LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only SURFACE MOUNT LED TAPE AND REEL LSRFVG9553/TR1 DATA SHEET DOC. NO REV DATE : : QW0905-L SRFVG9553/TR1 A : 31 - Oct. - 2005 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSRFVG9553/TR1 Page 1/8 Package Dimensions 3.5 3.2 1.85 4 3 0.7±0.05 3.0 0.7±0.05 2.8 1 2 0.7±0.05 2.2 0.7±0.05 0.6 1.85 0.95 - 4 +1 VG 1.3 0.8 SRF 3 + 2 - 0.8 Note : 1.All dimension are in millimeter tolerance is ± 0.2mm unless otherwise noted. 2.Specifications are subject to change without notice. Carrier Type Dimensions 4.0 2.0 0.23 1.55 1.75 5.5 12.0±0.3 4.06 9.3 Polarity 4.0 3.12 Note : The tolerances unless mentioned is ±0.2mm,Angle ± 0.5. Unit=mm. 2.24 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/8 PART NO. LSRFVG9553/TR1 Reel Dimensions 16.0±1.0 ψ178±2.0 14.2±1.0 74.0±1.5 Part No. Description Quantity/Reel LSRFVG9553/TR1 12.0mm tape,7"reel 1500 devices LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/8 PART NO. : LSRFVG9553/TR1 Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT SRF VG Forward Current IF 30 30 mA Peak Forward Current Duty 1/10@10KHz IFP 90 120 mA Power Dissipation PD 75 100 mW Reverse Current @5V Ir μA 10 V Electrostatic Discharge ESD Operating Temperature Topr -40 ~ +85 ℃ Storage Temperature Tstg -40 ~ +100 ℃ Soldering Temperature Tsol 2000 --- Max 260 ℃ for 5 sec Max Typical Electrical & Optical Characteristics (Ta=25 ℃) COLOR PART NO MATERIAL Emitted AlGaInP Peak Dominant Spectral wave halfwidth wave △λ nm length length λPnm λDnm Lens Red Forward Luminous Viewing voltage intensity angle @20mA(V) @20mA(mcd) 2θ 1/2 (deg) Min. Max. Min. Typ. ---- 630 20 1.5 2.4 80 190 120 565 ---- 30 1.7 2.6 20 44 120 Water Clear LSRFVG9553/TR1 GaP Green Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.LSRFVG9553/TR1 Page 4/8 Typical Electro-Optical Characteristics Curve SRF CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 0.1 2.5 2.0 1.5 1.0 0.5 0.0 1.0 2.0 3.0 4.0 5.0 1.0 10 Fig.3 Forward Voltage vs. Temperature Fig.4 Relative Intensity vs. Temperature 3.0 Relative Intensity@20mA Normalize @25℃ 1.2 Forward Voltage@20mA Normalize @25℃ 1000 Forward Current(mA) Forward Voltage(V) 1.1 1.0 0.9 0.8 -40 -20 0 20 40 60 80 100 Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 550 600 650 Wavelength (nm) 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 Ambient Temperature( ℃) Ambient Temperature( ℃) Relative Intensity@20mA 100 700 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/8 PART NO. LSRFVG9553/TR1 Typical Electro-Optical Characteristics Curve VG CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.5 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0.1 1.0 2.0 3.0 4.0 1.0 5.0 10 1.2 1.1 1.0 0.9 0.8 0 20 40 60 80 100 Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 500 550 600 Wavelength (nm) 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 Ambient Temperature( ℃) Ambient Temperature( ℃) Relative Intensity@20mA Fig.4 Relative Intensity vs. Temperature Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ Fig.3 Forward Voltage vs. Temperature -20 1000 Forward Current(mA) Forward Voltage(V) -40 100 650 80 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 6/8 PART NO. : LSRFVG9553/TR1 Soldering Iron: Basic spec is ≦5 sec when 260 ℃. If temperature is higher, time should be shorter(+10 ℃ → -1sec). Power dissipation of iron should be smaller than 15W,and temperature should be controllable. Surface temperature of the device should be under 230 ℃. Soldering heat Soldering heat Max. 260 ℃ 245 ±5℃ within 5 sec Preheat 120 ~ 150 ℃ 120 ~ 180 sec Reflow Temp/Time Temp. ( ℃) 220 Rising +5 ℃/sec 150 Cooling -5℃/sec Preheat 120 60 ~ 120 sec 5sec Time LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 7/8 PART NO. : LSRFVG9553/TR1 Precautions For Use: Storage time: 1.The operation of Temperatures and RH are : 5 ℃~35℃,RH<60%. 2.Once the package is opened, the products should be used within a week. Otherwise, they should be kept in a damp proof box with descanting agent. Considering the tape life, we suggest our customers to use our products within a year(from production date). 3.If opened more than one week in an atmosphere 5 ℃ ~ 35℃,RH<60%, they should be treated at 60 ℃± 5 ℃fo r 15hrs. Drive Method: LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series with the LED. Consider worst case voltage variations than could occur across the current limiting resistor. The forwrd current should not be allowed to change by more than 40 % of its desired value. Circuit model A Circuit model B LED LED (A) Recommended circuit. (B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED. Cleaning: Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED. ESD(Electrostatic Discharge): Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 8/8 PART NO. : LSRFVG9553/TR1 Reliability Test: Test Item Test Condition Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) High Temperature Storage Test Description Reference Standard This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hous. 1.Ta=105 ℃±5℃ &-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11