HSMC DB3

HI-SINCERITY
Spec. No. :Preliminary Data
Issued Date : 1998.02.01
Revised Date : 1999.08.01
Page No. : 1/2
MICROELECTRONICS CORP.
DB3
TRIGGER DIODES (Package DO-35)
Description
High reliability glass passivation insuring parameter stability and against contamination.
Absolute Maximum Ratings (Ta=25°C)
• Maximum Temperatures
Storage Temperature ............................................................................................ -40 ~ +125 °C
Junction Temperature ........................................................................................... -40 ~ +110 °C
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C) ............................................................................... 150 mW
• Maximum Voltages and Currents
Breakover Voltage .............................................................................................................. 32 V
Breakover Voltage symmetry .............................................................................................. ±3 V
Repetitive peak on-state Current .......................................................................................... 2 A
Characteristics (Ta=25°C)
Symbol
VBO
[ |+VBO| ]-[ |-VBO| ]
IV±I
VO
IBO
tr
IB
Min.
28
5
5
-
Typ.
32
1.5
-
Max.
36
±3
50
10
Unit
V
V
V
V
uA
uS
uA
Test Conditions
C=22nF
C=22nF
I=[ IBO to IF=10mA ]
C=22nF
VB=0.5 VBO max
*Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. :Preliminary Data
Issued Date : 1998.02.01
Revised Date : 1999.08.01
Page No. : 2/2
DO-35(Glass) Dimension
E
A
B
C
D
DO-35 Glasses Package, HSMC Package Code : L
*:Typical
DIM
A
B
C
Inches
Min.
Max.
φ0.0181 φ0.0220
0.9646 1.2811
0.1200 0.1700
Millimeters
Min.
Max.
φ0.46
φ0.56
24.50
32.54
3.05
4.20
DIM
D
E
Inches
Min.
Max.
0.9646 1.2811
φ0.0602 φ0.0787
Millimeters
Min.
Max.
24.50
32.54
φ1.53
φ2.00
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory :
• Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
• Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5983621~5 Fax : 886-3-5982931
• Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5977061 Fax : 886-3-5979220
HSMC Product Specification