TI TPS23841

TPS23841
www.ti.com
SLUS745 – NOVEMBER 2006
HIGH-POWER, WIDE VOLTAGE RANGE, QUAD-PORT ETHERNET POWER SOURCING
EQUIPMENT MANAGER
FEATURES
APPLICATIONS
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Quad-Port Power Management With Integrated
Switches and Sense Resistors
High Power PoE up to 25 W at PD Input
Operating from a 53-V Minimum Input Power
Rail
Wide Range Single Supply: 21.5 V up to 57 V
ICUT = 615 mA, ILIM = 650 mA Nominal
IEEE 802.3af Compatible
Individual Port 15-bit A/D Converters
Auto, Semi-Auto and Power Management
Modes
Controlled Current Ramp Power-Up/Down for
EMI Reduction
Over-Temperature Protection
DC Disconnect Detection, Supports AC
Disconnect
High-Speed 400-kHz I2C Interface
Supports Legacy PD Detection
PowerPAD™ Package
Comprehensive Power Management Software
Available for MPS430 Microcontroller
Medical/Industrial Applications at 24 V
High Power Ethernet Enterprise Switches
SOHO Hubs, Ethernet Hubs
Ethernet High Power Mid-Spans
High Power PSE Injectors
DESCRIPTION
The TPS23841 is a high-power, wide voltage range,
quad-port sourcing equipment manager. The
TPS23841 can provide up to 570 mA per port over a
wide temperature range (-40°C to +125°C). Each
port may operate from 21.5 V up to 57 V. The
integrated
output
eliminates
two
external
components per port (MOSFET and sense resistor)
and survives 100-V transients. Four individual 15-bit
A/D converters are used to measure signature
resistance, voltage, current and die temperature,
resulting in a simple and robust PSE solution. The
TPS23841 comes with a comprehensive software
solution to meet the most demanding applications
which can serve as a core for all PoE system
designs.
TYPICAL APPLICATION
PSE
D1
PD
FB1
Z
+55V
F1
TX
Up to 100m
of CAT 5A
RJ45
RJ45
3
3
6
6
TX
VDD
TPS2376-H
Px
C1
TPS23841
High-current
PoE Xfmr
High-current
PoE Xfmr
1
1
DET
CLASS
RTN
RX
Nx
VPOE
RTN
RETx
SCL
SDA_I
SDA_O
Z
FB2
Optional
MSP430
Micro
2
2
4
4
5
5
7
7
8
8
RX
DC/DC
Converter
VSS
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006, Texas Instruments Incorporated
TPS23841
www.ti.com
SLUS745 – NOVEMBER 2006
DESCRIPTION (CONTINUED)
The TPS23841 has three internal supply buses (10 V, 6.3 V and 3.3 V) generated from the 48-V input supply.
These supplies are used to bias all internal digital and analog circuitry. Each supply has been brought out
separately for proper bypassing to insure high performance. The digital supply (3.3 V) is available for powering
external loads up to 2 mA. For more demanding loads it is highly recommended to use external buffers to
prevent system degradation. When the TPS23841 is initially powered up an internal Power-on-Reset (POR)
circuit resets all registers and sets all ports to the off state to ensure that the device is powered up in a known
safe operating state.
The TPS23841 has three modes of operation; auto mode (AM), semi-auto mode (SAM) and power management
mode (PMM).
• In auto mode the TPS23841 performs discovery, classification and delivery of power autonomously to a
compliant PD without the need of a micro-controller.
• In semi-auto mode the TPS23841 operates in auto mode but users can access the contents of all read status
registers and A/D registers through the I2C serial interface. All write control registers are active except for D0
through D3 of port control register 1 (Address 0010) for limited port control. The semi-auto mode allows the
TPS23841 to detect valid PD's without micro-controller intervention but adds a flexibility to perform power
management activities.
• Power management mode (with a micro-controller) allows users additional capabilities of discovering
non-compliant (legacy) PDs, performing AC Disconnect and advanced power management system control
that are based on real time port voltages and currents. All functions in this mode are programmed and
controlled through read/write registers over the I2C interface. This allows users complete freedom in
detecting and powering devices. A comprehensive software package is available that mates the power of the
TPS23841 with the MSP430 micro-controller.
TPS23841 integrated output stage provides port power and low-side control. The internal low-side circuitry is
designed with internal current sensing so there are no external resistors required. The output design ensures the
power switches operate in the fully enhanced mode for low power dissipation.
The I2C interface allows easy application of opto-coupler circuitry to maintain Ethernet port isolation when a
ground based micro-controller is required. The TPS23841 five address pins (A1–A5) allow the device to be
addressed at one of 31 possible I2C addresses. Per-port write registers separately control each port state
(discovery, classification, legacy, power up, etc) while the read registers contain status information of the entire
process along with parametric values of discovery, classification, and real-time port operating current, voltage
and die temperature.
The proprietary 15-bit integrating A/D converter is designed to meet the harsh environment where the PSEPM
resides. The converter is set for maximum rejection of power line noise allowing it to make accurate
measurements of line currents during discovery, classification and power delivery for reliable power
management decisions.
The TPS23841 is available in either 64-pin PowerPAD™ down (PAP) or 64-pin PowerPAD up (PJD) packages.
ORDERING INFORMATION
(1)
(2)
2
PACKAGED DEVICES (1)
TEMPERATURE RANGE
TA = TJ
TQFP – 64 (PAP) (2)
TQFP – 64 (PJD) (2)
–40°C to 125°C
TPS23841PAP
TPS23841PJD
The PAP and PJD packages are available taped and reeled. Add R suffix to device type
(e.g.TPS23841PAPR) to order quantities of 1,000 devices per reel.
PAP = PowerPad down, PJD = PowerPad up.
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TPS23841
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SLUS745 – NOVEMBER 2006
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1) (2)
PARAMETER
VALUE
UNIT
V10 current sourced
100
µA
V3.3 current sourced
5
mA
Applied voltage on CINT#, CT, RBIAS
–0.5 to 10
Applied voltage on SCL, SDA_I, SDA_O, INTB, A1, A2, A3, A4, A5, MS, PORB, WD_DIS,
ALT_A/B, AC_LO, AC_HI
–0.5 to 6
V
Applied voltage on V48, P#, N#
–0.5 to 80
TJ
Junction operating temperature
–40 to 125
Tstg
Storage temperature --55 to 150
–55 to 150
Tsol
Lead temperature (soldering, 10 sec.)
(1)
(2)
°C
260
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to GND. Currents are positive into, negative out of the specified terminal. Consult Packaging Section of the
Data book for thermal limitations and considerations of packages.
DISSIPATION RATINGS (1)
(1)
PACKAGE
THERMAL RESISTANCE
JUNCTION TO CASE θJC
THERMAL RESISTANCE
JUNCTION TO AMBIENT θJA
PAP
0.38°C/W
21.47°C/W
PJD
0.38°C/W
21.47°C/W
Thermal Resistance measured using 2-oz copper trace and copper pad solder following layout recommendation in TI Publication
PowerPAD Thermally Enhanced Package Technical Brief SLMA002.
