PI74LCX374 12345678901234567890123456789012123456789012345678901234567890121234567890123456789012345678901212345678901234567890123456789012123456789012 12345678901234567890123456789012123456789012345678901234567890121234567890123456789012345678901212345678901234567890123456789012123456789012 12345678901234567890123456789012123456789012345678901234567890121234567890123456789012345678901212345678901234567890123456789012123456789012 Fast CMOS 3.3V Octal D Flip-Flop Product Features Product Description ™ • • • • • • • • • Compatible with LVT and FCT3 families of products 5V Tolerant inputs and outputs 2.0V - 3.6V VCC supply operation Balanced sink and source output drives (±24mA) Low ground bounce outputs Power Down High Impedance inputs and outputs Supports live insertion Hysteresis on all inputs ESD protection exceeds 2000V, Human Body Mode 200V, Machine Mode • Packages: – 20-pin 173 mil -wide plastic TSSOP (L) – 20-pin 150 mil- wide plastic QSOP (Q) – 20-pin 300 mil -wide plastic SOIC (S) Pericom Semiconductor’s PI74LCX series of logic circuits are produced using the Company’s advanced 0.6 CMOS technology, achieving industry leading speed grades. Logic Block Diagram Product Pin Configuration The PI74LCX374 is an 8-bit wide octal D-type flip flop designed with a buffered common clock and buffered 3-state outputs. When output enable (OE) is LOW, the outputs are enabled. When OE is HIGH, the outputs are in the high impedance state. Input data meeting the setup and hold time requirements of the D inputs is transferred to the O outputs on the LOW-to-HIGH transition of the clock input. The PI74LCX374 can be driven from either 3.3V or 5.0V devices allowing for the device to be used as a translator in a mixed 3.3V/5.0V system. OE OE O0 D0 D1 O1 O2 D2 D3 O3 GND CP D0 D O0 Q V CP 20 1 19 2 18 3 4 20-Pin 17 5 L, Q, S 16 15 6 14 7 13 8 12 9 11 10 VCC O7 D7 D6 O6 O5 D5 D4 O4 CP TO 7 OTHER CHANNELS Truth Table(1) Product Pin Description Inputs Outputs Pin Name De s cription DN CP OE ON OE Output Enable Inputs (Active LOW) H ↑ L H CP Clock Pulse, LOW- to- HIGH Transition L ↑ L L D0- D7 Data Inputs X L L O0 O 0- O 7 3- State Outputs X X H Z GND Ground VCC Power Note: 1. H = High Voltage Level; X = Don’t Care L = Low Voltage Level; Z = High Impedance ↑ = LOW-to-HIGH Transition; O0 = Previous O0 before High-to-Low of CP 1 PS8570B 1/20/04 PI74LCX374 Fast CMOS 3.3V Octal D Flip-Flop 12345678901234567890123456789012123456789012345678901234567890121234567890123456789012345678901212345678901234567890123456789012123456789012 12345678901234567890123456789012123456789012345678901234567890121234567890123456789012345678901212345678901234567890123456789012123456789012 Maximum Ratings (Above which the useful life may be impaired. For user guidelines, not tested.) Storage Temperature ............................................................. –65°C to +150°C Ambient Temperature with Power Applied ............................. –40°C to +85°C Supply Voltage to Ground Potential (Inputs & VCC Only) ....... –0.5V to +7.0V Supply Voltage to Ground Potential (Outputs & D/O Only) .... –0.5V to +7.0V DC Input Voltage ...................................................................... –0.5V to +7.0V DC Output Current ................................................................................ 