LC5540LD Series Single-Stage Power Factor Corrected Off-Line Switching Regulators Features and Benefits Description • Integrated on-width control circuit (it realizes high power factor by average current control) • Integrated startup circuit (no external startup circuit necessary) • Integrated soft-start circuit (reduces power stress during start-up on the incorporated power MOSFET and rectifier) • Integrated bias assist circuit (improves the startup performance, suppresses VCC voltage droop during operation, allows reduction of VCC capacitor value as well as use of a ceramic capacitor) • Integrated Leading Edge Blanking (LEB) circuit • Integrated maximum on-time limit circuit • Dual-chip structure, with an avalanche-guaranteed power MOSFET (allows simplified surge suppressing circuits) • Protection features: ▫ Overcurrent protection (OCP): pulse-by-pulse ▫ Overvoltage protection (OVP): latched shutdown ▫ Overload protection (OLP): latched shutdown ▫ Thermal shutdown (TSD): latched shutdown LC5540LD series is a quasi-resonant topology switching power supply IC, designed for input capacitorless applications, and making it possible for systems to comply with the harmonics standard (IEC61000-3-2 class C). It incorporates separate controller and power MOSFET chips. The controller adapts the average current control method for realizing high power factors, and the quasi-resonant topology contributes to high efficiency and low EMI noise. The rich set of protection features helps to realize low component counts, and high performance-to-cost power supply. Package: 8-pin DIP The LC5540LD devices are intended for isolated designs. The incorporated MOSFET has a VDSS(min) rating from 650 V (LC5545LD and LC5546LD) to 800 V (LC5548LD). The RDS(on)(max) is 1.9 Ω (LC5546LD) to 3.95 Ω (LC5545LD). It is capable of a maximum output power of 20 W on 230 VAC supply to 16 W on universal supply (LC5546LD) based on the thermal rating. Note that the maximum output power can be up to 120% to 140% of this value. However, it may be limited in applications with low output voltage or short duty cycle. Applications • LED lighting fixtures • LED light bulbs Not to scale Typical Application F1 VAC L1 C11 D1 D2 D3 D4 T1 L2 C1 C8 D8 R5 R8 R10 PC2 C2 C9 Q1 C10 D5 U1 LC554xLD 8 S/GND 5 NF 6 D/ST OVP R1 R9 Control Part DZ2 R7 R2 (Rocp) C17 R4 PC1 D7 C7 R3 LC5540LD-DS R12 C13 SANKEN ELECTRIC CO., LTD. R14 R17 R15 R18 - DZ1 S/GND VCC OCP FB 1 2 3 4 C6 R11 C12 R6 D6 C5 PC1 C4 PC2 C3 LED R13 D9 U2 + C14 C15 R16 C16 R19 R20 LC5540LD Series Single-Stage Power Factor Corrected Off-Line Switching Regulators Selection Guide MOSFET VDSS(min) (V) Part Number LC5545LD RDS(on) (max) (Ω) 650 LC5546LD LC5548LD 800 PWM Operation Frequency, fOSC(typ) (kHz) On-Time tON(MAX)(typ) (μs) POUT* (W) 230 VAC Universal 3.95 72 9.3 13 10 1.9 60 11.2 20 16 3.5 72 9.3 13 10 *Based on the thermal rating; the allowable maximum output power can be up to 120% to 140% of this value. However, maximum output power may be limited in such an application with low output voltage or short duty cycle. The polarity value for current specifies a sink as "+," and a source as “−,” referencing the IC. Absolute Maximum Ratings Unless specifically noted, TA is 25°C Characteristic Symbol Notes Pins LC5545LD Drain Current1 IDPeak LC5546LD Single pulse 8–1 LC5548LD Single Pulse Avalanche Energy2 EAS LC5545LD ILPeak = 2.0 A, VDD = 99 V, L = 10 mH LC5546LD ILPeak = 2.7 A, VDD = 99 V, L = 10 mH LC5548LD ILPeak = 2.3 A, VDD = 99 V, L = 10 mH 8–1 Rating Unit 2.5 A 4.0 A 2.6 A 47 mJ 86 mJ 56 mJ Input Voltage for Control Part (MIC) VCC 2–1 35 V OCP Pin Voltage VOCP 3–1 −1.0 to 5.0 V FB Pin Voltage VFB 4–1 −0.3 to 7.0 V OVP Pin Voltage VOVP 6–1 −0.3 to 5.0 V Allowable Power Dissipation of MOSFET3 PD1 8–1 0.97 W Operating Ambient Temperature TOP ― −55 to 125 °C Storage Temperature Tstg ― −55 to 125 °C Channel Temperature Tch ― 150 °C Mounted on a 15 mm × 15 mm PCB 1Refer to MOSFET Safe Operating Area Curve. 