SANKEN SI-3000LU_11

1-1-4 Linear Regulator ICs
SI-3000LU Series Surface-Mount, Low Current Consumption, Low Dropout Voltage
■Features
■Absolute Maximum Ratings
• Compact surface-mount package (SOT89-5)
Parameter
• Output current: 250 mA
• Low current consumption lq (OFF) ≤ 1µA (VC =
0 V)
• Low dropout voltage: VDIF ≤ 0.5 V (at IO = 250
mA)
• Output voltage range (1.5V to 15V)
• Built-in drooping-type-overcurrent and thermal
protection circuits
(Ta=25°C)
Symbol
Ratings
Unit
V
DC Input Voltage
VIN
18
Output control terminal voltage
VC
VIN
V
DC Output Current
IO
250
mA
Power Dissipation
PD*1
0.75
W
Junction Temperature
Tj*2
–40 to +135
°C
Storage Temperature
Tstg*2
–40 to +125
°C
Thermal Resistance (Junction to Ambient Air)
θ j-a*1
146
°C/W
*1: When mounted on glass-epoxy board 40 × 40 mm (copper laminate area 2%).
*2: Thermal protection circuits may operate if the junction temperature exceeds 135°C.
■Applications
• Auxiliary power supplies for PC
• Battery-driven electronic equipment
■Recommended Operating Conditions
Ratings
Parameter
Symbol
min.
Unit
max.
Input Voltage
VIN
*2, *3
VO+2*1
V
DC Output Current
IO
0
250
mA
Operating Ambient Temperature
Top
–20
85
°C
*1: VIN (max) and IO (max) are restricted by the relation PD = (VIN - VO) × IO.
Calculate these values referring to the reference data on page 67.
*2: Refer to the Dropout Voltage parameter.
*3: For the SI-3012LU, set the input voltage to Vin ≥ 2.4 V, and secure the minimum voltage as explained in "Setting DC Input Voltage" section in Linear Regulator Application Note.
■Electrical Characteristics
(Ta=25°C, VC=2V, unless otherwise specified)
Ratings
Parameter
Symbol
SI-3012LU(Variable)
min.
VADJ
Reference Voltage
1.210
Conditions
max.
1.250
1.290
VIN=VO+1V, IO =10mA
VDIF
Dropout Voltage
Conditions
IO=100mA(VO =3.3V)
Conditions
IO=250mA(VO =3.3V)
0.5
∆VLINE
∆VLOAD
∆VO/∆Ta
±0.3
Tj=0 to 100°C
Conditions
RREJ
Iq
150
µA
VIN=VO+1V, IO =0mA
VC=2V, R2=100kΩ
Conditions
Iq(OFF)
1
Conditions
VIN=VO+1V, VC=0V
260
Conditions
VC, IH
Control Voltage (Output OFF)*2
VC, IL
0.8
IC, IH
40
Control Current (Output ON)
Control Current (Output OFF)
Conditions
IC, IL
Conditions
2.0
VC=2V
0
VC=0V
µA
mA
VIN=VO +1V
ON)*2
Control Voltage (Output
Terminal
dB
VIN=VO +1V ,
f=100 to 120HZ( VO=3.3V)
Conditions
IS1
mV/ °C
55
Ripple Rejection
Overcurrent Protection
Starting Current*1
mV
VIN=VO +1V,
IO=1 to 250mA( V O=3.3V)
Conditions
Circuit Current at Output OFF
mV
20
Load Regulation
Quiescent Circuit
Current
V
10
VIN=VO+1 to VO+5V,
IO=10mA( VO=3.3V)
Conditions
Temperature Coefficient of
Reference Voltage
V
0.3
Line Regulation
VC
Unit
typ.
–5
V
µA
µA
*1: Is1 is specified at the 5% drop point of output voltage VO on the condition that VIN = 3.3 V, and IO = 10 mA.
*2: Output is OFF when the output control terminal (VC terminal) is open. Each input level is equivalent to LS-TTL level. Therefore, the device can be driven directly by LS-TTLs.
66
ICs
SI-3000LU Series
■External Dimensions (SOT89-5)
(Unit : mm)
4.5±0.05
1.6±0.05
4.2±0.05
r
w
e
4.2±0.05
4.3±0.05
2.5±0.05
4.7±0.05
q
Plastic Mold Package Type
Flammability: UL94V-0
Product Mass: Approx. 0.05g
1.5±0.05
1.5±0.05
0.4±0.05
1.5±0.05
4.2±0.05
Pin Assignment
q ADJ
w GND
e VC
r VIN
t VO
0.1±0.05
5
±0.0 )
.0
( φ1
0.4±0.03
0.90±0.1
4.2±0.05
0.90±0.1
0.40
4.2±0.05
t
■Block Diagram
SI-3012LU
VIN 4
5 VO
VC 3
1 ADJ
TSD
+
–
2 GND
REF
■Typical Connection Diagram
SI-3012LU
+
CIN
5
4
R1
3
1
2
VIN
CO: Output capacitor (10 µF or larger)
For SI-3000LU series, Co has to be a low ESR capacitor such as a
ceramic capacitor.
CIN: Input capacitor (10 µF approx.)
Setting of SI-3012LU output voltage (recommended voltage: 1.5 V to 15 V)
R1 and R2: Resistors for output setting
The output voltage can be set by connecting R1 and R2 as shown in the
diagram on the left.
R2: 100 kΩ is recommended
R1=(VO–VADJ)/(VADJ/R2)
VO
ADJ
R2
GND
Load
VIN
•
VC
■Reference Data
Copper Laminate Area vs Power Dissipation
Tj=100°C PCB size 40×40
1
Power Dissipation PD (W)
Ta=25°C
0.9
Ta=40°C
0.8
Ta=60°C
Ta=85°C
0.7
0.6
Case temperature Tc
measurement point
0.5
0.4
0.3
• A monolithic ICs mounts an inner frame stage that is connected to the GND
pin (pin 2). Therefore, enlarging the copper laminate area connected to the
GND pin improves heat radiation effect.
• Obtaining the junction temperature
Measure the temperature TC at the lead part of the GND pin (pin 2) with a
thermocouple, etc. Then, substitute this value in the following formula to
obtain the junction temperature.
T j =PD ×θ j–c+Tc ( θ j–c=5° C/W)
0.2
0.1
0
10
100
1000
Copper Laminate Area (mm2)
ICs
67