CXA1600M/P 8-pin Single-chip AM Radio with Built-in Power Amplifier For the availability of this product, please contact the sales office. Description The CXA1600M/P is an 8-pin single-chip bipolar IC for AM radios. This IC includes all functions from the front-end to the power amplifier. The CXA1600M/P doesn’t require any external filter, making external ceramic filter attachment unnecessary. Features • EIAJ output=100 mW (typ.) (VCC=3 V, RL=8 Ω) • Built-in electrical volume control. • No ceramic filter required. • Few peripheral components. CXA1600M 8 pin SOP (Plastic) CXA1600P 8 pin DIP (Plastic) Absolute Maximum Ratings (Ta=25 °C) • Supply voltage VCC 7 • Operating temperature Topr –20 to +75 • Storage temperature Tstg –65 to +150 Operating Conditions Supply voltage Applications AM radio VCC 1.8 to 4.5 V °C °C V Structure Bipolar silicon monolithic IC Block Diagram RF IN OL AGC LO OSC VCC 8 7 6 5 RF AMP MIXER OSC BPF OVERLOAD AGC IF AMP AGC IF DET VOL AF POWER AMP 1 2 3 4 AGC VOL GND SP OUT Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. —1— E92311B8X CXA1600M/P Pin Description No. Symbol VCC=3 V Voltage (typ.) Equivalent Circuit Description VCC 1 AGC 0.61 V Connect with a capacitor. AGC 1 GND VCC 2 VOL 0.1 V VOL Connect to the midpoint of the volume control. 2 GND 3 GND 0V Ground VCC 4 SP OUT Audio output. Connect with a capacitor. 4 1.28 V SP OUT GND 5 VCC 3V Power supply VCC 6 LO OSC 6 LO OSC Oscillation output. Connect with an oscillation coil. VCC GND —2— CXA1600M/P No. Symbol Voltage (typ.) Equivalent Circuit Description VCC 7 OL AGC 7 0.62 V Connect with a capacitor. OL AGC GND VCC 8 RF IN 8 RF IN RF input. Connect with the antenna circuit. 3V GND Electrical Characteristics VCC=3 V, Ta=25 °C Item 1 2 Non-signal circuit current EIAJ output (with 8 Ω load) 3 Volume attenuation 4 Overall noise level 5 Selectivity Test conditions No signal f=1 MHz, fMOD=1 kHz, 30 % Vin=90 dBµV f=1 MHz, fMOD=1 kHz, 30 % Vin=90 dBµV, Volume=minimum Short circuit at RF IN with a 1µF capacitor. Measure the level at SP OUT. Volume=maximum f=1.010 MHz, fMOD=1 kHz, 30 % Vin=35 dBµV. —3— Min. Typ. Max. Unit 4.8 6 10 mA 80 100 14 mW –70 –65 dBm –25 –15 dBm 19 dB CXA1600M/P AM I/O Characteristics S+N 0 0dB=–10dBV VCC=3V f=1MHz fMOD=1kHz MOD=30% –10 8 –30 6 –40 5 Noise 4 –50 3 –60 2 THD 1 0 20 30 40 50 60 70 80 90 100 110 120 Bar antenna input level [dBµV/m] Selectivity Characteristics 0 –10 –20 –30 –40 –50 –60 –110 –100 –90 –80 –70 –60 –50 –40 –30 –20 Input frequency (fIN-fO) [kHz] —4— –10 0 10 20 30 THD - Distortion factor [%] 7 Output level [dB] Output level [dB] –20 CXA1600M/P Notes on Applications Application 1 VARIABLE CAPACITOR: HQ-025A of Toko Co., Ltd. or equivalent C3 D1 3V 220µ C7 160p 4.7µ D2 160p fIN VOSC=400mVp-p OSC COIL 130µH D1, D2: 1S1555 C2 Bar ANT 1500p GND 8 GND 7 RF IN 6 OL AGC RF AMP fOSC 5 LO OSC MIXER VCC OSC fIF BPF OVERLOAD AGC IF AMP AGC IF DET VOL 1 AGC 2 AF POWER AMP VOL 3 GND 4 SP OUT 220µ C5 0.1µ C4 2.2µ R1 100k 22µ C1 C6 8Ω SP GND GND The CXA1600M/P operates on the new system using very low intermediate frequency (approx. 