2Refer to MOSFET Avalanche Energy Derating Coefficient Curve. 3Refer to MOSFET Temperature versus Power Dissipation Curve. LC5540LD-DS SANKEN ELECTRIC CO., LTD. 2 LC5540LD Series Single-Stage Power Factor Corrected Off-Line Switching Regulators Electrical Characteristics of Control Part (MIC) TA = 25°C, VCC = 20 V, unless otherwise specified Characteristic Symbol Test Conditions Pins Min. Typ. Max. Unit Power Supply Startup Operation Operation Start Voltage VCC(ON) 2–1 13.8 15.1 17.3 V Operation Stop Voltage* VCC(OFF) 2–1 8.4 9.4 10.7 V ICC(ON) 2–1 – – 4.7 mA VSTARTUP 8–1 18 21 24 V 2–1 −8.5 −4.0 −1.5 mA 2–1 9.5 11.0 12.5 V 60 72 84 kHz 50 60 70 kHz 60 72 84 kHz Circuit Current in Operation Startup Circuit Operation Voltage Startup Current Startup Current Threshold Biasing Voltage* ICC(STARTUP) VCC = 13 V VCC(BIAS) Normal Operation LC5545LD PWM Operation Frequency fOSC LC5546LD 8–1 LC5548LD LC5545LD 8.0 9.3 11.2 μs 8–1 9.0 11.2 13.4 μs 8.0 9.3 11.2 μs VFB(MIN) 4–1 0.50 0.85 1.20 V Maximum Feedback Current IFB(MAX) 4–1 –40 –25 –10 μA Leading Edge Blanking Time tON(LEB) 3–1 − 600 − ns Quasi-Resonant Operation Threshold Voltage-1 VBD(TH1) 3–1 0.14 0.24 0.34 V Quasi-Resonant Operation Threshold Voltage-2 VBD(TH2) 3–1 0.11 0.16 0.21 V OCP Pin Overcurrent Protection (OCP) Threshold Voltage VOCP 3–1 −0.66 −0.60 −0.54 V OCP Pin Source Current IOCP 3–1 −120 −40 −10 μA OCP Pin Overvoltage Protection (OVP) Operation Voltage VBD(OVP) 3–1 2.2 2.6 3.0 V Overload Protection (OLP) Threshold Voltage VFB(OLP) 4–1 4.1 4.5 4.9 V OVP Pin OVP Threshold Voltage VOVP(OVP) 6–1 1.6 2.0 2.4 V VCC Pin OVP Threshold Voltage VCC(OVP) 2–1 28.5 31.5 34.0 V TJ(TSD) – 135 – – °C Maximum On-Time tON(MAX) FB Pin Control Minimum Voltage LC5546LD LC5548LD Protected Operation Thermal Shutdown Activating Temperature *VCC(BIAS) > VCC(OFF) always. LC5540LD-DS SANKEN ELECTRIC CO., LTD. 3 LC5540LD Series Single-Stage Power Factor Corrected Off-Line Switching Regulators ELECTRICAL CHARACTERISTICS (MOSFET) TA = 25°C, unless otherwise specified Characteristic Symbol Test Conditions Pins LC5545LD Drain-to-Source Breakdown Voltage VDSS LC5546LD 8–1 LC5548LD Drain Leakage Current IDSS 8–1 LC5545LD On-Resistance Switching Time RDS(ON) tr LC5546LD 8–1 Unit ― V 650 ― ― V 800 ― ― V ― ― 300 μA ― ― 3.95 Ω Ω ― 1.9 ― ― 3.5 Ω LC5545LD ― ― 250 ns LC5546LD LC5546LD LC5548LD LC5540LD-DS Max. ― ― LC5545LD Rθch-c Typ. 650 LC5548LD 8–1 LC5548LD Thermal Resistance Min. Between channel and case; case temperature, TC , measured at the center of the marking side SANKEN ELECTRIC CO., LTD. ― ― ― 400 ns ― ― 400 ns ― ― 42 °C/W ― ― 35.5 °C/W ― ― 40 °C/W 4 LC5540LD Series Single-Stage Power Factor Corrected Off-Line Switching Regulators Characteristic Performance LC5545LD MOSFET Safe Operating Area Curve 100 100 10 80 Drain Current, ID (A) Safe Operating Area Temperature Derating Coefficient (%) S. O. A. Temperature Derating Coefficient Curve 60 40 20 Drain current limited by on-resistance 1 0.1 ms 1 ms 0.1 0 0 25 50 75 100 125 150 