FORYARD FYLS

SMD
FYLS
FYLS-1206UWC
1206UWC
Radiation pattern.
Features:
Compatible with automatic placement equipment
Compatible with reflow solder process.
Applications:
Automotive-Telecommumication
Indicators
LCD Back-lights
Illuminations
Relative Lumionous Intensity(LOP @max=1)
Descriptions:
Dice material: InGaN.
Emitting Color: White
Lens Color: Yellow Diffused
Absolute maximun ratings(Ta=25゜
ratings(Ta=25゜с)
Parameter
MAX.
Unit
Power Dissipation
70
mW
Peak Forward Current (1/10 Duty Cycle, 0.1ms Pulse
Width)
Continuous Forward Current
100
mA
25
mA
Derating Linear From 25℃
0.4
mA/℃
Operating Temperature Range
-30℃ to +80℃
Storage Temperature Range
-40℃ to +100℃
260℃ for 5 Seconds
Lead Soldering Temperature[4mm(.157”) From Body]
Electrical and optical characteristics(Ta=25゜
characteristics(Ta=25゜с)
Parameter
Luminous Intensity
Viewing Angle
Symbol
Min.
Typ.
Max.
Unit
IV
--
70
--
mcd
2θ1/2
130
140
150
Deg
x
0.29
y
0.29
Forward Voltage
VF
3.5
Reverse Current
IR
Chromaticity coordinate
Test Condition
IF=20mA
4.2
V
10
µA
VR=5V
SMD
Typical Electrical Characteristics Curves
(25゜
(25゜с Ambient
Ambient Temperature Unless Otherwise Noted)
Reduance
Normalized Response
Spectral
Wave Length(nm)
y
t
i
s
n
e
t
n
i
s
u
o
n
i
m
u
L
e
v
i
t
a
l
e
R
t
n
e
r
r
u
c
d
r
a
w
r
o
F
s
v
Forward Current Vs
Forward Voltage
0
.
3
Forward Current(mA)
50
y
t
i
s
n
e
t
n
I
e
v
i
t
a
l
e
R
40
30
20
10
2.5
)
1
=
A
m
0
2
@
p
o
L
(
2.0
1.5
1.0
0.5
0
3.3
3.1
3.5
3.7
3.9
4.1
4.3
4.5
0
4.7
10
40
30
20
)
A
m
(
F
I
t
n
e
r
r
u
C
d
r
a
w
r
o
F
2.9
0
5
0
2.7
Forward Voltage(V)
.
s
V
e
r
yu
t
t
ia
s
r
ne
ep
t
m
ne
I
T
st
un
oe
n
i
ib
m
um
LA
Forward Current Derating Curve
0
4
C
i
S
/
N
a
G
n
I
0
3
O3
l2
A
/
N
a
G
n
I
0
2
0 0
1
Forward Current(mA)
0
5
0
9
0
8
0
7
0
6
0
5
0
4
0
3
0
2
0
1
0
C)
Relative Luminous Intensity
0
6
Ambient Temperature TA(
2.5
2.0
1.5
1.0
0.5
0
-40
-20
0
20
40
Ambient Temperature TA( C )
80
100
SMD
Precautions For Use
Over-current-proof
Customer must apply resistors for protection,otherwise slight voltage shift will cause big
current chang(Burn out will happen)
Storage
1. The operation of temperature and R.H are:5゜с ---30゜с,R.H.60% Max.
2. Once the package is opened ,the products should be used within a week. Otherwise,they
Should be kept in a dampproof box with desccating regent.Considering the tape life,we
Suggest our customers to use our products within 1.5year (form production date).
3. It’s recommended to bake before soldering when the package is unsealed after 72hrs.The
Condition is: 60゜с
±5゜с
for 15 hrs.
Soldering Iron:
Temperature at tip of iron:300゜с Max.(25W Max)
Soldering time:3±1sec.
Reflow Temp./Time:
Temp./Time:
Temperature
Time
SMD
Package
Package Dimensions of Device
l
a
n
i
m
r
e
T
g
n
i
r
e
d
l
o
S
1.6
0.6
1.5
3.2
LED Die
2.0
2.0
Cathode Mark
PCB
1.6
1.5
2.0
1.5
Resin
1.1
0.8
0.5
0.6
Unit:mm
Tape Specification:3000pcs Per Reel.
Packing Size
Item
W
P1
E
F
D0
D1
P0
Unit
Spec.
8.00
4.00
1.75
3.50
1.50
1.00
4.00
mm
Tolerance
±0.20
±0.10
±0.10
±0.05
+0.1/-0
±0.05
±0.05
mm
Item
10P0
P2
A0
B0
K0
T
Unit
Spec.
40.00
2.00
1.85
3.45
1.27
0.22
mm
Tolerance
±0.20
±0.05
±0.10
±0.10
±0.10
±0.05
mm
Cathode
P2
P0
K0
E
A'
F
D0
W
D1
5°
A0
P1
t
A'
SEC:A-A'
Package Dimensions of Reel:
Reel:
sb
?
? 13.5± 0.2
? 178± 1.0
0
/
5
.
0
+
0
6
9.0±0.1
12.0±0.15
Unit:mm
SMD
Packing and Shipping Spec.
L1
sb
W1
sb
Zip-lock
Desiccant
Antistatic
Bag
Desiccant
Spec.
Spec.
Spec.
203.0.
198.0
Unit:mm
)
s
c
p
(
Y
T
'
Q
5
.
1
1
*
9
1
*
0
3
:
)
m
c
(
n
o
i
s
n
e
m
i
D
x
o
B
.
O
N
T
R
A
P
10 Reels per box
CARTON
Dimension(cm):39*32*38
)
s
c
p
(
Y
T
'
Q
R
E
B
M
U
N
T
R
A
P
S
G
K S
G
K M
C
8
3
*
1
3
*
8
3
W
W :
S
.
G .
N A
E
M
C/NO
6 Boxes/Carton
0603B/0603/0805:
4000pcs*10reels*6boxs
0805B/1206B/1206/1210/1204/:
3000pcs*10Reels*6boxs*
1311:2000pcs*10Reels*6boxs
SMD