PACKAGE OPTION ADDENDUM www.ti.com 5-Dec-2011 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) (Requires Login) 5962-89905012A ACTIVE LCCC FK 20 1 TBD Call TI Call TI 5962-8990501EA ACTIVE CDIP J 16 1 TBD Call TI Call TI UC1823J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type UC1823J883B ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type UC1823L ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type UC1823L883B ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type UC2823DW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC2823DWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC2823DWTR ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC2823DWTRG4 ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC2823N ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UC2823NG4 ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UC2823QTR ACTIVE PLCC FN 20 1000 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR UC2823QTRG3 ACTIVE PLCC FN 20 1000 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR UC3823DW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC3823DWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC3823DWTR ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC3823DWTRG4 ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC3823N ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 5-Dec-2011 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) UC3823NG4 ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UC3823Q ACTIVE PLCC FN 20 46 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR UC3823QG3 ACTIVE PLCC FN 20 46 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR UC3823QTR ACTIVE PLCC FN 20 1000 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR UC3823QTRG3 ACTIVE PLCC FN 20 1000 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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OTHER QUALIFIED VERSIONS OF UC1823, UC3823 : Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 5-Dec-2011 • Catalog: UC3823 • Military: UC1823 NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product • Military - QML certified for Military and Defense Applications Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 5-Aug-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing UC2823DWTR SOIC SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) DW 16 2000 330.0 16.4 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 10.85 10.8 2.7 12.0 16.0 Q1 UC2823QTR PLCC FN 20 1000 330.0 16.4 10.3 10.3 4.9 12.0 16.0 Q1 UC3823DWTR SOIC DW 16 2000 330.0 16.4 10.85 10.8 2.7 12.0 16.0 Q1 UC3823QTR PLCC FN 20 1000 330.0 16.4 10.3 10.3 4.9 12.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 5-Aug-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) UC2823DWTR SOIC DW 16 2000 346.0 346.0 33.0 UC2823QTR PLCC FN 20 1000 346.0 346.0 33.0 UC3823DWTR SOIC DW 16 2000 346.0 346.0 33.0 UC3823QTR PLCC FN 20 1000 346.0 346.0 33.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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