To use this graph, apply the S.O.A temperature derating coefficient taken from the graph at the left Channel Temperature, Tch (°C) 0.01 1 10 100 1000 Drain-to-Source Voltage, VDS (V) 100 MOSFET Temperature versus Power Dissipation Curve Allowable Power Dissipation, PD1 (W) EAS Temperature Derating Coefficient (%) MOSFET Avalanche Energy Derating Coefficient Curve 80 60 40 20 0 25 50 75 100 125 150 1.2 1.0 0.8 0.6 0.4 0.2 0 0 Transient Thermal Resistance, Rθch-c (°C/W) Channel Temperature, Tch (°C) 10 25 50 75 100 125 150 Ambient Temperature, TA (°C) Transient Thermal Resistance Curve 1 0.1 0.01 10–6 10–5 10–4 10–3 10–2 10–1 Time (s) LC5540LD-DS SANKEN ELECTRIC CO., LTD. 5 LC5540LD Series Single-Stage Power Factor Corrected Off-Line Switching Regulators Characteristic Performance LC5546LD MOSFET Safe Operating Area Curve 100 100 Drain current limited by on-resistance 10 80 Drain Current, ID (A) Safe Operating Area Temperature Derating Coefficient (%) S. O. A. Temperature Derating Coefficient Curve 60 40 20 0.1 ms 1 ms 1 0.1 0 0 25 50 75 100 125 150 To use this graph, apply the S.O.A temperature derating coefficient taken from the graph at the left Channel Temperature, Tch (°C) 0.01 1 10 100 1000 Drain-to-Source Voltage, VDS (V) 100 MOSFET Temperature versus Power Dissipation Curve Allowable Power Dissipation, PD1 (W) EAS Temperature Derating Coefficient (%) MOSFET Avalanche Energy Derating Coefficient Curve 80 60 40 20 0 25 50 75 100 125 150 1.2 1.0 0.8 0.6 0.4 0.2 0 0 Transient Thermal Resistance, Rθch-c (°C/W) Channel Temperature, Tch (°C) 10 25 50 75 100 125 150 Ambient Temperature, TA (°C) Transient Thermal Resistance Curve 1 0.1 0.01 10–6 10–5 10–4 10–3 10–2 10–1 Time (s) LC5540LD-DS SANKEN ELECTRIC CO., LTD. 6 LC5540LD Series Single-Stage Power Factor Corrected Off-Line Switching Regulators Characteristic Performance LC5548LD MOSFET Safe Operating Area Curve 100 100 Drain current limited by on-resistance 10 80 Drain Current, ID (A) Safe Operating Area Temperature Derating Coefficient (%) S. O. A. Temperature Derating Coefficient Curve 60 40 20 0.1 ms 1 ms 1 0.1 0 0 25 50 75 100 125 150 To use this graph, apply the S.O.A temperature derating coefficient taken from the graph at the left Channel Temperature, Tch (°C) 0.01 1 10 100 1000 Drain-to-Source Voltage, VDS (V) 100 MOSFET Temperature versus Power Dissipation Curve Allowable Power Dissipation, PD1 (W) EAS Temperature Derating Coefficient (%) MOSFET Avalanche Energy Derating Coefficient Curve 80 60 40 20 0 25 50 75 100 125 150 1.2 1.0 0.8 0.6 0.4 0.2 0 0 Transient Thermal Resistance, Rθch-c (°C/W) Channel Temperature, Tch (°C) 10 25 50 75 100 125 150 Ambient Temperature, TA (°C) Transient Thermal Resistance Curve 1 0.1 0.01 10–6 10–5 10–4 10–3 10–2 10–1 Time (s) LC5540LD-DS SANKEN ELECTRIC CO., LTD. 7 LC5540LD Series Single-Stage Power Factor Corrected Off-Line Switching Regulators Functional Block Diagram VCC ② Control Part ⑧ D/ST START UP TSD UVLO Reg Drv Bias OVP OVP ⑥ ① S/GND S RQ OCP ③ Bottom Detection NF ⑤ OCP OSC OLP LEB Feedback Control ④ FB Reg Pin List Table Pin-out Diagram S/GND 1 8 D/ST VCC 2 OCP 3 FB 4 LC5540LD-DS 6 OVP Number Name 1 S/GND 2 VCC Supply voltage input and Overvoltage Protection (OVP) signal input 3 OCP Overcurrent Protection (OCP), quasi-resonant signal input, and Overvoltage Protection (OVP) signal input 4 FB Feedback phase-compensation input and Overload Protection (OLP) signal input 5 NF No function; must be externally connected to S/GND pin with