TI LM211QD

LM111, LM211, LM311
DIFFERENTIAL COMPARATORS WITH STROBES
SLCS007H − SEPTEMBER 1973 − REVISED AUGUST 2003
Fast Response Times
Strobe Capability
Maximum Input Bias Current . . . 300 nA
Maximum Input Offset Current . . . 70 nA
D Can Operate From Single 5-V Supply
D Available in Q-Temp Automotive
− High-Reliability Automotive Applications
− Configuration Control/Print Support
− Qualification to Automotive Standards
LM111 . . . JG PACKAGE
LM211 . . . D, P, OR PW PACKAGE
LM311 . . . D, P, PS, OR PW PACKAGE
(TOP VIEW)
8
2
7
3
6
4
5
VCC+
COL OUT
BAL/STRB
BALANCE
NC
EMIT OUT
NC
VCC+
NC
1
NC
IN+
NC
IN−
NC
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
NC
VCC−
EMIT OUT
IN+
IN−
VCC−
LM111 . . . FK PACKAGE
(TOP VIEW)
NC
COL OUT
NC
BAL/STRB
NC
NC
BALANCE
NC
D
D
D
D
NC − No internal connection
description/ordering information
The LM111, LM211, and LM311 are single high-speed voltage comparators. These devices are designed to
operate from a wide range of power-supply voltages, including ±15-V supplies for operational amplifiers and
5-V supplies for logic systems. The output levels are compatible with most TTL and MOS circuits. These
comparators are capable of driving lamps or relays and switching voltages up to 50 V at 50 mA. All inputs and
outputs can be isolated from system ground. The outputs can drive loads referenced to ground, VCC+ or VCC−.
Offset balancing and strobe capabilities are available, and the outputs can be wire-OR connected. If the strobe
is low, the output is in the off state, regardless of the differential input.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright © 2003, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
LM111, LM211, LM311
DIFFERENTIAL COMPARATORS WITH STROBES
SLCS007H − SEPTEMBER 1973 − REVISED AUGUST 2003
description/ordering information
ORDERING INFORMATION
TA
VIO max
AT 25°C
PACKAGE†
PDIP (P)
7 5 mV
7.5
LM311P
Tube of 75
LM311D
Reel of 2500
LM311DR
Reel of 2000
LM311PSR
Reel of 150
LM311PW
Tube of 2000
LM311PWR
Tube of 50
LM211P
Tube of 75
LM211D
Reel of 2500
LM211DR
Reel of 150
LM211PW
Reel of 2000
LM211PWR
Tube of 75
LM211QD
Reel of 2500
LM211QDR
CDIP (JG)
Tube of 50
LM111JG
LM111JG
LCCC (FK)
Tube of 55
LM111FK
LM111FK
SOP (PS)
TSSOP (PW)
PDIP (P)
−40°C
40 C to 85°C
85 C
3 mV
SOIC (D)
TSSOP (PW)
†
−40°C
40°C to 125°C
3 mV
55°C to 125°C
−55°C
3 mV
SOIC (D)
LM311P
LM311
L311
L311
LM211P
LM211
L211
LM211Q
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
functional block diagram
BALANCE
BAL/STRB
2
TOP-SIDE
MARKING
Tube of 50
SOIC (D)
−0°C
0°C to 70°C
ORDERABLE
PART NUMBER
IN+
+
COL OUT
IN−
−
EMIT OUT
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
LM111, LM211, LM311
DIFFERENTIAL COMPARATORS WITH STROBES
SLCS007H − SEPTEMBER 1973 − REVISED AUGUST 2003
schematic
Component Count
Resistors
Diodes
EPI FET
Transistors
BAL/STRB BALANCE
450 Ω
450 Ω
20
2
1
22
VCC+
2.4
kΩ
750 Ω
2.4
kΩ
600 Ω
70 Ω
1.2 kΩ
IN+
1.2 kΩ
4 kΩ
COL OUT
IN−
400 Ω
130 Ω
60 Ω
450 Ω
250 Ω
600 Ω
200 Ω
2 kΩ
4Ω
EMIT OUT
VCC−
All resistor values shown are nominal.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
LM111, LM211, LM311
DIFFERENTIAL COMPARATORS WITH STROBES
SLCS007H − SEPTEMBER 1973 − REVISED AUGUST 2003
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage: VCC+ (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 V
VCC− (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −18 V
VCC+ − VCC− . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 V
Differential input voltage, VID (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±30 V
Input voltage, VI (either input, see Notes 1 and 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±15 V
Voltage from emitter output to VCC− . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 V
