HI-8585, HI-8586
ARINC 429
Line Driver
September 2011
DESCRIPTION
PIN CONFIGURATION
The HI-8585 and HI-8586 are CMOS integrated circuits
designed to directly drive the ARINC 429 bus in an 8-pin
package. Two logic inputs control a differential voltage
between the output pins producing a +10 volt One, a
-10 volt Zero, and a 0 volt Null.
The CMOS/TTL control inputs are translated to ARINC
specified amplitudes using on board band-gap reference.
A logic input is provided to control the slope of the differential output signal. Timing is set by on-chip resistor and
capacitor and tested to be within ARINC requirements.
The HI-8585 has 37.5 ohms in series with each line driver
output. The HI-8586 provides the option to bypass part of
the output resistance so that series resistance can be
used in external protection circuitry.
The HI-8585 or the HI-8586 along with the HI-8588 or the
Hi-8591 line receivers offer the smallest options available
to get on and off the ARINC bus.
TX0IN 2
7 TXBOUT
TX1IN 3
6 TXAOUT
GND 4
!
!
!
!
!
!
!
!
Direct ARINC 429 line driver interface
in a small package
On-chip band-gap reference to set
output levels
On-chip line driver slope control and
selection by logic input
Low current 12 to 15 volt supplies
CMOS / TTL logic pins
Plastic and ceramic package options surface mount and DIP
Thermally enhanced SOIC packages
5 V-
SUPPLY VOLTAGES
V+ = 12V to 15V
V- = -12V to -15V
FUNCTION TABLE
TX1IN TX0IN SLP1.5
FEATURES
8 V+
SLP1.5 1
TXAOUT
TXBOUT
SLOPE
0
0
X
0V
0V
N/A
0
1
0
-5V
5V
10ms
0
1
1
-5V
5V
1.5ms
1
0
0
5V
-5V
10ms
1
0
1
5V
-5V
1.5ms
1
1
X
0V
0V
N/A
PIN DESCRIPTION TABLE
PIN
SYMBOL
FUNCTION
DESCRIPTION
1
SLP 1.5
LOGIC INPUT
CMOS OR TTL, V+ IS OK
2
TX0IN
LOGIC INPUT
CMOS OR TTL
3
TX1IN
LOGIC INPUT
CMOS OR TTL
4
GND
POWER
GROUND
5
V-
POWER
-12 TO -15 VOLTS
6
TXAOUT
OUTPUT
LINE DRIVER TERMINAL A
7
TXBOUT
OUTPUT
LINE DRIVER TERMINAL B
8
V+
POWER
+12 TO +15 VOLTS
Industrial & extended temperature
ranges
( DS 8585 Rev. N)
HOLT INTEGRATED CIRCUITS
www.holtic.com
09/11
HI-8585, HI-8586
FUNCTIONAL DESCRIPTION
Figure 1 is a block diagram of the line driver. The +5V and
-5V levels are generated internally using a on-chip bandgap reference. Currents for slope control are set by zener
voltages across on-chip resistors.
A unity gain buffer receives the internally generated slopes
and differentially drives the ARINC line. Current is limited
by the series output resistors at each pin. There are no
fuses at the outputs of the HI-8585 as exists on the
Hi-8382.
The TX0IN and TX1IN inputs receive logic signals from a
control transmitter chip such as the HI-6010, HI-3282 or
HI-8282. TXAOUT and TXBOUT hold each side of the
ARINC bus at Ground until one of the inputs becomes a
One. If for example TX1IN goes high, a charging path is
enabled to 5V on an “A” side internal capacitor while the
“B” side is enabled to -5V. The charging current is selected by the SLP1.5 pin. If the SLP1.5 pin is high, the
capacitor is nominally charged from 10% to 90% in 1.5µs.
If SLP1.5 is low, the rise and fall times are 10µs.
5V
The HI-8585 has 37.5 ohms in series with each output and
the HI-8586 has 2 ohms in series with each output. The
HI-8586 is for applications where external series resistance is required, typically for lightning protection devices.
Both the HI-8585 and HI-8586 are built using high-speed
CMOS technology. Care should be taken to ensure the
V+ and V- supplies are locally decoupled and that the
input waveforms are free from negative voltage spikes
which may upset the chip’s internal slope control circuitry.
