RF2352 Preliminary 4 3V CDMA DRIVER AMPLIFIER Typical Applications • General Purpose Amplification • Low Noise Transmit Driver Amplifier • Commercial and Consumer Systems Product Description 2 0.45 0.28 3.75 The RF2352 is a low noise driver amplifier for 900MHz CDMA/AMPS applications. The device is designed for operation from 2.7V to 3.6V, and features selectable high and low gain modes. In high gain mode, the device will provide about 19dB of gain, and the linearity and current drain are set with an external resistor, allowing the designer to select the optimum performance for a given application. In the low gain, or “bypass” mode, the gain is controlled by an external attenuator network, and the device draws essentially no current. The part is fabricated using a high performance silicon BiCMOS process, and is packaged in a 4mmx4mm, 16-pin, leadless chip carrier. 0.75 0.50 3.75 + Si BJT GaAs MESFET SiGe HBT Si CMOS 1.50 SQ 3.20 0.75 0.65 4.00 1.00 0.90 0.05 0.00 NOTES: 1 Shaded Pin is Lead 1. 2 NC RF GND NC NC • Low Noise and High Intercept Point 15 14 13 • Gain Control RF IN 2 12 RF OUT NC 3 11 VCC VREF 4 10 ATT OUT2 • Single 2.7V to 3.6V Power Supply • Extremely Small MLF16 Package 9 GND ATT IN NC ATT OUT1 PD 8 Functional Block Diagram Rev A4 010720 Features 16 7 Pins 1 and 9 are fused. Package Warpage: 0.05 max. Package Style: LCC, 16-Pin, 4x4 1 6 Dimension applies to plated terminal and is measured between 0.10 mm and 0.25 mm from terminal tip. The terminal #1 identifier and terminal numbering convention 3 shall conform to JESD 95-1 SPP-012. Details of terminal #1 identifier are optional, but must be located within the zone indicated. The identifier may be either a mold or marked feature. • Power Down Control 5 1.60 4.00 12° GND üSi Bi-CMOS GaAs HBT 1 INDEX AREA 3 4 5 Optimum Technology Matching® Applied 1 0.80 TYP Ordering Information RF2352 RF2352 PCBA 3V CDMA Driver Amplifier Fully Assembled Evaluation Board RF Micro Devices, Inc. 7628 Thorndike Road Greensboro, NC 27409, USA Tel (336) 664 1233 Fax (336) 664 0454 http://www.rfmd.com 4-177 4 GENERAL PURPOSE AMPLIFIERS • TDMA/CDMA/FM Driver Amplifier RF2352 Preliminary Absolute Maximum Ratings Parameter Supply Voltage Input RF Level Operating Ambient Temperature Storage Temperature Parameter GENERAL PURPOSE AMPLIFIERS 4 Rating Unit -0.5 to +4.5 0 -40 to +85 -40 to +150 VDC dBm °C °C Specification Min. Typ. Max. Caution! ESD sensitive device. RF Micro Devices believes the furnished information is correct and accurate at the time of this printing. However, RF Micro Devices reserves the right to make changes to its products without notice. RF Micro Devices does not assume responsibility for the use of the described product(s). Unit Overall High Gain Mode Gain Noise Figure Input VSWR Output VSWR Adjacent Channel Power Rejection (ACPR1) Alternate Channel Power Rejection (ACPR2) Gain Noise Figure Input VSWR Output VSWR Adjacent Channel Power Rejection (ACPR1) Alternate Channel Power Rejection (ACPR2) Gain Noise Figure Input VSWR Output VSWR Adjacent Channel Power Rejection (ACPR1) Alternate Channel Power Rejection (ACPR2) 18 57 20 1.9 1.3 1.6 60 78 80 17 58 19 2.0 1.6 1.5 60 76 77 16.5 57 18.5 2.2 1.8 1.4 60 76 22 2.9 1.5 1.8 dB dB VCC =3.0V, T=25°C, External Matching Components Required. VPD =2.8V, POUT =+4dBm, ICC =15mA At 824MHz dBc 900kHz offset dBc 1.98MHz offset dB dB At 874MHz dBc 900kHz offset dBc 1.98MHz offset dB dB At 925MHz dBc 900kHz offset 77 dBc 1.98MHz offset -4.2 4.2 1.2 1.4 -3.7 3.7 1.4 1.3 -4.7 4.7 1.5 1.4 dB dB 21 3.0 1.8 1.7 20.5 3.2 2.0 1.6 Bypass (Low Gain) Mode Gain Noise Figure Input VSWR Output VSWR Gain Noise Figure Input VSWR Output VSWR Gain Noise Figure Input VSWR Output VSWR Condition VPD =0V, Pins 6 and 8 shorted. At 824MHz 1.4 1.6 dB dB At 874MHz dB dB At 925MHz 1.6 1.5 1.7 1.6 Power Supply Power Supply Range (VCC) Current Drain (ICC) Current Drain (ICC) 4-178 2.7 3.0 15.0 3.6 10 V mA µA VPD =2.8V (High Gain Mode) VPD =0V (Bypass Mode) Rev A4 010720 RF2352 Preliminary Pin 1 Function GND 2 RF IN Description Interface Schematic Ground connection. For best performance, keep traces physically short and connect immediately to ground plane. RF input pin. It is DC-coupled and looks like 50Ω from 824MHz to 925MHz. RF OUT Bias RF IN 5 6 7 8 NC VREF PD ATT OUT1 NC ATT IN 9 GND 10 ATT OUT2 11 12 VCC RF OUT 13 14 15 NC NC RF GND 16 Pkg Base NC GND Rev A4 010720 Not connected. Provides the bias voltage for controlling the RF amplifier current drain. This pin is typically