TECHNICAL DATA IN74HC157A Quad 2-Input Data Selectors/Multiplexer The IN74HC157A is identical in pin out to the LS/ALS157. The device inputs are compatible with standard CMOS outputs; with pull up resistors, they are compatible with LS/ALSTTL outputs. This device routes 2 nibbles (A or B) to a single port (Y) as determined by the Select input. The data is presented at the outputs in non inverted form. A high level on the Output Enable input sets all four Y outputs to a low level. • Outputs Directly Interface to CMOS, NMOS, and TTL • Operating Voltage Range: 2.0 to 6.0 V • Low Input Current: 1.0 µA • High Noise Immunity Characteristic of CMOS Devices ORDERING INFORMATION IN74HC157AN Plastic IN74HC157AD SOIC IZ74HC157A Chip TA = -55° to 125° C for all packages PIN ASSIGNMENT LOGIC DIAGRAM FUNCTION TABLE Inputs PIN 16 =VCC PIN 8 = GND Outputs Output Enable Select Y0-Y3 H X L L L A0-A3 L H B0-B3 X=don’t care A0-A3, B0-B3=the levels of the respective Data-Word Inputs INTEGRAL 1 IN74HC157A MAXIMUM RATINGS * Symbol Parameter Value Unit -0.5 to +7.0 V VCC DC Supply Voltage (Referenced to GND) VIN DC Input Voltage (Referenced to GND) -1.5 to VCC +1.5 V DC Output Voltage (Referenced to GND) -0.5 to VCC +0.5 V DC Input Current, per Pin ±20 mA DC Output Current, per Pin ±25 mA ±50 mA 750 500 mW -65 to +150 °C 260 °C VOUT IIN IOUT ICC DC Supply Current, VCC and GND Pins ** PD Power Dissipation in Still Air, Plastic DIP SOIC Package** Tstg Storage Temperature TL Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP or SOIC Package) * Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. ** Derating - Plastic DIP: - 10 mW/°C from 65° to 125°C SOIC Package: : - 7 mW/°C from 65° to 125°C RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN, VOUT Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage, Output Voltage (Referenced to GND) TA Operating Temperature, All Package Types tr, t f Input Rise and Fall Time (Figure 1) VCC =2.0 V VCC =4.5 V VCC =6.0 V Min Max Unit 2.0 6.0 V 0 VCC V -55 +125 °C 0 0 0 1000 500 400 ns This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range GND≤(VIN or VOUT)≤VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open. INTEGRAL 2 IN74HC157A DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND) Symbol Parameter Test Conditions VCC Guaranteed Limit Unit V 25 °C to -55°C ≤85 °C ≤125 °C VIH Minimum High-Level Input Voltage VOUT=0.1 V or VCC-0.1 V IOUT≤ 20 µA 2.0 4.5 6.0 1.5 3.15 4.2 1.5 3.15 4.2 1.5 3.15 4.2 V VIL Maximum Low -Level Input Voltage VOUT=0.1 V or VCC-0.1 V IOUT ≤ 20 µA 2.0 4.5 6.0 0.5 1.35 1.8 0.5 1.35 1.8 0.5 1.35 1.8 V VOH Minimum High-Level Output Voltage VIN=VIH or VIL IOUT ≤ 20 µA 2.0 4.5 6.0 1.9 4.4 5.9 1.9 4.4 5.9 1.9 4.4 5.9 V 4.5 6.0 3.98 5.48 3.84 5.34 3.7 5.2 2.0 4.5 6.0 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 VIN=VIH or VIL IOUT ≤ 4.0 mA IOUT ≤ 5.2 mA 4.5 6.0 0.26 0.26 0.33 0.33 0.4 0.4 VIN=VIH or VIL IOUT ≤ 4.0 mA IOUT ≤ 5.2 mA VOL Maximum Low-Level Output Voltage VIN=VIH or VIL IOUT ≤ 20 µA V IIN Maximum Input Leakage Current VIN=VCC or GND 6.0 ±0.1 ±1.0 ±1.0 µA ICC Maximum Quiescent Supply Current (per Package) VIN=VCC or GND IOUT=0µA 6.0 4.0 40 160 µA INTEGRAL 3 IN74HC157A AC ELECTRICAL CHARACTERISTICS (CL=50pF,Input t r=t f=6.0 ns) VCC Symbol Parameter Guaranteed Limit V 25 °C to -55°C ≤85°C ≤125°C Unit tPLH, t PHL Maximum Propagation Delay, Input A or B to Output Y (Figures 1and 4) 2.0 4.5 6.0 105 21 18 130 26 22 160 32 27 ns tPLH, t PHL Maximum Propagation Delay , Select to Output Y (Figures 2 and 4) 2.0 4.5 6.0 110 22 19 140 28 24 165 33 28 ns tPLH, t PHL Maximum Propagation Delay , Output Enable to Output Y (Figures 3 and 4) 2.0 4.5 6.0 100 20 17 125 25 21 150 30 26 ns tTLH, t THL Maximum Output Transition Time, Any Output (Figures 1 and 4) 2.0 4.5 6.0 75 15 13 95 19 16 110 22 19 ns - 10 10 10 pF CIN CPD Maximum Input Capacitance Power Dissipation Capacitance (Per Package) Typical @25°C,VCC=5.0 V Used to determine the no-load dynamic power consumption: PD=CPDVCC2f+ICCVCC 33 Figure 1. Switching Waveforms Figure 2. Switching Waveforms Figure 3. Switching Waveforms Figure 4. Test Circuit INTEGRAL pF 4 IN74HC157A EXPANDED LOGIC DIAGRAM INTEGRAL 5 IN74HC157A CHIP PAD DIAGRAM IZ74HC157A Pad size 0.120 x 0.120 mm (Pad size is given as per passivation layer) Thickness of chip 0,46±0,02 mm PAD LOCATION Pad No 01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16 Symbol SELECT A0 B0 Y0 A1 B1 Y1 GND Y2 B2 A2 Y3 B3 A3 OUTPUT ENABLE Vcc INTEGRAL X 0.143 0.143 0.143 0.377 0.644 0.848 1.132 1.132 1.131 1.101 1.122 0.650 0.442 0.153 0.143 0.143 Y 0.668 0.443 0.173 0.133 0.133 0.133 0.244 0.468 0.748 1.036 1.27 0.311 1.311 1.271 1.069 0.838 Pad size 0.106x0.106 0.106x0.106 0.106x0.106 0.106x0.106 0.106x0.106 0.106x0.106 0.106x0.106 0.106x0.159 0.106x0.106 0.106x0.106 0.106x0.106 0.106x0.106 0.106x0.106 0.106x0.106 0.106x0.106 0.106x0.159 6