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
VIN
PARAMETER
Input voltage, V48 pin
21.5
48
57
UNIT
V
TJ
Junction temperature
-40
125
°C
ELECTRO STATIC DISCHARGE (ESD) PROTECTION
MAX
Human body model
UNIT
1.5
CDM
1
Machine model
kV
0.2
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TPS23841
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SLUS745 – NOVEMBER 2006
ELECTRICAL CHARACTERISTICS
V48 = 48 V, RT = 124 kΩ, CT = 220 pF, CINT = 0.027 µF (low leakage), –40°C to 125°C and TA = TJ (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
4
9
12
10
14
UNIT
Power Supply
V48 quiescent current
Off mode (all ports)
V48 quiescent current
Powered mode (all ports)
V10, internal analog supply
ILOAD = 0
9.75
10.5
11.5
V3.3, internal digital supply
ILOAD = 0 to 3 mA
3
3.3
3.7
V3.3 short circuit current
V=0
3
V6.3, internal supply
ILOAD = 0
5
6.3
7
V2.5, internal reference supply
ILOAD = 0
2.46
2.5
2.54
VUVLO_R, V48 UVLO
Input voltage rising
16.0
21.5
VUVLO_F, V48 UVLO
Input voltage falling
14
21
VHYSUV, UVLO hysteresis
0.2
Internal POR time out(I2C)
After all supplies are good I2C activity is valid
Internal POR time out (Port)
After all supplies are good Port active to I2C
commands
12
1.0
mA
V
mA
V
2.0
8
Clock
Pulses
66000
Port Discovery
Port off #P to #N input resistance
400
Discovery open circuit voltage
600
22
Discovery 1 voltage loop control
70 µA < IPORT < 3 mA
Discovery 2 voltage loop control
70 µA < IPORT < 3 mA
Discovery current limit
P = N = 48 V
Auto-mode discovery resistance
acceptance Band
2.8
4.4
8.8
3
kΩ
30
4
V
10
5
19
26.5
Auto-mode discovery resistance low
end rejection
0
15
Auto-mode discovery resistance high
end rejection
33
Discovery1,2 A/D conversion scale
factor
100 µA < IPORT < 3 mA
Discovery1,2 A/D conversion time
IPORT= 120 µA
5.30
6.10
mA
kΩ
6.75 count/µA
ms
Port Classification
Classification voltage loop control
100 µA < IPORT < 50 mA
15
17.5
20
Classification current limit
P = N = 48 V
50
60
100
Class 0 to 1 detection threshold
5.5
6.5
7.5
Class 1 to 2 detection threshold
13
14.5
16
Class 2 to 3 detection threshold
21
23
25
Class 3 to 4 detection threshold
31
33
35
Class 4 to 0 detection threshold
Classification A/D conversion scale
factor
Classification A/D conversion time
4
IPORT = 50 mA
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45
48
375
424
18
V
mA
51
475 Count/m
A
22
ms
TPS23841
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SLUS745 – NOVEMBER 2006
ELECTRICAL CHARACTERISTICS (continued)
V48 = 48 V, RT = 124 kΩ, CT = 220 pF, CINT = 0.027 µF (low leakage), –40°C to 125°C and TA = TJ (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Port Legacy Detection
Legacy current limit
P = N = 48 V
Legacy voltage A/D conversion scale
factor
100 mV < VPORT < 17.5 V
Legacy A/D conversion time
0 V < VPORT < 15 V
2.6
3.5
4.3
1365
1400
1445
mA
18
22
ms
Ω
Count/V
Port Powered Mode
Port on resistance
20 mA < IPORT < 300 mA
ICUT
Over current threshold
RBIAS = 124 kΩ, CT = 220 pF,
ILIM
Output current limit
ILIM ICUT
Threshold delta
Disconnect timer current threshold
TMPDO Disconnect detection time
1.3
1.8
570
615
665
600
650
700
10
RBIAS = 124 kΩ, CT = 220 pF
ILOAD < current threshold, RBIAS = 124 kΩ, CT =
220 pF
70
7.5
300
10
400
Port output UV
42.0
42.7
44.0
Port output OV
54
55
56
TOVLD
Over current time out
RBIAS = 124 kΩ, CT = 220 pF
50
TLIM
Short circuit time out
RBIAS = 124 k., CT = 220 pF
50
Turn--off delay from UV/OV faults
RBIAS = 124 k., CT = 220 pF, After port enabled
and ramped up
Port current A/D conversion scale
factor
20 mA < IPORT < 56 V
Port current A/D conversion time
IPORT < 300 mA
Port voltage A/D conversion scale
factor
mA
ms
V
75
75
ms
3
31
36.41
40 Count/m
A
18
22
ms
335
353
370
Count/V
18
22
ms
45 V < VPORT < 56 V
Port voltage A/D conversion time
Port temperature A/D conversion
(17500 - counts)/16
°C
Port Disable Mode
Port N voltage
P = 48 V
47
V
AC LO and AC HI Specification
AC_LO, AC_HI – low output voltage
0
0.5
AC_LO – high output voltage
3.0
5.0
AC_HI – high output voltage
5.0
7.0
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V
5
TPS23841
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SLUS745 – NOVEMBER 2006
ELECTRICAL CHARACTERISTICS (continued)
V48 = 48 V, RT = 124 kΩ, CT = 220 pF, CINT = 0.027 µF (low leakage), –40°C to 125°C and TA = TJ (unless otherwise noted)
PARAMETER
Digital
I2C
TEST CONDITIONS
MIN
TYP
MAX
UNIT
DC Specifications
SCL, SDA_I, A1–A5 ,WD_DIS,
ALTA/B, MS, PORB logic input
threshold
1.5
SCL, SDA_I input hysteresis
250
MS, PORB input hysteresis
150
WD_DIS, ALTA/B, MS, PORB input
pulldown resistance
Input voltage 0.5 to 3 V
V
mV
50
kΩ
10
µA
SDA_O logic high leakage
Drain = 5 V
100
nA
SDA_O logic low
ISINK = 10 mA
200
mV
INTB logic high leakage
Drain = 6 V
INTB logic low
ISINK = 10 mA
A1–A5 pull-down current
10
µA
200
mV
Digital I2C Timing
SCL clock frequency
Pulse duration
0
SCL high
0.6
SCL low
1.3
Rise time, SCL to SDA
kHz
0.300
Fall time, SCL to SDA
6
400
0.300
Setup time, SDA to SCL
0.250
Hold time, SCL to SDA
0.300
Bus free time between start and stop
1.3
Setup time, SCL to start condition
0.6
Hold time, start condition to SCL
0.6
Setup time, SCL to stop condition
0.6
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0.900
µs
TPS23841
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SLUS745 – NOVEMBER 2006
TPS23841 SINGLE PORT BLOCK DIAGRAM
Diff Amp
(Fix Gain)
UV/OV
Comparators
600 kW
Two
8 Bits
Status
Register
Loop Cntri Amp
Detect/Class Modes
Two
8 Bits
Status
Register
Auto
Seq
Logic
Analog
Control
Circurty
LCA
Power Mode
Thermal
Detector
A2D
Registers
Resistor
Voltage
Current
&
Die Temp
Max I
Thld
OVI
OVI
Thld
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TPS23841
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SLUS745 – NOVEMBER 2006
TERMINAL FUNCTIONS
TERMINAL
NAME
NO.
PAP
I/O
DESCRIPTION
PJD
POWER AND GROUND
V48
60
5
I
48-V input to the device. This supply can have a range of 22 V to 57 V. This pin should be decoupled
with a 0.1-µF capacitor from V48 to AG1 placed as close to the device as possible.
V10
58
7
O
10-V analog supply. The 10-V reference is generated internally and connects to the main internal
analog power bus. A 0.1-µF de-coupling capacitor should terminate as close to this node and the
AG1 pin as possible. Do not use for an external supply.
V6.3
59
6
O
6.3-V analog supply. A 0.1-µF de-coupling capacitor should terminate as close to this pin and the
AG1 pin as possible. Do not use for an external supply.
V3.3
24
41
O
3.3-V logic supply. The 3.3-V supply is generated internally and connects to the internal logic power
bus. A 0.1-µìF de-coupling capacitor should terminate as close to this node and the DG pin as
possible. This output can be used as a low current supply to external logic.
V2.5
54
11
O
2.5-V reference supply. The V2.5 is generated internally and connects to the internal reference power
bus. This pin should not be tied to any external supplies. A 0.1-µF de-coupling capacitor should
terminate as close to this node and the RG pin as possible. Do not use for an external supply.
