HI-SINCERITY Spec. No. :Preliminary Data Issued Date : 1998.02.01 Revised Date : 1999.08.01 Page No. : 1/2 MICROELECTRONICS CORP. DB3 TRIGGER DIODES (Package DO-35) Description High reliability glass passivation insuring parameter stability and against contamination. Absolute Maximum Ratings (Ta=25°C) • Maximum Temperatures Storage Temperature ............................................................................................ -40 ~ +125 °C Junction Temperature ........................................................................................... -40 ~ +110 °C • Maximum Power Dissipation Total Power Dissipation (Ta=25°C) ............................................................................... 150 mW • Maximum Voltages and Currents Breakover Voltage .............................................................................................................. 32 V Breakover Voltage symmetry .............................................................................................. ±3 V Repetitive peak on-state Current .......................................................................................... 2 A Characteristics (Ta=25°C) Symbol VBO [ |+VBO| ]-[ |-VBO| ] IV±I VO IBO tr IB Min. 28 5 5 - Typ. 32 1.5 - Max. 36 ±3 50 10 Unit V V V V uA uS uA Test Conditions C=22nF C=22nF I=[ IBO to IF=10mA ] C=22nF VB=0.5 VBO max *Pulse Test : Pulse Width ≤380us, Duty Cycle≤2% HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Spec. No. :Preliminary Data Issued Date : 1998.02.01 Revised Date : 1999.08.01 Page No. : 2/2 DO-35(Glass) Dimension E A B C D DO-35 Glasses Package, HSMC Package Code : L *:Typical DIM A B C Inches Min. Max. φ0.0181 φ0.0220 0.9646 1.2811 0.1200 0.1700 Millimeters Min. Max. φ0.46 φ0.56 24.50 32.54 3.05 4.20 DIM D E Inches Min. Max. 0.9646 1.2811 φ0.0602 φ0.0787 Millimeters Min. Max. 24.50 32.54 φ1.53 φ2.00 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory : • Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 • Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931 • Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5977061 Fax : 886-3-5979220 HSMC Product Specification