LED Lighting IC LC5225S 13 October 2011 ◆Description ◆Package LC5225S is non-isolated type driver IC for LED lighting which can achieve high efficiency in simple circuitry. Its compact package which includes output MOSFET and controller, and low external components are suitable for small lighting equipment which requires saving space, like LED light bulb. To meet various requirements, Buck-Boost operation which has wide input/output capability is available. And also, control functions with Ref input are implemented. Its high voltage capability allows direct connection to rectified AC supply. Open protection for Buck-Boost operation and variable OCP improve safeness. ◆Applications Package: SOP8 ◆Main Specification LED Lighting equipment LED Light bulb MOSFET Output Current Main Supply Voltage 450V (MIN), 6.0Ω (MAX) 0.5A (MAX) 450V (MAX) ◆Features Buck-Boost operation In addition to normal Buck operation, Buck-Boost operation which can both Step-up and down is also available, to operate in wide input/output condition. Open protection for Buck-Boost operation Protection circuit to prevent damage when load open failure in Buck-Boost operation. Built-in reference voltage for current setting Precision and easy current setting. Sleep function Latch off the output by Ref pin input voltage. Disable function Shut off LED current by Ref pin input voltage. SOP8 Package Output MOSFET and controller are included in one package. High voltage supply input Built-in constant current controller - PWM mode current control circuitry. - Adjustable output current by input voltage to Ref pin. External PWM Dimming Variable type over current protection (OCP) - Latch type operation - OCP threshold is adjusted by setting current and temperature to ensure protection. Under voltage lockout protection (UVLO) Thermal Shutdown protection (TSD) Typical application circuit Vin FUSE AC Input Reg R1 C2 D1 VLED LC5225 C1 Ref PWM R2 VBB OUT GND CPWM SANKEN ELECTRIC CO.,LTD. http://www.sanken-ele.co.jp 1/8 L1 Sen RS LED Cin Line Filter LED Lighting IC LC5225S 13 October 2011 1 Scope The present specifications shall apply to a LED driver IC for LED lighting, LC5225S. 2 Outline Type Structure Applications Hybrid Integrated Circuit Plastic Molded (Transfer Mold) LED Lighting 3 Absolute Maximum Ratings (Ta=25℃) Parameter Terminal Symbol Ratings Units Main Power Supply Voltage 6−8 VBB 450 V Output Breakdown Voltage 5−4 Vo 450 V Output Current 5−4 IO PWM Pin Voltage 2−8 VPWM 0.5 ※1 A −0.3～VZ※2 V ※2 V -0.3～VZ Remarks Exclude Pulse Width<1µs Ref Pin Voltage 3−8 VRef Sen Pin Voltage 4−8 VSen -0.3～4.0 V Exclude Pulse Width<1µs Allowable Power Dissipation ― PD 0.85※3 W Mounted on PWB ※4 Junction Temperature ― Tj 150 ℃ Operating Temperature Range ― Ta −40～105 ℃ Tstg ― −40～150 ℃ Output current rating may be limited by duty cycle, ambient temperature, and heat sinking. Under any set of conditions, do not exceed the specified junction temperature (Tj). VZ here is breakdown voltage of zener diode which is internally connected to between pins and GND. (VZ=6.3V typ.) Maximum input current is 1mA. Allowable Power Dissipation depends on PWB pattern layout. Mounted on Sanken evaluation board. Storage Temperature Range ※1 ※2 ※3 ※4 SANKEN ELECTRIC CO.,LTD. 2/8 LED Lighting IC LC5225S 13 October 2011 4 Electrical Characteristic (Ta=25°C, VBB=140V, Unless Otherwise Noted.) Ratings Units Remarks 1.5 mA At disable 2.5 4.0 mA At enable 450 ― ― V ID=1mA RDS(on) ― 3.5 6.0 Ω ID=0.5A 4−5 VF ― 0.8 ― V IF=0.5A UVLO Threshold (Turn On) 6−8 VUVLO(on) ― 14 ― V UVLO Threshold (Turn Off) 6−8 VUVLO(off) ― 12 ― V Reg Output Voltage 1−8 VReg 9.6 10 10.4 V IReg=0mA Reg Output Current 1−8 IReg ― ― −2 mA VReg=9V Enable Voltage 3−8 VENB ― 0.15 0.19 V Sleep Voltage 3−8 VSLP 2.85 3.0 ― V Ref Pin Input Current 3−8 IRef ― 4-8 VSen 10 0.4VRef +0.03 0.83 µA Current Control Detection Voltage −10 0.4VRef −0.03 0.77 Parameter