AG1
57
8
Analog ground 1. This is the analog ground of the V6.3, V10 and V48 power systems. It should be
GND externally tied to the common copper 48-V return plane. This pin should carry the low side of three
de-coupling capacitors tied to V48, V10 and V6.3.
AG2
61
4
Analog ground 2. This is the analog ground which ties to the substrate and ESD structures of the
GND device. It should be externally tied to the common copper 48-V return plane. AG1 and AG2 must be
tied together directly for the best noise immunity.
DG
23
42
GND
Digital ground. This pin connects to the internal logic ground bus. It should be externally tied to the
common copper 48-V return plane.
RG
56
9
GND
Reference ground. This is a precision sense of the external ground plane. The integration capacitor
(CINT) and the biasing resistor (RBIAS pin) should be tied to this ground. This ground should also be
used to form a printed wiring board ground guard ring around the active node of the integration
capacitor (CINT). It should tie to common copper 48-V return plane.
PORT ANALOG SIGNAL
8
P1
7
58
I
P2
10
55
I
P3
39
26
I
P4
42
23
I
N1
6
59
I
N2
11
54
I
N3
38
27
I
N4
43
22
I
RET1
5
60
I
RET2
12
53
I
RET3
37
28
I
RET4
44
21
I
CINT1
4
61
I
CINT2
13
52
I
CINT3
36
29
I
CINT4
45
20
I
Port Positive. 48-V load sense pin. Terminal voltage is monitored and controlled differentially with
respect to each Port N pin Optionally, if the application warrants, this high side path can be protected
with the use of a self resetting poly fuse.
Port negative. 48-V load return pin. The low side of the load is switched and protected by internal
circuitry that will limit the current.
48 V return pin
Integration capacitor. This capacitor is used for the ramp A/D converter signal integration. Connect A
0.027- µF capacitor from this pin to RG. To minimize errors use a polycarbonate, poly-polypropylene,
polystyrene or teflon capacitor type to prevent leakage. Other types of capacitors can be used with
increased conversion error.
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SLUS745 – NOVEMBER 2006
TERMINAL FUNCTIONS (continued)
TERMINAL
NAME
NO.
PAP
I/O
DESCRIPTION
PJD
ANALOG SIGNALS
This is a dual-purpose pin. When tied to an external capacitor this pin sets the internal clock. When
the CT pin is grounded the SYN pin turns from a output to an input (see SYN pin description)
CT
53
12
I
The timing capacitor and the resistor on the RBIAS pin sets the internal clock frequency of the
device. This internal clock is used for the internal state machine, integrating A/D counters, POR time
out, faults and delay timers of each port. Using a 220-pF capacitor for CT and a 124-kΩ resistor for
RBIAS sets the internal clock to 245 kHz and ensure IEEE 802.3af compliance along with maximizing
the rejection of 60-Hz line frequency noise from A/D measurements.
RBIAS
55
10
I
Bias set resistor. This resistor sets all precision bias currents within the chip. This pin will regulate to
1.25V (V2.5/2) when a resistor is connected between RBIAS and RG. This voltage and RBIAS
generate a current which is replicated and used throughout the chip. This resistor also works in
conjunction with the capacitors on CT and CINT to set internal timing values. The RBIAS resistor
should be connected RG. RBIAS is a high impedance input and care needs to be taken to avoid
signal injection from the SYN pin or I2C signals.
SYN
52
13
I/O
This is a dual purpose pin. When the CT pin is connected to a timing capacitor this output pin is a 0v
to 3.3V pulse of the internal clock which can be used to drive other TPS23841 SYN pins for
elimination of a timing capacitor. When the CT pin is grounded this pin becomes an input pin that can
be driven from a master TPS23841 or any other clock generator signal.
AC_LO
51
14
O
Totem-pole output pin for AC Disconnect excitation.
AC_HI
50
15
O
Totem-pole output pin for AC Disconnect excitation.
DIGITAL SIGNALS
SCL
25
40
I
Serial clock input pin for the I2C interface.
SDA_I
26
39
I
Serial data input pin for the I2C interface. When tied to the SDA_O pin, this connection becomes the
standard bi-directional serial data line (SDA)
SDA_O
27
38
O
Serial data open drain output for the I2C interface. When tied to the SDA_I pin, this connection
becomes the standard bi-directional serial data line (SDA). This is a open drain output that can
directly drive opto-coupler.
WD_DIS
22
43
I
The WD_DIS pin disables the watchdog timer function when connected to 3.3 V. The pin has internal
50-k. resistor to digital ground. The watchdog timer monitors the I2C clock pin (SCL) and the internal
oscillator activity in power management mode and only the internal oscillator activity in auto mode.
INTB
20
45
O
This is an open-drain output that goes low if a fault condition occurs on any of the 4 ports.
ALTA/B
21
44
I
When this input is set to logic low there is no back-off time after a discovery failure. When this pin set
to a logic high there is a back-off time (approximately 2 seconds) before initiating another discovery
cycle. This pin has an internal 50-kΩ resistor pull-down to digital ground.
A1
28
37
I
A2
29
36
I
A3
30
35
I
A4
31
34
I
A5
32
33
I
MS
PORB
63
62
2
3
Address 1 through 5 These are the I2C address select inputs. Select the appropriate binary address
on these pins by connecting to the chip ground for a logic low or tying to the V3.3 pin for a logic high.
Each address line has an internal current source pull-down to digital ground.
I
The MS pin selects either the auto mode (MS low) or the power management mode, PMM, (MS
high). This pin can be held low for controller-less standalone applications. When MS is low and the
POR timing cycle is complete the chip will sequentially Discover, Classify and Power on each port.
When MS is set high the ports are controlled by register setting via the I2C bus. The MS pin has an
internal 50-kΩ resistor pull-down to analog ground.
I
This pin can be used to override the internal POR. When held low, the I2C interface, all the state
machines, and registers are held in reset. When all internal and external supplies are within
specification, and this pin is set to a logic high level, the POR delay will begin. The I2C interface and
registers will become active within 70µs of this event and communications to read or preset registers
can begin. The reset delay for the remainder of the chip then extinguishes in 1 second. This pin has
an internal 50-kΩ resistor pull-down to analog ground.
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SLUS745 – NOVEMBER 2006
CONNECTION DIAGRAM
TPS23841
64 Pin Power Pad
TQFP_PAP
10
(1)
NIC = No internal connection. Pins are floating.
(2)
NIC pins can be tied to the ground plane for improved thermal characteristics and to prevent noise injection from
unused pins.
(3)
NIC pins next to CINT pins should be tied to ground to prevent noise injection into A/D converter.
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TPS23841
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SLUS745 – NOVEMBER 2006
POWERPAD
OUTLINE
LASER MARKER
PIN 1 IDENTIFIER
TOP VIEW
TPS23841
64 PIN POWER PAD
UP
TQFP - PJD
(1)
NIC = No internal connection. Pins are floating.
(2)
NIC pins can be tied to the ground plane for improved thermal characteristics and to prevent noise injection from
unused pins.
(3)
NIC pins next to CINT pins should be tied to ground to prevent noise injection into A/D converter.
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TPS23841
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SLUS745 – NOVEMBER 2006
AUTO MODE FUNCTIONAL DESCRIPTION
Auto Mode
Auto mode (AM, MS = 0) operation is the basic approach for applying power to IEEE compliant PD’s. When AM
has been selected the TPS23841 automatically performs the following functions:
• Discovery of IEEE 802.3af compliant powered devices (PD's)
• Classification
• Power delivery
• Port over/under voltage detection, (if enabled, see Over/Under Voltage Fault section)
• Port over current detection (570 mA < IPORT < 665 mA
• Port maximum current limit (600 mA < IPORT < 700 mA)
• DC Disconnect (5 mA < IPORT < 10 mA)
• Thermal shutdown protection (TSD), (TJ > 150°C)
• Internal oscillator watchdog
In AM the contents of all read registers are available via the I2C interface. In addition all control registers except
for the function bits can be written. This supports a semi-auto mode where the TPS23841 auto detects compliant
PD's while a host can access the A/D registers and class information and then implement power management
(including turning a port off, responding to faults, etc).
