HT46R01T3/HT48R01T3 8-Bit OTP MCU with RF Transmitter Features MCU Features · MCU Operating voltage: fSYS= 4MHz: 2.2V~3.6V fSYS= 8MHz: 3.0V~3.6V · Power Down modes and wake-up functions to reduce power consumption · Oscillator types - External high frequency Crystal - External RC - Internal RC - External low frequency crystal - Watchdog Timer Internal RC Oscillator · Three operational modes: Normal, Slow, Sleep · Fully integrated internal 4MHz, 8MHz oscillator requires no external components · OTP Program Memory: 1K´15 · RAM Data Memory: 96´8 · Watchdog Timer function · All instructions executed in one or two instruction cycles · Table read instructions · 63 powerful instructions · 6-level subroutine nesting · Bit manipulation instruction · Low voltage reset function · 16-pin NSOP package type · Up to 8 bidirectional I/O lines · 4 channel 12-bit ADC · 1 channel 8-bit PWM · External interrupt input shared with an I/O line · Two 8-bit programmable Timer/Event Counter with overflow interrupt and prescaler · Time-Base function · Programmable Frequency Divider - PFD RF Transmitter Features Rev. 1.30 · Complete UHF ASK/OOK transmitter · Frequency range 300MHz to 450MHz · Data rates more than 10k bps · Output Power up to 10dBm · Low voltage operation - down to 2.2V · Data tracking function for power saving · Reference clock output for MCU IRC clock synchronisation 1 November 23, 2010 HT46R01T3/HT48R01T3 8-Bit OTP MCU with RF Transmitter General Description These devices provide a combination of a fully featured MCU plus an RF transmitter function, giving them great flexibility for use in wide range of wireless I/O control applications such as industrial control, consumer products, subsystem controllers, etc. Analog features include a multi-channel 12-bit A/D converter. Multiple and extremely flexible Timer/Event Counters provide full timing functions. Protective features such as an internal Watchdog Timer and Low Voltage Reset coupled with excellent noise immunity and ESD protection ensure that reliable operation is maintained in hostile electrical environments. An extensive choice of oscillator functions are provided including a fully integrated system oscillator which requires no external components for its implementation. The ability to operate and switch dynamically between a range of operating modes using different clock sources gives users the ability to optimise microcontroller operation and minimise power consumption. The devices also include flexible I/O programming features Time-Base functions and a range of other features. The RF transmitter is a high performance and easy to use transmitter operating in the 300MHz to 450MHz frequency band. One only needs to add a crystal reference frequency, and a limited number of external components to create a complete and versatile RF transmitter system. The device is capable of delivering more than +9dBm into a 50W load. Such a power level enables a small form factor transmitter to operate near the maximum limit of the transmission regulations. The device can operate with ASK - Amplitude Shift Keying, and OOK - On-Off Keying, UHF receiver types from wide-band super-regenerative radios to narrow-band, high performance super-heterodyne receivers. The data rate is higher than 10kbps, allowing the device to support more complicated