User Manual SPMU290 – April 2013 BOOSTXL-SENSHUB Sensor Hub BoosterPack The Sensor Hub Booster Pack (BOOSTXL-SENSHUB) is a low-cost extension board for the Tiva™ C Series TM4C LaunchPad EK-TM4C123GXL evaluation platform for ARM® Cortex™-M4F-based microcontrollers (MCUs). This extension board, or BoosterPack, is specifically designed to expand the functionality of the Tiva TM4C LaunchPad. This user’s manual provides an overview of the Sensor Hub BoosterPack software and hardware Figure 1 shows a photo of the BOOST-XL-SENSHUB. Figure 1. BOOSTXL-SENSHUB BoosterPack Extension Board RF Expansion Connections TPS75118 Voltage Regulator BMP180 Pressure Sensor RF Expansion Connections User LED 1.6 in MPU9150 9-axis Motion Sensor User Button TMP006 Temp Sensor SHT21 Humidity Sensor ISL29023 Light Sensor User Button 2.0 in 1 2 3 4 Contents Board Overview ............................................................................................................. Hardware Description ...................................................................................................... Software Development ..................................................................................................... References, PCB Layout, and Bill of Materials ......................................................................... 2 3 5 6 Tiva, Code Composer Studio are trademarks of Texas Instruments. TivaWare, Stellaris are registered trademarks of Texas Instruments. Cortex, Keil are trademarks of ARM Limited. ARM, RealView are registered trademarks of ARM Limited. Microsoft, Windows are registered trademarks of Microsoft Corp. All other trademarks are the property of their respective owners. SPMU290 – April 2013 Submit Documentation Feedback BOOSTXL-SENSHUB Sensor Hub BoosterPack Copyright © 2013, Texas Instruments Incorporated 1 Board Overview 1 www.ti.com Board Overview The Sensor Hub BoosterPack is an extension board for the TI MCU LaunchPad evaluation module ecosystem. It was designed specifically to extend the functionality of the Tiva TM4C1233 LaunchPad (EKTM4C123GXL). The Sensor Hub enables customers to create and model innovative prototype solutions that leverage the processing and floating-point capabilities of the TM4C123GH6PM MCU coupled with motion and environmental sensors. The Sensor Hub BoosterPack plugs in to the BoosterPack XL headers located on the top of the LaunchPad. The BoosterPack also features a TI-standard extension module (EM) connector to further extend customer applications through a variety of wireless extension modules. This board and the available software also highlight the use of the new TivaWare® SensorLib sensor driver library, an easy-to-use, extendable foundation of sensor communication software. NOTE: The Sensor Hub BoosterPack is fully compatible with both the Tiva™ C Series LaunchPad (EK-TM4C123GXL) and the Stellaris® LM4F120 LaunchPad (EK-LM4F120XL). 1.1 Kit Features The BOOSTXL-SENSHUB BoosterPack offers the following features: • TMP006 infrared object temperature sensor • 9-axis InvenSense MPU9150 motion sensor: – 3-axis acceleration – 3-axis gyroscope – 3-axis magnetometer • Bosch BMP180 pressure sensor • Intersil ISL29023 ambient and infrared light sensor • Sensirion SHT21 humidity sensor • Two user pushbuttons • One user LED • One power LED • EM connector for additional wireless expansion 1.2 Using the Sensor Hub BoosterPack Follow these recommended steps to quickly configure your Sensor Hub for proper operation. Step 1. Review the BOOSTXL-SENSHUB BoosterPack Getting Started Guide (literature number SPMU295, available for download at www.ti.com). This document guides you through downloading, installing, and