ICX409AK
Diagonal 6mm (Type 1/3) CCD Image Sensor for PAL Color Video Cameras
Description
The ICX409AK is an interline CCD solid-state
image sensor suitable for PAL color video cameras
with a diagonal 6mm (Type 1/3) system. Compared
with the conventional product ICX059CK, basic
characteristics such as sensitivity, smear, dynamic
range and S/N are improved drastically.
This chip features a field period readout system and
an electronic shutter with variable charge-storage
time.
This chip is suitable for applications such as surveillance
cameras, automotive cameras, etc.
Features
• High sensitivity (+6dB compared with the ICX059CK)
• Low smear (–15dB compared with the ICX059CK)
• High D range (+5dB compared with the ICX059CK)
• High S/N
• High resolution and low dark current
• Excellent antiblooming characteristics
• Ye, Cy, Mg, and G complementary color mosaic filters on chip
• Continuous variable-speed shutter
• No voltage adjustment
(Reset gate and substrate bias are not adjusted.)
• Reset gate:
5V drive
• Horizontal register: 5V drive
16 pin DIP (Plastic)
AAAAA
AAAAA
AAAAA
AAAAA
AAAAA
Pin 1
2
V
3
Pin 9
H
12
40
Optical black position
(Top View)
Device Structure
• Interline CCD image sensor
• Image size:
Diagonal 6mm (Type 1/3)
• Number of effective pixels: 752 (H) × 582 (V) approx. 440K pixels
• Total number of pixels:
795 (H) × 596 (V) approx. 470K pixels
• Chip size:
5.59mm (H) × 4.68mm (V)
• Unit cell size:
6.50µm (H) × 6.25µm (V)
• Optical black:
Horizontal (H) direction : Front 3 pixels, rear 40 pixels
Vertical (V) direction
: Front 12 pixels, rear 2 pixels
• Number of dummy bits:
Horizontal 22
Vertical 1 (even fields only)
• Substrate material:
Silicon
∗Super HAD CCD is a trademark of Sony Corporation. The Super HAD CCD is a version of Sony's high performance CCD HAD (HoleAccumulation Diode) sensor with sharply improved sensitivity by the incorporation of a new semiconductor technology developed by Sony
Corporation.
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
–1–
E00611B28
NC
GND
Vφ1
Vφ2
Vφ3
Vφ4
8
7
6
5
4
3
2
1
Vertical Register
NC
Block Diagram and
Pin Configuration
(Top View)
VOUT
ICX409AK
Cy
Ye
Cy
Ye
G
Mg
G
Mg
Cy
Ye
Cy
Ye
G
Mg
G
Mg
Cy
Ye
Cy
Ye
Mg
G
Mg
G
Note)
Horizontal Register
GND
φSUB
VL
Pin Description
Pin No.
Symbol
Description
13
14
Pin No.
15
16
Hφ2
12
Hφ1
11
NC
10
φRG
9
VDD
Note)
: Photo sensor
Description
Symbol
1
Vφ4
Vertical register transfer clock
9
VDD
Supply voltage
2
Vφ3
Vertical register transfer clock
10
GND
GND
3
Vφ2
Vertical register transfer clock
11
φSUB
Substrate clock
4
Vφ1
Vertical register transfer clock
12
VL
Protective transistor bias
5
GND
GND
13
φRG
Reset gate clock
6
NC
14
NC
7
NC
15
Hφ1
Horizontal register transfer clock
8
VOUT
16
Hφ2
Horizontal register transfer clock
Signal output
Absolute Maximum Ratings
Item
Against φSUB
Against GND
Against VL
Ratings
Unit
VDD, VOUT, φRG – φSUB
–40 to +8
V
Vφ1, Vφ3 – φSUB
–50 to +15
V
Vφ2, Vφ4, VL – φSUB
–50 to +0.3
V
Hφ1, Hφ2, GND – φSUB
–40 to +0.3
V
VDD, VOUT, φRG – GND
–0.3 to +20
V
Vφ1, Vφ2, Vφ3, Vφ4 – GND
–10 to +18
V
Hφ1, Hφ2 – GND
–10 to +6
V
Vφ1, Vφ3 – VL
–0.3 to +28
V
Vφ2, Vφ4, Hφ1, Hφ2, GND – VL
–0.3 to +15
V
to +15
V
Voltage difference between vertical clock input pins
Between input clock
pins
Hφ1 – Hφ2
–6 to +6
V
–14 to +14
V
Storage temperature
–30 to +80
°C
Operating temperature
–10 to +60
°C
Hφ1, Hφ2 – Vφ4
∗1 +24V (Max.) when clock width < 10µs, clock duty factor < 0.1%.
