HMC493LP3 / 493LP3E v04.0507 FREQUENCY DIVIDERS & DETECTORS - SMT 6 SMT GaAs HBT MMIC DIVIDE-BY-4, DC - 18 GHz Typical Applications Features Prescaler for DC to 18 GHz PLL Applications: Ultra Low SSB Phase Noise: -150 dBc/Hz • Point-to-Point / Multi-Point Radios Very Wide Bandwidth • VSAT Radios Output Power: -4 dBm • Fiber Optic Single DC Supply: +5V • Test Equipment 3x3 mm QFN SMT Package • Military Functional Diagram General Description The HMC493LP3 & HMC493LP3E are low noise Divide-by-4 Static Dividers utilizing InGaP GaAs HBT technology packaged in leadless 3x3 mm QFN surface mount plastic packages. This device operates from DC (with a square wave input) to 18 GHz input frequency from a single +5V DC supply. The low additive SSB phase noise of -150 dBc/Hz at 100 kHz offset helps the user maintain excellent system noise performance. Electrical Specifi cations, TA = +25° C, 50 Ohm System, Vcc= +5V Parameter Conditions Maximum Input Frequency Minimum Input Frequency Input Power Range Output Power Reverse Leakage SSB Phase Noise (100 kHz offset) Output Transition Time Min. Typ. 18 18.5 Sine Wave Input. [1] Max. GHz 0.2 0.5 GHz Fin = 2 to 12 GHz -20 -15 +10 dBm Fin = 12 to 14 GHz -20 -15 +3 dBm Fin = 14 to 16 GHz -20 -15 0 dBm Fin = 16 to 18 GHz -15 -10 0 dBm Fin = 0.5 to 18 GHz -7 -4 dBm Both RF Outputs Terminated 55 dB Pin = 0 dBm, Fin = 6 GHz -150 dBc/Hz Pin = 0 dBm, Fout = 882 MHz 100 pSec 96 mA Supply Current (Icc1 + Icc2) 1. Divider will operate down to DC for square-wave input signal 6 - 124 Units For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC493LP3 / 493LP3E v04.0507 SMT GaAs HBT MMIC DIVIDE-BY-4, DC - 18 GHz 20 10 10 Recommended Operating Window -10 -20 0 Min Pin +25C Max Pin +25C Min Pin +85C Max Pin +85C Min Pin -40C Max Pin -40C -10 -20 -30 -30 0 2 4 6 8 10 12 14 16 18 20 0 2 4 6 INPUT FREQUENCY (GHz) 8 10 12 14 16 18 20 INPUT FREQUENCY (GHz) SSB Phase Noise Performance, Pin= 0 dBm, T= 25 °C Output Power vs. Temperature 0 0 SSB PHASE NOISE (dBc/Hz) OUTPUT POWER (dBm) -20 -2 -4 -6 +25C +85C -40C -8 -10 0 4 8 12 16 -40 -60 -80 -100 -120 -140 -160 2 10 20 3 4 10 INPUT FREQUENCY (GHz) 6 10 7 10 10 OFFSET FREQUENCY (Hz) Output Harmonic Content, Pin= 0 dBm, T= 25 °C Reverse Leakage, Pin= 0 dBm, T= 25 °C 0 0 Both Output Ports Terminated One Output Port Terminated -10 OUTPUT LEVEL (dBm) -10 OUTPUT LEVEL (dBm) 5 10 FREQUENCY DIVIDERS & DETECTORS - SMT 20 0 6 Input Sensitivity Window vs. Temperature INPUT POWER (dBm) INPUT POWER (dBm) Input Sensitivity Window, T= 25 °C -20 -30 -40 Pfeedthru 2nd Harmonic 3rd Harmonic -20 -30 -40 -50 -60 -70 -50 -80 0 2 4 6 8 10 12 14 INPUT FREQUENCY (GHz) 16 18 20 0 2 4 6 8 10 12 14 16 18 20 INPUT FREQUENCY (GHz) For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 6 - 125 HMC493LP3 / 493LP3E v04.0507 Output Voltage Waveform, Pin= 0 dBm, Fout= 882 MHz, T= 25 °C Absolute Maximum Ratings 500 300 AMPLITUDE (mV) FREQUENCY DIVIDERS & DETECTORS - SMT 6 SMT GaAs HBT MMIC DIVIDE-BY-4, DC - 18 GHz 100 -100 -300 -500 22.7 23.1 23.5 23.9 24.3 24.7 RF Input (Vcc = +5V) +13 dBm Supply Voltage (Vcc1, Vcc2) +5.5V Channel Temperature (Tc) 135 °C Continuous Pdiss (T = 85 °C) (derate 11.9 mW/° C above 85 °C) 593 mW Thermal