SCLS140D − DECEMBER 1982 − REVISED AUGUST 2003 D Wide Operating Voltage Range of 2 V to 6 V D High-Current 3-State True Outputs Can Drive Up To 15 LSTTL Loads D Low Power Consumption, 80-µA Max ICC D Typical tpd = 13 ns D ±6-mA Output Drive at 5 V D Low Input Current of 1 µA Max D Eight High-Current Latches in a Single D Package Full Parallel Access for Loading SN54HC373 . . . J OR W PACKAGE SN74HC373 . . . DB, DW, N, NS, OR PW PACKAGE (TOP VIEW) 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 1D 1Q OE VCC 8Q VCC 8Q 8D 7D 7Q 6Q 6D 5D 5Q LE 2D 2Q 3Q 3D 4D 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 8D 7D 7Q 6Q 6D 4Q GND LE 5Q 5D OE 1Q 1D 2D 2Q 3Q 3D 4D 4Q GND SN54HC373 . . . FK PACKAGE (TOP VIEW) description/ordering information These 8-bit latches feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers. The eight latches of the ’HC373 devices are transparent D-type latches. While the latch-enable (LE) input is high, the Q outputs follow the data (D) inputs. When LE is taken low, the Q outputs are latched at the levels that were set up at the D inputs. ORDERING INFORMATION PACKAGE† TA PDIP − N SN74HC373N Tube of 25 SN74HC373DW Reel of 2000 SN74HC373DWR SOP − NS Reel of 2000 SN74HC373NSR HC373 SSOP − DB Reel of 2000 SN74HC373DBR HC373 Tube of 70 SN74HC373PW Reel of 2000 SN74HC373PWR Reel of 250 SN74HC373PWT CDIP − J Tube of 20 SNJ54HC373J SNJ54HC373J CFP − W Tube of 85 SNJ54HC373W SNJ54HC373W LCCC − FK Tube of 55 SNJ54HC373FK TSSOP − PW −55°C −55 C to 125 125°C C TOP-SIDE MARKING Tube of 20 SOIC − DW −40°C to 85°C ORDERABLE PART NUMBER SN74HC373N HC373 HC373 SNJ54HC373FK † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2003, Texas Instruments Incorporated !"# $"%&! '#( '"! ! $#!! $# )# # #* "# '' +,( '"! $!#- '# #!#&, !&"'# #- && $##( $'"! !$& ./0 && $## # ##' "&# )#+# #'( && )# $'"! $'"! $!#- '# #!#&, !&"'# #- && $##( POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SCLS140D − DECEMBER 1982 − REVISED AUGUST 2003 description/ordering information (continued) An output-enable (OE) input places the eight outputs in either a normal logic state (high or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without interface or pullup components. OE does not affect the internal operations of the latches. Old data can be retained or new data can be entered while the outputs are off. FUNCTION TABLE (each latch) INPUTS OE LE D OUTPUT Q L H H H L H L L L L X Q0 H X X Z logic diagram (positive logic) OE LE 1 11 C1 1D 3 2 1D 1Q To Seven Other Channels absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±35 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±70 mA Package thermal impedance, θJA (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SCLS140D − DECEMBER 1982 − REVISED AUGUST 2003 recommended operating conditions (see Note 3) SN54HC373 VCC VIH Supply voltage VCC = 2 V VCC = 4.5 V High-level input voltage VCC = 6 V VCC = 2 V VIL VI VO ∆t/∆v MIN NOM MAX 2 5 6 Input voltage MAX 2 5 6 3.15 3.15 4.2 4.2 0 VCC = 6 V UNIT V V 0.5 0.5 1.35 1.35 1.8 1.8 VCC VCC VCC = 2 V VCC = 4.5 V Input transition rise/fall time NOM 1.5 0 Output voltage MIN 1.5 VCC = 4.5 V VCC = 6 V Low-level input voltage SN74HC373 0 VCC VCC 0 1000 1000 500 500 400 400 V V V ns TA Operating free-air temperature −55 125 −40 85 °C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VOH VOL TEST CONDITIONS VI = VCC or 0, MIN MAX SN74HC373 MIN MAX UNIT 1.9 1.998 1.9 1.9 IOH = −20 µA 4.4 4.499 4.4 4.4 6V 5.9 5.999 5.9 5.9 IOH = −6 mA IOH = −7.8 mA 4.5 V 3.98 4.3 3.7 3.84 6V 5.48 5.8 5.2 5.34 2V 0.002 0.1 0.1 0.1 IOL = 20 µA 4.5 V 0.001 0.1 0.1 0.1 6V 0.001 0.1 0.1 0.1 4.5 V 0.17 0.26 0.4 0.33 6V 0.15 0.26 0.4 0.33 6V ±0.1 ±100 ±1000 ±1000 nA 6V ±0.01 ±0.5 ±10 ±5 µA 8 160 80 µA 10 10 10 pF IOL = 6 mA IOL = 7.8 mA ICC Ci SN54HC373 