as short a trace as possible, for stable operation of the IC 6 OVP 7 – 8 D/ST 5 NF Function MOSFET source and GND pin for the Control Part Overvoltage Protection (OVP) signal input Pin removed MOSFET drain pin and input of the startup current SANKEN ELECTRIC CO., LTD. 8 LC5540LD Series Single-Stage Power Factor Corrected Off-Line Switching Regulators Package Outline Drawing, DIP8 9.4 ±0.3 8 5 LC 6.5 ±0.2 a b c 1.0 +0.3 -0.05 4 1 +0.3 1.52 -0.05 3.3 ±0.2 7.5 ±0.5 4.2 ±0.3 3.4 ±0.1 (7.6 TYP) 0.2 5 + 0. - 0.01 5 ０～１５° ０～１５° 2.54 TYP 0.89 TYP 0.5 ±0.1 Unit： mm Leadframe Material： Cu Pin treatment: Solder Plating Weight： Approximately 0.51g a: Part #: 554x b: Lot number 3 digits, plus L st 1 letter: Last digit of year nd 2 letter: Month Jan to September: Numeric October: O November: N December: D rd 3 letter: Week Date 1 to 10: 1 Date 11 to 20: 2 Date 21 to 31: 3 c: Internal use control number Pb-free. Device composition compliant with the RoHS directive. LC5540LD-DS SANKEN ELECTRIC CO., LTD. 9 LC5540LD Series Single-Stage Power Factor Corrected Off-Line Switching Regulators Because reliability can be affected adversely by improper storage environments and handling methods, please observe the following cautions. Cautions for Storage • Ensure that storage conditions comply with the standard temperature (5°C to 35°C) and the standard relative humidity (around 40% to 75%); avoid storage locations that experience extreme changes in temperature or humidity. • Avoid locations where dust or harmful gases are present and avoid direct sunlight. • Reinspect for rust on leads and solderability of products that have been stored for a long time. Cautions for Testing and Handling When tests are carried out during inspection testing and other standard test periods, protect the products from power surges from the testing device, shorts between the product pins, and wrong connections. Remarks About Using Silicone Grease with a Heatsink • When silicone grease is used in mounting this product on a heatsink, it shall be applied evenly and thinly. If more silicone grease than required is applied, it may produce excess stress. • Volatile-type silicone greases may crack after long periods of time, resulting in reduced heat radiation effect. Silicone grease with low consistency (hard grease) may cause cracks in the mold resin when screwing the product to a heatsink. • Our recommended silicone greases for heat radiation purposes, which will not cause any adverse effect on the product life, are indicated below: Soldering • When soldering the products, please be sure to minimize the working time, within the following limits: 260±5°C 10±1 s (Flow, 2 times) 380±10°C 3.5±0.5 s (Solder iron, 1 time) • Soldering iron should be at a distance of at least 1.5 mm from the body of the products Electrostatic Discharge • When handling the products, the operator must be grounded. Grounded wrist straps worn should have at least 1 MΩ of resistance from the operator to ground to prevent shock hazard, and it should be placed near the operator. • Workbenches where the products are handled should be grounded and be provided with conductive table and floor mats. • When using measuring equipment such as a curve tracer, the equipment should be grounded. • When soldering the products, the head of soldering irons or the solder bath must be grounded in order to prevent leak voltages generated by them from being applied to the products. • The products should always be stored and transported in