E2B0022-27-Y2 ¡ Semiconductor MSM5839B ¡ Semiconductor This version: MSM5839B Nov. 1997 Previous version: Mar. 1996 40-DOT SEGMENT DRIVER GENERAL DESCRIPTION The MSM5839B is a dot matrix LCD segment driver LSI which is fabricated using low power CMOS metal gate technology. This LSI consists of two 20-bit shift registers, two 20-bit latches, a 40-bit level shifter and a 40-bit 4-level driver. It converts serial data, which is received from an LCD controller LSI, to parallel data and outputs LCD driving waveform to the LCD panel. Expansion of display can easily be made by increasing the number of characters and character patterns. This LSI can drive a variety of LCD panels because the bias voltage, which determines the LCD driving voltage, can be optionally supplied from the external source. FEATURES • Supply voltage : 4.5 to 5.5V • LCD driving voltage : 8 to 18V • Applicable LCD duty : 1/32 to 1/128 • Bias voltage can be supplied externally • Applicable common driver : MSM5238 (32 outputs) • Package options: 56-pin plastic QFP (QFP56-P-910-0.65-K) (Product name: MSM5839B GS-K) 56-pin plastic QFP (QFP56-P-910-0.65-L2) (Product name: MSM5839B GS-L2) 56-pin plastic QFP (QFP56-P-910-0.65-2K) (Product name: MSM5839B GS-2K) 1/11 MSM5839B ¡ Semiconductor BLOCK DIAGRAM O1 O2 O19 O20 O21 O22 VDD(V1) V2 V3 VEE(V4) O39 O40 40-Bit 4-Level Driver VDD VEE 40-Bit Level Shifter VDD DF LOAD 20-Bit Latch 20-Bit Latch VSS VSS DI1 CP 20-Bit Shift Register 20-Bit Shift Register DO20 DO40 DI21 2/11 MSM5839B ¡ Semiconductor 56 55 54 53 52 51 (Top view) 42 2 41 3 40 4 39 5 38 6 37 7 36 8 35 9 34 10 33 11 32 12 31 13 30 14 29 DO40 O40 O39 O38 O37 O36 O35 O34 O33 O32 O31 O30 O29 O28 O15 O16 O17 O18 O19 O20 *(VDD) O21 O22 O23 O24 O25 O26 O27 21 22 23 24 25 26 27 28 1 15 16 17 18 19 20 O1 O2 O3 O4 O5 O6 O7 O8 O9 O10 O11 O12 O13 O14 50 49 48 47 46 45 44 43 NC NC NC DF LOAD DI 1 CP VDD(V1) VSS V2 V3 VEE(V4) DO20 DI 21 PIN CONFIGURATION NC: No connection 14 13 12 11 9 10 8 7 6 5 4 3 27 28 O15 O16 O17 O18 O19 O20 *(VDD) O21 O22 O23 O24 O25 O26 O27 DO40 O40 O39 O38 O37 O36 O35 O34 O33 O32 O31 O30 O29 O28 29 44 43 30 25 26 31 46 45 32 23 24 33 22 48 47 34 49 35 20 21 36 19 51 50 37 18 52 38 53 39 16 17 40 15 55 54 41 56 42 NC NC NC DF LOAD DI 1 CP VDD(V1) VSS V2 V3 VEE(V4) DO20 DI 21 2 1 O1 O2 O3 O4 O5 O6 O7 O8 O9 O10 O11 O12 O13 O14 56-Pin Plastic QFP (Type K) NC: No connection 56-Pin Plastic QFP (Type L) * This pin is internally connected to VDD, so connect it to the power supply or leave it open. Note : The figure for Type L shows the configuration viewed from the reverse side of the package. Pay attention to the difference in pin arrangement. 3/11 MSM5839B ¡ Semiconductor ABSOLUTE MAXIMUM RATINGS Parameter Supply Voltage (1) Supply Voltage (2) Input Voltage Storage Temperature *1 *2 Symbol VDD VDD–VEE Condition Rating Ta = 25°C *1 *1 *2 –0.3 Ta = 25°C VDD–VEE Ta = 25°C V1 Ta = 25°C TSTG — –0.3 to +6 Unit V 0 to 18 V 0 to 18 V to VDD +0.3 V –55 to +150 °C VDD>V2>V3>VEE Applies when a series resistor of 47W or more is connected as shown below. VDD VDD–VEE V2 MSM5839B VSS V3 +V –V VEE RS => 47W 4/11 MSM5839B ¡ Semiconductor RECOMMENDED OPERATING CONDITIONS Parameter Symbol Supply Voltage (1) VDD VDD–VEE Supply Voltage (2) Range Unit — — 4.5 to 5.5 8 to 16 V V — 8 to 18 V — –20 to +85 °C *1 *1 *2 VDD–VEE Top Operating Temperature *1 *2 Condition VDD>V2>V3>VEE Applies when a series resistor of 47W or more is connected as shown below. VDD VDD–VEE V2 +V V3 MSM5839B VSS VEE RS ≥ 47W –V ELECTRICAL CHARACTERISTICS DC Characteristics (VDD = 5V ±10%, Ta = –20 to +85°C) Condition Min. Typ. "H" Input Voltage VIH *1 — 0.8VDD — VDD V "L" Input Voltage VIL *1 — VSS — 0.2VDD V "H" Input Current IIH *1 VI = VDD — — 1 mA "L" Input Current IIL *1 VI = 0V — — –1 mA IO =–0.4mA VDD–0.4 — — V IO = 0.4mA VDD–VEE= 10V — — 0.4 V — 3.5 7 kW — — 100 mA Parameter Symbol "H" Output Voltage VOH *2 "L" Output Voltage VOL *2 