–2–
Remarks
∗1
ICX409AK
Bias Conditions
Symbol
Item
Supply voltage
VDD
Protective transistor bias
VL
Substrate clock
φSUB
Min.
Typ.
Max.
Unit
14.55
15.0
∗1
15.45
V
Remarks
∗2
∗1 VL setting is the VVL voltage of the vertical transfer clock waveform, or the same power supply as the VL
power supply for the V driver should be used.
∗2 Do not apply a DC bias to the substrate clock pin, because a DC bias is generated within the CCD.
DC Characteristics
Symbol
Item
Supply current
Min.
IDD
Typ.
Max.
Unit
4
6
mA
Remarks
Clock Voltage Conditions
Item
Readout clock voltage
Vertical transfer clock
voltage
Horizontal transfer
clock voltage
Min.
Typ.
Max.
Unit
Waveform
diagram
VVT
14.55
15.0
15.45
V
1
VVH1, VVH2
–0.05
0
0.05
V
2
VVH3, VVH4
–0.2
0
0.05
V
2
VVL1, VVL2,
VVL3, VVL4
–8.0
–7.0
–6.5
V
2
VVL = (VVL3 + VVL4)/2
VφV
6.3
7.0
8.05
V
2
VφV = VVHn – VVLn (n = 1 to 4)
Symbol
Substrate clock voltage
VVH = (VVH1 + VVH2)/2
VVH3 – VVH
–0.25
0.1
V
2
VVH4 – VVH
–0.25
0.1
V
2
VVHH
0.3
V
2
High-level coupling
VVHL
0.3
V
2
High-level coupling
VVLH
0.3
V
2
Low-level coupling
VVLL
0.3
V
2
Low-level coupling
VφH
4.75
5.0
5.25
V
3
VHL
–0.05
0
0.05
V
3
4.5
5.0
5.5
V
4
Input through 0.1µF
capacitance
VRGLH – VRGLL
0.4
V
4
Low-level coupling
VRGL – VRGLm
0.5
V
4
Low-level coupling
VφRG
Reset gate clock
voltage
Remarks
VRGH
VDD
+0.3
VDD
+0.6
VDD
+0.9
V
4
VφSUB
21.0
22.0
23.5
V
5
–3–
ICX409AK
Clock Equivalent Circuit Constant
Symbol
Item
Min.
Typ.
Max.