control protocols. For enhanced power saving, the device includes a data tracking function. The data tracking function enables the PLL to be activated as long as high transient data input trigger signals are received. The PLL will also be automatically switched off if there are no data input transients for a time exceeding approximately 300ms. As there is a reference clock input on line PB0, the MCU can use its internal RC clock rather than using an additional crystal for the system clock. These features add up to ensure that the devices can offer excellent capabilities in terms of functionality and power-saving as well as being highly cost effective in a huge range of remote wireless applications Selection Guide Part No. Program Data Memory Memory I/O 8-bit Timer Time Base RF Transmitter A/D PWM ¾ ¾ HT48R01T3 1K´15 96´8 9 2 1 Ö HT46R01T3 1K´15 96´8 9 2 1 Ö Rev. 1.30 2 12-bit´4 8-bit´1 Stack Package 6 16NSOP 6 16NSOP November 23, 2010 HT46R01T3/HT48R01T3 8-Bit OTP MCU with RF Transmitter Block Diagram The following block diagram illustrates the dual-chip structure of the devices, where an individual MCU and RF Transmitter devices are combined into a single package. V A V D D D D P B 1 /D O U T P A 0 /A N 0 P A O U T R F M o d u le P A 1 /P F D /A N 1 P A 2 /T M R 0 /A N 2 H T 4 6 R 0 1 B H T 4 8 R 0 1 B P A 3 /IN T /A N 3 P A 4 /P W M /T M R 1 P B 1 D IN P B 0 C R E F X O U T X IN E N P A 5 /O S C 2 P A 6 /O S C 1 P A 7 /R E S V S S A V S S Internal Chip Interconnection Diagram Note: The PWM and AN0~AN3 shared-pin functions only exist in the HT46R01T3 device. L o w V o lta g e R e s e t P W M D r iv e r P F D D r iv e r R F T r a n s m itte r W a tc h d o g T im e r I/O P o rts R e s e t C ir c u it 8 - b it R IS C M C U C o re In te rru p t C o n tr o lle r E x te rn a l R C /X T O s c illa to r A /D C o n v e rte r T im e r s T im e B a s e In te rn a l O s c illa to r Note: The PWM and A/D Converter functions only exist in the HT46R01T3 device. Rev. 1.30 3 November 23, 2010 HT46R01T3/HT48R01T3 8-Bit OTP MCU with RF Transmitter Pin Assignment P B 1 /D O U T 1 1 6 P A 4 /P W M /T M R 1 P B 1 /D O U T 1 1 6 P A 4 /T M R 1 P A 3 /IN T /A N 3 2 1 5 P A 5 /O S C 2 P A 3 /IN T 2 1 5 P A 5 /O S C 2 P A 2 /T M R 0 /A N 2 3 1 4 P A 6 /O S C 1 P A 2 /T M R 0 3 1 4 P A 6 /O S C 1 P A 1 /P F D /A N 1 4 1 3 P A 7 /R E S P A 1 /P F D 4 1 3 P A 7 /R E S P A 0 /A N 0 5 1 2 V D D P A 0 5 1 2 V D D V S S 6 1 1 X O U T V S S 6 1 1 X O U T A V S S 7 1 0 X IN A V S S 7 1 0 X IN P A O U T 8 9 P A O U T 8 9 A V D D A V D D H T 4 8 R 0 1 T 3 1 6 N S O P -A H T 4 6 R 0 1 T 3 1 6 N S O P -A Pin Description HT46R01T3 Pin Name Function OPT I/T PA0 PAPU PAWK ST AN0 ADCR AN PA1 PAPU PAWK ST CMOS General purpose I/O. Register enabled pull-up and wake-up. PFD CTRL0 ¾ CMOS PFD output AN1 ADCR AN PA2 PAPU PAWK ST TC0 ¾ ST ¾ External Timer 0 clock input AN2 ADCR AN ¾ A/D channel 2 PA3 PAPU PAWK ST INT ¾ ST ¾ External interrupt input AN3 ADCR AN ¾ A/D channel 3 PA4 PAPU PAWK ST TC1 ¾ ST PWM CTRL0 ¾ CMOS PWM output PA5 PAPU PAWK ST CMOS General purpose I/O. Register enabled pull-up and wake-up. OSC2 CO ¾ PA6 PAPU PAWK ST OSC1 CO OSC PA7 PAWK ST RES CO ST PA0/AN0 PA1/PFD/AN1 PA2/TMR0/AN2 PA3/INT/AN3 PA4/TMR1/PWM PA5/OSC2 PA6/OSC1 PA7/RES Rev. 1.30 O/T Description CMOS General purpose I/O. Register enabled