“A” SIDE
ONE
TXAOUT
CURRENT
CONTROL
NULL
HI-8585 = 37.5 OHMS
HI-8586 = 2 OHMS
ZERO
-5V
TX0IN
TX1IN
ESD
PROTECTION
AND
VOLTAGE
TRANSLATION
CONTROL
LOGIC
SLP1.5
5V
“B” SIDE
ONE
TXBOUT
CURRENT
CONTROL
NULL
HI-8585 = 37.5 OHMS
HI-8586 = 2 OHMS
ZERO
CONTROL
LOGIC
-5V
FIGURE 1 - LINE DRIVER BLOCK DIAGRAM
5V
1
HARDWIRED
OR
DRIVEN FROM LOGIC
{
2
8
4
APPLICATION INFORMATION
ARINC
Channel
3
Figure 2 shows a possible application
of the HI-8585/86 interfacing an ARINC
transmit channel from the HI-6010.
VCC
TESTA
ROUTA
TESTB
ROUTB
6
RXD1
7
RXD0
HI-8588
RINA
HI-6010
RINB
5
15V
1
6
ARINC
Channel
7
V+
SLP1.5
TXAOUT
TX1IN
HI-8585
TXBOUT
GND
4
8 BIT BUS
8
TX0IN
3
2
TXD1
TXD0
V-
5
-15V
FIGURE 2 - APPLICATION DIAGRAM
HOLT INTEGRATED CIRCUITS
2
HI-8585, HI-8586
RECOMMENDED OPERATING CONDITIONS
ABSOLUTE MAXIMUM RATINGS
Supply Voltages
V+.................................+11.4V to +16.5V
V-.................................. -11.4V to -16.5V
Voltages referenced to Ground
Supply voltages
V+....................................................20V
V-....................................................-20V
Temperature Range
Industrial .............-40°C to +85°C
Extended ...........-55°C to +125°C
DC current per input pin................ +10mA
Power dissipation at 25°C
plastic DIL............1.0W, derate 10mW/°C
ceramic DIL..........0.5W, derate 7mW/°C
NOTE: Stresses above absolute maximum
ratings or outside recommended operating
conditions may cause permanent damage to
the device. These are stress ratings only.
Operation at the limits is not recommended.
Solder Temperature ........275°C for 10 sec
Storage Temperature........-65°C to +150°C
DC ELECTRICAL CHARACTERISTICS
V+ = +12V to +15V, V- = -12V to -15V, T A = Operating Temperature Range (unless otherwise stated)
PARAMETERS
SYMBOL
Input voltage (TX1IN, TX0IN, SLP1.5)
high
low
VIH
VIL
Input current (TX1IN, TX0IN, SLP1.5)
source
sink
IIH
IIL
TEST CONDITIONS
VIN = 0V
VIN = 5V
MIN
TYP
MAX
UNITS
2.1
-
-
V+
0.5
volts
volts
-
-
0.1
0.1
mA
mA
10.00
-10.00
0
11.00
-9.00
0.50
volts
volts
volts
ARINC output voltage (Differential)
one
zero
null
VDIFF1
VDIFF0
VDIFFN
no load; TXAOUT - TXBOUT
9.00
no load; TXAOUT - TXBOUT -11.00
no load; TXAOUT - TXBOUT -0.50
ARINC output voltage (Ref. to GND)
one or zero
null
VDOUT
VNOUT
no load & magnitude at pin
no load
4.50
-0.25
5.00
0
5.50
0.25
volts
volts
SLP1.5 = V+
TX1IN & TX0IN = 0V: no load
TX0IN & TX1IN = 0V: no load
-14.0
6.0
-6.0
14.0
-
mA
mA
-
37.5
-
2
ohms
ohms
Operating supply current
V+
VARINC output impedence
HI-8585
HI-8586
IDD
IEE
ZOUT
HOLT INTEGRATED CIRCUITS
3
HI-8585, HI-8586
AC ELECTRICAL CHARACTERISTICS
V+ = 15.0V, V- = -15V, T A = Operating Temperature Range (unless otherwise stated)
SYMBOL
PARAMETERS
Line Driver propagation delay
TEST CONDITIONS
MIN
TYP
MAX
UNITS
-
500
500
-
ns
ns
SLP 1.5 = V+
pin 1 = logic 1
1.0
pin 1 = logic 1
1.0
1.5
1.5
2.0
2.0
µs
µs
SLP 1.5 = GND
pin 1 = logic 1
pin 1 = logic 1
5.0
5.0
10.0
10.0
15.0
15.0
µs
µs
-
-
10
pF