Voltage from collector output to VCC−: LM111 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 V
LM211 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 V
LM211Q . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 V
LM311 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 V
Duration of output short circuit (see Note 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 s
Package thermal impedance, θJA (see Notes 5 and 6): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97°C/W
P package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85°C/W
PS package . . . . . . . . . . . . . . . . . . . . . . . . . . . 95°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . 149°C/W
Package thermal impedance, θJC (see Notes 7 and 8): FK package . . . . . . . . . . . . . . . . . . . . . . . . . 5.61°C/W
JG package . . . . . . . . . . . . . . . . . . . . . . . . . 14.5°C/W
Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Case temperature for 60 seconds: FK package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds: J or JG package . . . . . . . . . . . . . . . . 300°C
Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds: D, P, PS, or PW package . . . . . . . . 260°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, unless otherwise noted, are with respect to the midpoint between VCC+ and VCC−.
2. Differential voltages are at IN+ with respect to IN−.
3. The magnitude of the input voltage must never exceed the magnitude of the supply voltage or ±15 V, whichever is less.
4. The output may be shorted to ground or either power supply.
5. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
6. The package thermal impedance is calculated in accordance with JESD 51-7.
7. Maximum power dissipation is a function of TJ(max), θJC, and TC. The maximum allowable power dissipation at any allowable case
temperature is PD = (TJ(max) − TC)/θJC. Operating at the absolute maximum TJ of 150°C can affect reliability.
8. The package thermal impedance is calculated in accordance with MIL-STD-883.
recommended operating conditions
VCC+ − VCC−
Supply voltage
VI
Input voltage (|VCC±| ≤ 15 V)
TA
free air temperature range
Operating free-air
POST OFFICE BOX 655303
MAX
3.5
30
V
V
VCC−+0.5
VCC+−1.5
LM111
−55
125
LM211
−40
85
LM211Q
−40
125
0
70
LM311
4
MIN
• DALLAS, TEXAS 75265
UNIT
°C
LM111, LM211, LM311
DIFFERENTIAL COMPARATORS WITH STROBES
SLCS007H − SEPTEMBER 1973 − REVISED AUGUST 2003
electrical characteristics at specified free-air temperature, VCC± = ±15 V (unless otherwise noted)
PARAMETER
LM111
LM211
LM211Q
TA†
TEST CONDITIONS
MIN
TYP‡
MAX
0.7
3
25°C
VIO
Input offset voltage
See Note 6
IIO
Input offset current
See Note 6
IIB
Input bias current
VO = 1 V to 14 V
IIL(S)
Low-level
strobe current
(see Note 7)
V(strobe) = 0.3 V,
VICR
Common-mode
input voltage range
AVD
Large-signal
differential voltage
amplification
IOH
High-level
g
(collector)
output leakage
current
Full range
25°C
4
VOL
Low level
Low-level
(collector-to-emitter)
output voltage
25°C
I(strobe) = −3
3 mA,
VID = 5 mV
VOH = 35 V,
VID = 5 mV,
VOH = 35 V
25°C
VID = −5 mV
25°C
25°C
VID = −6 mV
Full range
VID = −10 mV
Full range
10
6
100
100
−3
13
to
−14.5
13.8
to
−14.7
40
200
40
200
0.2
nA
250
300
13.8
to
−14.7
mV
50
70
13
to
−14.5
25°C
VID = −10 mV
7.5
10
−3
Full range
VCC+ = 4.5 V,
VCC− = 0,
0
IOL = 8 mA
MAX
2
150
25°C
RL = 1 kΩ
IOL = 50 mA
75
Full range
VO = 5 V to 35 V,
TYP‡
20
25°C
Full range
MIN
UNIT
4
Full range
VID ≤ −10 mV
LM311
nA
mA
V
V/mV
10
nA
0.5
μA
0.75
1.5
0.23
0.4
0.2
50
0.75
1.5
nA
V
0.23
0.4
ICC+
Supply current
from VCC+,
output low
VID = −10 mV,
No load
25°C
5.1
6
5.1
7.5
mA
ICC−
Supply current
from VCC−,
output high
VID = 10 mV,
No load
25°C
−4.1
−5
−4.1
−5
mA
†
Unless otherwise noted, all characteristics are measured with BALANCE and BAL/STRB open and EMIT OUT grounded.