pull-up and wake-up. ¾ ¾ A/D channel 0 A/D channel 1 CMOS General purpose I/O. Register enabled pull-up and wake-up. CMOS General purpose I/O. Register enabled pull-up and wake-up. CMOS General purpose I/O. Register enabled pull-up and wake-up. ¾ OSC External Timer 1 clock input Oscillator pin CMOS General purpose I/O. Register enabled pull-up and wake-up. ¾ Oscillator pin NMOS General purpose I/O. Register enabled wake-up. ¾ Reset input 4 November 23, 2010 HT46R01T3/HT48R01T3 8-Bit OTP MCU with RF Transmitter Pin Name Function OPT I/T O/T Description General purpose I/O. Register enabled pull-up. CMOS Internally connected to DIN pin on RF module. Must be setup as output for interfacing to RF module. PB1 PBPU ST DOUT ¾ ¾ ¾ PAOUT ¾ ¾ NSO RF power amplifier output XOUT ¾ ¾ HXT RF chip crystal pin XIN XIN ¾ HXT ¾ RF chip crystal pin VDD VDD ¾ PWR ¾ MCU power supply PB1/DOUT PAOUT XOUT Data output from MCU to RF module Connected internally to PB1 VSS ¾ PWR ¾ MCU ground AVDD AVDD ¾ PWR ¾ RF chip power supply AVSS AVSS ¾ PWR ¾ RF chip ground VSS Note: I/T: Input type O/T: Output type OPT: Optional by configuration option (CO) or register option PWR: Power CO: Configuration option ST: Schmitt Trigger input CMOS: CMOS output NSO: Non-standard output HT48R01T3 Pin Name PA0 Function OPT I/T PA0 PAPU PAWK ST CMOS General purpose I/O. Register enabled pull-up and wake-up. PA1 PAPU PAWK ST CMOS General purpose I/O. Register enabled pull-up and wake-up. PFD CTRL0 ¾ CMOS PFD output PA2 PAPU PAWK ST CMOS General purpose I/O. Register enabled pull-up and wake-up. TC0 ¾ ST PA3 PAPU PAWK ST INT ¾ ST PA4 PAPU PAWK ST TC1 ¾ ST PA5 PAPU PAWK ST OSC2 CO ¾ PA6 PAPU PAWK ST OSC1 CO OSC PA1/PFD PA2/TMR0 PA3/INT PA4/TMR1 PA5/OSC2 PA6/OSC1 Rev. 1.30 O/T ¾ Description External Timer 0 clock input CMOS General purpose I/O. Register enabled pull-up and wake-up. ¾ External interrupt input CMOS General purpose I/O. Register enabled pull-up and wake-up. ¾ External Timer 1 clock input CMOS General purpose I/O. Register enabled pull-up and wake-up. OSC Oscillator pin CMOS General purpose I/O. Register enabled pull-up and wake-up. ¾ Oscillator pin 5 November 23, 2010 HT46R01T3/HT48R01T3 8-Bit OTP MCU with RF Transmitter Pin Name Function OPT I/T PA7 PAWK ST RES CO ST PB1 PBPU ST DOUT ¾ ¾ ¾ PAOUT ¾ ¾ NSO RF power amplifier output XOUT ¾ ¾ HXT RF chip crystal pin XIN XIN ¾ HXT ¾ RF chip crystal pin VDD VDD ¾ PWR ¾ MCU power supply VSS VSS ¾ PWR ¾ MCU ground AVDD AVDD ¾ PWR ¾ RF chip power supply AVSS AVSS ¾ PWR ¾ RF chip ground PA7/RES PB1/DOUT PAOUT XOUT Note: O/T Description NMOS General purpose I/O. Register enabled wake-up. ¾ Reset input General purpose I/O. Register enabled pull-up. CMOS Internally connected to DIN pin on RF module. Must be setup as output for interfacing to RF module. Data output from MCU to RF module Connected internally to PB1 I/T: Input type O/T: Output type OPT: Optional by configuration option (CO) or register option PWR: Power CO: Configuration option ST: Schmitt Trigger input CMOS: CMOS output NSO: Non-standard output Internally Connected Pins In addition to the internal connection between MCU pin, PB1, and RF Transmitter pin, DIN, the MCU pin, PB0, and RF Transmitter pin, CREF, are also internally connected. However it should be noted that PB0/CREF is not connected to any external pins on the device package. Pin Name Function OPT I/T O/T PB0 PBPU ST CMOS CREF ¾ ¾ ¾ PB0/CREF Rev. 1.30 Description General Purpose I/O. Register enabled pull-high resistor. Internally connected to CREF pin on RF module. Must be setup as an input for interfacing to RF module. Not available on package. RF Transmitter generated pulses for synchronisation. Connected internally to PB0. Not available on package. 