PEDR26T51203L-02-04 OKI Semiconductor MR26T51203L 32M–Word × 16–Bit or 64M–Word × 8–Bit Issue Date: Mar. 26, 2004 Preliminary P2ROM FEATURES · 33,554,432-word × 16-bit/67,108,864-word × 8-bit electrically switchable configuration · 2.7 V to 3.6 V power supply · Access time 120 ns MAX · Operating current 40 mA MAX (5MHz) · Standby current 20 µA MAX · Input/Output TTL compatible · Three-state output PACKAGES ·MR26T51203L-xxxMB 70-pin plastic SSOP (P-SSOP70-P-500-0.80-K-MC) P2ROM ADVANCED TECHNOLOGY P2ROM stands for Production Programmed ROM. This exclusive Oki technology utilizes factory test equipment for programming the customers code into the P2ROM prior to final production testing. Advancements in this technology allows production costs to be equivalent to MASKROM and has many advantages and added benefits over the other non-volatile technologies, which include the following; · Short lead time, since the P2ROM is programmed at the final stage of the production process, a large P2ROM inventory "bank system" of un-programmed packaged products are maintained to provide an aggressive lead-time and minimize liability as a custom product. · No mask charge, since P2ROMs do not utilize a custom mask for storing customer code, no mask charges apply. · No additional programming charge, unlike Flash and OTP that require additional programming and handling costs, the P2ROM already has the code loaded at the factory with minimal effect on the production throughput. The cost is included in the unit price. · Custom Marking is available at no additional charge. PIN CONFIGURATION (TOP VIEW) A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A23 NC NC NC NC NC GND NC NC NC NC NC BYTE# A0 D0 D8 D1 D9 Vcc D2 D10 D3 D11 GND 1 70 2 69 3 68 4 67 5 66 6 65 7 64 8 63 9 62 10 61 11 60 12 59 13 58 14 57 15 56 16 55 17 18 54 70SSOP 53 19 52 20 51 21 50 22 49 23 48 24 47 25 46 26 45 27 44 28 43 29 42 30 41 31 40 32 39 33 38 34 37 35 36 CE# A12 A13 A14 A15 Vcc A16 A17 A18 A19 A20 A21 NC NC NC NC NC GND NC NC NC NC NC A22 A24 OE# D15/A-1 D7 D14 D6 D13 D5 D12 D4 Vcc 1/4 PEDR26T51203L-02-04 OKI Semiconductor MR26T51203L / P2ROM PACKAGE DIMENSIONS (Unit: mm) P-SSOP70-500-0.80-K-MC 5 Package material Lead frame material Pin treatment Package weight (g) Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 2.15 TYP. 1/Nov. 13, 2002 Notes for Mounting the Surface Mount Type Package The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 2/4 PEDR26T51203L-02-04 OKI Semiconductor MR26T51203L / P2ROM REVISION HISTORY Document No. Page Date Previous Edition Current Edition PEDR26T51203L-02-01 Mar. 2003 – – PEDR26T51203L-02-02 Apr. 2003 1 1 PEDR26T51203L-02-03 Jun. 17, 2003 1 1, 3 PEDR26T51203L-02-04 Mar. 26, 2004 1, 2 1 Description Change operating current to 40mA from 70mA, standby current to 20µA from 10µA. Add MR26T51203L-xxxMB. Delete MR26T51203L-xxxTM. 3/4 PEDR26T51203L-02-04 OKI Semiconductor MR26T51203L / P2ROM NOTICE 1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date. 2. The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. 3. When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. 4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. 5. Neither indemnity against nor license of a third party’s industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us for any infringement of a third party’s right which may result from the use thereof. 6. The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products are not, unless specifically authorized by Oki, authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. 7. Certain products in this document may need government approval before they can be exported to particular countries. The purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. 8. No part of the contents contained herein may be reprinted or reproduced without our prior permission. Copyright 2004 Oki Electric Industry Co., Ltd. 4/4