2V VI = VIH or VIL VI = VCC or 0 VO = VCC or 0 TA = 25°C MIN TYP MAX 4.5 V VI = VIH or VIL II IOZ VCC IO = 0 6V 2 V to 6 V POST OFFICE BOX 655303 3 • DALLAS, TEXAS 75265 V V 3 SCLS140D − DECEMBER 1982 − REVISED AUGUST 2003 timing requirements over recommended operating free-air temperature range (unless otherwise noted) VCC tw Pulse duration, LE high tsu Setup time, data before LE↓ th Hold time, data after LE↓ TA = 25°C MIN MAX SN54HC373 MIN MAX SN74HC373 MIN 2V 80 120 100 4.5 V 16 24 20 6V 14 20 17 2V 50 75 63 4.5 V 10 15 13 6V 9 13 11 2V 20 26 24 4.5 V 10 13 12 6V 10 13 12 MAX UNIT ns ns ns switching characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) D ten tdis tt 4 OE OE SN54HC373 SN74HC373 VCC 2V 58 150 225 190 Q 4.5 V 15 30 45 38 6V 13 26 38 32 2V 73 175 265 220 4.5 V 18 35 53 44 6V 15 30 45 38 2V 65 150 225 190 4.5 V 17 30 45 38 6V 14 26 38 32 2V 50 150 225 190 4.5 V 15 30 45 38 6V 13 26 38 32 2V 28 60 90 75 4.5 V 8 12 18 15 6V 6 10 15 13 tpd LE TA = 25°C MIN TYP MAX TO (OUTPUT) Any Q Any Q Any Q Any Q POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MIN MAX MIN MAX UNIT ns ns ns ns SCLS140D − DECEMBER 1982 − REVISED AUGUST 2003 switching characteristics over recommended operating free-air temperature range, CL = 150 pF (unless otherwise noted) (see Figure 1) PARAMETER SN74HC373 VCC 2V 82 200 300 250 D Q 4.5 V 22 40 60 50 6V 19 34 51 43 2V 100 225 335 285 4.5 V 24 45 67 57 6V 20 38 57 48 LE tt SN54HC373 TO (OUTPUT) tpd ten TA = 25°C TYP MAX FROM (INPUT) OE Any Q Any Q Any Q MIN MIN MAX MIN MAX 2V 90 200 300 250 4.5 V 23 40 60 50 6V 19 34 51 43 2V 45 210 315 265 4.5 V 17 42 63 53 6V 13 36 53 45 UNIT ns ns ns operating characteristics, TA = 25°C PARAMETER Cpd Power dissipation capacitance per latch POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TEST CONDITIONS TYP UNIT No load 100 pF 5 SCLS140D − DECEMBER 1982 − REVISED AUGUST 2003 PARAMETER MEASUREMENT INFORMATION VCC From Output Under Test CL (see Note A) PARAMETER tPZH S1 Test Point RL ten RL 1 kΩ tPZL tPHZ tdis S2 tPLZ 1 kΩ Reference Input VCC 50% Data Input VCC 50% 10% 50% VCC 0V In-Phase Output 50% 10% tPHL 90% 90% tr tPHL Out-ofPhase Output 90% tf Open Closed Closed Open Open Open VCC th 90% 90% VCC 50% 10% 0 V tf 50% 10% Output Control (Low-Level Enabling) VCC 50% 50% 0V tPZL VOH 50% 10% V OL tf Output Waveform 1 (See Note B) tPLZ 90% VOH VOL Output Waveform 2 (See Note B) ≈VCC ≈VCC 50% 10% tPZH tPLH 50% 10% Open VOLTAGE WAVEFORMS SETUP AND HOLD AND INPUT RISE AND FALL TIMES 50% tPLH Closed tr VOLTAGE WAVEFORMS PULSE DURATIONS 50% Closed 0V 0V Input Open tsu 0V 50% 50 pF or 150 pF 50% 50% tw Low-Level Pulse S2 50 pF or 150 pF LOAD CIRCUIT High-Level Pulse S1 50 pF −− tpd or tt CL VOL tPHZ 50% 90% VOH ≈0 V tr VOLTAGE WAVEFORMS PROPAGATION DELAY AND OUTPUT TRANSITION TIMES VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES FOR 3-STATE OUTPUTS NOTES: A. CL includes probe and test-fixture capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns. D. The outputs are measured one at a time with one input transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) 5962-8407201VRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8407201VR A SNV54HC373J 5962-8407201VSA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type -55 to 125 5962-8407201VS A SNV54HC373W 84072012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 84072012A SNJ54HC 373FK 8407201RA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 8407201RA SNJ54HC373J 8407201SA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type -55 to 125 8407201SA SNJ54HC373W JM38510/65403B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/ 65403B2A JM38510/65403BRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 65403BRA M38510/65403B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/ 