Unit
CφV1, CφV3
1500
pF
CφV2, CφV4
1000
pF
CφV12, CφV34
820
pF
CφV23, CφV41
330
pF
CφV13
120
pF
CφV24
100
pF
Capacitance between horizontal
transfer clock and GND
CφH1, CφH2
75
pF
Capacitance between horizontal
transfer clocks
CφHH
22
pF
Capacitance between reset gate clock
and GND
CφRG
5
pF
Capacitance between substrate clock
and GND
CφSUB
270
pF
R1, R3
100
Ω
R2, R4
150
Ω
Vertical transfer clock ground resistor
RGND
68
Ω
Horizontal transfer clock series resistor
RφH
15
Ω
Reset gate clock series resistor
RφRG
50
Ω
Capacitance between vertical transfer
clock and GND
Capacitance between vertical transfer
clocks
Vertical transfer clock series resistor
Vφ1
Remarks
Vφ2
CφV12
R1
R2
RφH
RφH
Hφ2
Hφ1
CφV1
CφHH
CφV2
CφV41
CφV23
CφH1
CφH2
CφV13
CφV24
CφV4 RGND CφV3
R4
R3
CφV34
Vφ4
Vφ3
Vertical transfer clock equivalent circuit
Horizontal transfer clock equivalent circuit
RφRG
RGφ
CφRG
Reset gate clock equivalent circuit
–4–
ICX409AK
Drive Clock Waveform Conditions
(1) Readout clock waveform
100%
90%
II
II
φM
VVT
φM
2
10%
0%
tr
twh
0V
tf
(2) Vertical transfer clock waveform
Vφ1
Vφ3
VVHH
VVH1
VVHH
VVH
VVHL
VVHL
VVH3
VVHL
VVL1
VVH
VVHH
VVHH
VVHL
VVL3
VVLH
VVLH
VVLL
VVLL
VVL
VVL
Vφ2
Vφ4
VVHH
VVHH
VVH
VVH
VVHH
VVHH
VVHL
VVHL
VVH2 VVHL
VVH4
VVL2
VVHL
VVLH
VVLH
VVLL
VVLL
VVL
VVL4
VVH = (VVH1 + VVH2)/2
VVL = (VVL3 + VVL4)/2
VφV = VVHn – VVLn (n = 1 to 4)
–5–
VVL
ICX409AK
(3) Horizontal transfer clock waveform
tr
twh
tf
90%
twl
VφH
10%
VHL
(4) Reset gate clock waveform
tr
twh
tf
VRGH
twl
Point A
VφRG
RG waveform
VRGLH
VRGL
VRGLL
VRGLm
Hφ1 waveform
VφH/2 [V]
VRGLH is the maximum value and VRGLL is the minimum value of the coupling waveform during the period from
Point A in the above diagram until the rising edge of RG. In addition, VRGL is the average value of VRGLH and
VRGLL.
VRGL = (VRGLH + VRGLL)/2
Assuming VRGH is the minimum value during the interval twh, then:
VφRG = VRGH – VRGL
Negative overshoot level during the falling edge of RG is VRGLm.
(5) Substrate clock waveform
100%
90%
φM
VφSUB
10%
0%
VSUB
(A bias generated within the CCD)
tr
twh
–6–
φM
2
tf
ICX409AK
Clock Switching Characteristics
Item
Symbol
VT
Vertical transfer
clock
Vφ1, Vφ2,
Vφ3, Vφ4
tr
tf
Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max.
2.3 2.5
Readout clock
Horizontal
transfer clock
twl
twh
0.5
0.5
µs
26 28.5
26 28.5
6.5 9.5
6.5 9.5
Hφ2
26 28.5
26 28.5
6.5 9.5
6.5 9.5
During
Hφ1
parallel-serial
Hφ2
conversion
5.38
0.01
0.01
5.38
0.01
0.01
51
3
3
Reset gate clock
φRG
11
Substrate clock
φSUB
1.5 1.8
13
During
readout
250 ns ∗1
15
Hφ1
During
imaging
Unit Remarks
µs
ns
0.5
0.5
ns ∗2
µs
During drain
charge
∗1 When vertical transfer clock driver CXD1267AN is used.
∗2 tf ≥ tr – 2ns, and the cross-point voltage (VCR) for the Hφ1 rising side of the Hφ1 and Hφ2 waveforms must be
at least VφH/2 [V].
Item
Horizontal transfer clock
Symbol
Hφ1, Hφ2
two
Min.
Typ.
22
26
Max.
Unit
Remarks
ns
∗3
∗3 The overlap period for twh and twl of horizontal transfer clocks Hφ1 and Hφ2 is two.
–7–
ICX409AK
Image Sensor Characteristics
Item
(Ta = 25°C)
Symbol
Min.
Typ.
S
760
950
RMgG
0.93
1.35
2
RYeCy
1.15
1.48
2
Saturation signal
Ysat
1000
Smear
Sm
Video signal shading
SHy
Sensitivity
Sensitivity ratio
Max.
