SONY CXA1600M

CXA1600M/P
8-pin Single-chip AM Radio with Built-in Power Amplifier
For the availability of this product, please contact the sales office.
Description
The CXA1600M/P is an 8-pin single-chip bipolar IC
for AM radios. This IC includes all functions from
the front-end to the power amplifier.
The CXA1600M/P doesn’t require any external
filter, making external ceramic filter attachment
unnecessary.
Features
• EIAJ output=100 mW (typ.)
(VCC=3 V, RL=8 Ω)
• Built-in electrical volume control.
• No ceramic filter required.
• Few peripheral components.
CXA1600M
8 pin SOP (Plastic)
CXA1600P
8 pin DIP (Plastic)
Absolute Maximum Ratings (Ta=25 °C)
• Supply voltage
VCC
7
• Operating temperature Topr
–20 to +75
• Storage temperature
Tstg –65 to +150
Operating Conditions
Supply voltage
Applications
AM radio
VCC
1.8 to 4.5
V
°C
°C
V
Structure
Bipolar silicon monolithic IC
Block Diagram
RF IN
OL AGC
LO OSC
VCC
8
7
6
5
RF AMP
MIXER
OSC
BPF
OVERLOAD AGC
IF AMP
AGC
IF DET
VOL
AF POWER AMP
1
2
3
4
AGC
VOL
GND
SP OUT
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
—1—
E92311B8X
CXA1600M/P
Pin Description
No.
Symbol
VCC=3 V
Voltage
(typ.)
Equivalent Circuit
Description
VCC
1
AGC
0.61 V
Connect with a capacitor.
AGC
1
GND
VCC
2
VOL
0.1 V
VOL
Connect to the midpoint of the
volume control.
2
GND
3
GND
0V
Ground
VCC
4
SP OUT
Audio output.
Connect with a capacitor.
4
1.28 V
SP OUT
GND
5
VCC
3V
Power supply
VCC
6
LO OSC
6
LO OSC
Oscillation output.
Connect with an oscillation coil.
VCC
GND
—2—
CXA1600M/P
No.
Symbol
Voltage
(typ.)
Equivalent Circuit
Description
VCC
7
OL AGC
7
0.62 V
Connect with a capacitor.
OL AGC
GND
VCC
8
RF IN
8
RF IN
RF input.
Connect with the antenna circuit.
3V
GND
Electrical Characteristics
VCC=3 V, Ta=25 °C
Item
1
2
Non-signal
circuit current
EIAJ output
(with 8 Ω load)
3
Volume attenuation
4
Overall noise level
5
Selectivity
Test conditions
No signal
f=1 MHz, fMOD=1 kHz, 30 %
Vin=90 dBµV
f=1 MHz, fMOD=1 kHz, 30 %
Vin=90 dBµV, Volume=minimum
Short circuit at RF IN with a 1µF
capacitor. Measure the level at SP OUT.
Volume=maximum
f=1.010 MHz, fMOD=1 kHz, 30 %
Vin=35 dBµV.
—3—
Min.
Typ.
Max.
Unit
4.8
6
10
mA
80
100
14
mW
–70
–65
dBm
–25
–15
dBm
19
dB
CXA1600M/P
AM I/O Characteristics
S+N
0
0dB=–10dBV
VCC=3V
f=1MHz
fMOD=1kHz
MOD=30%
–10
8
–30
6
–40
5
Noise
4
–50
3
–60
2
THD
1
0
20
30
40
50
60
70
80
90
100
110
120
Bar antenna input level [dBµV/m]
Selectivity Characteristics
0
–10
–20
–30
–40
–50
–60
–110 –100 –90
–80
–70 –60
–50 –40
–30
–20
Input frequency (fIN-fO) [kHz]
—4—
–10
0
10
20
30
THD - Distortion factor [%]
7
Output level [dB]
Output level [dB]
–20
CXA1600M/P
Notes on Applications
Application 1
VARIABLE CAPACITOR:
HQ-025A of Toko Co., Ltd.
or equivalent
C3
D1
3V
220µ
C7
160p
4.7µ
D2
160p
fIN
VOSC=400mVp-p
OSC COIL
130µH
D1, D2: 1S1555
C2
Bar ANT
1500p
GND
8
GND
7
RF IN
6
OL AGC
RF AMP
fOSC
5
LO OSC
MIXER
VCC
OSC
fIF
BPF
OVERLOAD AGC
IF AMP
AGC
IF DET
VOL
1
AGC
2
AF POWER AMP
VOL
3
GND
4
SP OUT
220µ
C5
0.1µ
C4
2.2µ
R1
100k
22µ
C1
C6
8Ω SP
GND
GND
The CXA1600M/P operates on the new system using very low intermediate frequency (approx. 55 kHz).