The write registers that are still active in AM are:
• All ports disable – Common Control register 0001b
• Over/Under Voltage Faults – Common Control register 0001b
• Software reset – Common Control register 0001b
• Disconnect disable – Port Control 1 register 0010b
• Discovery fault disable – Port Control 1 register 0010b
• Port enable – Port Control 2 register 0011b
For alternative B, semi-auto mode implementations which will manipulate the all ports disable or Port Enable
bits, please contact the factory for additional application information.
12
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AUTO MODE FUNCTIONAL DESCRIPTION (continued)
Auto Mode Functional Description
Update
Class Register
PortPwr
Update Reg
OVI = Over Current Fault
U/O V = Under or Over Voltage Fault
TSD = Thermal Shutdown Fault
TMPDO = PD Maintain Power Dropout Time Limit
TED = Error Delay Timing
A2D V/I
Measurements
300 ms
<tMPDO<400 ms
Figure 1. The Basic Flow for Auto Mode
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AUTO MODE FUNCTIONAL DESCRIPTION (continued)
AM Discovery
The TPS23841 uses a four-point measurement technique using two low level probe signals (typically 4.4 V and
8.8V) during the discovery process to determine whether a valid PD is present. The use of a multipoint detection
method for the PD resistor measurement allows accurate detection even when series steering diodes are
present. The low level probe voltages also prevent damage to non-802.3 devices. When a valid PD has been
detected the TPS23841 moves to classification. If a valid PD has not been detected the TPS23841 continues to
cycle through the discovery process. The waveform in Figure 2 shows typical N-pin waveforms for the discovery
of a valid PD and the failure to discovery due to a discovery resistor of 15 kΩ and 33kΩ.
Figure 2.
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AUTO MODE FUNCTIONAL DESCRIPTION (continued)
AM Classification
After a successful discovery of a valid PD the TPS23841 enters the classification function that identifies the
power level based on the PD's current signature. The classification current level is measured at a reduced
terminal voltage of 17.5V. During classification the power dissipation can be at its highest; therefore, to prevent
over temperature shutdown in automode only one port classifies at a time. When multiple ports successfully
discover and proceed to classification at the same time the auto sequencer processes each request separately
allowing only one port to enter classification. Figure 3 shows all 4 ports successfully detecting a valid PD at the
same time and than the classification of each port occurring separately.
Figure 3.
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AUTO MODE FUNCTIONAL DESCRIPTION (continued)
Upon completion of classification the port classification register is updated. In AM mode this information is not
used but for semi-auto mode the class information can be used for power management. Figure 4 shows actual
class currents and the class assignment which were stored in the register. These assignments are compliant
with the IEEE 802.3af Standard
4
0
or
1
1
0
or
1
or
2
0
or
2
or
3
2
3
2
1
0
0
10
20
30
Figure 4.
16
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50
60
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AUTO MODE FUNCTIONAL DESCRIPTION (continued)
AM Power Delivery
After successfully discovery and classification of a valid PD the power is delivered by controlling the current to
the PD until its current requirements are met or until the internal current limit is reached (approximately 650 mA).
The power switch is fully enhanced after 500 µs. Figure 5 show the voltage and the current that is being applied
to the PD during power-up and reaching the PD load of 250mA.
Figure 5.
After power has been applied to the PD the TPS23841 automatically enters the current and voltage sample
mode. The sample mode performs 31 current measurements and 1 voltage measurement. Each measurement
takes approximately 18 ms to complete. The port remains powered and the current/voltage measurement cycle
continues until a fault condition occurs. The current and voltage measurements are both stored in the A/D
current and voltage registers and can be accessed through the I2C pins. This allows power management in the
AM if it is desired.
AM Faults and INTB Output
AM faults are:
• Port under and over voltage faults, (if enabled, see Over/Under Voltage Fault section)
• Over current faults
• Under current (DC Disconnect) fault
• Thermal shutdown (TSD) fault
• Watchdog timer faults (disabled via WD_DIS pin)
Any one of the first four fault conditions listed above causes the port to shut down, and a 3-bit fault code to be
latched into the affected port's Status Read 1 register (addr = 0100b). Watchdog faults cause all four ports to
shut down. Faulted ports are temporarily disabled after a fault has been detected and latched.
The INTB pin is an open-drain, active-low output which is asserted if a fault condition occurs on any of the four
ports. This indication is asserted for any of the port faults which result in a code displayed in the port status
register (the faults listed in Table 8). In automode, the fault latch, the status register fault bits, and consequently,
INTB assertion, are cleared by expiration of the 750-ms TED timer.
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AUTO MODE FUNCTIONAL DESCRIPTION (continued)
Over/Under Voltage Fault
For the TPS23841, port over and undervoltge detection is disabled by default after device POR. This continuous
voltage monitoring feature can subsequently be enabled by writing a logic 1 to bit D2 in the Common Control
register, assuming usage under the direction of a higher level controller, (i.e., usage in semi-auto mode).
Over/under voltage faults are only processed after port power up has completed (voltage/power ramp to PD is
done). The TPS23841 measures the voltage between the P and N pin and if this voltage drops below the under
voltage threshold (typically 43 V) or increases above the over voltage threshold (typically 55 V) the voltage timer
is turned on. When the voltage timer reaches its time-out limit that is set between 2 ms to 5 ms the
corresponding port is turned off and the UV/OV fault code generated in the Port Status 1 register. If the
over/under voltage condition is removed prior to the voltage timer reaching its limit the timer is reset and waits
for the next event. Figure 6 shows a voltage fault lasting for more then 2 ms that has caused the port to
shutdown.
Figure 6.
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AUTO MODE FUNCTIONAL DESCRIPTION (continued)
Over Current or Current Limit Faults
Over current or current limit faults are conditions when the load current that is being sensed trips either the ICUT
comparator (570 mA to 665 mA) or the ILIM comparator (600 mA to 700 mA) and turns on the current fault timer.
When the over current timer reaches its time out limit that is set between 50 ms to 75 ms the corresponding port
is turned off and the over current fault code generated in the Port Status 1 register. If the over current condition
goes away prior to the over current timer reaching its limit the timer is reset and waits for the next event.
Figure 7 shows an over current fault lasting more than 50 ms that has caused the port to shut off.
Figure 7.
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AUTO MODE FUNCTIONAL DESCRIPTION (continued)
Under Current Fault (DC Modulated Disconnect)
Under current fault (dc modulated disconnect) is a condition when the load current that is being measured drops
below 7.5mA and turns on the disconnect timer. If the disconnect timer reaches its time out limit that is set
between 300ms to 400ms the corresponding port is turned off and the load disconnect fault code generated in
the Port Status 1 register. If the under current condition goes away prior to the disconnect timer reaching its limit
the timer is reset and the port remains powered.
Figure 8 shows DC Disconnect event. In this setup the load current was set right above the 7.5mA threshold.
The duty cycle of the load was then adjusted until the off period exceeded the disconnect time out, causing
turn-off of the port. The time-out period was > 300 ms.
Figure 8.
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POWER MANAGEMENT MODE FUNCTIONAL DESCRIPTION
Power Management Mode (PMM)
Power management mode (PMM) has been designed to work efficiently with simple low-cost microcontrollers
such as those in the MSP430 family.
The power management mode uses 13 self-contained functions to completely control the device operation. You
simply write/read through the I2C pins and wait for the function done bit to be set. If an A/D measurement was
performed during the function the results can be accessed by going to the read mode and addressing the proper
register.
