TRS207 5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD PROTECTION www.ti.com SLLS809 – JUNE 2007 FEATURES • • • • • • ESD Protection for RS-232 Bus Pins – ±15-kV Human-Body Model (HBM) Meets or Exceeds the Requirements of TIA/EIA-232-F and ITU v.28 Standards Operates at 5-V VCC Supply Operates up to 120 kbit/s External Capacitors . . . 4 × 0.1 μF Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II DB OR DW PACKAGE (TOP VIEW) DOUT3 DOUT1 DOUT2 RIN1 ROUT1 DIN2 DIN1 GND VCC C1+ V+ C1− APPLICATIONS • • • • • • Battery-Powered Systems PDAs Notebooks Laptops Palmtop PCs Hand-Held Equipment 1 24 2 23 3 22 4 21 5 20 6 19 7 18 8 17 9 16 10 15 11 14 12 13 DOUT4 RIN2 ROUT2 DIN5 DOUT5 DIN4 DIN3 ROUT3 RIN3 V− C2− C2+ DESCRIPTION/ORDERING INFORMATION The TRS207 consists of five line drivers, three line receivers, and a dual charge-pump circuit with ±15-kV ESD protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the serial-port connector. The charge pump and four small external capacitors allow operation from a single 5-V supply. The devices operate at data signaling rates up to 120 kbit/s and a maximum of 30-V/μs driver output slew rate. ORDERING INFORMATION PACKAGE (1) (2) TA 0°C to 70°C SOIC – DW SSOP – DB –40°C to 85°C SOIC – DW SSOP – DB (1) (2) ORDERABLE PART NUMBER Tube of 25 TRS207CDW Reel of 2000 TRS207CDWR Reel of 2000 TRS207CDBR Tube of 25 TRS207IDW Reel of 2000 TRS207IDWR Reel of 2000 TRS207IDBR TOP-SIDE MARKING TRS207C RU07C TRS207I RU07I Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2007, Texas Instruments Incorporated TRS207 5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD PROTECTION www.ti.com SLLS809 – JUNE 2007 FUNCTION TABLES xxx Each Driver (1) (1) INPUT DIN OUTPUT DOUT L H H L H = high level, L = low level Each Receiver (1) (1) INPUT RIN OUTPUT ROUT L H H L Open H H = high level, L = low level, Open = input disconnected or connected driver off LOGIC DIAGRAM (POSITIVE LOGIC) 7 2 DIN1 DOUT1 6 3 DIN2 TTL/CMOS Inputs DOUT2 18 1 DIN3 DOUT3 19 24 DIN4 DOUT4 21 20 DIN5 DOUT5 5 4 ROUT1 TTL/CMOS Outputs RIN1 22 23 ROUT2 RIN2 17 16 ROUT3 2 RS-232 Outputs Submit Documentation Feedback RIN3 RS-232 Inputs TRS207 5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD PROTECTION www.ti.com SLLS809 – JUNE 2007 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) VCC Supply voltage range (2) V+ Positive output supply voltage range (2) V– Negative output supply voltage range VI Input voltage range VO Output voltage range (2) Drivers Receivers V VCC – 0.3 14 V –14 0.3 V –0.3 V+ + 0.3 V– – 0.3 V+ + 0.3 –0.3 VCC + 0.3 DOUT Package thermal impedance (3) (4) TJ Operating virtual junction temperature Tstg Storage temperature range (4) 6 UNIT V ±30 Drivers θJA (2) (3) MAX Receivers Short-circuit duration (1) MIN –0.3 V Continuous DB package 63 DW package 46 –65 °C/W 150 °C 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to network GND. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. The package thermal impedance is calculated in accordance with JESD 51-7. Recommended Operating Conditions (1) See Figure 4 Supply voltage VIH Driver high-level input voltage DIN VIL Driver low-level input voltage DIN Driver input voltage DIN VI TA (1) NOM MAX 4.5 5 5.5 2 TRS207C TRS207I UNIT V V 0.8 Receiver input voltage Operating free-air temperature MIN 0 5.5 –30 30 0 70 –40 85 V V °C Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V. Electrical Characteristics (1) over recommended ranges of supply voltage (unless otherwise noted) (see Figure 4) PARAMETER ICC (1) Supply current TEST CONDITIONS No load, VCC = 5 V, MIN TA = 25°C TYP MAX 11 20 UNIT mA Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V. Submit Documentation Feedback 3 TRS207 5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD PROTECTION www.ti.com SLLS809 – JUNE 2007 DRIVER SECTION Electrical Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4) PARAMETER TEST CONDITIONS MIN TYP (2) VOH High-level output voltage DOUT at RL = 3 kΩ to GND, DIN = GND 5 9 VOL Low-level output voltage DOUT at RL = 3 kΩ to GND, DIN = VCC –5 –9 IIH High-level input current VI = VCC IIL Low-level input current VI at 0 V IOS (3) Short-circuit output current VCC = 5.5 V, VO = 0 V ro Output resistance VCC, V+, and V– = 0 V, VO = ±2 V (1) (2) (3) MAX UNIT V V μA 15 200 –15 –200 μA ±10 ±60 mA Ω 300 Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 5 V, and TA = 25°C. Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one output should be shorted at a time. Switching Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4) PARAMETER TEST CONDITIONS MIN TYP (2) MAX UNIT Maximum data rate CL = 50 pF to 1000 pF, One DOUT switching, RL = 3 kΩ to 7 kΩ, See Figure 1 tPLH(D) Propagation delay time, low- to high-level output CL = 2500 pF, All drivers loaded, RL = 3 kΩ, See Figure 1 2 μs tPHL(D) Propagation delay time, high- to low-level output CL = 2500 pF, All drivers loaded, RL = 3 kΩ, See Figure 1 2 μs tsk(p) Pulse skew (3) CL = 150 pF to 2500 pF, See Figure 2 RL = 3 kΩ to 7 kΩ, 300 ns SR(tr) Slew rate, transition region (see Figure 1) CL = 50 pF to 1000 pF, VCC = 5 V RL = 3 kΩ to 7 kΩ, (1) (2) (3) 120 3 kbit/s 6 30 V/μs Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 5 V, and TA = 25°C. Pulse skew is defined as |tPLH – tPHL| of each channel of the same device. ESD Protection PIN DOUT, RIN 4 TEST CONDITIONS Human-Body Model Submit Documentation Feedback TYP UNIT ±15 kV TRS207 5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD PROTECTION www.ti.com SLLS809 – JUNE 2007 RECEIVER SECTION Electrical Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4) PARAMETER TEST CONDITIONS VOH High-level output voltage IOH = –1 mA VOL Low-level output voltage IOL = 1.6 mA VIT+ Positive-going input threshold voltage VCC = 5 V, TA = 25°C VIT– Negative-going input threshold voltage VCC = 5 V, TA = 25°C Vhys Input hysteresis (VIT+ – VIT–) ri Input resistance (1) (2) VI = ±3 V to ±25 V MIN TYP (2) 3.5 VCC – 0.4 1.7 MAX UNIT V 0.4 V 2.4 V 0.8 1.2 0.2 0.5 1 V V 3 5 7 kΩ Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 5 V, and TA = 25°C. Switching Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 3) PARAMETER TEST CONDITIONS tPLH Propagation delay time, low- to high-level output tPHL Propagation delay time, high- to low-level output tsk(p) (1) (2) (3) Pulse skew CL = 150 pF (3) MIN TYP (2) MAX 0.5 10 μs 0.5 10 μs 300 UNIT ns Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 5 V, and TA = 25°C. Pulse skew is defined as |tPLH – tPHL| of each channel of the same device. Submit Documentation Feedback 5 TRS207 5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD PROTECTION www.ti.com SLLS809 – JUNE 2007 PARAMETER MEASUREMENT INFORMATION 3V Input Generator (see Note B) 1.5 V RS-232 Output 50 Ω RL 1.5 V 0V tPHL (D) CL (see Note A) Output tPLH (D) 3V 3V −3 V −3 V TEST CIRCUIT SR(tr) + t PHL (D) 6V or t VOH VOL VOLTAGE WAVEFORMS PLH (D) A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 120 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 1. Driver Slew Rate 3V Generator (see Note B) RS-232 Output 50 Ω RL Input 1.5 V 1.5 V 0V CL (see Note A) tPHL (D) tPLH (D) VOH 50% 50% Output VOL TEST CIRCUIT VOLTAGE WAVEFORMS A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 120 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 2. Driver Pulse Skew Input 3V 1.5 V 1.5 V −3 V Output Generator (see Note B) 50 Ω CL (see Note A) tPHL (R) tPLH (R) VOH 50% Output 50% VOL TEST CIRCUIT VOLTAGE WAVEFORMS A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 3. Receiver Propagation Delay Times 6 Submit Documentation Feedback TRS207 5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD PROTECTION www.ti.com SLLS809 – JUNE 2007 APPLICATION INFORMATION DOUT3 DOUT1 1 24 2 23 DOUT4 RIN2 5 kΩ 3 DOUT2 22 4 RIN1 ROUT2 5V 5 kΩ 400 kΩ 21 5 ROUT1 20 5V 400 kΩ 19 5V 400 kΩ DIN1 GND 400 kΩ 7 18 8 17 16 = 0.1µF − DIN4 5V CBYPASS + DOUT5 5V 400 kΩ 6 DIN2 DIN5 DIN3 ROUT3 RIN3 C4 = 0.1 µF 16 V 5 kΩ 9 C3 † = 0.1 µF 6.3 V V− + 10 11 C1 = 0.1 µF 6.3 V † VCC − C1+ C2− 15 − 14 V+ − + + − 12 C2+ C1− + 13 C2 = 0.1 µF 16 V C3 can be connected to VCC or GND. A. Resistor values shown are nominal. B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be connected as shown. Figure 4. Typical Operating Circuit and Capacitor Values Submit Documentation Feedback 7 TRS207 5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD PROTECTION www.ti.com SLLS809 – JUNE 2007 APPLICATION INFORMATION (continued) Capacitor Selection The capacitor type used for C1–C4 is not critical for proper operation. The TRS207 requires 0.1-μF capacitors, although capacitors up to 10 μF can be used without harm. Ceramic dielectrics are suggested for the 0.1-μF capacitors. When using the minimum recommended capacitor values, make sure the capacitance value does not