defined in Figure 3, no load
Output high to low
Output low to high
t phlx
t plhx
Line Driver transition times
High Speed
Output high to low
Output low to high
t fx
t rx
Low Speed
Output high to low
Output low to high
t fx
t rx
Input capacitance (1)
logic
CIN
Notes:
1. Guaranteed but not tested
5V
0V
pin 3
t phlx
t plhx
t plhx
5V
0V
pin 2
t phlx
t rx
t rx
VDIFF
pin 6 - pin 7
10V
0V
-10V
90%
10%
10%
90%
10%
t fx
t fx
FIGURE 3 - LINE DRIVER TIMING
HOLT INTEGRATED CIRCUITS
4
HI-8585, HI-8586
PACKAGE THERMAL CHARACTERISTICS
MAXIMUM ARINC LOAD 9, 10
PACKAGE STYLE 1
8 Lead Plastic DIP
8 Lead Plastic ESOIC 5
8 Lead Plastic ESOIC 6
SUPPLY CURRENT (mA) 2
JUNCTION TEMP, Tj (°C)
ARINC 429
DATA RATE
Ta = 25 C
Ta = 85 C
Ta=125 C
Ta = 25oC
Ta = 85oC
Ta=125oC
Low Speed 3
16.8
17.2
16.9
58
116
157
High Speed 4
27.3
26.7
25.9
75
132
169
Low Speed
17.4
17.5
16.9
68
126
166
High Speed
27.6
27.1
25.9
97
147
186
Low Speed
17.1
17.2
16.7
52
110
151
High Speed
27.3
27.1
26.2
57
112
157
o
o
o
TXAOUT and TXBOUT Shorted to Ground 7, 8, 9, 10
PACKAGE STYLE 1
8 Lead Plastic DIP
8 Lead Plastic ESOIC 5
8 Lead Plastic ESOIC 6
SUPPLY CURRENT (mA) 2
ARINC 429
DATA RATE
Ta = 25 C
Ta = 85 C
Ta=125 C
Ta = 25oC
Ta = 85oC
Ta=125oC
Low Speed 3
53.6
50.7
52.2
131
181
217
4
46.9
38.7
42.5
135
181
219
46.4
47.6
68.1
167
191
221
High Speed
42.1
43.8
67.1
177
212
223
Low Speed
48.5
45.6
46.1
112
161
186
High Speed
46.8
41.1
40.5
116
168
197
High Speed
Low Speed
o
o
o
JUNCTION TEMP, Tj (°C)
Notes:
1. All data taken in still air on devices soldered to single layer copper PCB (3" X 4.5" X .062").
2. At 100% duty cycle, 15V power supplies. For 12V power supplies multiply all tabulated values by 0.8.
3. Low Speed: Data Rate = 12.5 Kbps, Load: R = 400 Ohms, C = 30 nF.
4. High Speed: Data Rate = 100 Kbps, Load: R = 400 Ohms, C = 10 nF. Data not presented for C = 30 nF
as this is considered unrealistic for high speed operation.
5. 8 Lead Plastic ESOIC (Thermally enhanced SOIC with built in heat sink). Heat sink not soldered to the PCB.
6. 8 Lead Plastic ESOIC (Thermally enhanced SOIC with built in heat sink). Heat sink soldered to the PCB.
7. Similar results would be obtained with TXAOUT shorted to TXBOUT.
8. For applications requiring survival with continuous short circuit, operation above Tj = 175°C is not recommended.
9. Data will vary depending on air flow and the method of heat sinking employed.
10. Current values are per supply.
HEAT SINK - ESOIC PACKAGES
An 8-pin thermally enhanced SOIC package is used for the
HI-8585/HI-8586 products. The ESOIC package includes
a metal heat sink located on the bottom surface of the
device. This heat sink should be soldered down to the
printed circuit board for optimum thermal dissipation. The
heat sink is electrically isolated from the chip and can be
soldered to any ground or power plane. However, since
the chip’s substrate is at V+, connecting the heat sink to
this power plane is recommended to avoid coupling noise
into the circuit.