13 Funcitons
•
•
•
•
•
•
•
•
•
•
•
•
•
Disable: Disable the port and reset all functions.
Discovery 1: Enable the Discovery 1 condition which applies a 4.4 V across the PD and measure and store
the resulting current.
Discovery 2: Enable the Discovery 2 condition which applies a 8.8 V across the PD and measure and store
the resulting current.
V Sample: Measure the voltage between the P and N pins and store the result in the A/D voltage register.
Legacy: Enable the 3.5-mA current source formeasuring capacitance and measure the voltage across the P
and N terminals and store the result in the A/D voltage register.
Classify: Enable the classification condition which applies 17.7 V across the PD and measure and store the
resulting current.
Rup Pwr: Turn on the output switch while controlling the current being delivered to the PD until the PD
current needs are met or the max current is reached.
C Sample: Continuous cycle of 31 current measurements and 1 voltage measurement. After each
measurement the contents of the appropriate register are updated.
Rdwn: Turn off the output switch while controlling current until output current reaches 0 mA.
AC LO: Turns on low side output FET and measures voltage between P and N pin and store result in A/D
voltage registers.
AC HI: Turns on high side output FET and measures voltage between P and N pin and store result in A/D
voltage registers.
ISample: Measure the current and store the result in the A/D current register.
TSample: Measure the internal die temperature and store the result in the A/D temperature register.
Conversion times for A/D measurements performed as part of the functions listed above are generally as
shown in the typical values in the Electrical Characteristics table. However, conversion time is somewhat
dependant on the magnitude of the input signal being measured. Power management mode applications
should take precautions to test the A/D DONE bit (MSB of the high byte) of the pertinent results register
before accepting or using the returned value. A logic 1 at this bit location indicates the conversion is
complete. Also, once an A/D conversion is in process on a given port, subsequent function calls to that port
should wait until the currently executing conversion is complete. Commands written prior to completion may
cause the results of the initial conversion to be written to the register of the subsequent function.
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22
Set Done Bit
Wait for Next
Function Call
Apply 8.8V
(Imax5mA)
To Chnl
4 ms Delay
Start A2D
Measure Chnl I
(18mS)
Store Value
Discovery I Reg
Set Done Bit
Wait for Next
Function Call
Apply 4.4V
(Imax5mA)
To Chnl
4mSDelay
Start A2D
Measure Chnl I
(18mS)
Store Value
Discovery I Reg
Set Done Bit
Wait for Next
Function Call
Enable
Control
Enable
Control
Power Down
Reset all
Functions
Discover 2
0010
Discover 1
0001
Disable
0000
Figure 9.
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Wait for Next
Function Call
Set Done Bit
Store Value
V Reg
Set Done Bit
Wait for Next
Function Call
Wait for Next
Function Call
Store Value
I Reg
Apply 18V
(Imax 100mA)
To Chnl
Measure Chnl I
(18mS)
Enable
Control
Classify
0101
Set Done Bit
Store Value
V Reg
Measure Chnl V
(18mS)
Apply 2.5mA
(Vmax 18) to
Chnl
Enable
Control
Enable
Diff Amp
Av 0.107
Measure Chnl V
(18 ms)
Legacy
0100
V Sample
0011
Wait for Next
Function Call
Set Done Bit
Enable
OVR I , Ovr V
& Und V
Comparators
Latch State
Power On
RampPwr
1.4A/mSec
Rup/Pwr
0110
Decoder
Control Register
I2C
Wait for Next
Function Call
If 0111
Repeat
Set Done Bit
Clear On Read
Measure Chnl V
(1 Sample) Store
Value V Reg
Measure Chnl I
(31 Samples)
Store Value I
Reg
C Sample
0111
Wait for Next
Function Call
Set Done Bit
Pwr Off
Ramp Down
Rdwn
1000
Wait for Next
Function Call
Wait for Next
Function Call
Set Done Bit
Store Value
V Reg
Set Done Bit
Measure Chnl V
(18mS)
Store Value
V Reg
Apply AC HI
Voltage
AC HI
1010
Measure Chnl V
(18mS)
Apply AC
LOVoltage
AC LO
1001
I Sample
1011
Wait for Next
Function Call
Set Done Bit
Measure Chnl I
(18mS)
Notes:
1. Each Function State remains set until a new function is
called. Example Function 1 - Port Voltage remains at 4.4
V and Resistor Register value is held.
2. Times shown are typical and set by RBIAS , and C T .
3. Poll for and verify A/D done indication prior to sending
next function call.
Wait for Next
Function Call
Set Done Bit
Store Value
Temp Reg
Measure Die
Temperature
(18mS)
T Sample
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POWER MANAGEMENT MODE FUNCTIONAL DESCRIPTION (continued)
PMM Discovery 1
PMM Discovery 1 function waveforms for the N and CINT pins are shown in Figure 10. The measurement is
being performed using 25 kΩ impedance between the P and N pin. The Discovery 1 voltage is allowed to settle
for approximately 5ms before the A/D begins integrating. The voltage on the CINT pin shows the A/D cycle.
There are four distinct regions to any A/D cycle: pre-charge (to a known starting voltage), charge, coarse
discharge, and fine discharge. CINT pin is very high impedance therefore extreme care must be taken to avoid
any noise or leakage affecting this pin. For the measurements where CINT voltage is shown a buffer was used
to prevent performance degradation. The A/D measurement time is approximately 18ms. The entire Discovery 1
function takes approximately 22 ms to complete. At the end of the A/D cycle the Discovery 1 current is stored in
the Discovery Current Register and the function done bit is set. The applied Discovery 1 voltage level remains
until a new function is called. The data for this measurement will remain stored in the Discovery Current Register
until another Discovery 1 or 2 function is called.
Figure 10.
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POWER MANAGEMENT MODE FUNCTIONAL DESCRIPTION (continued)
PMM Discovery 2
PMM Discovery 2 function waveforms for the N and CINT pins are shown in Figure 11. Again the measurement
is being performed using 25 kΩ impedance between the P and N pin. The Discovery 2 function was called after
a Discovery 1 function so the voltage ramps from 4.4 V to 8.8 V below the P pin. The Discovery 2 voltage is
given 5 ms to settle before the A/D begins to integrate. At the end of the A/D cycle the Discovery 2 current is
stored in the Port Discovery Current Register and the function done bit is set. The applied Discovery 2 voltage
level will remain until a new function is called. The data for this measurement will remain stored in the Discovery
Current Register until another Discovery 1 or 2 function is called.
Figure 11.
PMM Classification
PMM Classification function looks similar to Discovery 1 and 2 except that the voltage between the P and N pins
regulates to approximately 17.5 V. At the end of the A/D cycle the classification current is stored in the Port
Current Register and the done bit is set. The applied classification level will remain until a new function is called.
The data for this measurement remains stored in the Port Current Register until either the Classify or ISample
function is called.
As indicated in the flow diagram of Figure 1, the TPS23841 in AM only performs classification at one port at a
time. Similarly, PMM applications should take care to ensure that only one port per device is put into the
classification mode at any one time to limit power dissipation in the package.
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POWER MANAGEMENT MODE FUNCTIONAL DESCRIPTION (continued)
PMM Legacy
PMM Legacy function is used to detect PDs that are non compliant. Legacy detection uses a current source
(typically 3.5 mA) as a test current while the A/D measures the average voltage for approximately 18 ms. The
waveform shown in Figure 12 is the Legacy function charging a 10-µF capacitor. The capacitance charges to a
value that is no greater than 20V below the P port voltage. As the capacitor is charging the A/D is accumulating
counts in the voltage A/D register. Figure 13 shows the relationship between port capacitance and the number of
counts. A user can characterize non-compliant PD's signatures and use the Legacy function to recognize these
devices.
Figure 12.
Figure 13.