degrade excessively as the operating temperature varies. If in doubt, use capacitors with a larger (e.g., 2×) nominal value. The capacitors' effective series resistance (ESR), which usually rises at low temperatures, influences the amount of ripple on V+ and V–. Use larger capacitors (up to 10 μF) to reduce the output impedance at V+ and V–. Bypass VCC to ground with at least 0.1 μF. In applications sensitive to power-supply noise generated by the charge pumps, decouple VCC to ground with a capacitor the same size as (or larger than) the charge-pump capacitors (C1–C4). Electrostatic Discharge (ESD) Protection TI TRS207 devices have standard ESD protection structures incorporated on the pins to protect against electrostatic discharges encountered during assembly and handling. In addition, the RS-232 bus pins (driver outputs and receiver inputs) of these devices have an extra level of ESD protection. Advanced ESD structures were designed to successfully protect these bus pins against ESD discharge of ±15-kV when powered down. ESD Test Conditions ESD testing is stringently performed by TI, based on various conditions and procedures. Please contact TI for a reliability report that documents test setup, methodology, and results. Human-Body Model (HBM) The HBM of ESD testing is shown in Figure 5, while Figure 6 shows the current waveform that is generated during a discharge into a low impedance. The model consists of a 100-pF capacitor, charged to the ESD voltage of concern, and subsequently discharged into the DUT through a 1.5-kΩ resistor. RD 1.5 kΩ VHBM + − CS 100 pF Figure 5. HBM ESD Test Circuit 8 Submit Documentation Feedback DUT TRS207 5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD PROTECTION www.ti.com SLLS809 – JUNE 2007 APPLICATION INFORMATION (continued) 1.5 VHBM = 2 kV I DUT (A) 1.0 0.5 DUT = 10-V 1-Ω Zener Diode 0.0 0 50 100 150 200 Time (ns) Figure 6. Typical HBM Current Waveform Machine Model (MM) The MM ESD test applies to all pins using a 200-pF capacitor with no discharge resistance. The purpose of the MM test is to simulate possible ESD conditions that can occur during the handling and assembly processes of manufacturing. In this case, ESD protection is required for all pins, not just RS-232 pins. However, after PC board assembly, the MM test is no longer as pertinent to the RS-232 pins. Submit Documentation Feedback 9 PACKAGE OPTION ADDENDUM www.ti.com 26-Sep-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TRS207CDB ACTIVE SSOP DB 24 60 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRS207CDBG4 ACTIVE SSOP DB 24 60 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRS207CDBR ACTIVE SSOP DB 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRS207CDBRG4 ACTIVE SSOP DB 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRS207CDW ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRS207CDWG4 ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRS207CDWR ACTIVE SOIC DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRS207CDWRG4 ACTIVE SOIC DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRS207IDB ACTIVE SSOP DB 24 60 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRS207IDBG4 ACTIVE SSOP DB 24 60 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRS207IDBR ACTIVE SSOP DB 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRS207IDBRG4 ACTIVE SSOP DB 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRS207IDW ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRS207IDWG4 ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRS207IDWR ACTIVE SOIC DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRS207IDWRG4 ACTIVE SOIC DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 26-Sep-2007 (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device TRS207CDBR Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SSOP DB 24 2000 330.0 16.4 8.2 8.8 2.5 12.0 16.0 Q1 TRS207CDWR SOIC DW 24 2000 330.0 24.4 10.75 15.7 2.7 12.0 24.0 Q1 TRS207IDBR SSOP DB 24 2000 330.0 16.4 8.2 8.8 2.5 12.0 16.0 Q1 TRS207IDWR SOIC DW 24 2000 330.0 24.4 10.75 15.7 2.7 12.0 24.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TRS207CDBR SSOP DB 24 2000 346.0 346.0 33.0 TRS207CDWR SOIC DW 24 2000 346.0 346.0 41.0 TRS207IDBR SSOP DB 24 2000 346.0 346.0 33.0 TRS207IDWR SOIC DW 24 2000 346.0 346.0 41.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. 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