HMC451 v01.1007 LINEAR & POWER AMPLIFIERS - CHIP 3 Typical Applications Features The HMC451 is ideal for use as a driver amplifier for: Gain: 22 dB • Point-to-Point Radios Saturated Output Power: +22 dBm @ 24% PAE • Point-to-Multi-Point Radios & VSAT Output IP3: +30 dBm • Test Equipment & Sensors Single Positive Supply: +5V @ 127 mA • LO Driver for HMC Mixers 50 Ohm Matched Input/Output • Military & Space Small Size: 1.35 x 1.35 x 0.1 mm Functional Diagram General Description The HMC451 is a general purpose GaAs PHEMT MMIC Medium Power Amplifier which operates between 5 and 20 GHz. The amplifier provides 22 dB of gain, +22 dBm of saturated power and 24% PAE from a +5V supply. Consistent gain and output power across the operating band make it possible to use a common driver/LO amplifier approach in multiple radio bands. The HMC451 amplifier can easily be integrated into Multi-Chip-Modules (MCMs) due to its small (1.82mm2) size, single supply operation and DC blocked I/Os. All data is tested with the chip in a 50 Ohm test fixture connected via 0.025mm (1 mil) diameter wire bonds of minimal length <0.31mm (<12 mils). Electrical Specifi cations, TA = +25° C, Vdd1, Vdd2 = +5V Parameter Min. Frequency Range Gain Typ. Max. Min. 5 - 15 19 Gain Variation Over Temperature 22 0.03 Typ. Max. Min. 15 - 18 17 0.04 20 0.03 15 0.04 Typ. Max. Units 18 - 20 GHz 18 dB 0.03 0.04 dB/ °C Input Return Loss 14 11 8 dB Output Return Loss 16 11 8 dB 20 dBm Output Power for 1 dB Compression (P1dB) 17 20 17 20 17 Saturated Output Power (Psat) 22 21 21 dBm Output Third Order Intercept (IP3) 32 30 30 dBm Noise Figure 7 Supply Current (Idd) 3 - 22 GaAs PHEMT MMIC MEDIUM POWER AMPLIFIER, 5 - 20 GHz 127 6 150 127 6.5 150 127 dB 150 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com mA HMC451 v01.1007 GaAs PHEMT MMIC MEDIUM POWER AMPLIFIER, 5 - 20 GHz Broadband Gain & Return Loss Gain vs. Temperature 28 25 20 24 5 S21 S11 0 S22 3 20 -5 16 12 +25C +85C -55C -10 8 -15 -20 4 -25 0 -30 3 5 7 9 11 13 15 17 19 21 23 4 25 6 8 Input Return Loss vs. Temperature 12 14 16 18 20 22 Output Return Loss vs. Temperature 0 0 -5 RETURN LOSS (dB) +25C +85C -55C -5 RETURN LOSS (dB) 10 FREQUENCY (GHz) FREQUENCY (GHz) -10 -15 -20 -10 -15 -20 -25 +25C +85C -55C -30 -35 -25 -40 4 6 8 10 12 14 16 18 20 22 4 6 8 FREQUENCY (GHz) 14 16 18 20 22 18 20 22 Output Psat vs. Temperature 28 28 24 24 20 20 Psat (dBm) P1dB (dBm) 12 FREQUENCY (GHz) Output P1dB vs. Temperature 16 +25C +85C -55C 12 10 16 12 8 8 4 4 0 LINEAR & POWER AMPLIFIERS - CHIP 10 GAIN (dB) RESPONSE (dB) 15 +25C +85C -55C 0 4 6 8 10 12 14 16 FREQUENCY (GHz) 18 20 22 4 6 8 10 12 14 16 FREQUENCY (GHz) For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 3 - 23 HMC451 v01.1007 GaAs PHEMT MMIC MEDIUM POWER AMPLIFIER, 5 - 20 GHz Power Compression @ 10 GHz Power Compression @ 20 GHz Pout (dBm), GAIN (dB), PAE (%) 28 24 20 Pout (dBm) Gain (dB) PAE (%) 16 12 8 4 0 -20 -18 -16 -14 -12 -10 -8 -6 -4 -2 2 4 20 16 12 8 4 0 -18 6 -14 -10 -6 -2 2 6 INPUT POWER (dBm) Output IP3 vs. Temperature Noise Figure vs. Temperature 38 11 10 9 NOISE FIGURE (dB) IP3 (dBm) 34 30 26 +25C +85C -55C 22 8 7 6 5 4 3 +25C +85C -55C 2 1 18 0 4 6 8 10 12 14 16 18 20 22 4 6 8 FREQUENCY (GHz) 24 -10 23 -20 ISOLATION (dB) 0 22 21 14 16 18 20 22 +25C +85C -55C -30 -40 -50 Gain P1dB Psat 19 12 Reverse Isolation vs. Temperature 25 20 10 FREQUENCY (GHz) Gain & Power vs. Supply Voltage @ 10 GHz 18 4.5 -60 -70 5 Vdd SUPPLY VOLTAGE (V) 3 - 24 0 Pout (dBm) Gain (dB) PAE (%) 24 INPUT POWER (dBm) GAIN (dB), P1dB (dBm), Psat (dBm) LINEAR & POWER AMPLIFIERS - CHIP 3 Pout (dBm), GAIN (dB), PAE (%) 28 5.5 4 7 10 13 16 19 FREQUENCY (GHz) For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 22 HMC451 v01.1007 GaAs PHEMT MMIC MEDIUM POWER AMPLIFIER, 5 - 20 GHz Typical Supply Current vs. Vdd Drain Bias Voltage (Vdd) +5.5 Vdc Vdd (V) Idd (mA) RF Input Power (RFIN)(Vdd = +5Vdc) +10 dBm +4.5 125 Channel Temperature 175 °C +5.0 127 +5.5 129 Continuous Pdiss (T= 85 °C) (derate 13 mW/°C above 85 °C) 1.2 W Thermal Resistance (channel to die bottom) 75 °C/W Storage Temperature -65 to +150 °C Operating Temperature -55 to +85 °C Note: Amplifi er will operate over full voltage ranges shown above ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS Outline Drawing Die Packaging Information [1] Standard Alternate GP-2 (Gel Pack) [2] [1] Refer to the “Packaging Information” section for die packaging dimensions. [2] For alternate packaging information contact Hittite Microwave Corporation. 