PACKAGE OPTION ADDENDUM www.ti.com 22-Apr-2011 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) 5962-9453001M2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type 5962-9453001MEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type Add to cart Add to cart UC1856J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type Add to cart UC1856J883B ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type Add to cart UC1856L OBSOLETE TO/SOT L 28 TBD Call TI Call TI Add to cart UC1856L20 ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type Add to cart UC1856L20883B ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type Add to cart UC1856L883B OBSOLETE TO/SOT L 28 UC2856DW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Add to cart UC2856DWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Add to cart UC2856DWTR ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Add to cart UC2856DWTRG4 ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Add to cart UC2856J ACTIVE CDIP J 16 1 TBD UC2856N ACTIVE PDIP N 16 25 UC2856NG4 ACTIVE PDIP N 16 UC3856DW ACTIVE SOIC DW UC3856DWG4 ACTIVE SOIC UC3856DWTR ACTIVE UC3856DWTRG4 TBD Call TI Add to cart N / A for Pkg Type Add to cart Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type Add to cart 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type Add to cart 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Add to cart DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Add to cart SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Add to cart ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Add to cart UC3856N ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type Add to cart UC3856NG4 ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type Add to cart Addendum-Page 1 A42 Call TI PACKAGE OPTION ADDENDUM www.ti.com 22-Apr-2011 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) UC3856Q ACTIVE PLCC FN 20 46 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR Add to cart UC3856QG3 ACTIVE PLCC FN 20 46 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR Add to cart (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF UC1856, UC2856, UC2856M, UC3856 : • Catalog: UC3856, UC2856 • Automotive: UC2856-Q1, UC2856-Q1 • Military: UC2856M, UC1856 Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 22-Apr-2011 NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product • Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects • Military - QML certified for Military and Defense Applications Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 7-Oct-2010 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant UC2856DWTR SOIC DW 16 2000 330.0 16.4 10.85 10.8 2.7 12.0 16.0 Q1 UC3856DWTR SOIC DW 16 2000 330.0 16.4 10.85 10.8 2.7 12.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 7-Oct-2010 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) UC2856DWTR SOIC DW 16 2000 346.0 346.0 33.0 UC3856DWTR SOIC DW 16 2000 346.0 346.0 33.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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