Sanken shipping containers or conductive containers, or be wrapped in aluminum foil. Type Suppliers G746 Shin-Etsu Chemical Co., Ltd. YG6260 MOMENTIVE Performance Materials, Inc SC102 Dow Corning Toray Co., Ltd. LC5540LD-DS SANKEN ELECTRIC CO., LTD. 10 LC5540LD Series Single-Stage Power Factor Corrected Off-Line Switching Regulators • The contents in this document are subject to changes, for improvement and other purposes, without notice. Make sure that this is the latest revision of the document before use. • Application and operation examples described in this document are quoted for the sole purpose of reference for the use of the products herein and Sanken can assume no responsibility for any infringement of industrial property rights, intellectual property rights or any other rights of Sanken or any third party which may result from its use. • Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semiconductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems against any possible injury, death, fires or damages to the society due to device failure or malfunction. • Sanken products listed in this document are designed and intended for the use as components in general purpose electronic equipment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). When considering the use of Sanken products in the applications where higher reliability is required (transportation equipment and its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), and whenever long life expectancy is required even in general purpose electronic equipment or apparatus, please contact your nearest Sanken sales representative to discuss, prior to the use of the products herein. The use of Sanken products without the written consent of Sanken in the applications where extremely high reliability is required (aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited. • In the case that you use our semiconductor devices or design your products by using our semiconductor devices, the reliability largely depends on the degree of derating to be made to the rated values. Derating may be interpreted as a case that an operation range is set by derating the load from each rated value or surge voltage or noise is considered for derating in order to assure or improve the reliability. In general, derating factors include electric stresses such as electric voltage, electric current, electric power etc., environmental stresses such as ambient temperature, humidity etc. and thermal stress caused due to self-heating of semiconductor devices. For these stresses, instantaneous values, maximum values and minimum values must be taken into consideration. In addition, it should be noted that since power devices or IC’s including power devices have large self-heating value, the degree of derating of junction temperature (Tj) affects the reliability significantly. • When using the products specified herein by either (i) combining other products or materials therewith or (ii) physically, chemically or otherwise processing or treating the products, please duly consider all possible risks that may result from all such uses in advance and proceed therewith at your own responsibility. • Anti radioactive ray design is not considered for the products listed herein. • Sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of Sanken’s distribution network. • The contents in this document must not be transcribed or copied without Sanken’s written consent. LC5540LD-DS SANKEN ELECTRIC CO., LTD. 11