The SN54LS07 and SN74LS17 are
obsolete and are no longer supplied.
SDLS021C − MAY 1990 − REVISED FEBRUARY 2004
D Convert TTL Voltage Levels to MOS Levels
D High Sink-Current Capability
D Input Clamping Diodes Simplify System
D
SN54LS07 . . . J PACKAGE
SN74LS07, SN74LS17 . . . D, DB, N, OR NS PACKAGE
(TOP VIEW)
1A
1Y
2A
2Y
3A
3Y
GND
Design
Open-Collector Driver for Indicator Lamps
and Relays
description/ordering information
1
14
2
13
3
12
4
11
5
10
6
9
VCC
6A
6Y
5A
5Y
4A
4Y
These hex buffers/drivers feature high-voltage
8
7
open-collector outputs to interface with high-level
circuits or for driving high-current loads. They are
also characterized for use as buffers for driving TTL inputs. The ’LS07 devices have a rated output voltage of
30 V, and the SN74LS17 has a rated output voltage of 15 V. The maximum sink current is 30 mA for the
SN54LS07 and 40 mA for the SN74LS07 and SN74LS17.
These circuits are compatible with most TTL families. Inputs are diode-clamped to minimize transmission-line
effects, which simplifies design. Typical power dissipation is 140 mW, and average propagation delay time is
12 ns.
ORDERING INFORMATION
PDIP − N
0°C
0
C to 70
70°C
C
ORDERABLE
PART NUMBER
PACKAGE†
TA
TOP-SIDE
MARKING
Tube
SN74LS07N
Tube
SN74LS07D
Tape and reel
SN74LS07DR
SOP − NS
Tape and reel
SN74LS07NSR
74LS07
SSOP − DB
Tape and reel
SN74LS07DBR
LS07
SOIC − D
SN74LS07N
LS07
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB
design guidelines are available at www.ti.com/sc/package.
logic diagram (positive logic)
1A
2A
3A
4A
5A
6A
1
2
3
4
5
6
9
8
11
10
13
12
1Y
2Y
3Y
4Y
5Y
6Y
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2004, Texas Instruments Incorporated
!"#$%! & '("")% $& ! *(+,'$%! -$%).
"!-('%& '!!"# %! &*)''$%!& *)" %/) %)"#& ! )0$& &%"(#)%&
&%$-$"- 1$""$%2. "!-('%! *"!')&&3 -!)& !% )')&&$",2 ',(-)
%)&%3 ! $,, *$"$#)%)"&.
*"!-('%& '!#*,$% %! 4565 $,, *$"$#)%)"& $") %)&%)(,)&& !%/)"1&) !%)-. $,, !%/)" *"!-('%& *"!-('%!
*"!')&&3 -!)& !% )')&&$",2 ',(-) %)&%3 ! $,, *$"$#)%)"&.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
The SN54LS07 and SN74LS17 are
obsolete and are no longer supplied.
SDLS021C − MAY 1990 − REVISED FEBRUARY 2004
schematic (each gate)
VCC
9 kΩ
1 kΩ
5 kΩ
Output
Input
2 kΩ
2 kΩ
GND
Resistor values shown are nominal.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Input voltage, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Output voltage, VO (see Notes 1 and 2): SN54LS07, SN74LS07 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 V
SN74LS17 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 V
Package thermal impedance, θJA (see Note 3): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W
DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/W
Storage temperature range,Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values are with respect to GND.
2. This is the maximum voltage that should be applied to any output when it is in the off state.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
The SN54LS07 and SN74LS17 are
obsolete and are no longer supplied.
SDLS021C − MAY 1990 − REVISED FEBRUARY 2004
recommended operating conditions (see Note 4)
SN54LS07
VCC
VIH
Supply voltage
VIL
Low-level input voltage
MIN
NOM
MAX
4.5
5
5.5
High-level input voltage
High-level output voltage
IOL
TA
Low-level output current
4.75
2
’LS07
VOH
SN74LS07
SN74LS17
MIN NOM
MAX
5
0.8
0.8
30
30
15
30
−55
125
V
V
SN74LS17
Operating free-air temperature
5.25
2
UNIT
0
V
V
40
mA
70
°C
NOTE 4: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
TEST CONDITIONS‡
PARAMETER
VIK
VCC = MIN,
II = − 12 mA
’LS07, VOH = 30 V
SN54LS07
SN74LS07
SN74LS17
MIN
MIN
MAX
UNIT
MAX
−1.5
−1.5
0.25
0.25
V
IOH
VCC = MIN,
VIH = 2 V
VOL
VCC = MIN,
VIL = 0.8 V
II
IIH
VCC = MAX,
VCC = MAX,
VI = 7 V
VI = 2.4 V
20
20
µA
IIL
ICCH
VCC = MAX,
VCC = MAX
VI = 0.4 V
−0.2
−0.2
mA
14
14
mA
45
mA
SN74LS17, VOH = 15 V
0.25
IOL = 16 mA
IOL = MAX§
0.4
0.4
0.7
0.7
1
1
ICCL
VCC = MAX
45
‡ For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
§ IOL = 30 mA for SN54 series parts and 40 mA for SN74 series parts.