Full range for LM111 is −55°C to 125°C, for LM211 is −40°C to 85°C, for LM211Q is −40°C to 125°C, and for LM311 is 0°C to 70°C.
‡ All typical values are at T = 25°C.
A
NOTES: 9. The offset voltages and offset currents given are the maximum values required to drive the collector output up to 14 V or down to
1 V with a pullup resistor of 7.5 kΩ to VCC+. These parameters actually define an error band and take into account the worst-case
effects of voltage gain and input impedance.
10. The strobe should not be shorted to ground; it should be current driven at −3 mA to −5 mA (see Figures 13 and 27).
switching characteristics, VCC± = ±15 V, TA = 25°C
PARAMETER
LM111
LM211
LM211Q
LM311
TEST CONDITIONS
UNIT
TYP
Response time, low-to-high-level output
Response time, high-to-low-level output
RC = 500 Ω to 5 V
V,
CL = 5 pF,
pF
See Note 8
115
ns
165
ns
NOTE 11: The response time specified is for a 100-mV input step with 5-mV overdrive and is the interval between the input step function and the
instant when the output crosses 1.4 V.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
LM111, LM211, LM311
DIFFERENTIAL COMPARATORS WITH STROBES
SLCS007H − SEPTEMBER 1973 − REVISED AUGUST 2003
TYPICAL CHARACTERISTICS†
INPUT OFFSET CURRENT
vs
FREE-AIR TEMPERATURE
20
500
VCC± = ±15 V
VO = 1 V to 14 V
See Note A
18
450
16
14
LM111
LM211
LM311
12
10
Condition 1
Condition 2
8
6
LM311
4
0
−60 −40 −20
0
20
400
350
300
250
LM111
LM211
150
LM311
50
40
60
80 100 120 140
NOTE A: Condition 1 is with BALANCE and BAL/STRB open.
Condition 2 is with BALANCE and BAL/STRB connected
to VCC+.
Condition 1
LM111
LM211
0
−60 −40 −20
0
20
40
60
80 100 120 140
TA − Free-Air Temperature − °C
NOTE A: Condition 1 is with BALANCE and BAL/STRB open.
Condition 2 is with BALANCE and BAL/STRB connected
to VCC+.