120mA Power Dissipation .................................................................................... 1.0W Note: Stresses greater than those listed under MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. Recommended Operating Conditions Symbol Parame te rs VCC Supply Voltage VI Input Voltage VO Output Voltage IOH/IOL TA ∆t/∆v Output Current M in. M a x. Operating 2.0 3.6 Data Retention 1.5 3.6 0 5.5 HIGH or LOW State 0 VCC 3- State 0 5.5 VCC = 3.0V - 3.6V — ± 24 VCC = 2.7V — ±12 VCC = 2.3V - 2.7V — ±8 –40 +85 °C 0 10 ns/V Free- Air Operating Temperature Input Edge Rate VIN = 0.8V - 2.0V, VCC = 3.0V 2 Units V mA PS8570B 1/20/04 PI74LCX374 Fast CMOS 3.3V Octal D Flip-Flop 12345678901234567890123456789012123456789012345678901234567890121234567890123456789012345678901212345678901234567890123456789012123456789012 12345678901234567890123456789012123456789012345678901234567890121234567890123456789012345678901212345678901234567890123456789012123456789012 1 DC Electrical Characteristics (Over the Operating Range, TA = –40°C to +85°C, VCC = 2.7V to 3.6V) Parame te rs Te s t Conditions (1) De s cription M in. Typ(2) M ax. VIH Input HIGH Voltage Guaranteed Logic HIGH Level 2.0 — — VIL Input LOW Voltage Guaranteed Logic LOW Level — — 0.8 VOH Output HIGH Voltage VCC = 2.7- 3.6 IOH = –0.1mA VCC- 0.2 — — VCC = 2.7 IOH = –12mA 2.2 — — IOH = –18mA 2.4 — — IOH = –24mA 2.2 — — VCC = 2.7- 3.6 IOL = 0.1mA — — 0.2 VCC = 2.7 IOL = 12mA — — 0.4 VCC = 3.0 IOL = 16mA — — 0.4 IOL = 24mA — — 0.55 VCC = 3.0 VOL Output LOW Voltage VIK Clamp Diode Voltage VCC = Min., IIN = –18mA — − 0.7 −1.2 II Input Leakage Current 0 ≤ VI ≤ 5.5V VCC = 2.7- 3.6 — — ±5 IOZ 3- State Output Leakage 0 ≤ VO ≤ 5.5V VI = VIH or VIL VCC = 2.7- 3.6 — — ±5 IOFF Power Down Disable VCC = 0V, VIN or VOUT ≤ 5.5V — — 10 ICC Quiescent Power Supply Current VCC = Max. VIN = GND oR VCC 0.1 10 ∆ICC Quiescent Power Supply Current TTL Inputs HIGH VCC = Max. VIN = VCC – 0.6V(3) 500 Units 3 V 6 µA Te s t Conditions Typ. CIN Input Capacitance VCC = Open, VI = 0V or VCC 7 COUT Output Capacitance VCC = 3.3V, VI = 0V or VCC 8 CPD Power Dissipation Capacitance VCC = 3.3V, VI = 0V or VCC, F = 10 MHz 25 7 8 9 10 Capacitance De s cription 4 5 Notes: 1. For Max. or Min. conditions, use appropriate value specified under Electrical Characteristics for the applicable device type. 2. Typical values are at VCC = 3.3V, +25°C ambient. 3. Per TTL driven input; all other inputs at VCC or GND. Parame te rs 2 Units 11 pF 12 13 14 15 3 PS8570B 1/20/04 PI74LCX374 Fast CMOS 3.3V Octal D Flip-Flop 12345678901234567890123456789012123456789012345678901234567890121234567890123456789012345678901212345678901234567890123456789012123456789012 12345678901234567890123456789012123456789012345678901234567890121234567890123456789012345678901212345678901234567890123456789012123456789012 Switching Characteristics over Operating Range VCC = 3.3V ± 0.3V VCC = 2.7V M in. M a x. M in. M a x. Maximum Clock Frequency 150 – 150 – tPLH tPHL Propagation Delay CP to OX 1.5 8.5 1. 