EHP-C04/NT01H-P01/TR Received ■ MASS PRODUCTION □ PRELIMINARY □ CUSTOMER DESIGN DEVICE NO. : DHE-0000991 PAGE : 12 Revised record 1 REV. DESCRIPTION RELEASE DATE 1 New spec 2011.03.09 2 Change Format 2011.03.31 3 1. Change Color Binning 2. Change Typical Electro-Optical Characteristics Curves 2010.08.06 4 Change Luminous Flux Binning 2010.09.06 5 1.Change format 2.Change IV、CCT、VF BIN 3.Change Package Dimension 4.Change Carrier Tape Dimensions 2011.10.06 Copyright © 2010, Everlight All Rights Reserved. Release Date : 10.06.2011. Issue No: DHE-0000991 www.everlight.com DATASHEET EHP-C04/NT01H-P01/TR EHP-C04/NT01H-P01/TR MASS PRODUTION Features zSmall & compact package and with high efficiency luminous flux: 85 lm @500mA zTypical color temperature: 5700 K@500mA zOptical efficiency@500mA : 47 lm/W zESD protection up to 8KV zMoisture Sensitivity Level (MSL) Class 1 zGrouping parameter: total luminous flux, color coordinates. zRoHS compliant & Pb free. zTypical Applications zMobile Phone Camera Flash(Camera flash light /strobe light for mobile devices ) light for DV(Digital Video) application zIndoor lighting applications zSignal and symbol luminaries for orientation maker lights (e.g. steps, exit ways, etc.) zTFT backlighting zExterior and interior illumination applications zDecorative and Entertainment Lighting zExterior and interior automotive illumination zTorch 2 Copyright © 2010, Everlight All Rights Reserved. Release Date : 10.06.2011. Issue No: DHE-0000991 www.everlight.com DATASHEET EHP-C04/NT01H-P01/TR Device Selection Guide Chip Emitted Color Materials InGaN White Absolute Maximum Ratings (Tsolder pad=25℃) Parameter Symbol Rating Unit DC Forward Current (mA) IF 350 mA IPulse 1500 mA ESD Resistance VB 8000 V Reverse Voltage VR [1] V Junction Temperature TJ 125 ℃ Operating Temperature TOpr -40 ~ +85 ℃ Storage Temperature TStg -40 ~ +110 ℃ Power Dissipation (Pulse Mode) Pd 7.5 W Soldering Temperature TSol 260 ℃ Allowable Reflow Cycles n/a 2 cycles Viewing Angle(2) 2θ1/2 130 deg Peak Pulse Current (mA) (400ms : ON，3600ms : OFF) Note: 1. The C04 series LEDs are not designed for reverse bias used. 2. View angle tolerance is ± 5∘. 3. Avoid operating C04 series LEDs at maximum operating temperature exceed 1 hour. 4. All specification are assured by reliability test for 1000hr, IV degradation less than 30%. 5. All reliability items are tested under good thermal management with 1.0x 1.0 cm2 MCPCB. 6. Peak pulse current shall be applied under conditions as max duration time 400ms and max duty cycle 10%. 7. Operate LED component at maximum rating conditions continuously will cause possible permanent damage and de-rating parameters. Exercise multiple maximum rating parameters simultaneously should not be allowed. When maximum rating parameters are applied over a long period will result potential reliability issue. 