Figure 1
6
Condition 2
200
TA − Free-Air Temperature − °C
†
VCC± = ±15 V
VO = 1 V to 14 V
See Note A
LM311
100
LM111
LM211
2
I IB − Input Bias Current − nA
I IO − Input Offset Current − nA
INPUT BIAS CURRENT
vs
FREE-AIR TEMPERATURE
Figure 2
Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
LM111, LM211, LM311
DIFFERENTIAL COMPARATORS WITH STROBES
SLCS007H − SEPTEMBER 1973 − REVISED AUGUST 2003
TYPICAL CHARACTERISTICS†
VCC+
VI = 50 V (LM111, LM211)
40 V (LM311)
= 30 V
1 kΩ
VOLTAGE TRANSFER CHARACTERISTICS
60
50
VCC+ = 30 V
VCC− = 0
TA = 25°C
Output
VID
LM111
LM211
VO − Output Voltage − V
VCC−
LM311
40
30
Emitter Output
RL = 600 Ω
COLLECTOR OUTPUT TRANSFER CHARACTERISTIC
TEST CIRCUIT FOR FIGURE 3
Collector
Output
RL = 1 kΩ
VCC+ = 30 V
20
VID
10
Output
600 Ω
0
−1
VCC−
−0.5
0
0.5
1
VID − Differential Input Voltage − mV
EMITTER OUTPUT TRANSFER CHARACTERISTIC
TEST CIRCUIT FOR FIGURE 3
Figure 3
†
Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
7
LM111, LM211, LM311
DIFFERENTIAL COMPARATORS WITH STROBES
SLCS007H − SEPTEMBER 1973 − REVISED AUGUST 2003
TYPICAL CHARACTERISTICS
Differential
Input Voltage
OUTPUT RESPONSE FOR
VARIOUS INPUT OVERDRIVES
100 mV
VCC± = ±15 V
RC = 500 Ω to 5 V
TA = 25°C
5
VO − Output Voltage − V
VO − Output Voltage − V
Differential
Input Voltage
OUTPUT RESPONSE FOR
VARIOUS INPUT OVERDRIVES
4
3
2
5 mV
2 mV
20 mV
1
0
0
50
100
150
200
250
300
100 mV
VCC± = ±15 V
RC = 500 Ω to 5 V
TA = 25°C
5
4
20 mV
3
2
0
350
0
50
100
150
200
t − Time − ns
t − Time − ns
Figure 5
Figure 4
VCC+ = 15 V
5V
500 Ω
VO
VID
VCC− = −15 V
TEST CIRCUIT FOR FIGURES 4 AND 5
8
2 mV
5 mV
1
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
250
300
350
LM111, LM211, LM311
DIFFERENTIAL COMPARATORS WITH STROBES
SLCS007H − SEPTEMBER 1973 − REVISED AUGUST 2003
TYPICAL CHARACTERISTICS
100 mV
VCC± = ±15 V
RE = 2 kΩ to −15 V
TA = 25°C
10
5 mV
5
2 mV
0
−5
−10
−15
0
100 mV
VCC± = ±15 V
RE = 2 kΩ to −15 V
TA = 25°C
15
20 mV
VO − Output Voltage − V
VO − Output Voltage − V
15
OUTPUT RESPONSE FOR
VARIOUS INPUT OVERDRIVES
Differential
Input Voltage
Differential
Input Voltage
OUTPUT RESPONSE FOR
VARIOUS INPUT OVERDRIVES
0.2 0.4
0.6
0.8
1.0
1.2
1.4 1.6
5
2 mV
0
−5
20 mV
−10
−15
1.8
5 mV
10
0
0.2 0.4
t − Time − ms
0.6
0.8
1.0
1.2
1.4 1.6
1.8
t − Time − ms
Figure 6
Figure 7
VCC+ = 15 V
VID
VO
RE = 2 kΩ
VCC− = −15 V
TEST CIRCUIT FOR FIGURES 6 AND 7
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
9
LM111, LM211, LM311
DIFFERENTIAL COMPARATORS WITH STROBES
SLCS007H − SEPTEMBER 1973 − REVISED AUGUST 2003
TYPICAL CHARACTERISTICS