5 9.5 tPZH tPZL Output Enable time OE to Ox 1.5 8.5 1. 5 9.5 tPHZ tPLZ Output Disable Time OE to Ox 1.5 7.5 1.5 8.5 tSU Setup Time HIGH or LOW, Dx to CP tH tW Parame te rs De s cription fMAX tsk(o) Conditions C L = 50pF RL = 500 ohms Units ns 2.5 – 2.5 – Hold Time HIGH or LOW, Dx to CP 1.5 – 1.5 – Pulse Width 3.3 – 3.3 – – 1.0 – – Output Skew(1) Note: 1. Skew between any two outputs, of the same package, switching in the same direction. Dynamic Switching Characteristics (TA = +25°C) Parame te rs Te s t Conditions (1) De s cription VOLP Dynamic Output LOW Peak Voltage VCC = 3.3V, CL = 50pF VIH = 3.3V, VIL = 0V VOLV Dynamic Output LOW Valley Voltage VCC = 3.3V, CL = 50pF VIH = 3.3V, VIL = 0V Typ. Units 0.8 V Note: 1. Measured with n–1 outputs switching from High-to-Low or Low-to-High. The remaining output is measured in the LOW state. 4 PS8570B 1/20/04 PI74LCX374 Fast CMOS 3.3V Octal D Flip-Flop 12345678901234567890123456789012123456789012345678901234567890121234567890123456789012345678901212345678901234567890123456789012123456789012 12345678901234567890123456789012123456789012345678901234567890121234567890123456789012345678901212345678901234567890123456789012123456789012 1 20-Pin 173 Mil-Wide Plastic TSSOP (L) Package 20 2 .169 .177 4.3 4.5 3 1 .252 .260 6.4 6.6 .004 0.09 .008 0.20 .047 1.20 Max .007 .012 0.19 0.30 .0256 BSC 0.65 0.45 0.75 SEATING PLANE 4 .018 .030 5 .238 .269 6.1 6.7 .002 0.05 .006 0.15 6 X.XX X.XX DENOTES CONTROLLING DIMENSIONS IN MILLIMETERS 7 20-Pin 150 Mil-Wide Plastic QSOP (Q) Package 8 20 .008 0.20 MIN. .150 .157 9 .008 .013 0.20 0.33 3.81 3.99 10 Guage Plane .010 0.254 1 Detail A .337 8.56 .344 8.74 .058 REF 1.47 11 .041 1.04 REF 12 .015 x 45˚ 0.38 .053 1.35 .069 1.75 Detail A .007 .010 SEATING PLANE .016 .050 .025 BSC 0.635 0˚-6˚ .016 .035 0.41 0.89 .004 0.101 .010 0.254 13 0.178 0.254 0.41 1.27 14 .228 .244 5.79 6.19 .008 0.203 .012 0.305 15 X.XX DENOTES DIMENSIONS X.XX IN MILLIMETERS 5 PS8570B 1/20/04 PI74LCX374 Fast CMOS 3.3V Octal D Flip-Flop 12345678901234567890123456789012123456789012345678901234567890121234567890123456789012345678901212345678901234567890123456789012123456789012 12345678901234567890123456789012123456789012345678901234567890121234567890123456789012345678901212345678901234567890123456789012123456789012 20-Pin 300 Mil-Wide Plastic SOIC (S) Package 20 .2914 .2992 7.40 7.60 .010 .029 0.254 x 45˚ 0.737 1 .496 12.60 .511 12.99 .0091 .0125 0-8˚ .020 0.508 REF .030 0.762 0.41 .016 1.27 .050 .0926 2.35 .1043 2.65 SEATING PLANE .050 BSC 1.27 .013 .020 0.33 0.51 0.23 0.32 .0040 .0118 .394 .419 10.00 10.65 0.10 0.30 X.XX DENOTES CONTROLLING X.XX DIMENSIONS IN MILLIMETERS Ordering Information Orde ring Code De s cription PI74LCX374L 20- pin, 173- mil wide plastic TSSOP PI74LCX374Q 20- pin, 150- mil wide plastic QSOP PI74LCX374S 20- pin, 300- mil wide plastic SOIC Note: 1. Thermal characteristics can be found on the web at http://www.pericom.com/packaging Pericom Semiconductor Corporation 1-800-435-2336 • Fax (408) 435-1100 • http://www.pericom.com 6 PS8570B 1/20/04