running the associated TivaWare examples that demonstrate the Sensor Hub capabilities and functions. Step 2. Examine the additional examples that are provided with the downloaded software to understand the capabilities and limitations of each on-board sensor. Step 3. Create your own application using the Tiva C Series LaunchPad and Sensor Hub BoosterPack. Use the TivaWare for C Series Sensor Library to enable your innovative Tiva TM4C MCU applications. Step 4. Customize and integrate the hardware to suit a specific end application. This user’s manual is an important reference for understanding circuit operation and completing hardware modifications. 2 BOOSTXL-SENSHUB Sensor Hub BoosterPack Copyright © 2013, Texas Instruments Incorporated SPMU290 – April 2013 Submit Documentation Feedback Hardware Description www.ti.com 1.3 Specifications Table 1 summarizes the specifications for the BOOSTXL-SENSHUB BoosterPack. Table 1. Sensor Hub BoosterPack Specifications 2 Parameter Value Board supply voltage 2.7 V to 5.5 V nominally supplied as 3.3 V from the BoosterPack interface Dimensions 2.0 x 1.5 x 0.625 (in) 5.08 x 3.81 x 1.587 (cm) RoHS status Compliant Hardware Description The Sensor Hub BoosterPack includes five motion and environmental sensors. It also enables RF expansion and access to user LEDs and buttons. The hardware is designed to enable innovative applications that fuse sensor information and Tiva C Series software processing through the functionality of the Tiva C Series LaunchPad. Figure 2 shows a block diagram of the Sensor Hub BoosterPack. Figure 2. BOOSTXL-SENSHUB BoosterPack Block Diagram User Buttons BoosterPack XL Connectors 3.3 V TPS75118 BMP180 I2C3 MPU9150 3.3 V UART/SPI/ I2C1 LED 1.8 V SHT21 ISL29023 RF Expansion TMP006 BOOSTXL-SENSHUB SPMU290 – April 2013 Submit Documentation Feedback BOOSTXL-SENSHUB Sensor Hub BoosterPack Copyright © 2013, Texas Instruments Incorporated 3 Hardware Description 2.1 www.ti.com Functional Description This section provides a functional description of the Sensor Hub BoosterPack. 2.1.1 BoosterPack XL Connector The BoosterPack XL connector attaches the BoosterPack to the Tiva TM4C LaunchPad. This BoosterPack is specifically designed to match the pin function with the Tiva TM4C LaunchPad. Basic I2C and UART communication to the sensors and RF expansion connectors are also available when the Sensor Hub is connected to either the C2000 or MSP430 LaunchPad. Table 2 describes the BoosterPack XL interface connections and the respective uses on the Sensor Hub BoosterPack. It also shows which pins remain available for additional expansion at the user's discretion. Table 2. BoosterPack XL Interface Connections (1) Pin Function Pin J1.1 3.3 V IN J1.2 Function Pin Function J2.1 Ground J3.1 J4.1 J2.2 Interrupt J3.2 J4.2 Interrupt J3.3 J4.3 RF GPIO J4.4 UART RTS UART RX J2.3 J1.4 UART TX J2.4 J3.4 J2.5 J3.5 USER LED J4.5 UART CTS J1.6 Interrupt J1.7 2.1.2 Pin J1.3 J1.5 (1) Function J2.6 Sensor I2C J3.6 User Button J4.6 RF Shutdown J2.7 Sensor I2C J3.7 User Button J4.7 RF Reset RF GPIO J1.8 SSI TX J2.8 SSI RX J3.8 RF GPIO J4.8 J1.9 RF I2C J2.9 SSI SS J3.9 RF GPIO J4.9 J1.10 RF I2C J2.10 SSI CLK J3.10 J4.10 Shaded cells indicate unused pins that are available for additional expansion. TMP006 Temperature Sensor The TMP006 provides both direct and indirect temperature measurements. It contains an on-chip temperature sensor to directly measure ambient temperature conditions. It also allows contactless infrared object temperature measurement. 