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POWER MANAGEMENT MODE FUNCTIONAL DESCRIPTION (continued)
PMM Rup Pwr
PMM Rup Pwr function turns on the port power by ramping up the current that is being delivered to the load in a
controlled fashion. The output current ramps from 0 mA to ILIM (typically 650 mA) in approximately 500 µs.
Figure 14 shows the output voltage and current turning on for a 250-mA load.
Figure 14.
PMM RDWN
PMM RDWN function turns off the port power by ramping down the current in a controlled fashion. The output
current ramps from ILIM (typically 650 mA) to 0mA in approximately 300µs. Figure 15 shows the output voltage
and current shutting down for a 250-mA load.
t - Time - ms/div
Figure 15.
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POWER MANAGEMENT MODE FUNCTIONAL DESCRIPTION (continued)
Miscellaneous Functional Description
PMM Faults
PMM faults are the same as those shown in the AM Faults and INTB Output section. In PM mode, the port
under- and over voltage and under-current faults can be enabled or disabled by writing to the control bits in the
appropriate register. For the TPS23841, port under- and overvoltage detection is disabled by default after device
POR or other reset operation. Under current detection, (DC Disconnect), is enabled by default. The enable state
of these features can be toggled by writing to the corresponding control bit as defined in Table 5 andTable 6.
The PMM faults are:
• Port under- and over-voltage faults (enable/disable via Common Control register 0001b, bit D2)
• Overcurrent fault (cannot be disabled)
• Under-current (DC Disconnect) fault (enable/disable via Port Control register 0010b, bit D4)
• Thermal shutdown (TSD) fault (cannot be disabled)
• Watchdog fault (disable via WD_DIS pin)
Any one of these faults causes the port to shutdown. Once a fault has occurred the port can not be repowered
until a Disable function is sent. The Disable function clears the fault latch and the fault register.
INTB pin operation is essentially the same in PMM as in AM, with the following exceptions:
• For load under-current to generate a fault shutdown and status indication, the condition of load current less
than the threshold must be detected by the continuous sample (C_SAMPLE) function (0111b).
• In PMM only, a Watchdog timer fault also asserts INTB.
Watchdog Timer
TPS23841 has two watchdog timers. One monitors the I2C clock and the other monitors the internal clock. When
automode is selected and the watchdog timer has not been disabled only the internal clock is monitored. When
in power management mode and the watchdog timer has not been disabled then both the I2C and internal
clocks are monitored. If there is no I2C clock activity for approximately two seconds then all ports are disabled.
There are three means to enable ports after a I2C clock fault and they are:
1. Hard power reset
2. PORB pulse
3. Writing a software reset to the Common Control register.
In both auto mode and power management mode if the internal oscillator is lost for more than 20 ms all ports
are disabled.
Loss of these signals is considered catastrophic since the system loses its ability to talk to each port. Therefore
the watchdog timers disabling all ports protects the system.
This function can be easily over ridden by setting the WD_DIS pin high.
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POWER MANAGEMENT MODE FUNCTIONAL DESCRIPTION (continued)
2
I C Interface Description
The serial interface used in the TPS23841 is a standard 2-wire I2C slave architecture. The standard SDA line of
the I2C architecture is broken out into independent input and output data paths. This feature simplifies earth
grounded controller applications that require opto-isolators to keep the 48-V return of the Ethernet power system
floating. For applications where opto-isolation is not required, the bidirectional property of the SDA line can be
restored by connecting SDA_I to SDA_O. The SCL line is a unidirectional input only line as the TPS23841 is
always accessed as a slave device and it never masters the bus.
Data transfers that require a data-flow reversal on the SDA line are 4-byte operations. This occurs during a
TPS23841 port read cycle where a slave address byte is sent, followed by a port/register address byte write. A
second slave address byte is sent followed by the data byte read using the port/register setup from the second
byte in the sequence.
The I2C interface and the port read write registers are held in active reset until all input voltages are within
specifications (V10, V6.3, V3.3 and V2.5) and the internal POR timer has timed out (see electrical
specifications).
The I2C read cycle consists of the following steps 1 through 14 and is shown in Figure 16:
1. Start Sequence (S)
2. Device address field
3. Write
4. Acknowledge
5. Register/Port address
6. Acknowledge
7. Stop
8. Start
9. Device address field
10. Read
11. Acknowledge
12. Data Transfer
13. Acknowledge
14. Stop
Data write transfers to the TPS23841 do not require a data-flow reversal and as such only a 3-byte operation is
required. The sequence in this case would be to send a slave device address byte, followed by a write of the
port/register address followed by a write of the data byte for the addressed port.
The I2C write cycle consists of the following steps 1 through 9 and is also shown in Figure 16:
1. Start sequence (S)
2. Device address field
3. Write
4. Acknowledge
5. Register/Port address
6. Acknowledge
7. Data for TPS23841
8. Acknowledge
9. Stop
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POWER MANAGEMENT MODE FUNCTIONAL DESCRIPTION (continued)
Start/Stop
The high-to-low transition of SDA_I while SCL is high defines the start condition. The low to high transition of
SDA_I while SCL is high defines the stop condition. The master device initiates all start and stop conditions.
The first serial packet is enclosed within start and stop bits, consists of a 7-bit address field, read/write bit, and
the acknowledge bit. The acknowledge bit is always generated by the device receiving the address or data field.
Five of the seven address bits are used by the TPS23841. The value of the sixth and seventh bit is ignored and
not used by the TPS23841.
Chip Address
The address field of the TPS23841 is 8 bits long and contains 5 bits of device address select and a read/write
bit as and two spare bits per Table 1. The leading two bits are not used and are reserved for future port
expansion. The five device address select bits follow this plan. These bits are compared against the hard-wired
state of the corresponding device address select pins (A1–A5). When the field contents are equivalent to the pin
logic states, the device is addressed. These bits are followed by LSB bit, which is used to set the read or write
condition (1 for read and 0 for write). Following a start condition and an address field, the TPS23841 responds
with an acknowledge by pulling the SDA_O line low during the 9th clock cycle if the address field is equivalent to
the value programmed by the pins. The SDA_O line remains a stable low while the 9th clock pulse is high.
START/STOP SEQUENCE
SCL
STOP
CONDITION(P)
Clock Data 1 Value
R/W
Bit
Clock Data 0 Value
Clock Data 1 Value
START
CONDITION(S)
Clock Data 1 Value
SDA
Write Cycle
SDA_I
A0
D7
R3
R2
R1 R0
D2
P1
P0
Ack Bit
Register/Port
Address
D7
D6
D5
D4
D3 D2
D1 D0
Data from
Master to
TPS23841
R/W
Bit
R/W
Bit
Read Cycle
A5
A4
A3
A2
A1
DeviceAddress
R/W=0
A0
D7
R3
R2
R1 R0
D2
P1
Register/Port
Address
P0
A7
Start Bit
A6
Ack Bit
Start Bit
SDA_O
A7
Ack Bit
SDA_I
A6
A5
A4
A3
A2
DeviceAddress
R/W=1
A1
A0
Data from
TPS23841to
Master
D7
D6
D5
D4
D3 D2
Stop Bit
A1
Ack Bit
A2
Ack Bit
A3
Stop Bit
A4
Ack Bit
A5
DeviceAddress
R/W=0
Start Bit
SDA_O
A6
Ack Bit
A7
D1 D0
Figure 16. I2C Read/Write Cycles
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POWER MANAGEMENT MODE FUNCTIONAL DESCRIPTION (continued)
Chip Addressing
Table 1 shows the bit assignments during the addressing cycle.
Table 1. Address Selection Field
BIT
FUNCTION
A7
Future expansion (value not compared)
A6
Future expansion (value not compared)
A5
Device address. Compared with pin A5
A4
Device address. Compared with pin A4
A3
Device address. Compared with pin A3
A2
Device address. Compared with pin A2
A1
Device address LSB. Compared with pin A1
A0
Read/Write
Port/Register Cycle
After the chip address cycle, the TPS23841 accepts eight bits of port/register select data as defined in Table 2.