ON Resistance RON *4 Supply Current IDD *1 *2 *3 *4 *3 VN–VO = 0.25V Connect all inputs to VDD or VSS VDD–VEE = 18V, No load Applicable to LOAD, CP, DI1, DI21, DF Applicable to DO20, DO40 VN = VDD to VEE, V3 = 29 (VDD–VEE), V2 = Applicable to O1 - O40 7 9 Max. Unit (VDD–VEE) 5/11 MSM5839B ¡ Semiconductor Switching Characteristics (VDD = 5V ±10%, Ta = –20 to +85°C, CL = 15pF) Parameter Symbol Condition Min. Typ. Max. Unit "H", "L" Propagation Delay Time tpLH tpHL — — — 250 ns Clock Frequency fCP DUTY = 50% — — 3.3 MHz Clock Pulse Width tW(CP) — 125 — — ns LOAD Pulse Width tW(L) — 125 — — ns Data Setup Time DI Æ CP tSETUP — 50 — — ns tCL — 250 — — ns tLC — 0 — — ns tHOLD tr(CP) tf(CP) — 50 — — ns — — — 50 ns — — — 1 ms CP Æ LOAD Time LOAD Æ CP Time Data Hold Time DI Æ CP CP Rise/Fall Time tr(L) tf(L) LOAD Rise/Fall Time tf(CP) tw(CP) 0.8VDD CP tr(CP) tw(CP) tSETUP 0.8VDD 0.8VDD 0.8VDD 0.2VDD 0.2VDD 0.2VDD tSETUP tHOLD 0.8VDD 0.8VDD DI1, DI21 tHOLD 0.8 VDD 0.2 VDD 0.2VDD 0.2VDD 0.8 VDD 0.2 VDD tPLH tPHL 0.8VDD 0.2VDD DO20, DO40 tf(L) tCL 0.8VDD LOAD 0.2VDD 0.8VDD tw(L) tLC 0.2VDD tr(L) 6/11 ¡ Semiconductor MSM5839B FUNCTIONAL DESCRIPTION Pin Functional Description • DI1 The data input pin for the 20-bit shift register (from 1st to 20th bit). The display data is input to the data pin in synchronization with a clock pulse. • CP Clock pulse input pin for the two 20-bit shift registers. The data is shifted in the two 20-bit shift registers at the falling edge of the clock pulse. Data setup time (tSETUP) and data hold time (tHOLD) are required each between DI1, DI21 and CP. Refer to the Switching Characteristics. • DO20 The 20th output bit of the shift register. The data which is input from DI1 is clocked out with the delay in the number of bits of the shift register (20). A 40-bit shift register can be configured by connecting the output of this pin to DI21 pin. • DI21 The data input pin for the 20-bit shift register (from 21st to 40th bit). Connecting the DO20 pin and this pin allows the device to be used as a 40-bit shift register. • DO40 The 40th output bit of the shift register. The data which is input from DI1 is clocked out with the delay in the number of the bits of the shift register (20). When extending the number of characters, this pin is used to cascade connect the next MSM5839B. • DF Alternate signal input pin for LCD driving waveform. • VDD(V1), VSS Supply voltage pins. VDD should be 4.5 to 5.5V. VSS is the ground pin (VSS = 0V). • V2, V3, VEE(V4) Bias supply voltage pins to drive the LCD. Bias voltage is supplied from an external source. • LOAD The signal for latching the shift register contents is input from this pin. When LOAD pin is set at "H", the shift register contents are transferred to the 40-bit 4-level driver. When LOAD pin is set at "L", the last display output data (O1 to O40), which was transferred when LOAD pin was at "H", is held. 7/11 MSM5839B ¡ Semiconductor • O1 to O40 Display data output pins which correspond to each data bit in the latch. One of VDD, V2, V3 or VEE (V4) is selected as a display driving voltage source based on the combination of latched data level and DF signal. Refer to the Truth Table below. These pins should be connected to the SEGMENT side of the LCD panel. Truth Table Latched data H L DF H LCD driver output VEE (V4) L VDD (V1) H V3 L V2 8/11 MSM5839B ¡ Semiconductor PACKAGE DIMENSIONS (Unit : mm) QFP56-P-910-0.65-K Mirror finish Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.36 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 9/11 MSM5839B ¡ Semiconductor (Unit : mm) QFP56-P-910-0.65-L2 Spherical surface Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.36 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 10/11 MSM5839B ¡ Semiconductor (Unit : mm) QFP56-P-910-0.65-2K Mirror finish Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.43 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 11/11