Unit
Measurement method
mV
1
Remarks
mV
3
–93
dB
4
20
%
5
Zone 0 and I
25
%
5
Zone 0 to II'
∆Sr
10
%
6
∆Sb
10
%
6
Dark signal
Ydt
2
mV
7
Ta = 60°C
Dark signal shading
∆Ydt
1
mV
8
Ta = 60°C
Flicker Y
Fy
2
%
9
Flicker R-Y
Fcr
5
%
9
Flicker B-Y
Fcb
5
%
9
Line crawl R
Lcr
3
%
10
Line crawl G
Lcg
3
%
10
Line crawl B
Lcb
3
%
10
Line crawl W
Lcw
3
%
10
Lag
Lag
0.5
%
11
Uniformity between video
signal channels
–110
Ta = 60°C
Zone Definition of Video Signal Shading
752 (H)
12
12
8
V
10
H
8
H
8
582(V)
Zone 0, I
Zone II, II'
6
Ignored region
Effective pixel region
V
10
Measurement System
[∗A]
CCD signal output
[∗Y]
Y signal output
LPF1
(3dB down 6.3MHz)
CCD
C.D.S
AMP
S
[∗C]
H
LPF2
SH
Chroma signal output
(3dB down 1MHz)
Note) Adjust the amplifier gain so that the gain between [∗A] and [∗Y] , and between [∗A] and [∗C] equals 1.
–8–
ICX409AK
Image Sensor Characteristics Measurement Method
Measurement conditions
1) In the following measurements, the device drive conditions are at the typical values of the bias and clock
voltage conditions.
2) In the following measurements, spot blemishes are excluded and, unless otherwise specified, the optical
black level (OB) is used as the reference for the signal output, which is taken as the value of Y signal output
or chroma signal output of the measurement system.
Color coding of this image sensor & Composition of luminance (Y) and chroma (color difference) signals
Cy
Ye
Cy
Ye
A1
G
Mg
G
Mg
Cy
Ye
Cy
Ye
Mg
G
Mg
G
B
A2
As shown in the left figure, fields are read out. The charge is
mixed by pairs such as A1 and A2 in the A field. (pairs such
as B in the B field)
As a result, the sequence of charges output as signals from
the horizontal shift register (Hreg) is, for line A1, (G + Cy),
(Mg + Ye), (G + Cy), and (Mg + Ye).
Hreg
Color Coding Diagram
These signals are processed to form the Y signal and chroma (color difference) signal. The Y signal is formed
by adding adjacent signals, and the chroma signal is formed by subtracting adjacent signals. In other words,
the approximation:
Y = {(G + Cy) + (Mg + Ye)} × 1/2
= 1/2 {2B + 3G + 2R}
is used for the Y signal, and the approximation:
R – Y = {(Mg + Ye) – (G + Cy)}
= {2R – G}
is used for the chroma (color difference) signal. For line A2, the signals output from Hreg in sequence are
(Mg + Cy), (G + Ye), (Mg + Cy), (G + Ye).
The Y signal is formed from these signals as follows:
Y = {(G + Ye) + (Mg + Cy)} × 1/2
= 1/2 {2B + 3G + 2R}
This is balanced since it is formed in the same way as for line A1.
In a like manner, the chroma (color difference) signal is approximated as follows:
– (B – Y) = {(G + Ye) – (Mg + Cy)}
= – {2B – G}
In other words, the chroma signal can be retrieved according to the sequence of lines from R – Y and – (B – Y)
in alternation. This is also true for the B field.
–9–
ICX409AK
Definition of standard imaging conditions
1) Standard imaging condition I:
Use a pattern box (luminance 706cd/m2, color temperature of 3200K halogen source) as a subject. (Pattern
for evaluation is not applicable.) Use a testing standard lens with CM500S (t = 1.0mm) as an IR cut filter and
image at F5.6. The luminous intensity to the sensor receiving surface at this point is defined as the standard
sensitivity testing luminous intensity.