6 November 23, 2010 HT46R01T3/HT48R01T3 8-Bit OTP MCU with RF Transmitter D.C. Characteristics Ta=25°C Test Conditions Symbol Parameter Min. Typ. Max. Unit fSYS=4MHz 2.2 ¾ 3.6 V fSYS=8MHz 3.3 ¾ 3.6 V 2.0 ¾ 3.6 V VDD VDD Operating Voltage ¾ Conditions AVDD RF Transmitter Power Supply ¾ IDD1 Operating current (Crystal OSC, RC OSC) 3V No load, fSYS=4MHz, ADC disable ¾ 1 2 mA IDD2 Operating Current (internal RC+RTC OSC, Normal Mode) 3V No load, fSYS=4MHz, ADC disable ¾ 1 2 mA ISTB1 Standby Current (WDT OSC on, RTC off) 3V No load, system HALT ¾ ¾ 5 mA ISTB2 Standby Current (WDT OSC off, RTC off) 3V No load, system HALT ¾ ¾ 1 mA ISTB3 Standby Current (WDT OSC off, RTC on) 3V No load, system HALT, RTC osc slowly start-up ¾ ¾ 5 mA VIL1 Input Low Voltage for PA, PB, TMR0, TMR1, INT ¾ ¾ 0 ¾ 0.3VDD V VIH1 Input High Voltage for PA, PB, TMR0, TMR1, INT ¾ ¾ 0.7VDD ¾ VDD V VIL2 Input Low Voltage (RES) ¾ ¾ 0 ¾ 0.4VDD V VIH2 Input High Voltage (RES) ¾ ¾ 0.9VDD ¾ VDD V VLVR1 Low Voltage Reset 1 ¾ Configuration option=2.1V 1.98 2.10 2.22 V VLVR2 Low Voltage Reset 2 ¾ Configuration option=3.15V 2.98 3.15 3.32 V IOL I/O Port Sink Current for PA, PB 3V VOL=0.1VDD 4 8 ¾ mA IOH I/O Port Source Current for PA, PB 3V VOH=0.9VDD -2 -4 ¾ mA RPH Pull-high Resistance for I/O 20 60 100 kW Rev. 1.30 ¾ ¾ 3V 7 November 23, 2010 HT46R01T3/HT48R01T3 8-Bit OTP MCU with RF Transmitter A.C. Characteristics Ta=25°C Test Conditions Symbol Parameter Min. Typ. Max. Unit -10% 4/8 +10% MHz 2.2V~3.6V 0 ¾ 4000 kHz 3.3V~3.6V 0 ¾ 8000 kHz VDD fHIRC System Clock (HIRC) 3V fTIMER Timer Input Frequency (TCn) ¾ Conditions Ta= -40°C~85°C tWDTOSC Watchdog Oscillator Period 3V ¾ 45 90 180 ms tRES External Reset Low Pulse Width ¾ ¾ 1 ¾ ¾ ms tSST System Start-up Time Period ¾ ¾ 1024 ¾ tSYS tINT Interrupt Pulse Width ¾ ¾ 1 ¾ ¾ ms tLVR Low Voltage Width to Reset ¾ ¾ 0.25 1.00 2.00 ms Note: Wake-Up from HALT 1. tSYS=1/fSYS 2. *For fERC, as the resistor tolerance will influence the frequency a precision resistor is recommended. A/D Converter Electrical Characteristics Ta=25°C Test Conditions Symbol Parameter Min. Typ. Max. Unit 2.7 ¾ 3.6 V 0 ¾ VADC/ VREF V TBD (TBC) ¾ VADC +0.1 V VREF=VADC=VDD, tAD=0.5ms -2 ¾ 2 LSB -4 ¾ 4 LSB 3V VREF=VADC=VDD, tAD=0.5ms (calculated on best-fit line) 3V No load, tAD=0.5ms ¾ 0.5 ¾ mA 0.5 ¾ 10 ms VDD VADC A/D Operating Voltage ¾ VADI A/D Converter Input Voltage ¾ VREF A/D Converter Input reference Voltage Range ¾ DNL A/D Converter Differential Non-Linearity A/D Converter Integral Non-Linearity INL 2.7V 3V 2.7V Conditions VREF=VADC ¾ VADC=3V IADC Additional Power Consumption if A/D Converter is Used tAD A/D Converter Clock Period 2.7V~ 3.6V tADC A/D Converter Sampling Time (see note) 2.7V~ 12-bit ADC 3.6V ¾ 16 ¾ tAD tON2ST A/D Converter on to ADC Start 2.7V~ 3.6V 2 ¾ ¾ ms Note: ¾ ¾ ADC conversion time (tAD)= n (bits ADC) + 4 (sampling time), the conversion for each bit needs one ADC clock(tAD). Rev. 1.30 8 November 23, 2010 HT46R01T3/HT48R01T3 8-Bit OTP MCU with RF Transmitter RF Transmitter Electrical Characteristics Specifications apply for AVDD=3.0V, Ta = 25°C, Freq X¢tal OSC=13.560MHz, DATA is transmitting. Bold values indicate -20°C to 70°C unless otherwise noted. 