SCDS034L − JULY 1997 − REVISED OCTOBER 2003 Standard ’245-Type Pinout 5-Ω Switch Connection Between Two Ports Rail-to-Rail Switching on Data I/O Ports Ioff Supports Partial-Power-Down Mode Operation D Latch-Up Performance Exceeds 250 mA Per D JESD 17 ESD Protection Exceeds JESD 22 − 2000-V Human-Body Model (A114-A) − 200-V Machine Model (A115-A) 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC OE B1 B2 B3 B4 B5 B6 B7 B8 A1 A2 A3 A4 A5 A6 A7 A8 NC − No internal connection VCC 1 1 20 19 OE 18 B1 2 3 17 B2 16 B3 4 5 15 B4 14 B5 6 7 13 B6 12 B7 8 9 10 11 B8 NC A1 A2 A3 A4 A5 A6 A7 A8 GND NC RGY PACKAGE (TOP VIEW) DBQ, DGV, DW, OR PW PACKAGE (TOP VIEW) GND D D D D NC − No internal connection description/ordering information The SN74CBTLV3245A provides eight bits of high-speed bus switching in a standard ’245 device pinout. The low on-state resistance of the switch allows connections to be made with minimal propagation delay. The device is organized as one 8-bit switch. When output enable (OE) is low, the 8-bit bus switch is on, and port A is connected to port B. When OE is high, the switch is open, and the high-impedance state exists between the two ports. This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. The device has isolation during power off. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. ORDERING INFORMATION QFN − RGY TOP-SIDE MARKING Tape and reel SN74CBTLV3245ARGYR Tube SN74CBTLV3245ADW Tape and reel SN74CBTLV3245ADWR SSOP (QSOP) − DBQ Tape and reel SN74CBTLV3245ADBQR CBTLV3245A TSSOP − PW Tape and reel SN74CBTLV3245APWR CL245A TVSOP − DGV Tape and reel SN74CBTLV3245ADGVR SOIC − DW −40°C to 85°C ORDERABLE PART NUMBER PACKAGE† TA CL245A CBTLV3245A CL245A † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2003, Texas Instruments Incorporated !" # $%&" !# '%()$!" *!"&+ *%$"# $ " #'&$$!"# '& ",& "&# &-!# #"%&"# #"!*!* .!!"/+ *%$" '$&##0 *&# " &$&##!)/ $)%*& "&#"0 !)) '!!&"&#+ POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SCDS034L − JULY 1997 − REVISED OCTOBER 2003 FUNCTION TABLE INPUT OE FUNCTION L A port = B port H Disconnect logic diagram (positive logic) 2 A1 18 B1 SW 9 A8 11 B8 SW 19 OE simplified schematic, each FET switch A B (OE) absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V Continuous channel current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA Input clamp current, IIK (VI/O < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA Package thermal impedance, θJA (see Note 2): DBQ package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68°C/W (see Note 2): DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92°C/W (see Note 2): DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W (see Note 2): PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W (see Note 3): RGY package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. 3. The package thermal impedance is calculated in accordance with JESD 51-5. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SCDS034L − JULY 1997 − REVISED OCTOBER 2003 recommended operating conditions (see Note 4) VCC Supply voltage VIH High-level control input voltage VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V VIL Low-level control input voltage VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V MIN MAX 2.3 3.6 UNIT V 1.7 V 2 0.7 0.8 V TA Operating free-air temperature −40 85 °C NOTE 4: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP† Control inputs VIK II = −18 mA II Ioff VCC = 3.6 V, VCC = 0, VI = VCC or GND VI or VO = 0 to 3.6 V ICC ∆ICC‡ Control inputs VCC = 3.6 V, VCC = 3.6 V, IO = 0, One input at 3 V, Ci Control inputs Cio(OFF) UNIT −1.2 VCC = 3 V, Data inputs MAX VI = 3 V or 0 VO = 3 V or 0, −0.8 VI = VCC or GND Other inputs at VCC or GND OE = VCC VI = 0 VCC = 2.3 V, TYP at VCC = 2.5 V VI = 1.7 V, ron§ VI = 0 VCC = 3 V V ±60 µA 40 µA 20 µA 300 µA 4 pF 9 pF IO = 64 mA IO = 24 mA 5 5 8 8 IO = 15 mA IO = 64 mA 27 40 5 7 Ω IO = 24 mA 5 7 VI = 2.4 V, IO = 15 mA 10 15 † All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C. ‡ This is the increase in supply current for each input that is at the specified voltage level, rather than VCC or GND. § Measured by the voltage drop between the A and B terminals at the indicated current through the switch. On-state resistance is determined by the lower of the voltages of the two (A or B) terminals. switching characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) FROM (INPUT) TO (OUTPUT) tpd¶ A or B B or A ten OE A or B PARAMETER VCC = 2.5 V ± 0.2 V MIN VCC = 3.3 V ± 0.3 V MAX MIN 0.15 1 6 1 UNIT MAX 0.25 ns 4.7 ns tdis A or B 1 6.1 1 6.4 ns OE ¶ The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance). POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SCDS034L − JULY 1997 − REVISED OCTOBER 2003 PARAMETER MEASUREMENT INFORMATION 2 × VCC RL From Output Under Test S1 Open GND CL (see Note A) TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 2 × VCC GND RL LOAD CIRCUIT VCC CL RL V∆ 2.5 V ±0.2 V 3.3 V ±0.3 V 30 pF 50 pF 500 Ω 500 Ω 0.15 V 0.3 V VCC Timing Input VCC/2 0V tw tsu VCC VCC/2 Input VCC/2 th VCC VCC/2 Data Input VCC/2 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VCC VCC/2 Input VCC/2 0V tPHL tPLH VOH VCC/2 Output VCC/2 VOL VOH Output VCC/2 VCC/2 VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS VCC/2 Output Waveform 2 S1 at GND (see Note B) VCC/2 0V t Output PZL Waveform 1 S1 at 2 × VCC (see Note B) tPLH tPHL VCC Output Control tPLZ VCC VCC/2 VOL + V∆ VOL tPHZ tPZH VCC/2 VOH − V∆ VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2 ns, tf ≤ 2 ns. D. The outputs are measured one at a time with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 25-Feb-2005 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) SN74CBTLV3245ADBQR ACTIVE SSOP/ QSOP DBQ 20 2500 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1 YEAR/ Level-1-235C-UNLIM SN74CBTLV3245ADGVR ACTIVE TVSOP DGV 20 2000 Pb-Free (RoHS) CU NIPDAU Level-1-250C-UNLIM SN74CBTLV3245ADW ACTIVE SOIC DW 20 25 Pb-Free (RoHS) CU NIPDAU Level-2-250C-1 YEAR/ Level-1-235C-UNLIM SN74CBTLV3245ADWR ACTIVE SOIC DW 20 2000 Pb-Free (RoHS) CU NIPDAU Level-2-250C-1 YEAR/ Level-1-235C-UNLIM SN74CBTLV3245APW ACTIVE TSSOP PW 20 70 Pb-Free (RoHS) CU NIPDAU Level-1-250C-UNLIM SN74CBTLV3245APWR ACTIVE TSSOP PW 20 2000 Pb-Free (RoHS) CU NIPDAU Level-1-250C-UNLIM SN74CBTLV3245ARGYR ACTIVE QFN RGY 20 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1YEAR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. None: Not yet available Lead (Pb-Free). Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens, including bromine (Br) or antimony (Sb) above 0.1% of total product weight. (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0°–8° 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. Falls within JEDEC: 24/48 Pins – MO-153 14/16/20/56 Pins – MO-194 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. 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