3 Copyright © 2010, Everlight All Rights Reserved. Release Date : 10.06.2011. Issue No: DHE-0000991 www.everlight.com DATASHEET EHP-C04/NT01H-P01/TR JEDEC Moisture Sensitivity Soak Requirements Standard Floor Life Level 1 Time (hours) Conditions Time (hours) Conditions unlimited ≦30℃ / 85% RH 168(+5/-0) 85℃ / 85 RH Electro-Optical Characteristics (T solder pad =25ºC) Parameter Symbol Min. Typ. Max. Unit Luminous Flux(1) Фv VF 85 ---- ---4.15 lm Forward Voltage(2) (3) 70 2.95 CCT 4500 ---- 7000 K Bin Code Min. Typ. Max. Unit 2932 3235 3538 3841 2.95 3.25 3.55 3.85 ------------- 3.25 3.55 3.85 4.15 V Bin Code Min. Typ. Max. Unit F7 F8 F9 J1 J2 J3 70 80 90 100 120 140 ------------------- 80 90 100 120 140 160 lm Correlated Color Temperature V Condition IF=500mA Note: 1. Luminous flux measurement tolerance: ±10%. 2. Forward voltage measurement tolerance: ±0.1V. 3. Electric and optical data is tested at 50 ms pulse condition. Bin Range of Forward Voltage Binning Condition IF=500mA Bin Range of Luminous Intensity 4 Copyright © 2010, Everlight All Rights Reserved. Release Date : 10.06.2011. Issue No: DHE-0000991 Condition IF=500mA www.everlight.com DATASHEET EHP-C04/NT01H-P01/TR White Bin Structure 0.45 4500 5000 0.42 5700 0.39 y (1) 0.36 (2) 7000 0.33 (3) 0.30 0.27 0.27 0.30 0.33 0.36 0.39 0.42 0.45 x Notes： 1.Color Bin (1) :4550K 2.Color Bin (2) :5057K 3.Color Bin (3) :5770K White Bin Coordinate Bin CIE-X CIE-Y CCT Reference Range 4550 0.3738 0.3524 0.3440 0.3620 0.4378 0.4061 0.3420 0.3720 4500K ~ 5000K 5057 0.3300 0.3300 0.3440 0.3524 0.3200 0.3730 0.3420 0.4061 5000K ~ 5700K 5770 0.3030 0.3300 0.3300 0.3110 0.3330 0.3730 0.3200 0.2920 5700K ~ 7000K Note: 1.Color coordinates measurement allowance : ±0.01 . 2.Color bins are defined at IF=500mA and 50ms pulse operation condition. 5 Copyright © 2010, Everlight All Rights Reserved. Release Date : 10.06.2011. Issue No: DHE-0000991 www.everlight.com DATASHEET EHP-C04/NT01H-P01/TR Typical Electro-Optical Characteristics Curves Relative Spectral Distribution, IF=500mA@50ms, Tsolder pad =25℃ Relative Intensity(a.u.) 1 .0 0 .8 0 .6 0 .4 0 .2 0 .0 4 0 0 5 0 0 6 0 0 7 0 0 Typical Radiation Patterns 8 0 0 ) W a v e le n g th ( n m Typical Polar Radiation Pattern for Lambertian X axis Y axis 0.8 Relative Intensity(a.u.) Relativety Luminous intensity 1.0 -15 1.2 -30 0 15 30 1.0 -45 0.6 45 0.8 0.6 0.4 0.4 -75 60 75 0.2 0.2 0.0 0.0 -90 -60 -60 -30 0 30 60 -90 90 90 2q (Degree) Degree Note: 1.2θ1/2 is the off axis angle from lamp centerline where the luminous intensity is 1/2 of the peak value. 2.View angle tolerance is ± 5∘. 6 Copyright © 2010, Everlight All Rights Reserved. Release Date : 10.06.2011. Issue No: DHE-0000991 www.everlight.com DATASHEET EHP-C04/NT01H-P01/TR Forward Voltage vs Forward Current, T solder pad =25ºC Correlated Color Temperature(CCT) vs. Forward Current 4.8 Forward Voltage(V) 6000 Correlated Color Temperatrue(K) 5.2 4.4 4.0 3.6 3.2 5900 5800 5700 5600 5500 0 2.8 0 250 500 750 1000 1250 1500 750 1000 1250 1500 Forward Current Derating Curve, Derating based on TjMAX=125°C at torch mode 2.0 600 500 Forward Current (mA) Relative Luminous Flux(lm) 500 Forward Current(mA@50ms) Forward Current(mA@50ms) Luminous Flux vs Forward Current, T solder pad =25ºC 250 1.5 1.0 0.5 400 300 200 100 0.0 0 250 500 750 1000 1250 1500 0 0 25 Forward Current(mA@50ms) 50 75 o Solder temperature ( C) 100 Note: 1. All correlation data is tested under superior thermal management with 1.0x 1.0 cm2 MCPCB 7 Copyright © 2010, Everlight All Rights Reserved. Release Date : 10.06.2011. Issue No: DHE-0000991 www.everlight.com DATASHEET EHP-C04/NT01H-P01/TR Package Dimension 0.3 -0.05/+0 0.3 1,64 Optical center 2,04 0.75 Chip position Top view 1,64 0,25 1,1 Optical center 1,45 0,5 Anode pad Cathode pad 0,125 Note: 1.Dimensions are in millimeters. 