The SCL line high-to-low transition after the eighth data bit then latches the selection of the appropriate internal
register for the follow-on data read or write operation. After latching the eight-bit data field, the TPS23841 pulls
the SDA_O line low for one clock cycle, for the acknowledge pulse.
Data Write Cycle
For a data write sequence, after the Port/Register address cycle, the TPS23841 accepts the eight bits of data as
defined in the tables below. The data is latched into the previously selected Write Register, and the TPS23841
generates a data acknowledge pulse by pulling the SDA_O line low for one clock cycle. Common register
functions act on all ports simultaneously. Per port registers are specific to the target port only.
To reset the interface, the host or master subsequently generates a stop bit by releasing the SDA_I line during
the clock-high portion of an SCL pulse.
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Data Read Cycles
For a data read sequence, after the register acknowledge bit, the master device generates a stop condition. This
is followed by a second start condition, and re-transmitting the device address as described in chip address
above. For this cycle, however, the R/W bit is set to a 1 to signal the read operation. The TPS23841 again
responds with an acknowledge pulse. The address acknowledge is then followed by sequentially presenting
each of the eight data bits on the SDA_O line (MSB first), to be read by the host device on the rising edges of
SCL. After eight bits are transmitted, the host acknowledges by pulling the SDA_I line high for one clock pulse.
The completed data transfer is terminated with the host generating a stop condition.
Table 2. Register/Port Addressing Map
BIT
FUNCTION
STATE
D7
Unused
0
D6
Register select MSB
D5
Register select Bit 2
D4
Register select Bit 1
0000 = Common Read - Port fault status, chip ID and rev.
0001 = Common Control Write - Software reset, ports disable and AC Disc.
0010 = Port Control Write 1 - Function calls; misc. fault disables
0011 = Port Control Write 2 - Port enable; A/D control
0100 = Port Status Read 1 - Fault status; device Class info.
0101 = Port Status Read 2 - Function and other status
0110 = Discovery Current - Lower Bits - A/D resistance results
0111 = Discovery Current - Upper Bits - A/D resistance results
1000 = Voltage-Lower Bits - A/D voltage reslts
1001 = Voltage - Upper Bits - A/D voltage results
1010 = Current - Lower Bits - A/D current results
1011 = Current - Upper Bits - A/D current results
1100 = Temperature - Lower Bits - A/D temperature results
1101 = Temperature - Upper Bits - A/D temperature results
1110 = unused
1111 = Common Write - Test mode selections - timer disables, discovery control, etc.
D3
Register select LSB
D2
Unused
0
D1
Port address MSB
D0
Port address LSB
00 =
01 =
10 =
11 =
PRESET
STATE
0
0000
0
port
port
port
port
1
2
3
4
00
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SLUS745 – NOVEMBER 2006
Table 3. Common Read, Register Select = 0000
BIT
FUNCTION
STATE
D7
Port 4 general
Fault status
0 = no fault
1 = port fault (1) (2)
0
D6
Port 3 general
Fault status
0 = no fault
1 = port fault(1) (2)
0
D5
Port 2 general
Fault status
0 = no fault
1 = port fault (1) (2)
0
D4
Port 1 general
Fault status
0 = no fault
1 = port fault (1) (2)
0
Chip rev
00 =
01 =
10 =
11 =
00
Chip ID
00 = TPS23841
01= future use
10 = TPS2384
11 = reserved
D3
D2
D1
D0
(1)
(2)
PRESET
STATE
rev
rev
rev
rev
–
1
2
3
00
PMM faults cleared by Disable function.
AM faults cleared by TED timer.
Table 4. Common Write, Register Select = 1111 (Test Register) (1)
BIT
(1)
32
FUNCTION
STATE
PRESET
STATE
D7
Unused
0
0
D6
Thermal shutdown test
0 = normal operation
1 = force TSD condition (all ports off)
0
D5
POR disable
0 = normal POR timing
1 = force POR to a non-reset state
0
D4
Discovery timers
0 = normal (4-ms Discovery 1 and Discovery 2)
1 = timers disable
0
D3
Discovery 1 and 2
0 = normal operation
1 = all 4-port Discovery 1 and Discovery 2 – halt
0
D2
DC Disconnect timer
0 = DC Disconnect timer between 300 ms to 400 ms for loads less than 5 mA (IEEE
standard)
1 = DC Disconnect timer 0 ms for loads less than 5 mA
0
D1
TED timer
0 = normal operation
1 = 750-ms TED timer disable
0
D0
Unused
0
0
Test mode select; not intended for end--application use.
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TPS23841
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SLUS745 – NOVEMBER 2006
Table 5. Common Control Write, Register Select = 0001
BIT
(1)
(2)
FUNCTION
STATE
PRESET
STATE
D7
Unused
0
0
D6
Unused
0
0
D5
Thermal shutdown fault (1)
0 = active
1 = disable
0
D4
AC high
0 = off
1 = AC_HI driver on
0
D3
AC low
0 = off
1 = AC_LO driver on
0
D2
Port over/under voltage faults
0 = disable
1 = active
0
D1
All ports disable (2)
0 = normal operation
1 = all ports shut down (no ramp)
0
D0
Software RESET
0 = normal operation
1 = reset all circuits and start a POR timing cycle
0
Register 0001, bit D5 operation inhibited after device probe.
Consult factory for alternative B, semi-auto mode implementations which write to bit D1.
Table 6. Port Control Write 1, Register Select = 0010 (One Per Port)
BIT
FUNCTION
STATE
PRESET
STATE
D7
Unused
0
0
D6
Unused
0
0
D5
Discovery fault disable
0 = normal operation
1 = disable internal discovery fault limits (19 kΩ to 29.5 kΩ)
0
D4
DC Disconnect disable
0 = DC Disconnect active
1 = DC Disconnect disable (for AC Disconnect)
0
D3
Function Bit 3
D2
Function Bit 2
D1
Function Bit 1
D0
Function Bit 0
0000 = Disable function (power down and reset all functions)
0001 = Discovery 1 function
0010 = Discovery 2 function
0011 = port voltage sample function (V sample)
0100 = legacy detection function
0101 = classification function
0110 = ramp up/power function (rup pwr)
0111 = continuous sample function C Sample)
1000 = ramp power down function RDWN)
1001 = ac low
1010 = ac high
1011 = port current sample function (I sample)
1100 = die temperature sample function (T sample)
1101 = spare
1110 = spare
1111 = spare
Submit Documentation Feedback
0000
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TPS23841
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SLUS745 – NOVEMBER 2006
Table 7. Port Control Write 2, Register Select = 0011 (One Per Port)
BIT
(1)
FUNCTION
STATE
PRESET
STATE
D7
Unused
0
0
D6
Unused
0
0
D5
Unused
0
0
0 = normal
1 = port disable
0
Enable (1)
D4
Port
D3
A/D Start
0 = normal
1 = start A/D (self clearing)
0
D2
A/D Abort
0 = normal
1 = abort
0
D1
Unused
0
0
D0
Unused
0
0
Consult factory for alternative B, semi-auto mode implementations which write to bit D4.