2.1.3 InvenSense MPU9150 9-Axis Motion Sensor The MPU9150 is a 3-axis accelerometer, 3-axis gyroscope, and 3-axis magnetometer in a single package. This device is the primary motion sensor on the Sensor Hub. It is used by the demonstration software as the raw motion inputs, which are fused by a direct cosine matrix into roll, pitch, and yaw measurements. 2.1.4 Intersil ISL29023 Ambient and Infrared Light Sensor The ISL29023 provides sensor measurements of light conditions across both the ambient (human-visible) spectrum and the infrared spectrum. 2.1.5 Sensirion SHT21 Humidity Sensor The SHT21 provides relative humidity measurements. 2.1.6 Bosch BMP180 Barometric Pressure Sensor The BMP180 measures barometric pressure conditions. It can be used to enhance the motion sensor by determining relative changes in altitude. 2.1.7 Low-Power RF Expansion Connection The RF expansion connection provides a wide array of options to the end application. 4 BOOSTXL-SENSHUB Sensor Hub BoosterPack Copyright © 2013, Texas Instruments Incorporated SPMU290 – April 2013 Submit Documentation Feedback Software Development www.ti.com 2.1.8 TPS75118 Voltage Regulator The TPS75118 regulates the 3.3-V supply from the LaunchPad down to 1.8 V for the input to the RF expansion connector. 3 Software Development This section provides general information on software development as well as instructions for Flash memory programming. Note: This information presumes that the Sensor Hub BoosterPack is connected to a Tiva TM4C1233 LaunchPad. 3.1 Software Description The TivaWare software provided with the Tiva C Series LaunchPad includes functional drivers for all of the peripheral devices supplied in the design. The TivaWare for C Series Peripheral Driver Library is used to configure and operate the on-chip peripherals as part of TivaWare. The TivaWare package includes a set of example applications that use the TivaWare Peripheral Driver Library. These applications demonstrate the capabilities of the TM4C1233H6 microcontroller, as well as provide a starting point for the user to develop the final application for use on the Tiva C Series LaunchPad evaluation board and the BOOSTXL-SENSHUB BoosterPack. 3.2 Source Code The complete source code, including the source code installation instructions, are available at www.ti.com/tool/boostxl-senshub. The source code and binary files are installed in the TivaWare for C Series Peripheral Driver Library tree. 3.3 Tool Options The source code installation includes directories that contain projects and/or makefiles for the following tool chains: • Keil™ ARM RealView® Microcontroller Development System • IAR Embedded Workbench for ARM • Sourcery CodeBench • Texas Instruments' Code Composer Studio™ IDE Download evaluation versions of these tools from www.ti.com/tiva-c. As a result of code size restrictions, the evaluation tools may not build all example programs. A full license is necessary to rebuild or debug all examples. Instructions on installing and using each of the evaluation tools can be found in the Quickstart guides (for example, Quickstart-Keil, Quickstart-IAR), which are available for download from the Evaluation Kit section of our website at www.ti.com/tiva-c. For detailed information on using each tool, see the documentation included with the respective tool chain installation or visit the website of the respective tool supplier. 