1kbps data rate 50% duty cycle. RL 50W load (matched) Test Conditions Symbol Parameter Min. Typ. Max. Unit @315MHz, POUT=+10dBm ¾ 12.5 ¾ mA @433.92MHz ¾ 12.5 ¾ mA @315MHz ¾ 3.0 ¾ mA @433.92 MHz ¾ 3.0 ¾ mA @315MHz ¾ 1.0 ¾ mA @433.92 MHz ¾ 1.0 ¾ mA @315MHz * ¾ 9.5 ¾ dBm @433.92MHz * ¾ 9.5 ¾ dBm @630MHz, 2nd harm ¾ -48 ¾ dBc @945MHz, 3rd harm ¾ -60 ¾ dBc @867.84MHz, 2nd harm ¾ -45 ¾ dBc @1301.76MHz, 3rd harm ¾ -55 ¾ dBc AVDD II Data High Current IO Data Low Current ISTB EN Low & DIN Low Current Conditions 3V 3V 3V RF and Crystal Output power level Harmonics output for 315 MHz Harmonics Output for 433.92MHz Note: 3.3V 3V 3V Extinction Ratio for ASK 10Kbps 3V ¾ ¾ 70 ¾ dBc Data Rate 3V ¾ 10 ¾ ¾ kbps @315MHz ¾ kHz 3V ¾ <900 Occupied Bandwidth @433.92MHz ¾ <1000 ¾ kHz 100kHz from Carrier ¾ -78 ¾ dBc/Hz 1000kHz from Carrier ¾ -77 ¾ dBc/Hz 100kHz from Carrier ¾ -78 ¾ dBc/Hz 1000kHz from Carrier ¾ -76 ¾ dBc/Hz 315MHz Single Side Band Phase Noise 3V 433.92MHz Single Side Band Phase Noise 3V XTLIN, XTLOUT 3V Pin capacitance ¾ 2 ¾ pF Output Blanking 3V Standby transition from low to high ** ¾ 500 ¾ ms ASK to RF Out Response Time 3V Delta between ASK input transition from Low To High to RF output transition from low to high ¾ 1 ¾ ms @315MHz ¾ Hz 3V ¾ 150 CREF Clock Output Frequency @433.92MHz ¾ 207 ¾ Hz * Depend on PC board layout ** Generally limited by crystal Rev. 1.30 9 November 23, 2010 HT46R01T3/HT48R01T3 8-Bit OTP MCU with RF Transmitter Power-on Reset Characteristics Ta=25°C Test Conditions Symbol Parameter VDD Conditions Min. Typ. Max. Unit VPOR VDD Start Voltage to Ensure Power-on Reset ¾ ¾ ¾ ¾ 100 mV RRVDD VDD raising rate to Ensure Power-on Reset ¾ ¾ 0.035 ¾ ¾ V/ms Ta=25°C, without 0.1mF between VDD and VSS 0.9 ¾ 1.5 V Ta=-40°C~85°C, without 0.1mF between VDD and VSS 0.6 ¾ 1.8 V without 0.1mF between VDD and VSS 2 ¾ ¾ ms without 0.1mF between VDD and VSS TBD ¾ ¾ ms VPOR MAX tPOR V Maximum VDD Start Voltage to Ensure Power-on Reset Power-on Reset Low Pulse Width ¾ ¾ D D tP R R O R V D D V P O R T im e Functional Description As these device packages contain different chips, for a detailed functional description, users must refer to the relevant datasheets for the related MCU. The following table shows which individual devices are inside each package. Device MCU HT48R01T3 HT48R01B HT46R01T3 HT46R01B Multi-chip Internal Devices The MCU controls the RF transmitter via a two line interface using two of its I/O pins, PB0 and PB1. Pin PB1, which should be setup as an output by the MCU, is used to generate the encoding data. Pin PB0, which should be setup as an input by the MCU, is used for synchronising purposes. There are some special considerations which need to be taken into account when using these devices. These points will be mentioned in the hardware and software consideration sections. Hardware Considerations As these devices are composed of an individual MCU and RF Transmitter, using them together requires the user to take care of some special points. Rev. 1.30 10 November 23, 2010 