TI LM3209-G3

LM3209-G3
LM3209-G3 PRODUCT BRIEF Seamless-Transition Buck-Boost Converter for
Battery- Powered 3G/4G RF Power Amplifiers
Literature Number: SNVS626
LM3209-G3 PRODUCT BRIEF
Seamless-Transition Buck-Boost Converter for BatteryPowered 3G/4G RF Power Amplifiers
General Description
Features
The LM3209-G3 is buck-boost DC/DC converter designed to
generate output voltages above or below a given input voltage. It is particularly suitable for single cell Li-ion batteries for
portable applications.
The LM3209-G3 operates at a 2.4 MHz typical switching frequency in full synchronous operation providing seamless
transitions between buck and boost operating modes.
The power converter topology needs only one external inductor and two capacitors. Five internal power switches enable high overall efficiency.
The LM3209-G3 is internally compensated for buck and boost
modes of operation thus providing an optimal transient response.
The LM3209-G3 is available in an 12-bump lead-free micro
SMD package of size 2.0 mm x 2.5 mm x 0.6 mm.
Notice: This document is not a full datasheet. For more
information regarding this product or to order samples,
please contact your local National Semiconductor/Texas
Instruments sales office or visit http://www.focus.ti.com/
general/docs/dsnsuprt.tsp.
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Operates from a single Li-Ion cell: 2.7V to 5.5V
Adjustable Output Voltage: 0.6V to 4.2V
1A Maximum Load Capability for VIN ≥3.2V, VOUT = 3.6V
2.4 MHz (typ.) Switching Frequency
Seamless Buck-Boost Mode Transition
Fast Output Voltage Transition: 0.8V to 4.0V in 20 µs
High-Efficiency: 95% typ. at 3.7VIN, 3.5VOUT, at 300 mA
Cycle-by-cycle Over-Current Limit
Output Over-Voltage Clamp
Internal Compensation
12-bump micro SMD Package
Applications
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Battery-Powered 3G/4G RF Power Amplifiers
Cellular Phones
Portable Hard Disk Drives
PDAs
Typical Application Circuit
30104001
© 2011 National Semiconductor Corporation
301040
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LM3209-G3 PRODUCT BRIEF
October 19, 2011
LM3209-G3 PRODUCT BRIEF
Physical Dimensions inches (millimeters) unless otherwise noted
12–Bump Thin Micro SMD, Large Bump
X1 = 2.0 mm ± 0.030 mm
X2 = 2.5 mm ± 0.030 mm
X3 = 0.6 mm ± 0.075 mm
NS Package Number TLA12VVA
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LM3209-G3 PRODUCT BRIEF
Notes
LM3209-G3 PRODUCT BRIEF
Notes
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