3.4 Programming the Tiva TM4C LaunchPad Evaluation Board The Tiva TM4C LaunchPad software package includes pre-built binaries for each of the example applications. If you installed TivaWare for C Series to the default installation path of C:\ti\TivaWare_C_Series_<version>, you can find these example applications in C:\ti\TivaWare_C_Series_<version>/examples\boards\ek-tm4c123gxl. The onboard ICDI is used with the LM Flash Programmer tool to program applications on the Tiva C Series LaunchPad. Follow these steps to program example applications into the Tiva C Series LaunchPad evaluation board using the ICDI: 1. Install the LM Flash Programmer on a PC running Microsoft® Windows® XP, Windows 7, or later Windows OS. 2. Switch the POWER SELECT switch to the right to use Debug mode. SPMU290 – April 2013 Submit Documentation Feedback BOOSTXL-SENSHUB Sensor Hub BoosterPack Copyright © 2013, Texas Instruments Incorporated 5 References, PCB Layout, and Bill of Materials www.ti.com 3. Connect the USB-A cable plug to an available port on the PC and the Micro-B plug to the Debug USB port on the board. 4. Verify that the POWER LED D4 on the board is lit. 5. Run the LM Flash Programmer program. 6. In the Configuration tab, use the Quick Set control to select the Tiva C Series LaunchPad evaluation board. 7. Move to the Program tab and click the Browse button. Navigate to the example applications directory (the default location is C:\ti\TivaWare_C_Series_<version>/examples\boards\ek-tm4c123gxl-senshub\). 8. Each example application has its own directory. Navigate to the example directory that you want to load, then navigate to the directory that contains the binary (*.bin) files. Select the desired binary file and click Open. 9. Set the Erase Method to Erase Necessary Pages. Check the Verify After Program box, and check the Reset MCU After Program option. 10. Click the Program button to start the Erase, Download, and Verify process. Program execution starts once the Verify process is complete. 4 References, PCB Layout, and Bill of Materials Complete schematics for the Sensor Hub BoosterPack are appended to this user's guide. 4.1 References In • • • • • addition to this document, the following references are available for download at www.ti.com: BOOSTXL-SENSHUB BoosterPack Getting Started Guide (literature number SPMU295) Tiva C Series TM4C123GH6PM Microcontroller Data Sheet (literature number SPMS376). TivaWare for C Series Driver Library. Available for download at www.ti.com/tool/sw-tm4c-drl. TivaWare for C Series Driver Library User’s Manual (literature number SPMU298). TPS75118 Fast Transient Response, 1.5-A, Low-Dropout Regulator Data Sheet (literature number SLVS241) • TMP006 Infrared Thermopile Sensor Data Sheet (literature number SBOS518) • Texas Instruments’ Code Composer Studio IDE website: www.ti.com/ccs Additional support: • RealView MDK (www.keil.com/arm/rvmdkkit.asp) • IAR Embedded Workbench (www.iar.com) • Sourcery CodeBench development tools (www.codesourcery.com/gnu_toolchains/arm) • InvenSense MPU9150 (www.invensense.com/mems/gyro/mpu9150.html) • Intersil ISL29023 (www.intersil.com/en/products/optoelectronics/ambient-light-sensors/light-to-digitalsensors/ISL29023.html) • Bosch BMP180 (www.boschsensortec.com/homepage/products_3/environmental_sensors_1/bmp180_1/bmp180) • Sensirion SHT21 (www.sensirion.com/en/products/humidity-temperature/humidity-sensor-sht21) 6 BOOSTXL-SENSHUB Sensor Hub BoosterPack Copyright © 2013, Texas Instruments Incorporated SPMU290 – April 2013 Submit Documentation Feedback References, PCB Layout, and Bill of Materials www.ti.com 4.2 Bill of Materials (BOM) Table 3 shows the bill of materials for the BOOSTXL-SENSHUB BoosterPack board. Table 3. BOOSTXL-SENSHUB Bill of Materials (1) (2) (3) Item (2) (3) (4) Qty Value Description Manufacturer Manufacturer Part No IC, digital, barometric pressure sensor Bosch BMP180 1 U2 1 BMP180 2 C1-2, C8-9, C11, C13, C15-16 8 100 nF Capacitor, ceramic, NPO or C0G or X5R, 10 V or higher, 0805 (4) Murata GRM21BR71E104KA01L 3 C4, C6 2 100 nF Capacitor, ceramic, X7R, ±10%, 10 V or higher, 0805 (4) Murata