2.Tolerances unless mentioned are ± 0.1mm. 8 Copyright © 2010, Everlight All Rights Reserved. Release Date : 10.06.2011. Issue No: DHE-0000991 www.everlight.com DATASHEET EHP-C04/NT01H-P01/TR Moisture Resistant Packing Materials Label Explanation ‧CPN: Customer Specification (when required) ‧P/N: Everlight Production Number ‧QTY: Packing Quantity ‧CAT: Luminous Flux (Brightness) Bin ‧HUE: Color Bin ‧REF: Forward Voltage Bin ‧LOT No: Lot Number Carrier Tape Dimensions: Loaded Quantity 2000 pcs Per Reel Progress Direction Polarity Note: 1.Dimensions are in millimeters. 2.Tolerances unless mentioned are ± 0.1mm. 9 Copyright © 2010, Everlight All Rights Reserved. Release Date : 10.06.2011. Issue No: DHE-0000991 www.everlight.com DATASHEET EHP-C04/NT01H-P01/TR Reel Dimensions Note: 1.Dimensions are in millimeters. Moisture Resistant Packing Process 10 Copyright © 2010, Everlight All Rights Reserved. Release Date : 10.06.2011. Issue No: DHE-0000991 www.everlight.com DATASHEET EHP-C04/NT01H-P01/TR Reflow Soldering Characteristics Soldering and Handling 1. Over-current-proof Though EHP-C04 series has conducted ESD protection mechanism, customers must not use the device in reverse and should apply resistors for extra protection. Otherwise, slight voltage shift may cause enormous current shift and burn out failure would happen 2. Storage i. ii. iii. iv. 3. Do not open the moisture-proof bag before the products are ready to use. Before opening the package, the LEDs should be stored at temperature less than 30°C and less and relative humidity less than 90%. After opening the package, the LEDs should be stored at temperature less than 30°C and relative humidity less than 85%. If the moisture absorbent material (silicone gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be implemented based on the following conditions: Pre-curing at 60±5°C for 24 hours. Thermal Management i. ii. iii. For maintaining the high flux output and achieving reliability, EHP-C04 series LEDs should be mounted on a metal core printed circuit board (MCPCB), with proper thermal connection to dissipate approximately 1W to 5W of thermal energy under normal operation. Sufficient thermal management must be conducted, or the die junction temperature will be over the limit under large electronic driving and LEDs lifetime will decrease critically When operating , the solder pad temperature ( or the board temperature nearby the LED) must be controlled under 70℃. 4. Soldering Condition 4.1 Soldering Pad 11 Copyright © 2010, Everlight All Rights Reserved. Release Date : 10.06.2011. Issue No: DHE-0000991 www.everlight.com DATASHEET EHP-C04/NT01H-P01/TR 4.2 For Reflow Process i. Lead reflow soldering temperature profile ii. iii. iv. Reflow soldering should not be done more than two times. While soldering, do not put stress on the LEDs during heating. After soldering, do not warp the circuit board. 12 Copyright © 2010, Everlight All Rights Reserved. Release Date : 10.06.2011. Issue No: DHE-0000991 www.everlight.com