TPD2S017 www.ti.com .......................................................................................................................................................................................... SLLS949 – SEPTEMBER 2009 2-CHANNEL ULTRA-LOW CLAMP VOLTAGE ESD SOLUTION WITH SERIES-RESISTOR ISOLATION FEATURES APPLICATIONS • • • • • 1 • • • • • • Ultra-Low Clamp Voltage Ensures the Protection of Ultra-Low Voltage Core Chipset During ESD Events Exceeds ESD Protection to IEC61000-4-2 (Level 4) Matching of Series Resistor (R =1 Ω) of ±8 mΩ (Typical) Differential Channel Input Capacitance Matching of 0.02 pF (Typical) High-Speed Data Rate and EMI Filter Action at High Frequencies (–3 dB Bandwidth, ≈3 GHz) Available in 6-Pin Small-Outline Transistor [SOT (DBV)] Package Flow-Through Single-In-Line Pin Mapping for the High-Speed Lines Ensures no Additional Board Layout Burden While Placing the ESD Protection Chip Near the Connector • Hi-Speed USB IEEE 1394 Interface Low-Voltage Differential Signaling (LVDS) Mobile Display Digital Interface (MDDI)/Mobile Industry Processor Interface (MIPI) HS Signal DBV PACKAGE (TOP VIEW) Ch1_Out 1 6 Ch2_Out GND 2 5 VCC Ch1_In 3 4 Ch2_In DESCRIPTION/ORDERING INFORMATION The TPD2S017 provides a robust system-level ESD solution for the high-speed lines interfacing low-voltage, ESD-sensitive core chipset. This device offers two stage ESD clamps in each line with ≈1-Ω series resistor isolation. This architecture allows the device to generate very low clamp voltage during system level ESD strikes. Due to the series resistor component, the TPD2S017 provides a controlled filter roll-off for even greater spurious EMI suppression and signal integrity. This device offers a flow-through pin mapping for ease of board layout. The monolithic silicon technology allows matching component values, including clamp capacitance, series resistor matching, etc., between the differential signal pairs. Tight matching of the line capacitance and series resistors ensure that the differential signal distortion due to added ESD clamp remains minimal, and also allow the part to operate at high-speed differential data rate (in excess of 1.5 Gbps). The TPD2S017 confirms the IEC61000-4-2 (Level 4) ESD protection and ±15 kV HBM ESD protection. This device is offered in space saving DBV packages. The TPD2S017 is characterized for operation over ambient air temperature of –40°C to 85°C. ORDERING INFORMATION PACKAGE (1) (2) TA –40°C to 85°C (1) (2) SOT (SOT-23) – DBV ORDERABLE PART NUMBER Reel of 3000 TPD2S017DBVR TOP-SIDE MARKING NFTF Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2009, Texas Instruments Incorporated TPD2S017 SLLS949 – SEPTEMBER 2009 .......................................................................................................................................................................................... www.ti.com CIRCUIT DIAGRAM VCC (optional) Ch1_In Ch1_Out Ch2_In Ch2_Out GND TERMINAL FUNCTIONS TERMINAL I/O DESCRIPTION NAME NO. Ch1_In Ch2_In 3 4 I High-speed ESD clamp input Ch1_Out Ch2_Out 1 6 O High-speed ESD clamp output GND 2 – Ground VCC 5 – Optional power ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VIO IO voltage range 0 5 V Tstg Storage temperature range –85 125 °C TA Operating temperature –40 85 °C (1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. ESD RATINGS PARAMETER IEC 61000-4-2 Contact Discharge Human Body Model 2 MIN MAX Out pin ±11 In pin ±11 In and out pins ±15 Submit Documentation Feedback UNIT kV kV Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPD2S017 TPD2S017 www.ti.com .......................................................................................................................................................................................... SLLS949 – SEPTEMBER 2009 DISSIPATION RATINGS (1) PACKAGE TA ≤ 25°C POWER RATING DERATING FACTOR (1) ABOVE TA ≤ 25°C TA = 70°C POWER RATING DBV 463.18 mW -4.63 mW/C 254.75 mW Derating factor is defined as the inverse of the traditional junction-to-ambient thermal resistance (RθJA). ELECTRICAL CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Ω R Series resistor 1 IIO Current from I/O pins VIO = 3 V 0.01 0.1 µA ΔRS Channel-to-channel resistance match VIO = 3 V ±8 ±15 mΩ VD Diode forward voltage for lower clamp ID = 8 mA –0.8 –0.95 RDYN Dynamic resistance (for I/O clamp) I = 9A CIO IO capacitance VIO = 2.5 V VBR Break-down voltage IO = 1 mA –0.6 11 V 0.8 Ω 1 pF 12 V TYPICAL CHARACTERISTICS 0 -1 -2 I/O to I/O Insertion Loss (dB) -3 -4 -5 -6 -7 -8 -9 1.000E+06 1.000E+07 1.000E+08 1.000E+09 1.000E+10 Frequency (Hz) Figure 1. Insertion Loss Data (S21) Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPD2S017 3 TPD2S017 SLLS949 – SEPTEMBER 2009 .......................................................................................................................................................................................... www.ti.com TYPICAL CHARACTERISTICS (continued) 8.0 130 7.2 117 6.4 104 5.6 91 Current (A) 78 4.0 65 Power (W) 3.2 PPP (W) IPP (A) 4.8 52 2.4 39 1.6 26 0.8 13 0.0 0 0 5 10 15 20 25 30 35 40 45 50 Time (us) 8.0 130 7.2 117 6.4 104 5.6 91 4.8 78 4.0 65 Current (A) 3.2 PPP (W) IPP (A) Figure 2. Peak Pulse Waveforms Ch1_Out, PUT wrt GND, VCC = 5.0 V 52 2.4 39 Power (W) 1.6 26 0.8 13 0.0 0 0 5 10 15 20 25 30 35 40 45 50 Time (us) Figure 3. Peak Pulse Waveforms Ch2_In, PUT wrt GND, VCC = 5.0 V 4 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPD2S017 TPD2S017 www.ti.com .......................................................................................................................................................................................... SLLS949 – SEPTEMBER 2009 TYPICAL CHARACTERISTICS (continued) 50 45 40 35 Amplitude (V) 30 25 20 15 10 5 0 -5 0 20 40 60 80 100 120 140 160 180 200 160 180 200 Time (ns) Figure 4. IEC Clamping Waveforms 8 kV Contact, 1 GHz Bandwidth 5 0 -5 -10 -15 Amplitude (V) -20 -25 -30 -35 -40 -45 -50 -55 -60 0 20 40 60 80 100 120 140 Time (nS) Figure 5. IEC Clamping Waveforms –8 kV Contact, 1 GHz Bandwidth Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPD2S017 5 PACKAGE OPTION ADDENDUM www.ti.com 5-Oct-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing TPD2S017DBVR ACTIVE SOT-23 DBV Pins Package Eco Plan (2) Qty 6 3000 Green (RoHS & no Sb/Br) Lead/Ball Finish CU NIPDAU MSL Peak Temp (3) Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 30-Sep-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device TPD2S017DBVR Package Package Pins Type Drawing SPQ SOT-23 3000 DBV 6 Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 178.0 9.0 Pack Materials-Page 1 3.23 B0 (mm) K0 (mm) P1 (mm) 3.17 1.37 4.0 W Pin1 (mm) Quadrant 8.0 Q3 PACKAGE MATERIALS INFORMATION www.ti.com 30-Sep-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPD2S017DBVR SOT-23 DBV 6 3000 180.0 180.0 18.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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