GRM21BR71E104KA01L 4 C5 1 10 nF Capacitor, ceramic, X7R, ±10%, 10 V or higher, 0805 (4) Murata GRM216R71H103KA01D 5 C3 1 2.2 nF Capacitor, ceramic, X7R, ±10%, 50 V or higher, 0805 (4) Kemet C0805C222K5RACTU 6 C7, C10, C12, C14 4 1 μF Capacitor, tantalum, 10 V or higher, Type A AVX Corp. TAJA105M020RNJ 7 C17 1 47 μF Capacitor, tantalum, 10 V or higher, Type A Nichicon F931A476MAA — Y1 0 32.768 kHz 8 D1 1 Red 9 D2 1 Yellow Clock oscillator, 2.5 x 3.2 mm Do not populate Do not populate Light emitting diode, 1.7 V forward voltage or less, 0805 Stanley BR1112H-TR Light emitting diode, 0805 Knightbright APT2012YC Sullins PPTC101LFBN-RC 10 J1-4 4 PEC10SAAN Header, female, 10-pin, 100-mil spacing, 0.100 inch x 10 11 RF_PART1-2 2 TFM-110-02SM-D-A-K-TR Header, SMT 10x2 pin, shrouded, 0.225 x 0.625 inch Samtec TFM-110-02-SM-D-A-K-TR 12 U4 1 ISL29023 IC, integrated digital light sensor with interrupt Intersil ISL29023 13 U3 1 MPU-9150 IC, nine-axis MEMS motion tracking device InvenSense MPU-9150 14 R1, R4, R9-10 4 10 kΩ Surface mount resistor, 1/10 W or higher, 0805 Yageo RC0805JR-0710KL — R2 0 10 kΩ Surface mount resistor, 1/10 W or higher, 0805 15 R6 1 5.1 Ω Surface mount resistor, 1/10 W or higher, 0805 Yageo RC0805JR-075R1L 16 R7 1 100 Ω Surface mount resistor, 1/10 W or higher, 0805 Yageo RC0805JR-07100RL 17 R5, R8 2 0Ω Surface mount resistor, 1/10 W or higher, 0805 Yageo RC0805JR-070RL 18 R3 1 499 kΩ Surface mount resistor, 1/10 W or higher, 0805 Yageo RC0805FR-07499KL 19 R11-12 2 3.3 kΩ Surface mount resistor, 1/10 W or higher, 0805 Yageo RC0805JR-073K3L 20 U5 1 SHT21 IC, humidity and temperature sensor Sensirion AG SHT21 Bourns 7914G Do not populate Do not populate 21 S1-2 2 7914G Switch, 1P1T, PB momentary, 100 mA, SM, 0.19 x 0.18 inch 22 U1 1 TMP006AIYZFT IC, infrared thermopile sensor Texas Instruments TMP006YZF 1 TPS75118Q PWP IC, low dropout voltage regulator, 1.8 V, 1.5 A Texas Instruments TPS75118QPWP 23 (1) Ref Des U6 These assemblies are ESD sensitive. ESD precautions shall be observed. These assemblies must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable. These assemblies must comply with workmanship standards IPC-A-610 Class 2. A dielectric with a higher thermal range and/or lower capacitance variation is also permitted (for example, X7R, X9R). SPMU290 – April 2013 Submit Documentation Feedback BOOSTXL-SENSHUB Sensor Hub BoosterPack Copyright © 2013, Texas Instruments Incorporated 7 A B C D Temperature Sensor U1 TMP006 B1 3.3V C1 ANALOG_GND A2 Pressure Sensor DGND SDA ADR1 SCL ADR0 V+ AGND DRDY C3 3.3V B3 I2C_SCL A3 9-Axis Motion Sensor ANALOG_PWR 1 C1 U3 MPU-9150 C2 I2C_SDA R1 10k INT_TEMP 1 U2 BMP180 I2C_SDA 100nF 2 3 CSB SDA VDD 6 I2C_SDA 5 I2C_SCL SCK VDDIO GND A1 I2C_SCL 1 SDO 4 7 3.3V C2 100nF RESV 19 CPOUT 20 RESV 21 1 CLKIN GND 18 2 NC GND 17 3 VDD NC 16 4 NC GND 15 5 NC NC 14 INT C6 100nF I2C_SDA 2 GND SCL 5 I2C_SCL 3 R-EXT C8 100nF R3 499k 7 INT 4 3.3V SDA 6 INT_LT Humidity & Temp. Sensor INT_MOTION C7 1uF + 1 VDD GND 3.3V 3 (Do Not Populate) U5 SHT21 I2C_SDA 1 SDA SCL 6 I2C_SCL 2 VSS VDD 5 3.3V 3 NC R4 10k VSS Light Sensor C4 100nF R2 10k C5 10nF 3 3.3V 12 RESV-G 11 REGOUT 10 9 AD0 8 VLOGIC VDD 13 7 RESV 6 RESV U4 ISL29023 2 3.3V 3.3V RESV 22 2 SCL 23 SDA 24 C3 2.2nF NC 4 C9 100nF 7 3.3V Texas Instruments 4 Title Size Number Rev 1 B Date Engineer Aneesh Rai A B C Filename 4 Sensor Hub Booster Pack 2/20/2013 Sensor_Hub_Booster_Pack Rev A.sch D A Drawn by 1 Sheet 2/20/2013 AR of 2 A B C D RF Headers LaunchPad Headers RF_PART1 1 U1RTS RF_PART2 1 2 3 4 1.8V 1 2 3 4 32.768_CLK 5 6 5 6 U1TX 7 8 7 8 U1RX 9 10 9 10 3.3V RF_GPIO0 RF_I2C_SDA 11 12 RF_GPIO1 RF_I2C_SCL 13 14 SSI0FSS 15 16 SSI0CLK 17 18 SSI0TX 19 20 