3 LINEAR & POWER AMPLIFIERS - CHIP Absolute Maximum Ratings NOTES: 1. ALL DIMENSIONS ARE IN INCHES [MM] 2. DIE THICKNESS IS .004” 3. TYPICAL BOND PAD IS .004” SQUARE 4. BACKSIDE METALLIZATION: GOLD 5. BOND PAD METALLIZATION: GOLD 6. BACKSIDE METAL IS GROUND. 7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS. 8. OVERALL DIE SIZE ± .002 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 3 - 25 HMC451 v01.1007 GaAs PHEMT MMIC MEDIUM POWER AMPLIFIER, 5 - 20 GHz Pad Descriptions Pad Number Function Description 1 RFIN This pad is AC coupled and matched to 50 Ohms. 2, 3 Vdd1, Vdd2 Power Supply Voltage for the amplifier. External bypass capacitors of 100 pF and 0.1 μF are required. 4 RFOUT This pad is AC coupled and matched to 50 Ohms. Interface Schematic LINEAR & POWER AMPLIFIERS - CHIP 3 3 - 26 Assembly Diagram For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC451 v01.1007 GaAs PHEMT MMIC MEDIUM POWER AMPLIFIER, 5 - 20 GHz Mounting & Bonding Techniques for Millimeterwave GaAs MMICs 50 Ohm Microstrip transmission lines on 0.127mm (5 mil) thick alumina thin film substrates are recommended for bringing RF to and from the chip (Figure 1). If 0.254mm (10 mil) thick alumina thin film substrates must be used, the die should be raised 0.150mm (6 mils) so that the surface of the die is coplanar with the surface of the substrate. One way to accomplish this is to attach the 0.102mm (4 mil) thick die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (Figure 2). 0.102mm (0.004”) Thick GaAs MMIC Wire Bond 3 0.076mm (0.003”) RF Ground Plane Microstrip substrates should be brought as close to the die as possible in order to minimize bond wire length. Typical die-to-substrate spacing is 0.076mm to 0.152 mm (3 to 6 mils). 0.127mm (0.005”) Thick Alumina Thin Film Substrate Figure 1. Handling Precautions Follow these precautions to avoid permanent damage. Storage: All bare die are placed in either Waffle or Gel based ESD protective containers, and then sealed in an ESD protective bag for shipment. Once the sealed ESD protective bag has been opened, all die should be stored in a dry nitrogen environment. Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid cleaning systems. Static Sensitivity: strikes. 0.102mm (0.004”) Thick GaAs MMIC Wire Bond 0.076mm (0.003”) RF Ground Plane Follow ESD precautions to protect against ESD Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize inductive pickup. 0.150mm (0.005”) Thick Moly Tab 0.254mm (0.010”) Thick Alumina Thin Film Substrate Figure 2. General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. The surface of the chip may have fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers. Mounting The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conductive epoxy. The mounting surface should be clean and flat. Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 °C and a tool temperature of 265 °C. When hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be 290 °C. DO NOT expose the chip to a temperature greater than 320 °C for more than 20 seconds. No more than 3 seconds of scrubbing should be required for attachment. LINEAR & POWER AMPLIFIERS - CHIP The die should be attached directly to the ground plane eutectically or with conductive epoxy (see HMC general Handling, Mounting, Bonding Note). Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule. Wire Bonding Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package or substrate. All bonds should be as short as possible <0.31mm (12 mils). For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 3 - 27