Terminal Symbol 6−8 MIN TYP MAX IBBs ― 1 6−8 IBB ― Output MOSFET Breakdown Voltage 5−4 V(BR)DSS Output MOSFET On Resistance 5−4 Body Diode Forward Voltage Power Supply Current OCP Detection Voltage 4−8 VOCP 0.4VRef ― 0.8 0.4VRef +0.7 1.5 ― V VRef=0.2~2.0V V V Ref =2.0~3.0V ― V VRef=0.2~2.0V ― V V Ref =2.0~3.0V Sen Pin Input Current 4−8 ISen −10 ― 10 µA PWM Pin Low Voltage 2−8 VPWML ― 2 ― V PWM Pin High Voltage 2−8 VPWMH ― 3 ― V PWM Pin Output Current 2−8 IPWM ― −20 ― µA PWM Blanking Time ― tBLKP ― 0.3 ― µs OCP Blanking Time ― tBLKO ― 0.2 ― µs PWM Frequency 2−8 fPWM ― ― 200 PWM Off Time ― tOff ― 17 Rise Time 5−4 tr ― Fall Time 5−4 tf Thermal Shutdown Threshold ― TTSD ※5 kHz Duty=50% ― µs CPWM=100pF 25 ― ns Io=0.4A ― 50 ― ns Io=0.4A ― 150 ― °C TTSDhys 55 ― ― ― ※5 Operation at a PWM frequency greater than fPWM is possible but not warranted. °C Temperature of Control IC Thermal Shutdown Hysteresis SANKEN ELECTRIC CO.,LTD. 3/8 LED Lighting IC LC5225S 13 October 2011 Thermal Data Temperature Rise ΔT[℃] 150 125 100 75 50 25 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 Total Power Dissipation PD[W] Allowable Package Power Dissipation PD[W] Power Dissipation versus Ambient Temperature 1 PD＝0.85W 0.8 0.6 0.4 0.2 0 0 25 50 75 100 125 150 Ambient Temperature Ta[℃] SANKEN ELECTRIC CO.,LTD. 4/8 LED Lighting IC LC5225S 13 October 2011 5 Functional Block Diagram (Pin assignment) VBB Control IC Reg TSD BandGap Reference PWM PWM_In CC Ref CC_Ref Reference Control Block OCP_Ref Current Detect Block OC Sen_In OP PWM Control Block OCP Blanking Regulator UVLO UVLO TSD PWM OCP OPP SLEEP ENABLE Logic Block Out OPP Logic Gate Driver Sen GND Pin Assignment Number Name Function 1 Reg Output of 10V Internal Regulator 2 PWM PWM Control 3 Ref Setting Output Current and Operation 4 Sen Current Sensing 5 OUT Output (Power MOSFET Drain) 6 OUT Output (Power MOSFET Drain) 7 VBB Power Supply 8 GND Ground SANKEN ELECTRIC CO.,LTD. 5/8 LED Lighting IC LC5225S 13 October 2011 6 Package 6.1 Package Drawing and Material SOP8 Package LC5225 Dimensions in mm Material of terminal: Cu Terminal treatment: Sn-Ag planting (Pb Free) Marking Position Contents Indication ① The last digit of the year 0 to 9 ② The Month 1 to 9,O,N,D ③ The week 1 to 3 Sanken Registration Number alphanumeric characters ④ ⑤ ⑥ ⑦ 6.2 Appearance The body shall be clean and shall not bear any stain, rust or flaw. 6.3 Marking The type number and lot number shall be clearly marked by laser so that cannot be erased easily. SANKEN ELECTRIC CO.,LTD. 6/8 LED Lighting IC LC5225S 13 October 2011 7 Cautions and warnings Since reliability can be affected adversely by improper storage environment and handling methods during Characteristic tests, please observe the following cautions. 7.1 Cautions for Storage Ensure that storage conditions comply with the standard temperature (5 to 35℃) and the standard relative humidity (around 40 to 75%) and avoid storage locations that experience extreme changes in temperature or humidity. Avoid locations where dust or harmful gases are present and avoid direct sunlight. Reinspect for rust in leads and solderability that have been stored for a long time. 7.2 Cautions for characteristic Tests and Handling When characteristic tests are carried out during inspection testing and other standard tests periods, protect the devices from surge of power from the testing device, shorts between the devices and the heatsink. 7.3 Considerations to protect the Products from Electrostatic Discharge When handling the devices, operator must be grounded. Grounded wrist straps be worn and should have at least 1MΩ of resistance near operators to ground to prevent shock hazard. Workbenches where the devices are handled should be grounded and be provided with conductive table and floor mats. When using measuring equipment such as a curve tracer, the equipment should also be grounded. When soldering the devices, the head of a soldering iron or a solder bath must be grounded in other to prevent leak voltage generated by them from being applied to the devices. The devices should always be stored and transported in our shipping containers or conductive containers, or be wrapped up in aluminum foil. 7.4 Insulation distance between pins The insulation distance between pins is not considered for this product. Therefore, please take measures for the insulation distance to apply to user's design standard. 7.5 Flow soldering (Wave soldering) Wave soldering (immerse the IC bodies in molten solder) may cause package crack since thermal shock is high, therefore wave soldering is not applicable. SANKEN ELECTRIC CO.,LTD. 7/8 LED Lighting IC LC5225S 13 October 2011 7.6 Others The contents in this document are subject to changes, for improvement and other purposes, without notice. Make sure that this is the latest revision of the document before use. Application and operation examples described in this document are quoted for the sole purpose of reference for the use of the products herein and Sanken can assume no responsibility for any infringement of industrial property rights, intellectual property rights or any other rights of Sanken or any third party which may result from its use. Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semiconductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems against any possible injury, death, fires or damages to the society due to device failure or malfunction. Sanken products listed in this document are designed and intended for the use as components in general purpose electronic equipment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). When considering the use of Sanken products in the applications where higher reliability is required (transportation equipment and its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), and whenever long life expectancy is required even in general purpose electronic equipment or apparatus, please contact your nearest Sanken sales representative to discuss, prior to the use of the products herein. The use of Sanken products without the written consent of Sanken in the applications where extremely high reliability is required (aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited. In the case that you use our semiconductor devices or design your products by using our semiconductor devices, the reliability largely depends on the degree of derating to be made to the rated values. Derating may be interpreted as a case that an operation range is set by derating the load from each rated value or surge voltage or noise is considered for derating in order to assure or improve the reliability. In general, derating factors include electric stresses such as electric voltage, electric current, electric power etc., environmental stresses such as ambient temperature, humidity etc. and thermal stress caused due to self-heating of semiconductor devices. For these stresses, instantaneous values, maximum values and minimum values must be taken into consideration. In addition, it should be noted that since power devices or IC’s including power devices have large self-heating value, the degree of derating of junction temperature (Tj) affects the reliability significantly. When using the products specified herein by either (i) combining other products or materials therewith or (ii) physically, chemically or otherwise processing or treating the products, please duly consider all possible risks that may result from all such uses in advance and proceed therewith at your own responsibility. Anti radioactive ray design is not considered for the products listed herein. Sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of Sanken’s distribution network. The contents in this document must not be transcribed or copied without Sanken’s written consent. SANKEN ELECTRIC CO.,LTD. 8/8