SHINDENGEN General Purpose Rectifiers S1VBA60 SIL Bridges OUTLINE DIMENSIONS Case : 1V Unit : mm 600V 1A FEATURES ● Small Single In-Line(:SIL)Package ● High IFSM ● Applicable to Automatic Insertion APPLICATION ● Switching power supply ● Home Appliances, Office Equipment ● Telecommunication, Factory Automation RATINGS ●Absolute Maximum Ratings (If not specified Tl=25℃) Item Symbol Conditions Storage Temperature Tstg Operating Junction Temperature Tj VRM Maximum Reverse Voltage IO Average Rectified Forward Current 50Hz sine wave,R-load,On glass-epoxy substrate, Ta=25℃ IFSM 50Hz sine wave,Non-repetitive 1cycle peak value, Tj=25℃ Peak Surge Forward Current I2t Current Squared Time 1ms≦t＜10ms Tj=25℃ Ratings -40∼150 150 600 1 50 10 ●Electrical Characteristics (If not specified Tl=25℃) Item Symbol Conditions VF Forward Voltage IF=0.5A, Pulse measurement,Rating of per diode IR VR=VRM , Pulse measurement,Rating of per diode Reverse Current Thermal Resistance θjl junction to lead θja junction to ambient Ratings Unit Max.1.05 V Max.10 μA Max.16 ℃/W Max.62 Copyright & Copy;2000 Shindengen Electric Mfg.Co.Ltd Unit ℃ ℃ V A A A2s S1VBAx Forward Voltage Forward Current IF [A] 10 Tl=150°C [TYP] 1 Tl=25°C [TYP] Pulse measurement per diode 0.1 0 0.2 0.4 0.6 0.8 1 Forward Voltage VF [V] 1.2 1.4 1.6 S1VBAx Forward Power Dissipation 2 Forward Power Dissipation PF [W] SIN 1.5 1 0.5 0 0 0.2 0.4 0.6 0.8 Average Rectified Forward Current IO [A] Tj = 150°C Sine wave 1 S1VBAx Derating Curve Average Rectified Forward Current IO [A] 1.2 1 PCB l Glass-epoxy substrate Soldering land 3mmφ 0.8 l = 10mm l = 2mm 0.6 0.4 0.2 0 0 20 40 60 80 100 120 Ambient Temperature Ta [°C] VR = VRM Sine wave R-load Free in air 140 160 S1VBAx Peak Surge Forward Capability IFSM 80 10ms 10ms Peak Surge Forward Current IFSM [A] 70 1 cycle non-repetitive, sine wave, Tj=25°C before surge current is applied 60 50 40 30 20 10 0 1 2 5 10 20 Number of Cycles [cycles] 50 100