2) Standard imaging condition II:
Image a light source (color temperature of 3200K) with a uniformity of brightness within 2% at all angles.
Use a testing standard lens with CM500S (t = 1.0mm) as an IR cut filter. The luminous intensity is adjusted
to the value indicated in each testing item by the lens diaphragm.
1. Sensitivity
Set to standard imaging condition I. After selecting the electronic shutter mode with a shutter speed of
1/250s, measure the Y signal (Ys) at the center of the screen and substitute the value into the following
formula.
S = Ys ×
250
[mV]
50
2. Sensitivity ratio
Set to standard imaging condition II. Adjust the luminous intensity so that the average value of the Y signal
output is 200mV, and then measure the Mg signal output (SMg [mV]) and G signal output (SG [mV]), and Ye
signal output (SYe [mV]) and Cy signal output (SCy [mV]) at the center of the screen with frame readout
method. Substitute the values into the following formula.
RMgG = SMg/SG
RYeCy = SYe/SCy
3. Saturation signal
Set to standard imaging condition II. After adjusting the luminous intensity to 10 times the intensity with
average value of the Y signal output, 200mV, measure the minimum value of the Y signal.
4. Smear
Set to standard imaging condition II. With the lens diaphragm at F5.6 to F8, adjust the luminous intensity to
500 times the intensity with average value of the Y signal output, 200mV. When the readout clock is
stopped and the charge drain is executed by the electronic shutter at the respective H blankings, measure
the maximum value YSm [mV] of the Y signal output and substitute the value into the following formula.
Sm = 20 × log
1
YSm
1
×
×
10
200
500
[dB] (1/10V method conversion value)
5. Video signal shading
Set to standard imaging condition II. With the lens diaphragm at F5.6 to F8, adjust the luminous intensity so
that the average value of the Y signal output is 200mV. Then measure the maximum (Ymax [mV]) and
minimum (Ymin [mV]) values of the Y signal and substitute the values into the following formula.
SHy = (Ymax – Ymin)/200 × 100 [%]
6. Uniformity between video signal channels
Set to standard imaging condition II. Adjust the luminous intensity so that the average value of the Y signal
output is 200mV, and then measure the maximum (Crmax, Cbmax [mV]) and minimum (Crmin, Cbmin
[mV]) values of the R – Y and B – Y channels of the chroma signal and substitute the values into the
following formula.
∆Sr = | (Crmax – Crmin)/200 | × 100 [%]
∆Sb = | (Cbmax – Cbmin)/200 | × 100 [%]
– 10 –
ICX409AK
7. Dark signal
Measure the average value of the Y signal output (Ydt [mV]) with the device ambient temperature 60°C and
the device in the light-obstructed state, using the horizontal idle transfer level as a reference.
8. Dark signal shading
After measuring 7, measure the maximum (Ydmax [mV]) and minimum (Ydmin [mV]) values of the Y signal
output and substitute the values into the following formula.
∆Ydt = Ydmax – Ydmin [mV]
9. Flicker
1) Fy
Set to standard imaging condition II. Adjust the luminous intensity so that the average value of the Y signal
output is 200mV, and then measure the difference in the signal level between fields (∆Yf [mV]). Then
substitute the value into the following formula.
Fy = (∆Yf/200) × 100 [%]
2) Fcr, Fcb
Set to standard imaging condition II. Adjust the luminous intensity so that the average value of the Y signal
output is 200mV, insert an R or B filter, and then measure both the difference in the signal level between
fields of the chroma signal (∆Cr, ∆Cb) as well as the average value of the chroma signal output (CAr, CAb).
Substitute the values into the following formula.
Fci = (∆Ci/CAi) × 100 [%] (i = r, b)
10. Line crawls
Set to standard imaging condition II. Adjust the luminous intensity so that the average value of the Y signal
output is 200mV, and then insert a white subject and R, G, and B filters and measure the difference
between Y signal lines for the same field (∆Ylw, ∆Ylr, ∆Ylg, ∆Ylb [mV]). Substitute the values into the
following formula.