OUTPUT CURRENT AND DISSIPATION
vs
OUTPUT VOLTAGE
TA = 25°C
No Load
700
120
600
PO (right scale)
100
500
80
400
60
300
40
200
IO (left scale)
20
100
0
0
5
I CC+ − Positive Supply Current − mA
140
6
800
VCC± = ±15 V
t ≤ 10 s
VID = −10 mV
TA = 25°C
PO − Output Dissipation − mW
I O − Output Current and Dissipation − mA
160
POSITIVE SUPPLY CURRENT
vs
POSITIVE SUPPLY VOLTAGE
0
15
10
5
VID = −10 mV
4
3
VID = 10 mV
2
1
0
0
VO − Output Voltage − V
5
Figure 8
Figure 9
NEGATIVE SUPPLY CURRENT
vs
NEGATIVE SUPPLY VOLTAGE
I CC− − Negative Supply Current − mA
−6
VID = 10 mV or −10 mV
TA = 25°C
No Load
−5
−4
−3
−2
−1
0
0
−5
−10
VCC− − Negative Supply Voltage − V
Figure 10
10
10
VCC+ − Positive Supply Voltage − V
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
−15
15
LM111, LM211, LM311
DIFFERENTIAL COMPARATORS WITH STROBES
SLCS007H − SEPTEMBER 1973 − REVISED AUGUST 2003
APPLICATION INFORMATION
Figure 11 through Figure 29 show various applications for the LM111, LM211, and LM311 comparators.
VCC+
3 kΩ
3 kΩ
VCC+
20 kΩ
1 kΩ
Square Wave
Output
(fanout to two
Series 54 gates,
or equivalent)
10 kΩ
1200 pF
20 kΩ
BALANCE
39 kΩ
BAL/
STRB
NOTE: If offset balancing is not used,
the BALANCE and BAL/STRB
pins should be shorted together.
Figure 12. Offset Balancing
Figure 11. 100-kHz Free-Running Multivibrator
BAL/STRB
VCC+
TTL
Strobe
2N2222
20 kΩ
1 kΩ
Output
Input
Figure 13. Strobing
NOTE: Do not connect strobe pin
directly to ground, because the
output is turned off whenever
current is pulled from the strobe
pin.
POST OFFICE BOX 655303
VCC−
Figure 14. Zero-Crossing Detector
• DALLAS, TEXAS 75265
11
LM111, LM211, LM311
DIFFERENTIAL COMPARATORS WITH STROBES
SLCS007H − SEPTEMBER 1973 − REVISED AUGUST 2003
APPLICATION INFORMATION
5V
1 kΩ
82 kΩ
240 kΩ
Input†
Output to TTL
‡
47 kΩ
82 kΩ
†
‡
Resistor values shown are for a 0- to 30-V logic swing and a 15-V threshold.
May be added to control speed and reduce susceptibility to noise spikes
Figure 15. TTL Interface With High-Level Logic
VCC+
100 kΩ
5V
4.5 kΩ
2 kΩ
100 kHz
10 pF
2 kΩ
Output
Output
to TTL
100 kΩ
1 kΩ
0.1 μF
50 kΩ
Magnetic
Transducer
Figure 16. Detector for Magnetic Transducer
12
POST OFFICE BOX 655303
Figure 17. 100-kHz Crystal Oscillator
• DALLAS, TEXAS 75265
LM111, LM211, LM311
DIFFERENTIAL COMPARATORS WITH STROBES
SLCS007H − SEPTEMBER 1973 − REVISED AUGUST 2003
APPLICATION INFORMATION
From D/A Network
VCC+
VCC+
Output
Analog
Input†
22 kΩ
BALANCE
BAL/STRB
0.1 μF
Input
TTL
Strobe
2N2222
Sample
1 kΩ
†
Figure 18. Comparator and Solenoid Driver
Typical input current is 50 pA with inputs strobed off.
