150 °C 4/12 ¡ Semiconductor MSM6596A-xxx RECOMMENDED OPERATING CONDITIONS Symbol Condition Range Unit Power Supply Voltage Parameter VDD GND=0 V 2.7 to 5.5 V Operating Temperature Top — –40 to +85 °C ELECTRICAL CHARACTERISTICS DC Characteristics VDD = 2.7 to 5.5 V, Ta = –40 to +85°C Symbol Condition Min. Typ. Max. Unit "H" Level Input Voltage Parameter VIH — 0.85xVDD — — V "L" Level Input Voltage VIL — — — 0.15xVDD V "H" Level Output Voltage VOH IOH = –40 mA VDD–0.3 — — V "L" Level Output Voltage VOL IOL = 2 mA — — 0.45 V "H" Level Input Current IIH VIH = VDD — — 10 mA "L" Level Input Current IIL VIL = GND –10 — — mA Current Consumption (1) IDD tRDC = 2.5 ms mA Current Consumption (2) IDS CS1 = CS2 = VDD – 0.2 V — 9 20 Ta = –40 to +70°C — — 10 Ta = –40 to +85°C — — 50 mA Typical values are at VDD = 5.0 V, Ta = 25°C. AC Characteristics VDD = 2.7 to 5.5 V, Ta = –40 to +85°C Symbol Min. Max. Unit CS, SAS Setup Time Parameter tCSS 1000 — ns SASX, SASY Cycle Time tSSC 500 — ns SASX, SASY Precharge Time tSAP 250 — ns SASX, SASY Pulse Width tSAS 250 — ns Address Setup Time tAS 100 — ns Address Hold Time tAH 100 — ns TAS Setup Time tATS 500 — ns TAS, RDCK Setup Time tTRS 500 — ns TAS Pulse Width tTAS 250 — ns Read Cycle Time tRDC 2500 — ns Access Time tACC — 1500 ns Output Turn-off Delay Time tOFF 0 200 ns RDCK Precharge Time tRDP 1000 — ns RDCK Pulse Width tRD 1500 — ns 5/12 AX1 AX2 AX3 AX4 AX5 AX6 AX7 tAH tAS SASX (I) tSAS tCSS AY0 tAH AY1 AY2 AY3 tAS SASY (I) tSAS tCSS TAS (I) tSAP AY4 AX8 AX9 tATS tSAP tSSC SADY (I) ¡ Semiconductor AX0 SADX (I) TIMING DIAGRAMS Serial Address Input Timing CS2 (I) ,, , , ,,,,, , CS1 (I) AY5 AY6 AY7 AY8 AY9 tATS tSSC tTAS MSM6596A-xxx 6/12 ¡ Semiconductor Read Access Timing , , TAS (I) tTAS tRDC tTRS RDCK (I) tRD tRDP tOFF DOUT (O) XnYm XnYm+1 XnYm+2 XnY1023 Xn+1Y0 Xn+1Y1 tACC MSM6596A-xxx 7/12 ¡ Semiconductor MSM6596A-xxx APPLICATION CIRCUIT MSM6588 Playback Storage Example RESET + MIN MSM6588 AU/D TEST TEST TEST TEST TEST CS VDD 1-Mbit SERIAL REGISTER MSM6389 SAD SAS TAS RWCK WE DIN DOUT MSM6389 MICROCONTROLLER RD WR CE MCUM TEST RSEL1 RSEL2 TEST TEST TEST TEST VDD SAD SAS TAS RWCK WE DI/O GND CS GND VDD SADX SASX TAS RDCK DOUT SASY SADY 2-Mbit SERIAL VOICE ROM MSM6596A-xxx DVDD DVDD' AVDD D3 D2 D1 D0 TEST CS1 CS2 GND CS1 CS2 CS3 CS4 MON XT XT 4.096 MHz MOUT DGND LIN AVDD + + LOUT AMON FIN FOUT ADIN SG DGND AOUT Speaker amplifier AGND AGND Note: When the MSM6596A is driven by the MSM6388 or MSM6588, a serial register is required. (The MSM6596A does not operate without it.) The MSM6389 is being used as the serial register in the above example. 8/12 ¡ Semiconductor MSM6596A-xxx PACKAGE DIMENSIONS (Unit : mm) QFJ18-P-R290-1.27 Spherical surface Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.50 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person on the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 9/12 ¡ Semiconductor MSM6596A-xxx (Unit : mm) SOP24-P-430-1.27-K Mirror finish Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.58 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person on the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 10/12 ¡ Semiconductor MSM6596A-xxx (Unit : mm) DIP18-P-300-2.54 Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 1.30 TYP. 11/12 ¡ Semiconductor MSM6596A-xxx (Unit : mm) SSOP30-P-56-0.65-K Mirror finish Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.19 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person on the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 12/12 E2Y0002-29-11 NOTICE 1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date. 2. The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. 3. When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. 4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. 5. Neither indemnity against nor license of a third party’s industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us for any infringement of a third party’s right which may result from the use thereof. 6. The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products are not authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. 7. Certain products in this document may need government approval before they can be exported to particular countries. The purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. 8. No part of the contents cotained herein may be reprinted or reproduced without our prior permission. 9. MS-DOS is a registered trademark of Microsoft Corporation. Copyright 1999 Oki Electric Industry Co., Ltd. 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