Resistance (RTH) (junction to ground paddle) 84 °C/W Storage Temperature -65 to +150 °C Operating Temperature -40 to +85 °C ESD Sensitivity (HBM) Class 1A Typical Supply Current vs. Vcc TIME (nS) Vcc1, Vcc2 (V) ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS Icc (mA) 4.75 84 5.0 96 5.25 108 Note: Divider will operate over full voltage range shown above Outline Drawing NOTES: 1. LEADFRAME MATERIAL: COPPER ALLOY 2. DIMENSIONS ARE IN INCHES [MILLIMETERS] 3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE 4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM. PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM. 5. PACKAGE WARP SHALL NOT EXCEED 0.05mm. 6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND. 7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED LAND PATTERN. Package Information Part Number Package Body Material Lead Finish MSL Rating HMC493LP3 Low Stress Injection Molded Plastic Sn/Pb Solder MSL1 HMC493LP3E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 Package Marking [3] [1] 493 XXXX [2] 493 XXXX [1] Max peak reflow temperature of 235 °C [2] Max peak reflow temperature of 260 °C [3] 4-Digit lot number XXXX 6 - 126 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC493LP3 / 493LP3E v04.0507 SMT GaAs HBT MMIC DIVIDE-BY-4, DC - 18 GHz Pin Number Function Description 1, 4-9, 12, 13, 16 N/C No connection. 2 IN RF Input must be DC blocked. 3 IN RF Input 180° out of phase with pin 2 for differential operation. AC ground for single ended operation. 10 OUT Divided Output. 11 OUT Divided output 180° out of phase with pin 10. 14, 15 Vcc1, Vcc2 Supply voltage 5V ± 0.25V. Connect both pins to +5V supply. GND Ground: Backside of package has exposed metal ground slug which must be connected to RF/DC ground. Interface Schematic For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com FREQUENCY DIVIDERS & DETECTORS - SMT 6 Pin Description 6 - 127 HMC493LP3 / 493LP3E v04.0507 FREQUENCY DIVIDERS & DETECTORS - SMT 6 Evaluation PCB List of Materials for Evaluation PCB 107384 [1] Item Description J1 - J3 PCB Mount SMA RF Connector J4, J5 DC Pin C2 - C5 100 pF Capacitor, 0402 Pkg. C6 1000 pF Capacitor, 0603 Pkg. C1 2.2 uF Tantalum Capacitor U1 HMC493LP3 / HMC493LP3E Divide-by-2 PCB [2] 107197 Eval Board [1] Reference this number when ordering complete evaluation PCB [2] Circuit Board Material: Rogers 4350 6 - 128 SMT GaAs HBT MMIC DIVIDE-BY-4, DC - 18 GHz The circuit board used in the final application should use RF circuit design techniques. Signal lines should have 50 ohm impedance while the package ground leads and backside ground slug should be connected directly to the ground plane similar to that shown. A sufficient number of via holes should be used to connect the top and bottom ground planes. The evaluation circuit board shown is available from Hittite upon request. This evaluation board is designed for single ended input testing. J2 and J3 provide differential output signals. For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC493LP3 / 493LP3E v04.0507 SMT GaAs HBT MMIC DIVIDE-BY-4, DC - 18 GHz 6 FREQUENCY DIVIDERS & DETECTORS - SMT Application Circuit For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 6 - 129