Figure 19. Strobing Both Input and Output Stages
Simultaneously
VCC+
VCC+ = 5 V
500 Ω
3.9 kΩ
3 kΩ
10 kΩ
3 kΩ
Output
2N3708
BALANCE
BAL/
STRB
Output
to MOS
Input
+
1 kΩ
1.5 μF
10 kΩ
2N2222
VCC− = −10 V
Figure 20. Low-Voltage Adjustable
Reference Supply
POST OFFICE BOX 655303
Figure 21. Zero-Crossing Detector
Driving MOS Logic
• DALLAS, TEXAS 75265
13
LM111, LM211, LM311
DIFFERENTIAL COMPARATORS WITH STROBES
SLCS007H − SEPTEMBER 1973 − REVISED AUGUST 2003
APPLICATION INFORMATION
VCC+ = 5 V
3.9 kΩ
30 kن
1 kΩ
2N3708
1 kΩ
1N914
Output
+
2N2222
1N914
Input
From
TTL
2N2222
1.5 μF
2.7 kΩ
510 Ω
2N2222
†
2.2 kΩ
Adjust to set clamp level
Figure 22. Precision Squarer
VCC+ = 5 V
5V
Opto Isolator
From
TTL
Gate
5 kΩ
1 kΩ
TTL
Output
100 Ω
1 kΩ
50 kΩ
0.01 μF
1 kΩ
Figure 23. Digital Transmission Isolator
VCC+ = 15 V
2 kΩ
Input
TL081
−
Output
10 kΩ
+
+
1 MΩ
VCC− = −15 V
1.5 μF
Figure 24. Positive-Peak Detector
14
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
LM111, LM211, LM311
DIFFERENTIAL COMPARATORS WITH STROBES
SLCS007H − SEPTEMBER 1973 − REVISED AUGUST 2003
APPLICATION INFORMATION
VCC+ = 15 V
1 MΩ
TL081
10 kΩ
2 kΩ
+
Input
Output
−
+
15 μF
VCC− = −15 V
Figure 25. Negative-Peak Detector
VCC+ = 5 V
3.9 kΩ
1N2175
2N3708
1 kΩ
Output
to TTL
2N2222
R1†
30 kΩ
†
R1 sets the comparison level. At comparison, the photodiode has less than 5 mV across it, decreasing dark current by an order of magnitude.
Figure 26. Precision Photodiode Comparator
VCC+
Inputs
BAL/STRB
‡
VCC−
TTL
Strobe
2N3708
1 kΩ
‡
Transient voltage and inductive kickback protection
Figure 27. Relay Driver With Strobe
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
15
LM111, LM211, LM311
DIFFERENTIAL COMPARATORS WITH STROBES
SLCS007H − SEPTEMBER 1973 − REVISED AUGUST 2003
APPLICATION INFORMATION
VCC+
620 Ω
BAL/STRB
300 Ω
1
100 kΩ
100 kΩ
Output
BAL/STRB
2
10 kΩ
Input
0.1 μF
300 Ω
47 Ω
620 Ω
VCC−
Figure 28. Switching Power Amplifier
VCC+
39 kΩ
620 Ω
300 kΩ
620 Ω
BAL/STRB
1
15 kΩ
Reference
VCC−
0.22 μF
620 Ω
V+
510 Ω
15 kΩ
510 Ω
Input
620 Ω
BAL/STRB
2
VCC−
39 kΩ
300 kΩ
620 Ω
620 Ω
Figure 29. Switching Power Amplifiers
16
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
Outputs
PACKAGE OPTION ADDENDUM
www.ti.com
18-Oct-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
JM38510/10304BPA
ACTIVE
CDIP
JG
8
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510
/10304BPA
LM111FKB
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
LM111FKB
LM111JG
ACTIVE
CDIP
JG
8
1
TBD
A42
N / A for Pkg Type
-55 to 125
LM111JG
LM111JGB
ACTIVE
CDIP
JG
8
1
TBD
A42
N / A for Pkg Type
-55 to 125
LM111JGB
LM211D
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
LM211
LM211DE4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
LM211
LM211DG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
LM211
LM211DR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
LM211
LM211DRE4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
LM211
LM211DRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
LM211
LM211P
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 85
LM211P
LM211PE4
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 85
LM211P
LM211PW
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
L211
LM211PWE4
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
L211
LM211PWG4
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
L211
LM211PWR
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
L211
LM211PWRE4
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
L211
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
18-Oct-2013
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM211PWRG4
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
L211
LM211QD
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
LM211Q
LM211QDG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
LM211Q
LM211QDR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
LM211Q
