SMD FYLS FYLS-0603B 0603BUWC Radiation pattern. Features: Compatible with automatic placement equipment Compatible with reflow solder process. Applications: Automotive-Telecommumication Indicators LCD Back-lights Illuminations Relative Lumionous Intensity(LOP @max=1) Descriptions: Dice material: InGaN. Emitting Color: White Lens Color: Water clear Absolute maximun ratings(Ta=25゜ ratings(Ta=25゜с) Parameter MAX. Unit Power Dissipation 70 mW Peak Forward Current (1/10 Duty Cycle, 0.1ms Pulse Width) Continuous Forward Current 100 mA 20 mA Derating Linear From 25℃ 0.4 mA/℃ Operating Temperature Range -30℃ to +80℃ Storage Temperature Range -40℃ to +100℃ 260℃ for 5 Seconds Lead Soldering Temperature[4mm(.157”) From Body] Electrical and optical characteristics(Ta=25゜ characteristics(Ta=25゜с) Parameter Luminous Intensity Viewing Angle Symbol Min. IV 2θ1/2 Typ. 150 120 130 x 0.29 y 0.30 Forward Voltage VF 2.9 Reverse Current IR Chromaticity coordinate Max. Unit Test Condition mcd 140 Deg IF=20mA 3.8 V 10 µA VR=5V SMD Typical Electrical Characteristics Curves (25゜ (25゜с Ambient Temperature Temperature Unless Otherwise Noted) Reduance Normalized Response Spectral Wave Length(nm) y t i s n e t n i s u o n i m u L e v i t a l e R t n e r r u c d r a w r o F s v Forward Current Vs Forward Voltage 0 . 3 Forward Current(mA) 50 y t i s n e t n I e v i t a l e R 40 30 20 10 2.5 ) 1 = A m 0 2 @ p o L ( 2.0 1.5 1.0 0.5 0 3.3 3.1 3.5 3.7 3.9 4.1 4.3 4.5 0 4.7 10 40 30 20 ) A m ( F I t n e r r u C d r a w r o F 2.9 0 5 0 2.7 Forward Voltage(V) . s V e r yu t t ia s r ne ep t m ne I T st un oe n i ib m um LA Forward Current Derating Curve 0 4 C i S / N a G n I 0 3 O3 l2 A / N a G n I 0 2 0 0 1 Forward Current(mA) 0 5 0 9 0 8 0 7 0 6 0 5 0 4 0 3 0 2 0 1 0 C) Relative Luminous Intensity 0 6 Ambient Temperature TA( 2.5 2.0 1.5 1.0 0.5 0 -40 -20 0 20 40 Ambient Temperature TA( C ) 80 100 SMD Precautions For Use Over-current-proof Customer must apply resistors for protection,otherwise slight voltage shift will cause big current chang(Burn out will happen) Storage 1. The operation of temperature and R.H are:5゜с ---30゜с,R.H.60% Max. 2. Once the package is opened ,the products should be used within a week. Otherwise,they Should be kept in a dampproof box with desccating regent.Considering the tape life,we Suggest our customers to use our products within 1.5year (form production date). 3. It’s recommended to bake before soldering when the package is unsealed after 72hrs.The Condition is: 60゜с ±5゜с for 15 hrs. Soldering Iron: Temperature at tip of iron:300゜с Max.(25W Max) Soldering time:3±1sec. Reflow Temp./Time: Temp./Time: Temperature Time SMD Package Dimensions of Device Soldering Terminal 0.2 0.8 0.3 Cathode Mark 0.8 1.0 0.6 1.6 1.2 LED Die 1.0 PCB 0.7 0.8 0.8 Resin 0.4 0.3 0.6 0.3 Unit:mm Tape Specification:3000pcs Per Reel. Item W P1 E F D0 D1 P0 Unit Spec. 8.00 4.00 1.75 3.50 1.50 0.5 4.00 mm Tolerance ±0.20 ±0.10 ±0.10 ±0.05 +0.1/-0 ±0.05 ±0.05 mm Item 10P0 P2 A0 B0 K0 T Unit Spec. 40.00 2.00 0.95 1.80 0.60 0.20 mm Tolerance ±0.20 ±0.05 ±0.10 ±0.10 ±0.10 ±0.05 mm Cathode P2 P0 K0 E A' F D0 B0 W D1 5° P1 A0 t A' SEC:A-A' 13.5±0.2 178±1.0 60+0.5/-0 Package Dimensions of Reel: 12±0.15 9±0.1 Unit:mm SMD Packing and Shipping Spec. L1 sb W1 sb Zip-lock Desiccant Antistatic Bag Spec. Spec. Spec. 203.0. 198.0 Unit:mm ) s c p ( Y T ' Q Box Dimension(cm):30 * 19* 11.5 Desiccant . O N T R A P 10 Reels per box CARTON Dimension(cm):39*32*38 6boxs/carton 0603B/0603/0805: 4000pcs*10Reels*6boxs S G K S G K M C 8 3 * 1 3 * 8 3 W W : S . G . N A E M C/NO 0805B/1206B/1206 1210/1204: 3000pcs*10Reels*6boxs* 3528:2000pcs*10Reels*6boxs 5050:1000pcs*8Reels*6boxs