65403B2A M38510/65403BRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 65403BRA SN54HC373J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 SN54HC373J SN74HC373DBLE OBSOLETE SSOP DB 20 TBD Call TI Call TI -40 to 85 SN74HC373DBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC373 SN74HC373DBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC373 SN74HC373DBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC373 SN74HC373DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC373 SN74HC373DWE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC373 Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 25-Sep-2013 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) SN74HC373DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC373 SN74HC373DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC373 SN74HC373DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC373 SN74HC373DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC373 SN74HC373N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 85 SN74HC373N SN74HC373N3 OBSOLETE PDIP N 20 TBD Call TI Call TI -40 to 85 SN74HC373NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 85 SN74HC373N SN74HC373NSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC373 SN74HC373NSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC373 SN74HC373NSRG4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC373 SN74HC373PW ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC373 SN74HC373PWE4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC373 SN74HC373PWG4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC373 SN74HC373PWLE OBSOLETE TSSOP PW 20 TBD Call TI Call TI -40 to 85 SN74HC373PWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC373 SN74HC373PWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC373 SN74HC373PWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC373 SN74HC373PWT ACTIVE TSSOP PW 20 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC373 SN74HC373PWTE4 ACTIVE TSSOP PW 20 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC373 Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 25-Sep-2013 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) SN74HC373PWTG4 ACTIVE TSSOP PW 20 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC373 SNJ54HC373FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 84072012A SNJ54HC 373FK SNJ54HC373J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 8407201RA SNJ54HC373J SNJ54HC373W ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type -55 to 125 8407201SA SNJ54HC373W (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 3 Samples PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN54HC373, SN54HC373-SP, SN74HC373 : • Catalog: SN74HC373, SN54HC373 • Military: SN54HC373 • Space: SN54HC373-SP NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product • Military - QML certified for Military and Defense Applications • Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 1-Jul-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74HC373DBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1 SN74HC373DWR SOIC DW 20 2000 330.0 24.4 10.8 13.3 2.7 12.0 24.0 Q1 SN74HC373NSR SO NS 20 2000 330.0 24.4 8.2 13.0 2.5 12.0 24.0 Q1 SN74HC373PWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1 SN74HC373PWT TSSOP PW 20 250 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 1-Jul-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74HC373DBR SN74HC373DWR SSOP DB 20 2000 367.0 367.0 38.0 SOIC DW 20 2000 367.0 367.0 45.0 SN74HC373NSR SO NS 20 2000 367.0 367.0 45.0 SN74HC373PWR TSSOP PW 20 2000 367.0 367.0 38.0 SN74HC373PWT TSSOP PW 20 250 367.0 367.0 38.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. 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