Lci = (∆Yli/200) × 100 [%] (i = w, r, g, b)
11. Lag
Adjust the Y signal output value generated by strobe light to 200mV. After setting the strobe light so that it
strobes with the following timing, measure the residual signal (Ylag). Substitute the value into the following
formula.
Lag = (Ylag/200) × 100 [%]
FLD
V1
Light
Strobe light
timing
Y signal output 200mV
Output
– 11 –
Ylag (lag)
RG
Hφ1
Hφ2
XV4
XSG2
XV3
XSG1
XV1
XV2
XSUB
13
12
11
8
9
10
22/20V
14
7
15
16
5
6
17
4
CXD1267AN
18
3
22/16V
0.1
1/20V
100k
1/35V
8
7
ICX409
(BOTTOM VIEW)
6
5
4
3
2
1
0.1
100k
Vφ4
19
Vφ3
Hφ1
Hφ2
16 15 14 13 12 11 10
NC
2
Vφ1
Vφ2
φRG
20
GND
VL
1
NC
φSUB
15V
NC
GND
VOUT
– 12 –
9
VDD
Drive Circuit
3.3/20V
0.01
2200p
3.9k
2SK523
100
3.3/16V
1M
CCD OUT
–7.0V
ICX409AK
ICX409AK
Spectral Sensitivity Characteristics (excludes both lens characteristics and light source characteristics)
1.0
Ye
0.9
Cy
G
0.8
Relative Response
0.7
0.6
0.5
Mg
0.4
0.3
0.2
0.1
0
400
450
550
500
600
650
700
Wave Length [nm]
Sensor Readout Clock Timing Chart
V1
2.6
V2
Odd Field
V3
V4
1.5
33.6
2.6 2.6 2.6
0.2
V1
V2
Even Field
V3
V4
Unit : µs
– 13 –
– 14 –
CCD
OUT
V4
V3
V2
V1
HD
BLK
VD
FLD
581
582
625
1
2
3
4
5
620
Drive Timing Chart (Vertical Sync)
15
2 4 6
13 5
20
2 4 6
1 35
315
582
581
1 3 5
2 4 6
335
1 3 5
2 4 6
ICX409AK
340
330
325
320
310
25
10
– 15 –
SUB
V4
V3
V2
V1
RG
H2
H1
BLK
HD
30
20
10
750
752
1
3
5
745
Drive Timing Chart (Horizontal Sync)
ICX409AK
20
10
20
22
1
2
3
1
2
3
10
1
2
3
5
40
ICX409AK
Notes on Handling
1) Static charge prevention
CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following
protective measures.
a) Either handle bare handed or use non-chargeable gloves, clothes or material.
Also use conductive shoes.
b) When handling directly use an earth band.
c) Install a conductive mat on the floor or working table to prevent the generation of static electricity.
d) Ionized air is recommended for discharge when handling CCD image sensor.
e) For the shipment of mounted substrates, use boxes treated for the prevention of static charges.
2) Soldering
a) Make sure the package temperature does not exceed 80°C.
b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a ground 30W
soldering iron and solder each pin in less than 2 seconds. For repairs and remount, cool sufficiently.
c) To dismount an image sensor, do not use a solder suction equipment. When using an electric desoldering
tool, use a thermal controller of the zero cross On/Off type and connect it to ground.
3) Dust and dirt protection
Image sensors are packed and delivered by taking care of protecting its glass plates from harmful dust and
dirt. Clean glass plates with the following operation as required, and use them.
a) Perform all assembly operations in a clean room (class 1000 or less).
b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should
dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized
air is recommended.)
c) Clean with a cotton bud and ethyl alcohol if the grease stained. Be careful not to scratch the glass.
d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when
moving to a room with great temperature differences.
e) When a protective tape is applied before shipping, just before use remove the tape applied for
electrostatic protection. Do not reuse the tape.