HOLT INTEGRATED CIRCUITS
5
HI-8585, HI-8586
ORDERING INFORMATION
HI - 85XX xx x x
PART
NUMBER
LEAD
FINISH
Tin / Lead (Sn / Pb) Solder
Blank
100% Matte Tin (Pb-free, RoHS compliant)
F
PART
NUMBER
TEMPERATURE
RANGE
FLOW
BURN
IN
No
I
-40°C TO +85°C
I
T
-55°C TO +125°C
T
No
M
-55°C TO +125°C
M
Yes
PART
NUMBER
PACKAGE
DESCRIPTION
PD
8 PIN PLASTIC DIP (8P)
8 PIN PLASTIC NARROW BODY ESOIC (8HNE)
8 PIN CERDIP (8D) not available Pb-free
PS
CR
PART
NUMBER
OUTPUT SERIES RESISTANCE
BUILT-IN
REQUIRED EXTERNALLY
8585
37.5 Ohms
0
8586
2 Ohms
35.5 Ohms
Legend: ESOIC - Thermally Enhanced Small Outline Package (SOIC) with built-in heat sink
HI - 8585 PS I - N
PART
NUMBER
LEAD
FINISH
Tin / Lead (Sn / Pb) Solder - No heat-sink
N
PART
NUMBER
I
-40°C TO +85°C
PART
NUMBER
PS
FLOW
BURN
IN
I
No
PACKAGE
DESCRIPTION
8 PIN PLASTIC NARROW BODY SOIC (8HN)
PART
NUMBER
8585
TEMPERATURE
RANGE
OUTPUT SERIES RESISTANCE
BUILT-IN
REQUIRED EXTERNALLY
37.5 Ohms
0
Legend: SOIC - Small Outline Package (No Heat-Sink)
HOLT INTEGRATED CIRCUITS
6
HI-8585, HI-8586
REVISION HISTORY
P/N
DS8585
Rev
Date
M
N
05/08/08
09/09/11
Description of Change
Clarified temperature ranges and added HI-8585PSI-N to Ordering Information
Replaced references of setting ARINC output levels with zener diodes to using a band-gap
reference circuit.
HOLT INTEGRATED CIRCUITS
7
HI-8585 / HI-8586 PACKAGE DIMENSIONS
8-PIN PLASTIC SMALL OUTLINE (ESOIC) - NB
(Narrow Body, Thermally Enhanced)
PIN 1
Package Type: 8HNE
Bottom View
Top View
.0085 ± .0015
(.216 ± .038)
.194 ± .004
(4.92 ± .09)
.236 ± .008
(5.99 ± .21)
inches (millimeters)
.140 ± .01
(3.56 ± .26)
.100 ± .01
(2.54 ± .25)
.154 ± .004
(3.90 ± .09)
.0165 ± .003
(.419 ± .089)
Electrically isolated metal
heat sink on bottom of
package
SEE DETAIL A
.055 ± .005
(1.397 ± .127)
Connect to any ground or
power plane for optimum
thermal dissipation
0° to 8°
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
.050 BSC
(1.27)
.0025 ± .002
(.064 ± .038)
.033 ± .017
(.838 ± .432)
DETAIL A
8-PIN PLASTIC SMALL OUTLINE (SOIC) - NB
(Narrow Body)
inches (millimeters)
Package Type: 8HN
.194 ± .004
(4.92 ± .09)
.0085 ± .0015
(.216 ± .038)
.236 ± .008
(5.99 ± .21)
PIN 1
.154 ± .004
(3.90 ± .09)
See Detail A
.0165 ± .003
(.419 ± .089)
.055 ± .005
(1.397 ± .127)
0° to 8°
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
.050 BSC
(1.27)
.0069 ± .003
(.1753 ± .074)
.033 ± .017
(.838 ± .432)
HOLT INTEGRATED CIRCUITS
8
Detail A
HI-8585 / HI-8586 PACKAGE DIMENSIONS
8-PIN PLASTIC DIP
inches (millimeters)
Package Type: 8P
.385 ±.015
(9.799 ±.381)
.250 ± .010
(6.350 ±.254)
.100
BSC
(2.54)
.300 ±.010
(7.620 ±.254)
.025 ±.010
(.635 ± .254)
.135 ±.015
(3.429 ±.381)
.1375 ±.0125
(3.493 ±.318)
.0115 ±.0035
(.292 ±.089)
.019 ±.002
(.483 ±.102)
.055 ±.010
(1.397 ±.254)
.335 ±.035
(8.509 ±.889)
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
8-PIN CERDIP
inches (millimeters)
Package Type: 8D
.380 ±.004
(9.652 ±.102)
.005 min
(.127 min)
.248 ±.003
(6.299 ±.076)
.039 ±.006
(.991 ±.154)
.100
BSC
(2.54)
.015 min
(.381min)
.200 max
(5.080 max)
.314 ±.003
(7.976 ±.076)
Base Plane
.010 ±.006
(.254 ±.152)
Seating Plane
.163 ±.037
(4.140 ±.940)
.056 ±.006
(1.422 ±.152)
.018 ±.006
(.457 ±.152)
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
HOLT INTEGRATED CIRCUITS
9
.350 ±.030
(8.890 ±.762)