SSI0RX RF_GPIO2 RF_RST RF_SHUTDN 11 12 13 14 J1 3.3V 16 17 18 U1CTS 19 20 RF_GPIO3 Power Indicator LED 1 1 2 2 INT_MOTION U1RX 3 3 INT_TEMP U1TX 4 4 5 5 6 6 I2C_SDA 7 7 I2C_SCL 8 8 SSI0RX RF_I2C_SCL 9 9 SSI0FSS RF_I2C_SDA 10 10 SSI0CLK INT_LT 15 SSI0TX General Purpose LED J3 LED_GPIO 2 1.8V 3.3V J2 1 J4 2 1 1 2 2 3 3 RF_GPIO0 4 4 U1RTS LED_GPIO 5 5 U1CTS PUSH_BUT_GPIO0 6 6 RF_SHUTDN PUSH_BUT_GPIO1 7 7 RF_RST RF_GPIO1 8 8 RF_GPIO3 RF_GPIO2 9 9 10 10 ANALOG_PWR C12 C13 100nF 1uF R6 5.1 ANALOG_GND 3 PG_1.8V R8 0 Regulator 3.3V + C14 1uF 1.8V NC 19 3 IN NC 18 4 IN GND 17 C17 EN NC 16 6 PG NC 15 7 FB/SEN NC 14 8 OUTPUT NC 13 9 OUTPUT NC 12 10 GND/HTSK 47uF GND/HTSK 11 S1 Oscillator Y1 1 3 R9 10k 32.768_CLK R10 10k S2 PUSH_BUT_GPIO0 R11 3.3k CRYSTAL_ECS-327KE 4 General Purpose Push Buttons I2C_SDA 3.3V PUSH_BUT_GPIO1 C15 100nF C16 100nF I2C_SCL R12 3.3k 2 PWRPAD 4 21 4 + 2 NC 5 PG_1.8V GND/HTSK 20 3.3V 1 GND/HTSK 3 3.3V U6 TPS75118 R7 100 3.3V R5 0 D2 C11 100nF 1uF + D1 C10 + Size Number B Engineer A B C Aneesh Rai Filename Rev Texas Instruments A 1 Date 2/20/2013 Sensor_Hub_Booster_Pack Rev A.sch Drawn by Sheet D 2 of 2 EVALUATION BOARD/KIT/MODULE (EVM) ADDITIONAL TERMS Texas Instruments (TI) provides the enclosed Evaluation Board/Kit/Module (EVM) under the following conditions: The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claims arising from the handling or use of the goods. Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned within 30 days from the date of delivery for a full refund. THE FOREGOING LIMITED WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES. Please read the User's Guide and, specifically, the Warnings and Restrictions notice in the User's Guide prior to handling the product. This notice contains important safety information about temperatures and voltages. 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Concernant les EVMs avec antennes détachables Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur. SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER 【Important Notice for Users of this Product in Japan】 】 This development kit is NOT certified as Confirming to Technical Regulations of Radio Law of Japan If you use this product in Japan, you are required by Radio Law of Japan to follow the instructions below with respect to this product: 1. 2. 3. Use this product in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of Japan, Use this product only after you obtained the license of Test Radio Station as provided in Radio Law of Japan with respect to this product, or Use of this product only after you obtained the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to this product. Also, please do not transfer this product, unless you give the same notice above to the transferee. Please note that if you could not follow the instructions above, you will be subject to penalties of Radio Law of Japan. Texas Instruments Japan Limited (address) 24-1, Nishi-Shinjuku 6 chome, Shinjuku-ku, Tokyo, Japan http://www.tij.co.jp 【ご使用にあたっての注】 本開発キットは技術基準適合証明を受けておりません。 本製品のご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。 1. 2. 3. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用いただく。 実験局の免許を取得後ご使用いただく。 技術基準適合証明を取得後ご使用いただく。 なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。 上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・インスツルメンツ株式会社 東京都新宿区西新宿６丁目２４番１号 西新宿三井ビル http://www.tij.co.jp SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER EVALUATION BOARD/KIT/MODULE (EVM) WARNINGS, RESTRICTIONS AND DISCLAIMERS For Feasibility Evaluation Only, in Laboratory/Development Environments. Unless otherwise indicated, this EVM is not a finished electrical equipment and not intended for consumer use. It is intended solely for use for preliminary feasibility evaluation in laboratory/development environments by technically qualified electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems and subsystems. It should not be used as all or part of a finished end product. Your Sole Responsibility and Risk. You acknowledge, represent and agree that: 1. 