LM211QDRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
LM211Q
LM311D
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LM311
LM311DE4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LM311
LM311DG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LM311
LM311DR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
Level-1-260C-UNLIM
0 to 70
LM311
LM311DRE4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LM311
LM311DRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LM311
LM311P
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
LM311P
LM311PE4
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
LM311P
LM311PSR
ACTIVE
SO
PS
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
L311
LM311PSRE4
ACTIVE
SO
PS
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
L311
LM311PSRG4
ACTIVE
SO
PS
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
L311
LM311PW
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
L311
LM311PWE4
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
L311
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
18-Oct-2013
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LM311PWG4
ACTIVE
TSSOP
PW
8
LM311PWLE
OBSOLETE
TSSOP
PW
8
TBD
Call TI
Call TI
LM311PWR
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
LM311PWRE4
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
LM311PWRG4
ACTIVE
TSSOP
PW
8
2000
LM311Y
OBSOLETE
DIESALE
Y
0
M38510/10304BPA
ACTIVE
CDIP
JG
8
1
Op Temp (°C)
Device Marking
(4/5)
0 to 70
L311
Level-1-260C-UNLIM
0 to 70
L311
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
L311
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
L311
TBD
Call TI
Call TI
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510
/10304BPA
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 3
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
18-Oct-2013
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LM211 :
• Automotive: LM211-Q1
• Enhanced Product: LM211-EP
NOTE: Qualified Version Definitions:
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
• Enhanced Product - Supports Defense, Aerospace and Medical Applications
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
3-Aug-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LM211DR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM211DR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM211DRG4
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM211DRG4
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM211PWR
TSSOP
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
LM311DR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM311DRG4
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM311DRG4
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM311PSR
SO
PS
8
2000
330.0
16.4
8.2
6.6
2.5
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
3-Aug-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM211DR
SOIC
D
8
2500
340.5
338.1
20.6
LM211DR
SOIC
D
8
2500
367.0
367.0
35.0
LM211DRG4
SOIC
D
8
2500
340.5
338.1
20.6
LM211DRG4
SOIC
D
8
2500
367.0
367.0
35.0
LM211PWR
TSSOP
PW
8
2000
367.0
367.0
35.0
LM311DR
SOIC
D
8
2500
367.0
367.0
35.0
LM311DRG4
SOIC
D
8
2500
367.0
367.0
35.0
LM311DRG4
SOIC
D
8
2500
340.5
338.1
20.6
LM311PSR
SO
PS
8
2000
367.0
367.0
38.0
Pack Materials-Page 2
MECHANICAL DATA
MCER001A – JANUARY 1995 – REVISED JANUARY 1997
JG (R-GDIP-T8)
CERAMIC DUAL-IN-LINE
0.400 (10,16)
0.355 (9,00)
8
5
0.280 (7,11)
0.245 (6,22)
1
0.063 (1,60)
0.015 (0,38)
4
0.065 (1,65)
0.045 (1,14)
0.310 (7,87)
0.290 (7,37)
0.020 (0,51) MIN
0.200 (5,08) MAX
Seating Plane
0.130 (3,30) MIN
0.023 (0,58)
0.015 (0,38)
0°–15°
0.100 (2,54)
0.014 (0,36)
0.008 (0,20)
4040107/C 08/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a ceramic lid using glass frit.
Index point is provided on cap for terminal identification.
Falls within MIL STD 1835 GDIP1-T8
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated