TI TPD2S017DBVR

TPD2S017
www.ti.com .......................................................................................................................................................................................... SLLS949 – SEPTEMBER 2009
2-CHANNEL ULTRA-LOW CLAMP VOLTAGE ESD SOLUTION
WITH SERIES-RESISTOR ISOLATION
FEATURES
APPLICATIONS
•
•
•
•
•
1
•
•
•
•
•
•
Ultra-Low Clamp Voltage Ensures the
Protection of Ultra-Low Voltage Core Chipset
During ESD Events
Exceeds ESD Protection to IEC61000-4-2
(Level 4)
Matching of Series Resistor (R =1 Ω) of ±8 mΩ
(Typical)
Differential Channel Input Capacitance
Matching of 0.02 pF (Typical)
High-Speed Data Rate and EMI Filter Action at
High Frequencies (–3 dB Bandwidth, ≈3 GHz)
Available in 6-Pin Small-Outline Transistor
[SOT (DBV)] Package
Flow-Through Single-In-Line Pin Mapping for
the High-Speed Lines Ensures no Additional
Board Layout Burden While Placing the ESD
Protection Chip Near the Connector
•
Hi-Speed USB
IEEE 1394 Interface
Low-Voltage Differential Signaling (LVDS)
Mobile Display Digital Interface (MDDI)/Mobile
Industry Processor Interface (MIPI)
HS Signal
DBV PACKAGE
(TOP VIEW)
Ch1_Out
1
6
Ch2_Out
GND
2
5
VCC
Ch1_In
3
4
Ch2_In
DESCRIPTION/ORDERING INFORMATION
The TPD2S017 provides a robust system-level ESD solution for the high-speed lines interfacing low-voltage,
ESD-sensitive core chipset. This device offers two stage ESD clamps in each line with ≈1-Ω series resistor
isolation. This architecture allows the device to generate very low clamp voltage during system level ESD strikes.
Due to the series resistor component, the TPD2S017 provides a controlled filter roll-off for even greater spurious
EMI suppression and signal integrity. This device offers a flow-through pin mapping for ease of board layout. The
monolithic silicon technology allows matching component values, including clamp capacitance, series resistor
matching, etc., between the differential signal pairs. Tight matching of the line capacitance and series resistors
ensure that the differential signal distortion due to added ESD clamp remains minimal, and also allow the part to
operate at high-speed differential data rate (in excess of 1.5 Gbps).
The TPD2S017 confirms the IEC61000-4-2 (Level 4) ESD protection and ±15 kV HBM ESD protection. This
device is offered in space saving DBV packages.
The TPD2S017 is characterized for operation over ambient air temperature of –40°C to 85°C.
ORDERING INFORMATION
PACKAGE (1) (2)
TA
–40°C to 85°C
(1)
(2)
SOT (SOT-23) – DBV
ORDERABLE PART NUMBER
Reel of 3000
TPD2S017DBVR
TOP-SIDE MARKING
NFTF
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2009, Texas Instruments Incorporated
TPD2S017
SLLS949 – SEPTEMBER 2009 .......................................................................................................................................................................................... www.ti.com
CIRCUIT DIAGRAM
VCC (optional)
Ch1_In
Ch1_Out
Ch2_In
Ch2_Out
GND
TERMINAL FUNCTIONS
TERMINAL
I/O
DESCRIPTION
NAME
NO.
Ch1_In
Ch2_In
3
4
I
High-speed ESD clamp input
Ch1_Out
Ch2_Out
1
6
O
High-speed ESD clamp output
GND
2
–
Ground
VCC
5
–
Optional power
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VIO
IO voltage range
0
5
V
Tstg
Storage temperature range
–85
125
°C
TA
Operating temperature
–40
85
°C
(1)
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
ESD RATINGS
PARAMETER
IEC 61000-4-2 Contact Discharge
Human Body Model
2
MIN
MAX
Out pin
±11
In pin
±11
In and out pins
±15
Submit Documentation Feedback
UNIT
kV
kV
Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s): TPD2S017
TPD2S017
www.ti.com .......................................................................................................................................................................................... SLLS949 – SEPTEMBER 2009
DISSIPATION RATINGS
(1)
PACKAGE
TA ≤ 25°C
POWER RATING
DERATING FACTOR (1)
ABOVE TA ≤ 25°C
TA = 70°C
POWER RATING
DBV
463.18 mW
-4.63 mW/C
254.75 mW
Derating factor is defined as the inverse of the traditional junction-to-ambient thermal resistance (RθJA).
ELECTRICAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Ω
R
Series resistor
1
IIO
Current from I/O pins
VIO = 3 V
0.01
0.1
µA
ΔRS
Channel-to-channel resistance
match
VIO = 3 V
±8
±15
mΩ
VD
Diode forward voltage for lower
clamp
ID = 8 mA
–0.8
–0.95
RDYN
Dynamic resistance (for I/O clamp)
I = 9A
CIO
IO capacitance
VIO = 2.5 V
VBR
Break-down voltage
IO = 1 mA
–0.6
11
V
0.8
Ω
1
pF
12
V
TYPICAL CHARACTERISTICS
0
-1
-2
I/O to I/O
Insertion Loss (dB)
-3
-4
-5
-6
-7
-8
-9
1.000E+06
1.000E+07
1.000E+08
1.000E+09
1.000E+10
Frequency (Hz)
Figure 1. Insertion Loss Data (S21)
Submit Documentation Feedback
Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s): TPD2S017
3
TPD2S017
SLLS949 – SEPTEMBER 2009 .......................................................................................................................................................................................... www.ti.com
TYPICAL CHARACTERISTICS (continued)
8.0
130
7.2
117
6.4
104
5.6
91
Current (A)
78
4.0
65
Power (W)
3.2
PPP (W)
IPP (A)
4.8
52
2.4
39
1.6
26
0.8
13
0.0
0
0
5
10
15
20
25
30
35
40
45
50
Time (us)
8.0
130
7.2
117
6.4
104
5.6
91
4.8
78
4.0
65
Current (A)
3.2
PPP (W)
IPP (A)
Figure 2. Peak Pulse Waveforms
Ch1_Out, PUT wrt GND, VCC = 5.0 V
52
2.4
39
Power (W)
1.6
26
0.8
13
0.0
0
0
5
10
15
20
25
30
35
40
45
50
Time (us)
Figure 3. Peak Pulse Waveforms
Ch2_In, PUT wrt GND, VCC = 5.0 V
4
Submit Documentation Feedback
Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s): TPD2S017
TPD2S017
www.ti.com .......................................................................................................................................................................................... SLLS949 – SEPTEMBER 2009
TYPICAL CHARACTERISTICS (continued)
50
45
40
35
Amplitude (V)
30
25
20
15
10
5
0
-5
0
20
40
60
80
100
120
140
160
180
200
160
180
200
Time (ns)
Figure 4. IEC Clamping Waveforms
8 kV Contact, 1 GHz Bandwidth
5
0
-5
-10
-15
Amplitude (V)
-20
-25
-30
-35
-40
-45
-50
-55
-60
0
20
40
60
80
100
120
140
Time (nS)
Figure 5. IEC Clamping Waveforms
–8 kV Contact, 1 GHz Bandwidth
Submit Documentation Feedback
Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s): TPD2S017
5
PACKAGE OPTION ADDENDUM
www.ti.com
5-Oct-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
TPD2S017DBVR
ACTIVE
SOT-23
DBV
Pins Package Eco Plan (2)
Qty
6
3000 Green (RoHS &
no Sb/Br)
Lead/Ball Finish
CU NIPDAU
MSL Peak Temp (3)
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Sep-2009
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
TPD2S017DBVR
Package Package Pins
Type Drawing
SPQ
SOT-23
3000
DBV
6
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
178.0
9.0
Pack Materials-Page 1
3.23
B0
(mm)
K0
(mm)
P1
(mm)
3.17
1.37
4.0
W
Pin1
(mm) Quadrant
8.0
Q3
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Sep-2009
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPD2S017DBVR
SOT-23
DBV
6
3000
180.0
180.0
18.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DLP® Products
DSP
Clocks and Timers
Interface
Logic
Power Mgmt
Microcontrollers
RFID
RF/IF and ZigBee® Solutions
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lprf
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2009, Texas Instruments Incorporated