55 kHz). (Actual IF frequency is determined by internal B.P.F.fo.) fIF = 1 fOSC–fIN ≈ 55 kHz 2 Please take care of choice of the coil and variable capacitor as follows. (See next page.) —5— CXA1600M/P Coil data APPlication 1 AM OSC 3 4 2 5 1 Wire diameter ø 0.08 mm 2UEW f (kHz) 6 S 796 L (µH) 1 to 3 130 QO 1 to 3 70 Number of widings (µH) 1 to 4 4 to 3 32.5 97.5 AM Bar Antenna f (kHz) 796 S 1 2 L (µH) 560 3 to 2 140 2 to 1 420 3 APPlication 2 AM OSC 3 4 2 5 1 Wire diameter ø 0.08 mm 2UEW f (kHz) 6 S 796 L (µH) 1 to 3 210 QO 1 to 3 70 Number of widings (µH) 1 to 4 4 to 3 71.3 138.7 AM Bar Antenna S 1 2 f (kHz) 796 L (µH) 900 3 —6— 3 to 2 180 2 to 1 720 CXA1600M/P VARIABLE CAPACITOR used (Equivalent capacitor) C3 D1 1500p GND 8 3V 220µ C7 4.7µ 160p D2 OSC COIL 130µH D1, D2: 1S1555 C2 Bar ANT VARIABLE CAPACITOR: HQ-025A of Toko Co., Ltd. or equivalent 160p Application Circuit 1 7 RF IN GND 6 OL AGC RF AMP MIXER OVERLOAD AGC BPF 5 LO OSC VCC OSC IF AMP AGC IF DET VOL 1 AGC 2 AF POWER AMP VOL 3 GND 4 SP OUT 220µ C5 0.1µ C4 2.2µ R1 100k 22µ C1 C6 8Ω SP GND GND Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same. —7— CXA1600M/P VARIABLE CAPACITOR used (Non-Equivalent capacitor) 3V 220µ C7 C2 4.7µ C3 D2 VARIABLE CAPACITOR: CRF=160p, COSC=80p OSC COIL 210µH D1, D2: 1S1555 160p Bar ANT 80p Application Circuit 2 D1 220p GND 8 GND 7 RF IN 6 OL AGC 5 LO OSC RF AMP MIXER OVERLOAD AGC BPF VCC OSC IF AMP AGC IF DET AF POWER AMP VOL AGC VOL 1 GND 2 SP OUT 3 4 220µ C5 0.1µ C4 2.2µ R1 100k 22µ C1 C6 8Ω SP GND GND Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same. —8— CXA1600M/P Package Outline Unit : mm 8PIN SOP (PLASTIC) CXA1600M + 0.4 1.25 – 0.15 + 0.4 5.0 – 0.1 0.10 8 5 6.4 ± 0.4 + 0.3 4.4 – 0.1 A 4 1 1.27 b 0.24 M + 0.15 0.1 – 0.1 0.5 ± 0.2 B + 0.03 0.15 – 0.01 (0.4) (0.15) + 0.1 0.15 – 0.05 0° to 10° + 0.1 b = 0.4 – 0.05 b = 0.4 ± 0.03 DETAIL B : SOLDER DETAILA DETAIL B : PALLADIUM PACKAGE STRUCTURE PACKAGE MATERIAL EPOXY RESIN SONY CODE SOP-8P-L03 LEAD TREATMENT SOLDER/PALLADIUM PLATING EIAJ CODE SOP008-P-0225 LEAD MATERIAL 42/COPPER ALLOY PACKAGE MASS 0.1g JEDEC CODE NOTE : PALLADIUM PLATING This product uses S-PdPPF (Sony Spec.-Palladium Pre-Plated Lead Frame). + 0.3 6.4 – 0.1 + 0.4 9.4 – 0.1 5 7.62 8 + 0.1 0.05 0.25 – 8PIN DIP (PLASTIC) CXA1600P 0° to 15° 4 1 + 0.4 3.7 – 0.1 3.0 MIN 0.5 MIN 2.54 0.5 ± 0.1 1.2 ± 0.15 PACKAGE STRUCTURE PACKAGE MATERIAL EPOXY RESIN SONY CODE DIP-8P-01 LEAD TREATMENT SOLDER PLATING EIAJ CODE DIP008-P-0300 LEAD MATERIAL COPPER ALLOY PACKAGE MASS 0.5g JEDEC CODE —9—