mA
V
mA
switching characteristics, VCC = 5 V, TA = 25°C (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tPLH
tPHL
A
Y
TEST CONDITIONS
RL = 110 Ω,
POST OFFICE BOX 655303
CL = 15 pF
• DALLAS, TEXAS 75265
MIN
TYP
MAX
6
10
19
30
UNIT
ns
3
The SN54LS07 and SN74LS17 are
obsolete and are no longer supplied.
SDLS021C − MAY 1990 − REVISED FEBRUARY 2004
PARAMETER MEASUREMENT INFORMATION
VCC
Test
Point
VCC
RL
(see Note B)
From Output
Under Test
CL
(see Note A)
High-Level
Pulse
1.3 V
S2
LOAD CIRCUIT
FOR 3-STATE OUTPUTS
3V
Timing
Input
1.3 V
5 kΩ
Test
Point
LOAD CIRCUIT
FOR OPEN-COLLECTOR OUTPUTS
LOAD CIRCUIT
FOR 2-STATE TOTEM-POLE OUTPUTS
S1
(see Note B)
CL
(see Note A)
RL
CL
(see Note A)
RL
From Output
Under Test
VCC
From Output
Under Test
Test
Point
1.3 V
0V
tw
Low-Level
Pulse
1.3 V
tsu
Data
Input
1.3 V
VOLTAGE WAVEFORMS
PULSE DURATIONS
1.3 V
1.3 V
Output
Control
(low-level
enabling)
0V
tPLH
In-Phase
Output
(see Note D)
1.3 V
0V
3V
1.3 V
1.3 V
0V
tPZL
tPLZ
tPHL
VOH
1.3 V
1.3 V
Waveform 1
(see Notes C
and D)
VOL
tPZH
tPLH
VOH
1.3 V
1.3 V
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
≈1.5 V
1.3 V
VOL
tPHL
Out-of-Phase
Output
(see Note D)
3V
1.3 V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
3V
Input
th
Waveform 2
(see Notes C
and D)
VOL + 0.5 V
tPHZ
VOH
1.3 V
VOH − 0.5 V
≈1.5 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES, 3-STATE OUTPUTS
NOTES: A. CL includes probe and jig capacitance.
B. All diodes are 1N3064 or equivalent.
C. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
D. S1 and S2 are closed for tPLH, tPHL, tPHZ, and tPLZ; S1 is open and S2 is closed for tPZH; S1 is closed and S2 is open for tPZL.
E. Phase relationships between inputs and outputs have been chosen arbitrarily for these examples.
F. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO ≈ 50 Ω, tr ≤ 1.5 ns, tf ≤ 2.6 ns.
G. The outputs are measured one at a time, with one input transition per measurement.
Figure 1. Load Circuits and Voltage Waveforms
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
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TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
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www.ti.com/digitalcontrol
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logic.ti.com
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Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74LS07D
ACTIVE
SOIC
D
14
SN74LS07DBLE
OBSOLETE
SSOP
DB
14
SN74LS07DBR
ACTIVE
SSOP
DB
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS07DBRE4
ACTIVE
SSOP
DB
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS07DBRG4
ACTIVE
SSOP
DB
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS07DE4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS07DG4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS07DR
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS07DRE4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS07DRG4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS07N
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LS07NE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LS07NSR
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS07NSRE4
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS07NSRG4
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS17D
OBSOLETE
SOIC
D
14
TBD
Call TI
Call TI
SN74LS17N
OBSOLETE
PDIP
N
14
TBD
Call TI
Call TI
50
Green (RoHS &
no Sb/Br)
TBD
Lead/Ball Finish
CU NIPDAU
Call TI
MSL Peak Temp (3)
Level-1-260C-UNLIM
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SN74LS07DBR
SSOP
SN74LS07DR
SN74LS07NSR
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
6.6
2.5
12.0
16.0
Q1
DB
14
2000
330.0
16.4
8.2
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
SO
NS
14
2000
330.0
16.4
8.2
10.5
2.5
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74LS07DBR
SSOP
DB
14
2000
346.0
346.0
33.0
SN74LS07DR
SOIC
D
14
2500
346.0
346.0
33.0
SN74LS07NSR
SO
NS
14
2000
346.0
346.0
33.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
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• DALLAS, TEXAS 75265