MSP430G2252-DIE www.ti.com SLAS853 – APRIL 2012 MIXED SIGNAL MICROCONTROLLER FEATURES 1 • • • • • • 23 Low Supply Voltage Range: 1.8 V to 3.6 V Ultra-Low Power Consumption Five Power-Saving Modes Ultra-Fast Wake-Up From Standby Mode 16-Bit RISC Architecture Basic Clock Module Configurations – Internal Frequencies up to 16 MHz With Four Calibrated Frequencies – Internal Very-Low-Power Low-Frequency (LF) Oscillator – 32-kHz Crystal – External Digital Clock Source • • • • • • • One 16-Bit Timer_A With Three Capture/Compare Registers Up to 16 Touch-Sense Enabled I/O Pins Universal Serial Interface (USI) Supporting SPI and I2C On-Chip Comparator for Analog Brownout Detector Serial Onboard Programming, No External Programming Voltage Needed, Programmable Code Protection by Security Fuse On-Chip Emulation Logic With Spy-Bi-Wire Interface DESCRIPTION The Texas Instruments MSP430™ family of ultra-low-power microcontrollers consist of several devices featuring different sets of peripherals targeted for various applications. The architecture, combined with five low-power modes, is optimized to achieve extended battery life in portable measurement applications. The device features a powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code efficiency. The MSP430G2252 is an ultra-low-power mixed signal microcontroller with a built-in 16-bit timer, and up to 16 I/O touch sense enabled pins and built-in communication capability using the universal serial communication interface and has a versatile analog comparator. The MSP430G2252 has a 10-bit A/D converter. Typical applications include low-cost sensor systems that capture analog signals, convert them to digital values, and then process the data for display or for transmission to a host system. 1 2 3 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. MSP430 is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2012, Texas Instruments Incorporated MSP430G2252-DIE SLAS853 – APRIL 2012 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION (1) (1) (2) PRODUCT PACKAGE DESIGNATOR PACKAGE (2) MSP430G2252 TD Bare die in waffle pack ORDERABLE PART NUMBER PACKAGE QUANTITY MSP430G2252TDA1 100 MSP430G2252TDA2 10 For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum. BARE DIE INFORMATION 2 DIE THICKNESS BACKSIDE FINISH BACKSIDE POTENTIAL BOND PAD METALLIZATION COMPOSITION BOND PAD THICKNESS 11 mils. Silicon with backgrind Floating AlCu (0.5%) 800 nm Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated MSP430G2252-DIE www.ti.com SLAS853 – APRIL 2012 Table 1. Bond Pad Coordinates in Microns (1) (1) DESCRIPTION PAD NUMBER X MIN Y MIN X MAX Y MAX DVCC 1 244 2253.65 319 2328.65 P1.0/TA0CLK/ACLK/A0/CA0 2 87.4 2050.15 162.4 2125.15 P1.1/TA0.0/A1/CA1 3 87.4 1810.15 162.4 1885.15 P1.2/TA0.1/A2/CA2 4 87.4 1650.15 162.4 1725.15 P1.3/ADC10CLK/CAOUT/VREF-/VEREF-/A3/CA3 5 87.4 630.15 162.4 705.15 P1.4/TA0.2/SMCLK/A4/VREF+/VEREF+/CA4/TCK 6 87.4 260.15 162.4 335.15 P1.5/TA0.0/SCLK/A5/CA5/TMS 7 240.15 87.4 315.15 162.4 P2.0 8 650.15 87.4 725.15 162.4 P2.1 9 820.15 87.4 895.15 162.4 P2.2 10 976.15 87.4 1051.15 162.4 P2.3 11 1130.15 87.4 1205.15 162.4 P2.4 12 1610.15 87.4 1685.15 162.4 P2.5 13 1800.15 87.4 1875.15 162.4 P1.6/TA0.1/SDO/SCL/A6/CA6/TDI/TCLK 14 2204.85 87.4 2279.85 162.4 P1.7/SDI/SDA/CAOUT/A7/CA7/TDO/TDI 15 2362.6 260.15 2437.6 335.15 RST BAR/NMI/SBWTDIO 16 2362.6 710.15 2437.6 785.15 TEST/SBWTCK 17 2362.6 1254.8 2437.6 1329.8 XOUT/P2.7 18 2362.6 1583.85 2437.6 1658.85 XIN/P2.6/TA0.1 19 2362.6 2096.15 2437.6 2171.15 DVSS 20 1994.8 2253.65 2069.8 2328.65 DVSS 21 1859.8 2253.65 1934.8 2328.65 DVCC 22 404 2253.65 479 2328.65 Substrate is floating. Copyright © 2012, Texas Instruments Incorporated Submit Documentation Feedback 3 PACKAGE OPTION ADDENDUM www.ti.com 12-May-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) MSP430G2252TDA1 ACTIVE 0 100 TBD Call TI N / A for Pkg Type MSP430G2252TDA2 ACTIVE 0 10 TBD Call TI N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. 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