2. 3. 4. You have unique knowledge concerning Federal, State and local regulatory requirements (including but not limited to Food and Drug Administration regulations, if applicable) which relate to your products and which relate to your use (and/or that of your employees, affiliates, contractors or designees) of the EVM for evaluation, testing and other purposes. You have full and exclusive responsibility to assure the safety and compliance of your products with all such laws and other applicable regulatory requirements, and also to assure the safety of any activities to be conducted by you and/or your employees, affiliates, contractors or designees, using the EVM. Further, you are responsible to assure that any interfaces (electronic and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard. You will employ reasonable safeguards to ensure that your use of the EVM will not result in any property damage, injury or death, even if the EVM should fail to perform as described or expected. You will take care of proper disposal and recycling of the EVM’s electronic components and packing materials. Certain Instructions. It is important to operate this EVM within TI’s recommended specifications and environmental considerations per the user guidelines. Exceeding the specified EVM ratings (including but not limited to input and output voltage, current, power, and environmental ranges) may cause property damage, personal injury or death. If there are questions concerning these ratings please contact a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the specified output range may result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, some circuit components may have case temperatures greater than 60°C as long as the input and output are maintained at a normal ambient operating temperature. These components include but are not limited to linear regulators, switching transistors, pass transistors, and current sense resistors which can be identified using the EVM schematic located in the EVM User's Guide. When placing measurement probes near these devices during normal operation, please be aware that these devices may be very warm to the touch. As with all electronic evaluation tools, only qualified personnel knowledgeable in electronic measurement and diagnostics normally found in development environments should use these EVMs. Agreement to Defend, Indemnify and Hold Harmless. You agree to defend, indemnify and hold TI, its licensors and their representatives harmless from and against any and all claims, damages, losses, expenses, costs and liabilities (collectively, "Claims") arising out of or in connection with any use of the EVM that is not in accordance with the terms of the agreement. This obligation shall apply whether Claims arise under law of tort or contract or any other legal theory, and even if the EVM fails to perform as described or expected. Safety-Critical or Life-Critical Applications. If you intend to evaluate the components for possible use in safety critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, such as devices which are classified as FDA Class III or similar classification, then you must specifically notify TI of such intent and enter into a separate Assurance and Indemnity Agreement. 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