SHINDENGEN General Purpose Rectifiers D2SBA60 SIL Bridges OUTLINE DIMENSIONS Case : 2S Unit : mm 600V 1.5A FEATURES ● Thin Single In-Line Package ● High IFSM ● Applicable to Automatic Insertion APPLICATION ● Switching power supply ● Home Appliances, Office Equipment ● Telecommunication, Factory Automation RATINGS ●Absolute Maximum Ratings (If not specified Tl=25℃) Item Symbol Conditions Storage Temperature Tstg Operating Junction Temperature Tj VRM Maximum Reverse Voltage IO Average Rectified Forward Current 50Hz sine wave, R-load, On glass-epoxy substrate, Ta=25℃ IFSM 50Hz sine wave, Non-repetitive 1cycle peak value, Tj=25℃ Peak Surge Forward Current I2t Current Squared Time 1ms≦t＜10ms Tj=25℃ Ratings -40∼150 150 600 1.5 60 16 ●Electrical Characteristics (If not specified Tl=25℃) Item Symbol Conditions VF Forward Voltage IF=0.75A, Pulse measurement, Rating of per diode IR VR=VRM , Pulse measurement, Rating of per diode Reverse Current Thermal Resistance θjl junction to lead θja junction to ambient Ratings Unit Max.1.05 V Max.10 μA Max.10 ℃/W Max.47 Copyright & Copy;2000 Shindengen Electric Mfg.Co.Ltd Unit ℃ ℃ V A A A2s D2SBAx Forward Voltage Forward Current IF [A] 10 Tl=150°C [TYP] Tl=25°C [TYP] 1 Pulse measurement per diode 0.1 0 0.2 0.4 0.6 0.8 1 Forward Voltage VF [V] 1.2 1.4 1.6 D2SBAx Forward Power Dissipation 4 Forward Power Dissipation PF [W] 3.5 3 SIN 2.5 2 1.5 1 0.5 0 0 0.5 1 1.5 Average Rectified Forward Current IO [A] Tj = 150°C Sine wave 2 D2SBAx Derating Curve Average Rectified Forward Current IO [A] 3 2.5 PCB Glass-epoxy substrate Soldering land 3mmφ 2 SIN 1.5 1 0.5 0 0 20 40 60 80 100 120 Ambient Temperature Ta [°C] Sine wave R-load Free in air 140 160 D2SBAx Peak Surge Forward Capability IFSM 100 10ms 10ms 1 cycle non-repetitive, sine wave, Tj=25°C before surge current is applied Peak Surge Forward Current IFSM [A] 80 60 40 20 0 1 2 5 10 20 Number of Cycles [cycles] 50 100