(Actual IF frequency is determined by internal B.P.F.fo.)
fIF =
1
fOSC–fIN ≈ 55 kHz
2
Please take care of choice of the coil and variable capacitor as follows. (See next page.)
—5—
CXA1600M/P
Coil data
APPlication 1
AM OSC
3
4
2
5
1
Wire diameter ø 0.08 mm 2UEW
f (kHz)
6
S
796
L (µH)
1 to 3
130
QO
1 to 3
70
Number of widings (µH)
1 to 4
4 to 3
32.5
97.5
AM Bar Antenna
f (kHz)
796
S
1
2
L (µH)
560
3 to 2
140
2 to 1
420
3
APPlication 2
AM OSC
3
4
2
5
1
Wire diameter ø 0.08 mm 2UEW
f (kHz)
6
S
796
L (µH)
1 to 3
210
QO
1 to 3
70
Number of widings (µH)
1 to 4
4 to 3
71.3
138.7
AM Bar Antenna
S
1
2
f (kHz)
796
L (µH)
900
3
—6—
3 to 2
180
2 to 1
720
CXA1600M/P
VARIABLE CAPACITOR used (Equivalent capacitor)
C3
D1
1500p
GND
8
3V
220µ
C7
4.7µ
160p
D2
OSC COIL
130µH
D1, D2: 1S1555
C2
Bar ANT
VARIABLE CAPACITOR:
HQ-025A of Toko Co., Ltd.
or equivalent
160p
Application Circuit 1
7
RF IN
GND
6
OL AGC
RF AMP
MIXER
OVERLOAD AGC
BPF
5
LO OSC
VCC
OSC
IF AMP
AGC
IF DET
VOL
1
AGC
2
AF POWER AMP
VOL
3
GND
4
SP OUT
220µ
C5
0.1µ
C4
2.2µ
R1
100k
22µ
C1
C6
8Ω SP
GND
GND
Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for
any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same.
—7—
CXA1600M/P
VARIABLE CAPACITOR used (Non-Equivalent capacitor)
3V
220µ
C7
C2
4.7µ
C3
D2
VARIABLE CAPACITOR:
CRF=160p, COSC=80p
OSC COIL
210µH
D1, D2: 1S1555
160p
Bar ANT
80p
Application Circuit 2
D1
220p
GND
8
GND
7
RF IN
6
OL AGC
5
LO OSC
RF AMP
MIXER
OVERLOAD AGC
BPF
VCC
OSC
IF AMP
AGC
IF DET
AF POWER AMP
VOL
AGC
VOL
1
GND
2
SP OUT
3
4
220µ
C5
0.1µ
C4
2.2µ
R1
100k
22µ
C1
C6
8Ω SP
GND
GND
Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for
any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same.
—8—
CXA1600M/P
Package Outline
Unit : mm
8PIN SOP (PLASTIC)
CXA1600M
+ 0.4
1.25 – 0.15
+ 0.4
5.0 – 0.1
0.10
8
5
6.4 ± 0.4
+ 0.3
4.4 – 0.1
A
4
1
1.27
b
0.24
M
+ 0.15
0.1 – 0.1
0.5 ± 0.2
B
+ 0.03
0.15 – 0.01
(0.4)
(0.15)
+ 0.1
0.15 – 0.05
0° to 10°
+ 0.1
b = 0.4 – 0.05
b = 0.4 ± 0.03
DETAIL B : SOLDER
DETAILA
DETAIL B : PALLADIUM
PACKAGE STRUCTURE
PACKAGE MATERIAL
EPOXY RESIN
SONY CODE
SOP-8P-L03
LEAD TREATMENT
SOLDER/PALLADIUM
PLATING
EIAJ CODE
SOP008-P-0225
LEAD MATERIAL
42/COPPER ALLOY
PACKAGE MASS
0.1g
JEDEC CODE
NOTE : PALLADIUM PLATING
This product uses S-PdPPF (Sony Spec.-Palladium Pre-Plated Lead Frame).
+ 0.3
6.4 – 0.1
+ 0.4
9.4 – 0.1
5
7.62
8
+ 0.1
0.05
0.25 –
8PIN DIP (PLASTIC)
CXA1600P
0° to 15°
4
1
+ 0.4
3.7 – 0.1
3.0 MIN
0.5 MIN
2.54
0.5 ± 0.1
1.2 ± 0.15
PACKAGE STRUCTURE
PACKAGE MATERIAL
EPOXY RESIN
SONY CODE
DIP-8P-01
LEAD TREATMENT
SOLDER PLATING
EIAJ CODE
DIP008-P-0300
LEAD MATERIAL
COPPER ALLOY
PACKAGE MASS
0.5g
JEDEC CODE
—9—