Table 8. Port Status Read 1, Register Select = 0100 (One Per Port)
BIT
34
FUNCTION
STATE
PRESET
STATE
D7
Discovery Status
0 = normal
1 = discovery fail
0
D6
Function Done Bit
0 = normal
1 = function complete (self clearing by a new function write)
0
D5
Port Class
D4
Port Class
D3
Port Class
D2
Fault status (MSB)
D1
Fault status
D0
Fault status (LSB)
000 =
001 =
010 =
011 =
100 =
class
class
class
class
class
0
1
2
3
4
000 =
001 =
010 =
011 =
100 =
101 =
110 =
111 =
no faults
UV/OV fault
thermal shutdown fault (TSD)
overload current > 50-ms fault
load disconnect
reserved for future
reserved for future
reserved for future
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000
000
TPS23841
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SLUS745 – NOVEMBER 2006
Table 9. Port Status Read 2, Register Select = 0101 (One Per Port)
BIT
FUNCTION
STATE
PRESET
STATE
D7
Unused
0
0
D6
Unused
0
0
D5
Unused
0
0
Watch dog timer
0 = not active
1 = active
0
A/D status
0 = not active
1 = active (conversion in process)
0
D4
D3
D2
Function status (MSB)
D1
Function status
D0
Function status (LSB)
000 =
001 =
010 =
011 =
100 =
101 =
110 =
111 =
disabled
searching
power delivery
fault
test
other fault
undefined
undefined
000
A/D Results Registers (Discovery Current, Voltage, Current and Temperature)
Table 10. Discovery Current — Lower Bits, Register Select = 0110 (One Per Port)
BIT
FUNCTION
D7
A/D bit 7
D6
A/D bit 6
D5
A/D bit 5
D4
A/D bit 4
D3
A/D bit 3
D2
A/D bit 2
D1
A/D bit 1
D0
A/D bit 0
STATE
A/D lower bits
PRESET
STATE
0
Table 11. Discovery Current — Upper Bits, Register Select = 0111 (One Per Port)
BIT
FUNCTION
STATE
PRESET
STATE
D7
Resistor measurement
complete
0 = measurement active (bit set low at the start of Discovery 1 or Discovery 2)
1 = measurement complete (bit set high after A/D is completed during Discovery 1 or
Discovery 2)
0
D6
A/D bit 14
A/D upper bits
0
D5
A/D bit 13
D4
A/D bit 12
D3
A/D bit 11
D2
A/D bit 10
D1
A/D bit 9
D0
A/D bit 8
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SLUS745 – NOVEMBER 2006
Table 12. Voltage — Lower Bits, Register Select = 1000 (One Per Port)
BIT
FUNCTION
D7
A/D bit 7
D6
A/D bit 6
D5
A/D bit 5
D4
A/D bit 4
D3
A/D bit 3
D2
A/D bit 2
D1
A/D bit 1
D0
A/D bit 0
STATE
A/D lower bits
PRESET
STATE
0
Table 13. Voltage — Upper Bits, Register Select = 1001 (One Per Port)
BIT
FUNCTION
STATE
PRESET
STATE
D7
Voltage measurement
complete
0 = measurement active (bit set low when A/D begins a voltage measurement)
1 = measurement complete (bit set high after A/D has completed a voltage
measurement)
0
D6
A/D bit 14
A/D upper bits
0
D5
A/D bit 13
D4
A/D bit 12
D3
A/D bit 11
D2
A/D bit 10
D1
A/D bit 9
D0
A/D bit 8
Table 14. Current — Lower Bits, Register Select = 1010 (One Per Port)
BIT
36
FUNCTION
D7
A/D bit 7
D6
A/D bit 6
D5
A/D bit 5
D4
A/D bit 4
D3
A/D bit 3
D2
A/D bit 2
D1
A/D bit 1
D0
A/D bit 0
STATE
A/D lower bits
PRESET
STATE
0
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TPS23841
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SLUS745 – NOVEMBER 2006
Table 15. Current — Upper Bits, Register Select = 1011 (One Per Port)
BIT
FUNCTION
STATE
PRESET
STATE
D7
Current measurement
complete
0 = measurement active (bit set low when A/D begins a current measurement)
1 = measurement complete (bit set high after A/D has completed a current
measurement)
0
D6
A/D bit 14
A/D upper bits
0
D5
A/D bit 13
D4
A/D bit 12
D3
A/D bit 11
D2
A/D bit 10
D1
A/D bit 9
D0
A/D bit 8
Table 16. Temperature — Lower Bits, Register Select = 1100 (One Per Port)
BIT
FUNCTION
D7
A/D bit 7
D6
A/D bit 6
D5
A/D bit 5
D4
A/D bit 4
D3
A/D bit 3
D2
A/D bit 2
D1
A/D bit 1
D0
A/D bit 0
STATE
A/D lower bits
PRESET
STATE
0
Table 17. Temperature — Upper Bits, Register Select = 1101 (One Per Port)
BIT
FUNCTION
STATE
PRESET
STATE
D7
Temperature
measurement complete
0 = measurement active (bit set low when A/D begins a temperature measurement)
1 = measurement complete (bit set high after A/D has completed a temperature
measurement)
0
D6
A/D bit 14
A/D upper bits
0
D5
A/D bit 13
D4
A/D bit 12
D3
A/D bit 11
D2
A/D bit 10
D1
A/D bit 9
D0
A/D bit 8
Submit Documentation Feedback
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TPS23841
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SLUS745 – NOVEMBER 2006
TPS23841 AC Drive Application Schematic
Figure 17. AC_HI and AC_LO With External FET Configuration
38
Submit Documentation Feedback
TPS23841
www.ti.com
SLUS745 – NOVEMBER 2006
TPS23841 System Block Diagram
SWITCH/HUB
POWERED DTE
RJ-45
CT CHOKE
RJ-45
1
W/GRN
W/GRN
1
2
GRN
GRN
2
3
W/ORG
W/ORG
3
6
ORG
ORG
6
4
BLUE
BLUE
4
5
W/BLUE
W/BLUE
5
7
W/BRN
W/BRN
7
8
BRN
BRN
8
CT CHOKE
TX
RX
CT CHOKE
CT CHOKE
RX
TX
PPTC
FUSE
P
V48
GND
+
-
PD
DC-DC
SUPPLY
N
RET
568A
UP TO 350ft
CATEGORY 5 CABLE
568A
OpticallyCoupled
I2C Serial Bus
48V
SUPPLY
TPS23841
PSE
(1PORT)
PD
SIGNATURE
MSP430
CONTROLLER
NOTE: A fuse may be required to provide additional protection if isolation is lost or the low-side current sense fails.
Figure 18.
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TPS23841
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SLUS745 – NOVEMBER 2006
TPS23841 Basic 4-Port (PMM) Isolated Configuration with AC Disconnect
TPS23841 basic 4-port isolated configuration with AC Disconnect (PAP pinout shown).
Function
7.5K
Auto
68uF
+
0.1uF
220pF
124K
0.1uF
0.1uF
0.1uF
-
7.5K
7.5K
7.5K
SYN
AC_HI
AC_LO
Ct
V2.5
RG
Rbias
AG1
V48
V6.3
V10
MS
RJ45-5
Xformer
1
2
48
3
46
47
CINT4 45
RET4 44
4 CINT1
0.027uF
5 RET1
6
N1
7
P1
8
TPS23841
Quad PSEController
N4
43
P4
42
P2
P3
39
11
N2
N3
38
RET3
37
CINT3 36
A5
A4
A3
A2
A1
SDA_O
SDA_I
SCL
V3
34
33
DG
INT
ALTA/B
WD_DIS
15
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
3.9K
9.1K
0.5W
48V BUS
9.1K
0.1uF
3.9K
270
270
270
3.9K
3.9K
SDA_OU
T
INT
SCL
Open Drain
SDA_IN
Open Drain
POR
Open Drain
GND CPU
Figure 19.
40
3.9K
NEG
0.5W
V DD CPU
0.027uF
35
16
POS
RJ45-5
Xformer
RJ45-5
Xformer
40
10
12 RET2
13 CINT
2
14
220nF
0.027uF
41
9
0.027uF
220nF
RJ45-5
Xformer
220nF
PORB
AG2
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
Submit Documentation Feedback
220nF
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Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
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Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
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TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
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TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
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Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
RFID
www.ti-rfid.com
Telephony
www.ti.com/telephony
Low Power
Wireless
www.ti.com/lpw
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated