HSMC H34063

HI-SINCERITY
Spec. No. : Preliminary Data
Issued Date : 1998.08.01
Revised Date : 1999.06.01
Page No. : 1/6
MICROELECTRONICS CORP.
H34063AP
DC-TO-DC CONVERTER INTEGRATE CIRCUIT DEVICES
Description
The H34063AP Series is a monolithic control circuit containing the
primary functions required for DC-to-DC converters. These devices
consist of an internal temperature compensated reference,
comparator, controlled duty cycle oscillator with an active current
limit circuit, driver and high current output switch. This series was
specifically by Hi-Sincerity Microelectronics Corp.
Features
• 3V to 40V Input Voltage Operation
• Internal 1.6A Peak Current Switch
• Internal ±1.8% Reference
• Low Quiescent Current at 1.6mA
• Frequency Operation from 100Hz~100KHz
• Current Limiting
Applications
• Saver for Cellular Phone
• DC-DC Converter Module
Typical Application Circuit
Fig1.Saver Circuit for Cellular Phone
L1
RSC
Vin
C1
100µF
8
1
7
2
6
3
5
4
Vout
200µH
H34063AP
D1
H1N5819
Cout
220µF
CT
470ρF
RB
33kΩ
RA
5.6kΩ
HSMC Product Specification
HI-SINCERITY
Spec. No. : Preliminary Data
Issued Date : 1998.08.01
Revised Date : 1999.06.01
Page No. : 2/6
MICROELECTRONICS CORP.
Pin Connections
8
7
6
5
1
2
3
4
Pin1:Switch Collector
Pin2:Switch Emitter
Pin3:Timing Capacitor
Pin4:Gnd
Pin5:Comparator Inverting Input
Pin6:Vcc
Pin7:Ipk Sense
Pin8:Driver Collector
Absolute Maxium Rating
Supply Voltage ..................................................................................................................... 40 V
Comparator Input Voltage Range ............................................................................. -0.3V ~ 40 V
Switch Collector Voltage ...................................................................................................... 40 V
Switch Emitter Voltage ......................................................................................................... 40 V
Switch Collector to Emitter Voltage ...................................................................................... 40 V
Driver Collector Voltage ....................................................................................................... 40 V
Switch Current ..................................................................................................................... 1.6 A
Power Dissipation DIP Package Ta=25°C .......................................................................... 1.0 W
Thermal Resistance Junction To Air............................................................................ 125 °C / W
Operating Junction Temperature........................................................................................ 125 °C
Operating Ambient Temperature Range ........................................................................ 0 ~ 70 °C
Storage Temperature Range................................................................................ -40 °C ~ 125 °C
Electrical Characteristics (Vcc=5V,Ta=25°C, unless otherwise specified)
Parameter
Oscillator
Charging Current
Discharge Current
Voltage Amplitude
Discharge to Charge Current Ratio
Current Limit Sense Voltage
Output Switch
Saturation Voltage, Darlington
Connection
Saturation Voltage
Test Condition
5.0V≤VCC≤40V
5.0V≤VCC≤40V
Pin3
VIPK(Sense) =VCC
IChg=Idischg
ISW =1.0A,
VC(Driver)=VC(Switch)
ISW =1.0A,
IC(Driver)=50mA
(Forced β ≈ 20)
ISW =1.0A, VCE=5.0V
VCE=30V
DC Current Gain
Collector Off-State Current
Comparator
Threshold Voltage
0°C≤Ta≤70°C
Threshold Voltage
Threshold Voltage Line Regulation 3.0V≤VCC≤40V
Input Bias Current
VIN=0V
VIPK(Sence)=VCC
VPin5>VFB,
Supply Current
5.0V≤VCC≤40V
CT=0.0001uF,Pin2=Gnd
Remaining pins open
Symbol
Min.
Typ. Max.
Unit
Ichg
Idischg
VOSC
IDischg/Ichg
VIPK(Sence)
24
140
5.2
250
35
220
0.6
6.5
300
42
260
7.5
350
uA
uA
V
mV
VCE(Sat)
-
1.0
1.3
V
VCE(Sat)
-
0.4
0.7
V
hFE
ICC(Off)
50
-
75
0.01
100
V
UA
VFB
Regline
IIB
ICC
1.227 1.250 1.273
1.210
1.29
1.5
6
-20 -400
-
1.6
3
V
mV
nA
mA
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : Preliminary Data
Issued Date : 1998.08.01
Revised Date : 1999.06.01
Page No. : 3/6
Block Diagram
SC
Pin1:1.6A Switch Collector
Q2
DRI
Pin8:Driver Collector
Q S
Q1
R
80Ω
SE
Pin2:Darlington Switch Emitter
IPK
CT
IPK
Pin7:Highside Current Sense
Input, VCC-VIPK=300mV
Oscillator
TC
Pin3:Oscilletor Timing Capacitor
1.25V
Reference Voltage
Comparator
+
-
GND
Pin4:Power GND
VCC
Pin6:Power Supply Input
FB
Pin5:Feedback Comparator
Inverting Input
Application Information
Design Formula Table
Calculation
Step-Down
Step-Up
Voltage-Inverting
ton / toff
Vout+VF /
Vin(min) -Vsat-VOut
Vout+VF-Vin(min) /
Vin(min)-Vsat
|Vout| + VF /
Vin-Vsat
(ton + toff) max
1/Fmin
1/Fmin
1/Fmin
CT
4*10 ton
4*10 ton
4*10-5ton
IC(switch)
2*Iout(max)
2*Iout(max)(ton+toff/toff)
2*Iout(max)(ton+toff/toff)
RS
0.3 / IC(switch)
0.3 / IC(switch)
0.3 / IC(switch)
(Vin(min)-Vsat-Vout / IC(switch))
(Vin(min)-Vsat / IC(switch))
(Vin(min)-Vsat/ IC(switch))
*ton(max)
*ton(max)
*ton(max)
IC(switch)*(ton+toff) /
8VRipple(P-P)
Iout*ton / VRipple(P-P)
Iout*ton / VRipple(P-P)
L(min)
CO
-5
-5
Vsat : Saturation voltage of the output switch.
VF : Forward voltage drop of the ringback rectifier.
The following power supply characteristics must be chosen :
Vin : Nominal input voltage.
Vout : Desired output voltage. |Vout|=1.25*(1+RB/RA)
Iout - Desired output current
Fmin : Minimum desired output switching frequency at the selected values for Vin and Iout.
VRipple(P-P) : Desired peak to peak output ripple voltage in practice, the calculated value will need to be increased
due to the capacitor equivalent series resistance and board layout. The ripple voltage should be kept to a low value
since it will directly effect the line and load regulation.
HSMC Product Specification
HI-SINCERITY
Spec. No. : Preliminary Data
Issued Date : 1998.08.01
Revised Date : 1999.06.01
Page No. : 4/6
MICROELECTRONICS CORP.
Application Information (Continuos)
Fig.2 Step-Up Converter
R1
150Ω
L1
D1
200µH
H34063AP
H1N5819
RSC
0.22
Vin
C1
100µF
8
1
7
2
6
3
5
4
Vout
28V / 200mA
Cout
220µF
CT
680ρF
RB
47kΩ
RA
2.2kΩ
Line Regulation : 100mV (Vin=8V~16V, @Io=200mA)
Load Regulation : 5mV (Vin=12V, @Io=80mA~200mA)
Fig.3 Step-Up Converter With External NPN Switch
L1
R1
RSC
Vin
C1
Vout
D1
H34063AP
8
1
7
2
6
3
5
4
Q1
CT
Cout
R2
RB
RA
Fig.4 Step-Down Converter
L1
200µH
H34063AP
RSC
0.25
Vin
C1
100µF
8
1
7
2
6
3
5
4
D1
H1N5819
Vout
5V / 500mA
Cout
470µF
CT
470ρF
RB
3.6kΩ
RA
1.2kΩ
Line Regulation : 40mV (Vin=10V~20V, @Io=500mA)
Load Regulation : 5mV (Vin=15V, @Io=10mA~500mA)
Short Circuit Current : 1.3A (Vin=15V, @RL=0.1Ω
HSMC Product Specification
HI-SINCERITY
Spec. No. : Preliminary Data
Issued Date : 1998.08.01
Revised Date : 1999.06.01
Page No. : 5/6
MICROELECTRONICS CORP.
Fig.5 Step-Down Converter With External PNP Saturation Switch
H34063AP
R1
R2
RSC
Vin
8
1
7
2
6
3
5
4
Q1
L1
CT
Vout
D1
Cout
RB
C1
RA
Fig.6 Voltage Inverting Converter
H34063AP
RSC
0.25
Vin
4.5V-6V
8
1
7
2
6
3
5
4
C1
100µF
Vout
-12V / 100mA
D1 H1N5819
L1
100µH
Cout
470µF
CT
680ρF
RA
953Ω
RB
8.2kΩ
Line Regulation : 20mV (Vin=4.5V~6V, @Io=100mA)
Load Regulation : 100mV (Vin=5V, @Io=10mA~100mA)
Fig.7 Voltage Inverting Converter With External PNP Saturation Switch
H34063AP
R2
R1
RSC
Vin
8
1
7
2
6
3
5
4
Q1
L1
D1
CT
RA
Vout
C1
RB
Cout
HSMC Product Specification
HI-SINCERITY
Spec. No. : Preliminary Data
Issued Date : 1998.08.01
Revised Date : 1999.06.01
Page No. : 6/6
MICROELECTRONICS CORP.
DIP-8P Dimension
Marking :
5
6
8 7
A
2
1
3
Package Code
HSMC Logo
Part Number
Date Code
4
Ink Mark
B
J
DIP-8P Plastic Package
HSMC Package Code : P
F
E
C
I
α1 K
G
D H
M
L
*:Typical
Inches
Min.
Max.
0.2480 0.2520
0.3630 0.3670
*0.0600
*0.0500
*0.0390
0.1280 0.1320
0.1250 0.1400
DIM
A
B
C
D
E
F
G
Millimeters
Min.
Max.
6.29
6.40
9.22
9.32
*1.52
*1.27
*0.99
3.25
3.35
3.17
3.55
DIM
H
I
J
K
L
M
α1
Inches
Min.
Max.
0.0150 0.0210
0.0898 0.1098
0.2950 0.3050
*0.1181
0.3370 0.7470
0.0090 0.0150
94°
97°
Millimeters
Min.
Max.
0.38
0.53
2.28
2.79
7.49
7.74
*3.00
8.56
8.81
0.229
0.381
94°
97°
Notes : 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material :
• Lead : 42 Alloy ; solder plating
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice :
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory :
• Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
• Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5983621~5 Fax : 886-3-5982931
• Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5977061 Fax : 886-3-5979220
HSMC Product Specification