MF388 High Performance LED DS5468 ISSUE 1 May 2001 Ordering Information MF388 MF388 ST 12940.11 TO-46 Package 13208.11 ST Housing Note: Rated Fiber coupled power apply only on the TO-46 package, for housing options fiber coupled power is typically 10% less Description This device is designed for Ethernet 100 Mbps and Intra-Office Telecom applications and offers an excellent price/performance ratio for cost effective solutions. Its double-lens optical system results in optimum coupling of power into the fiber. TO-46 Package with Lens Optical and Electrical Characteristics - Case Temperature 25˚C Parameter Fiber-Coupled Power (Fig. 1,2 & 3) (Table 1) Symbol Min. Typ. Pfiber 40 50 Max. Unit Test Condition µW IF=50mA (Note 1) Fiber: ns IF=50mA (no bias) MHz IF=50mA 62.5/ 125µm Graded Index NA=0.275 840 nm IF=50mA Rise and Fall Time (10-90%) tr’tf 2 Bandwidth (3dBel) fc 200 250 Peak Wavelength λp 800 820 Spectral Width (FWHM) ∆λ 60 nm IF=50mA Forward Voltage (Fig. 5) VF 1.85 V IF=50mA Reverse Current IR 20 µA VR=1V Capacitance C pF VR=0V, f=1MHz 20 Note 1: Measured at the exit of 100 meters of fiber Ø4.7 Ø1.5 0.6 CASE CATHODE ANODE 14 2.5 0.4 5.4 BOTTOM VIEW The diode chip is isolated from the case All dimensions in mm 3.7 1 MF388 Absolute Maximum Ratings Parameter Symbol Limit Storage Temperature Tstg -55 to +125˚C Operating Temperature see (derating: Fig. 4) Top -40 to +85˚C Electrical Power Dissipation (derating: Fig. 4) Ptot 250 mW IF 110 mA IFRM 180 mA Reverse Voltage VR 1.5V Soldering Temperature (2mm from the case for 10sec) Tsld 260˚C Continuous Forward Current (f<10kHz) Peak Forward Current (duty cycle<50%, f>1MHz) Thermal Characteristics Parameter Symbol Min. Typ. Max. Unit Thermal Resistance-Infinite Heat Sink Rthjc 100 ˚C/W Thermal Resistance-No Heat Sink Rthja 400 ˚C/W Temperature Coefficient - Optical Power dP/dTj -0.6 %/˚C Temperature Coefficient - Wavelength dλ/dTj 0.3 nm/˚C Typical Fiber-Coupled Power Core Diameter/Cladding Diameter Numberical Aperture 2 50/125 µm 0.20 62.5/125 µm 0.275 100/140 µm 0.29 200/230 µm 0.37 20µW 50µW 100µW 140µW MF388 % % 100 100 RELATIVE FIBER-COUPLED POWER RELATIVE FIBER-COUPLED POWER r 80 60 40 r 20 c ʵm 0 Øc = 62.5ʵm 80 z 60 40 20 0 0.5 2.0 3.0 mm 0 20 z - AXIAL DISPLACEMENT OF FIBER Figure 1 60 80 100 µm Figure 2 % mW 100 MAX. ELECTRICAL POWER DISSIPATION 300 80 50% DUTY CYCLE 60 DC 40 20 HEAT SINKED 0 200 INFINITE HEAT SINK NO HEAT SINK 100 0 0 40 80 120 160 0 200 mA 50 FORWARD CURRENT 100 150¡C OPERATING TEMPERATURE Figure 3 Figure 4 mA 200 FORWARD CURRENT RELATIVE FIBER-COUPLED POWER 40 r 100 0 0 1 2 3V FORWARD VOLTAGE Figure 5 3 BOTTOM VIEW ( 10 : 1 ) SIDE VIEW 13,46`0,76 3,8 2,54 0,6 0,03 (3x) n0,45 + - 0,05 (3x) n1,17 + - 0,04 n4,7 0 R2,7 45° R0,2 max (4x) 0,3 max glass overmould (2x) R0,4 max 2` 0, 3 3, 6 1, 0 Lens n1.5`0.05 NOTES:1. All dimensions in mm. 2. General tol. ISO-2768-mK. 3. Coating: Case: Ni 1,5-2,5 µm. Header: Ni 2-3 µm / Au min 1,32 µm. Package code © Zarlink Semiconductor 2002. All rights reserved. ISSUE 1 ACN JS004 076R1 A DATE 22-MAR-03 APPRD. TD/BE Previous package codes TB Drawing type Package drawing, TO-46 with lens Title JS004076 For more information about all Zarlink products visit our Web Site at www.zarlink.com Information relating to products and services furnished herein by Zarlink Semiconductor Inc. or its subsidiaries (collectively “Zarlink”) is believed to be reliable. However, Zarlink assumes no liability for errors that may appear in this publication, or for liability otherwise arising from the application or use of any such information, product or service or for any infringement of patents or other intellectual property rights owned by third parties which may result from such application or use. Neither the supply of such information or purchase of product or service conveys any license, either express or implied, under patents or other intellectual property rights owned by Zarlink or licensed from third parties by Zarlink, whatsoever. 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