HT46R01T3/HT48R01T3 8-Bit OTP MCU with RF Transmitter Absolute Maximum Ratings The Absolute Maximum Ratings must be checked for discrepancies and the necessary care taken in device handling and usage. Power Supply Examination of the block diagram will reveal that the Power Supply and Ground pins of the RF Transmitter and MCU are independent and must be connected together if they are to share the same power supply. If the same power supply is to be used for both chips then care must be taken as both have different power supply requirements. When calculating the total current consumption of the device, the internal DC specification currents for the MCU and RF parts must be added together. The RF data to be transmitted is derived from the PB1 line. When the PB1 line is high the device will transmit allowing users to program their encoded data on this line. If the RF transmitter is in its standby mode then there will be a delay of about 500ms before transmission begins. When the device is transmitting, a synchronising signal will be generated on the CREF/PB0 pin which allows the MCU to use it to calibrate its internal RC oscillator. To avoid the RF circuits entering an unknown state, pin PB1 should be setup as an output as soon as possible after power-on. To minimise power consumption, only when PB1 is high, can the RF signal be transmitted and the reference clock on PB0 be generated. If no data transitions are generated on PB1 for 300~500ms, the transmitter will enter a standby state and the RF circuits will be switched off along with the internal PLL to save power. The signal generated on the CREF/PB0 line will also remain at a low level. The internal PLL function is used to generate the RF frequency with a multiplier of 32 times the crystal frequency. The relationship is: RF frequency = 32 ´ Crystal frequency. Therefore a 9.84375MHz crystal will generate an RF frequency of 315MHz and a13.56MHz crystal will generate an RF frequency of 433.92MHz. All PLL circuits are contained within the device and the only external component required is a suitable crystal. Power Down and Wake up It is important to note that if the MCU is powered down or placed into a low power mode to conserve power, that the RF Transmitter may continue running and will consume a certain amount of power. Before powering down the MCU it is important to carefully manage the PB1 pin to ensure the RF-Transmitter enters its power down state. Programming Considerations As MCU lines PB0 and PB1 are used to control the RF transmitter function, care must be taken to manage these lines correctly in the application program. As line PB1 is used to send data to the RF circuitry this line must be setup as an output. To avoid erroneous operation of the RF circuits this line should be setup as an output immediately after power-on. The PB0 pin on the MCU is used to receive synchronising pulses from the RF circuits and should therefore be setup as an input. As the MCU will be powered down independently of the RF Transmitter Peripheral Module, care must be taken to ensure that the MCU first clears its PB1 line to zero before powering down. This will allow the RF Transmitter Peripheral Module to enter its standby state and thus keep power consumption to a minimum. Rev. 1.30 11 November 23, 2010 HT46R01T3/HT48R01T3 8-Bit OTP MCU with RF Transmitter Application Circuits Note: 1. 