connected through a resistor to an external regulated power supply. It may be connected to the same power supply as the VCC pin. However, if more bias control is desired, it may be connected to a separate supply. With a series external resistor of 1500Ω and power supply of 3V applied, the amplifier current drain should be around 14mA. By increasing the resistor, the amplifier current drain may be dropped. Conversely, by decreasing the resistor, the amplifier current may be increased to a maximum of 30mA. Power down function. When 0V to 0.5V is applied, the device is in Bypass Mode: the amplifier is shut off and the MOSFET switches are activated. There is no DC current dissipation in this state. When 1.5V to 3V is applied, the device is switched to High Gain Mode: the amplifier is activated and the MOSFET switches are opened. This is the normal operating mode. Output of the first MOSFET switch. DC-coupled. When the PD pin is grounded (Bypass Mode), the MOSFET switches are shorted, sending any signals at the RF IN pin through the first MOSFET and off the chip. In cases where minimum RF attenuation is desired, this pin should be shorted with 50Ω microstrip to the ATT IN pin. This setup will yield approximately 4dB of insertion loss. If more attenuation is desired, a resistive pad between the ATT OUT1 and ATT IN pins can be added to the PC board. Not connected. Input to the second MOSFET switch. DC-coupled. When the PD pin is grounded (Bypass Mode), the MOSFET switches are shorted. See the ATT OUT1 pin description for setup options. VREF 4 GENERAL PURPOSE AMPLIFIERS 3 4 PD RF IN ATT IN ATT OUT1 ATT OUT2 Ground connection. For best performance, keep traces physically short and connect immediately to ground plane. Output of the second MOSFET switch. DC-coupled. When the PD pin is grounded (Bypass Mode), the MOSFET switches are shorted. This pin should be shorted with 50Ω microstrip to the amplifier load. Provides the power supply to the logic circuitry on the IC. Amplifier output pin. An open collector output that needs VCC applied to it through an inductor. Typically, a shunt inductor, series capacitor matching network is used to provide a 50Ω output match. Not connected. Not connected. Amplifier ground. For best performance, keep traces physically short and connect immediately to ground plane. Not connected. Ground connection for die flag. The backside of the package should be soldered to a top side ground pad which is connected to the ground plane with multiple vias. 4-179 RF2352 Preliminary Application Schematic VCC 10 nH 1 nF 4 pF 50 Ω µstrip RF OUT 1 16 15 14 13 VCC 22 nF RF IN 2 12 3 11 4 10 1 nF VCC GENERAL PURPOSE AMPLIFIERS 4 1500 Ω 50 Ω µstrip 1 nF 5 6 7 8 9 1 nF Package base serves as die flag ground. The vias connecting the backside of the board should be large in diameter to allow for easier soldering. MODE SELECT Evaluation Board Schematic (Download Bill of Materials from www.rfmd.com.) VCC L1 10 nH J1 RF IN 50 Ω µstrip 1 C1 22 nF R1 1500 Ω VREF C2 1 nF 16 15 14 12 3 11 4 10 5 6 8 7 50 Ω µstrip C5 4 pF 13 2 C6 1 nF J2 RF OUT VCC C4 1 nF 50 Ω µstrip 9 C3 1 nF 2352400- PD * R2, R3 and R4 form a "Tee" attenuator network which determines the gain in the bypass mode. Evaluation boards are shipped with R2 and R4 as 0 Ω jumpers, and R3 omitted. This configuration provides the maximum gain (about -4 dB) available in bypass mode. R2* 0Ω 50 Ω µstrip R3* * R4* 0Ω P1 P2 1 PD 1 NC 2 GND 2 GND 3 VREF 3 VCC OMIT CON3 CON3 Package base serves as die flag ground. The vias connecting the backside of the board should be large in diameter to allow for easier soldering. 4-180 Rev A4 010720 RF2352 Preliminary Evaluation Board Layout Board Size 2.0" x 2.0" Board Thickness 0.031”; Board Material FR-4 GENERAL PURPOSE AMPLIFIERS 4 Rev A4 010720 4-181 RF2352 Preliminary ACPR1 versus ICC -50.0 ACPR2 versus ICC VCC=3V, VPD=2.8V, Temperature=26°C, POUT=4dBm -70.0 VCC=3V, VPD=2.8V, Temperature=26°C, POUT=4dBm 824 MHz -52.0 925MHz GENERAL PURPOSE AMPLIFIERS -56.0 -76.0 -58.0 -78.0 -60.0 -62.0 -82.0 -84.0 -66.0 -86.0 -68.0 -88.0 12.0 14.0 925 MHz -80.0 -64.0 -70.0 10.0 874 MHz -74.0 ACPR2 (dB) ACPR1 (dB) -54.0 4 824 MHz -72.0 874 MHz 16.0 18.0 20.0 22.0 24.0 26.0 28.0 ICC (mA) -90.0 10.0 12.0 14.0 16.0 18.0 20.0 22.0 24.0 26.0 28.0 ICC (mA) Gain versus VCC ICC=15mA, VPD=2.8V, Temperature=25°C, POUT=4dBm 25.0 824 MHz 24.0 874 MHz 925 MHz 23.0 Gain (dB) 22.0 21.0 20.0 19.0 18.0 17.0 16.0 15.0 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 VCC (V) 4-182 Rev A4 010720