4) Installing (attaching)
a) Remain within the following limits when applying a static load to the package. Do not apply any load more
than 0.7mm inside the outer perimeter of the glass portion, and do not apply any load or impact to limited
portions. (This may cause cracks in the package.)
AAAA AAAA AAAA
AAAA AAAA AAAA
Cover glass
50N
50N
1.2Nm
Plastic package
Compressive strength
Torsional strength
b) If a load is applied to the entire surface by a hard component, bending stress may be generated and the
package may fracture, etc., depending on the flatness of the bottom of the package. Therefore, for
installation, use either an elastic load, such as a spring plate, or an adhesive.
– 16 –
ICX409AK
c) The adhesive may cause the marking on the rear surface to disappear, especially in case the regulated
voltage value is indicated on the rear surface. Therefore, the adhesive should not be applied to this area,
and indicated values should be transferred to the other locations as a precaution.
d) The notch of the package is used for directional index, and that can not be used for reference of fixing.
In addition, the cover glass and seal resin may overlap with the notch of the package.
e) If the lead bend repeatedly and the metal, etc., clash or rub against the package, the dust may be
generated by the fragments of resin.
f) Acrylate anaerobic adhesives are generally used to attach CCD image sensors. In addition, cyanoacrylate instantaneous adhesives are sometimes used jointly with acrylate anaerobic adhesives. (reference)
5) Others
a) Do not expose to strong light (sun rays) for long periods, color filters will be discolored. When high
luminance objects are imaged with the exposure level control by electronic-iris, the luminance of the
image-plane may become excessive and discolor of the color filter will possibly be accelerated. In such a
case, it is advisable that taking-lens with the automatic-iris and closing of the shutter during the power-off
mode should be properly arranged. For continuous using under cruel condition exceeding the normal
using condition, consult our company.
b) Exposure to high temperature or humidity will affect the characteristics. Accordingly avoid storage or
usage in such conditions.
c) The brown stain may be seen on the bottom or side of the package. But this does not affect the CCD
characteristics.
d) This package has 2 kinds of internal structure. However, their package outline, optical size, and strength
are the same.
Structure A
Structure B
Package
Chip
Metal plate
(lead frame)
Cross section of
lead frame
The cross section of lead frame can be seen on the side of the package for structure A.
– 17 –
– 18 –
1.2
~
0.69
(For the first pin only)
~
2.5
8.4
GOLD PLATING
42 ALLOY
0.90g
AS-C2.2-01(E)
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
DRAWING NUMBER
M
Plastic
0.3
1.27
9.2
10.3
12.2 ± 0.1
H
PACKAGE MATERIAL
V
6.1
~
2.5
0.46
0.3
A
D
B'
C
1
8
11.6
16
9
2.5
2-R0.5
9. The notches on the bottom of the package are used only for directional index, they must
not be used for reference of fixing.
8. The thickness of the cover glass is 0.75mm, and the refractive index is 1.5.
7. The tilt of the effective image area relative to the bottom “C” is less than 50µm.
The tilt of the effective image area relative to the top “D” of the cover glass is less than 50µm.
6. The height from the bottom “C” to the effective image area is 1.41 ± 0.10mm.
The height from the top of the cover glass “D” to the effective image area is 1.94 ± 0.15mm.
5. The rotation angle of the effective image area relative to H and V is ± 1˚.
4. The center of the effective image area relative to “B” and “B'”
is (H, V) = (6.1, 5.7) ± 0.15mm.
3. The bottom “C” of the package, and the top of the cover glass “D”
are the height reference.
2. The two points “B” of the package are the horizontal reference.
The point “B'” of the package is the vertical reference.
1. “A” is the center of the effective image area.
16 pin DIP (450mil)
1.2
Unit: mm
5.7
PACKAGE STRUCTURE
B
2.5
0.5
9.5
11.4 ± 0.1
3.1
11.43
3.35 ± 0.15
1.27
3.5 ± 0.3
0˚ to 9˚
0.25
Package Outline
ICX409AK
Sony Corporation