TRF3701 0.6 GHz to 1.0 GHz QUADRATURE MODULATOR SLWS145 – FEBRUARY 2003 FEATURES D D D D Typical Carrier Suppression > 35 dBc Large Signal Output Differential or Single-Ended Signal Output Silicon Germanium Technology APPLICATIONS D Transmit Channel TDMA: GSM, IS-136, D D D D Edge/UMC-136 CDMA: IS-95, UMTS, CDMA2000 Wireless Local Loop Wireless LAN IEEE 802.11 LMDS, MMDS The TRF3701 is a low noise quadrature direct modulator that is capable of converting complex input signals from 0 – 300 MHz up to RF. An internal analog combiner sums the real and imaginary components of the RF outputs. This combined output can directly feed the RF pre-amp at frequencies of up to 1.0 GHz. The modulator is implemented as a double balanced mixer. An internal LO phase splitter accommodates a single LO input. functional block diagram VCC IVIN IREF +45 –45 LO Σ RFOUT 50 QVIN QREF PWD GND Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2003, Texas Instruments Incorporated PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 PRODUCT PREVIEW description TRF3701 0.6 GHz to 1.0 GHz QUADRATURE MODULATOR SLWS145 – FEBRUARY 2003 absolute maximum ratings over operating free-air temperature (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 5.5 V Input current range, II: IVIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TBD QVIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TBD IREF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TBD QREF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TBD VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TBD Total current, peak (all inputs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TBD Operating free-air temperature range, TA: TRF3701C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C TRF3701I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to 85°C Lead temperature 1, 6 mm (1/16 inch) from the case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. recommended operating conditions MIN NOM MAX UNIT Analog DC supply voltage, VCC 4.75 5 5.5 V Reference voltage, IREF, QREF 3.9 4.1 VCC–0.5 V PRODUCT PREVIEW Supplies and References Local Oscillator Input (LO) Input Frequency, f Power level (refer to specified input impedance) TBD 1000 MHz –6 6 dBm 0 300 MHz Signal Inputs (IVIN, QVIN) Input frequency range (1dB) 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TRF3701 0.6 GHz to 1.0 GHz QUADRATURE MODULATOR SLWS145 – FEBRUARY 2003 electrical characteristics, GSM 900 (925 MHz) signal performance over recommended operating conditions, VCC = 5 V, VI(IREF)=VI(QREF) = 4.1 V, ZL = 50 Ω, P(LO) = –5 dBm, single-ended input IMD IP3 (Output referred) CONDITIONS MIN I Signal: f(1) = 100 kHz, f(2) = 300 kHz, Q Signal: f(1) = 100 kHz, f(2) = 300 kHz, f(LO) = 925 MHz, VI(IVIN)=VI(QVIN) = 0.6 V, P(LO) = –5 dBm f(LO) = 925 MHz, f(1)= 100 kHz, f(2) = 300 kHz, VI(IVIN)=VI(QVIN) = 0 – 1.5 V TYP MAX UNIT 65 dBc 18 dBm 5 dBm 1–dB Intercept point (Output referred) f(LO) = 925 MHz, f(1)=100 kHz, VI(IVIN)=VI(QVIN) = 0 – 1.5 V Noise spectral density (NSD) f(LO) = 925 MHz, offset –20 Mhz, 30 kHz Resolution = .B/W, VI(IVIN)=VI(QVIN)=VI(IREF) =VI(QREF) = 4.1 V Output Power Single tone 100 kHz, IVIN =QVIN= 1.0V, I and Q signals driven in quadrature. Output Impedance P(LO) = 0, IVIN =QVIN= O/C Carrier suppression (unadjusted) Single tone 100 kHz, IVIN =QVIN= 1.0, I and Q signals driven in quadrature. P(RFOUT) = –4 dBm. 35 Sideband suppression (unadjusted) Single tone 100 kHz, IVIN =QVIN= 1.0V, I and Q signals driven in quadrature. P(RFOUT) = –4 dBm. 30 Phase error Single tone 100 kHz, IVIN =QVIN= 1.0 V, I and Q signals driven in quadrature. P(RFOUT) = –4 dBm. 1° Noise figure Single tone 100 kHz, IVIN =QVIN= 1.0 V, I and Q signals driven in quadrature 24 27 Conversion loss Single tone 100 kHz, IVIN =QVIN= 1.0 V, I and Q signals driven in quadrature. P(RFOUT) = –5 dBm 8 dB EVM Integrated across GSM 28 symbol midamble, GSM DC – 100 kHz, P(RFOUT) = –5 dBm, IVIN = QVIN = 1.0 V 2 % Modulation mask Single GSM 200 kHz carrier, 20 MHz Offset P(RFOUT) = –5 dBm –157 –5 –4 30 – j1 100 kHz offset, 30 kHz bandwidth –3.5 200 kHz offset, 30 kHz bandwidth –35 250 kHz offset, 30 kHz bandwidth –38 400 kHz offset, 30 kHz bandwidth –72 ≥ 600 kHz < 1200 kHz, 30 kHz BW –82 ≥ 1200 kHz < 1800 kHz, 30 kHz BW –85 ≥ 1800 kHz < 6000 kHz, 30 kHz BW –87 ≥ 6000 kHz, 100 kHz BW –92 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 dBm/Hz dBm Ω dBc 35 PRODUCT PREVIEW PARAMETER dB dB dBc 3 TRF3701 0.6 GHz to 1.0 GHz QUADRATURE MODULATOR SLWS145 – FEBRUARY 2003 MECHANICAL DATA RHC (S–PQFP–N16) (CUSTOM PACKAGE) 4,15 PLASTIC QUAD FLATPACK A 3,85 B ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ 4,15 3,85 16 1 PRODUCT PREVIEW PIN 1 INDEX AREA TOP AND BOTTOM 2 1,00 0,80 0,20 NOMINAL LEAD FRAME 0,08 C SEATING PLANE 0,05 0,00 C 1,65 MAX 0,80 PIN 1 CHAMBER 16 0,725 0,525 2 5 1 16 1,65 MAX 9 EXPOSED THERMAL DIE PAD 12 D 16 0,435 0,315 BOTTOM VIEW 0,10 4204353/A 05/02 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. QFN (Quad Flatpack No–Lead) Package configuration. D. The Package thermal performance may be enhanced by bonding the thermal die pad to an external thermal plane. This pad is electrically and thermally connected to the backside of the die and possibly selected ground leads. 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. 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