9.84375MHz crystal used for RF frequency of 315MHz 13.56MHz crystal used for RF frequency of 433.92MHz 2. The extra LC filter on the PAOUT pin can reduce second harmonics 3. The L and C values shown in brackets are for 433.92MHz Rev. 1.30 12 November 23, 2010 HT46R01T3/HT48R01T3 8-Bit OTP MCU with RF Transmitter Package Information 16-pin NSOP (150mil) Outline Dimensions 1 6 A 9 B 8 1 C C ' G H D E = F MS-012 Symbol Nom. Max. A 0.228 ¾ 0.244 B 0.150 ¾ 0.157 C 0.012 ¾ 0.020 C¢ 0.386 ¾ 0.402 D ¾ ¾ 0.069 E ¾ 0.050 ¾ F 0.004 ¾ 0.010 G 0.016 ¾ 0.050 H 0.007 ¾ 0.010 a 0° ¾ 8° Symbol A Rev. 1.30 Dimensions in inch Min. Dimensions in mm Min. Nom. Max. 5.79 ¾ 6.20 B 3.81 ¾ 3.99 C 0.30 ¾ 0.51 C¢ 9.80 ¾ 10.21 D ¾ ¾ 1.75 E ¾ 1.27 ¾ F 0.10 ¾ 0.25 G 0.41 ¾ 1.27 H 0.18 ¾ 0.25 a 0° ¾ 8° 13 November 23, 2010 HT46R01T3/HT48R01T3 8-Bit OTP MCU with RF Transmitter Reel Dimensions D T 2 A C B T 1 SOP 16N (150mil) Symbol Description Dimensions in mm A Reel Outer Diameter 330.0±1.0 B Reel Inner Diameter 100.0±1.5 C Spindle Hole Diameter D Key Slit Width T1 Space Between Flange T2 Reel Thickness Rev. 1.30 13.0 +0.5/-0.2 2.0±0.5 16.8 +0.3/-0.2 22.2±0.2 14 November 23, 2010 HT46R01T3/HT48R01T3 8-Bit OTP MCU with RF Transmitter Carrier Tape Dimensions P 0 D P 1 t E F W B 0 C D 1 P K 0 A 0 R e e l H o le IC p a c k a g e p in 1 a n d th e r e e l h o le s a r e lo c a te d o n th e s a m e s id e . SOP 16N (150mil) Symbol Description Dimensions in mm W Carrier Tape Width 16.0±0.3 P Cavity Pitch 8.0±0.1 E Perforation Position 1.75±0.1 F Cavity to Perforation (Width Direction) 7.5±0.1 D Perforation Diameter 1.55 +0.10/-0.00 D1 Cavity Hole Diameter 1.50 +0.25/-0.00 P0 Perforation Pitch 4.0±0.1 P1 Cavity to Perforation (Length Direction) 2.0±0.1 A0 Cavity Length 6.5±0.1 B0 Cavity Width 10.3±0.1 K0 Cavity Depth 2.1±0.1 t Carrier Tape Thickness 0.30±0.05 C Cover Tape Width 13.3±0.1 Rev. 1.30 15 November 23, 2010 HT46R01T3/HT48R01T3 8-Bit OTP MCU with RF Transmitter Holtek Semiconductor Inc. (Headquarters) No.3, Creation Rd. II, Science Park, Hsinchu, Taiwan Tel: 886-3-563-1999 Fax: 886-3-563-1189 http://www.holtek.com.tw Holtek Semiconductor Inc. (Taipei Sales Office) 4F-2, No. 3-2, YuanQu St., Nankang Software Park, Taipei 115, Taiwan Tel: 886-2-2655-7070 Fax: 886-2-2655-7373 Fax: 886-2-2655-7383 (International sales hotline) Holtek Semiconductor Inc. (Shenzhen Sales Office) 5F, Unit A, Productivity Building, No.5 Gaoxin M 2nd Road, Nanshan District, Shenzhen, China 518057 Tel: 86-755-8616-9908, 86-755-8616-9308 Fax: 86-755-8616-9722 Holtek Semiconductor (USA), Inc. (North America Sales Office) 46729 Fremont Blvd., Fremont, CA 94538, USA Tel: 1-510-252-9880 Fax: 1-510-252-9885 http://www.holtek.com Copyright Ó 2010 by HOLTEK SEMICONDUCTOR INC. The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek assumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable without further modification, nor recommends the use of its products for application that may present a risk to human life due to malfunction or otherwise. Holtek¢s products are not authorized for use as critical components in life support devices or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information, please visit our web site at http://www.holtek.com.tw. Rev. 1.30 16 November 23, 2010