1-1-4 Linear Regulator ICs SI-3000LU Series Surface-Mount, Low Current Consumption, Low Dropout Voltage ■Features ■Absolute Maximum Ratings • Compact surface-mount package (SOT89-5) Parameter • Output current: 250 mA • Low current consumption lq (OFF) ≤ 1µA (VC = 0 V) • Low dropout voltage: VDIF ≤ 0.5 V (at IO = 250 mA) • Output voltage range (1.5V to 15V) • Built-in drooping-type-overcurrent and thermal protection circuits (Ta=25°C) Symbol Ratings Unit V DC Input Voltage VIN 18 Output control terminal voltage VC VIN V DC Output Current IO 250 mA Power Dissipation PD*1 0.75 W Junction Temperature Tj*2 –40 to +135 °C Storage Temperature Tstg*2 –40 to +125 °C Thermal Resistance (Junction to Ambient Air) θ j-a*1 146 °C/W *1: When mounted on glass-epoxy board 40 × 40 mm (copper laminate area 2%). *2: Thermal protection circuits may operate if the junction temperature exceeds 135°C. ■Applications • Auxiliary power supplies for PC • Battery-driven electronic equipment ■Recommended Operating Conditions Ratings Parameter Symbol min. Unit max. Input Voltage VIN *2, *3 VO+2*1 V DC Output Current IO 0 250 mA Operating Ambient Temperature Top –20 85 °C *1: VIN (max) and IO (max) are restricted by the relation PD = (VIN - VO) × IO. Calculate these values referring to the reference data on page 67. *2: Refer to the Dropout Voltage parameter. *3: For the SI-3012LU, set the input voltage to Vin ≥ 2.4 V, and secure the minimum voltage as explained in "Setting DC Input Voltage" section in Linear Regulator Application Note. ■Electrical Characteristics (Ta=25°C, VC=2V, unless otherwise specified) Ratings Parameter Symbol SI-3012LU(Variable) min. VADJ Reference Voltage 1.210 Conditions max. 1.250 1.290 VIN=VO+1V, IO =10mA VDIF Dropout Voltage Conditions IO=100mA(VO =3.3V) Conditions IO=250mA(VO =3.3V) 0.5 ∆VLINE ∆VLOAD ∆VO/∆Ta ±0.3 Tj=0 to 100°C Conditions RREJ Iq 150 µA VIN=VO+1V, IO =0mA VC=2V, R2=100kΩ Conditions Iq(OFF) 1 Conditions VIN=VO+1V, VC=0V 260 Conditions VC, IH Control Voltage (Output OFF)*2 VC, IL 0.8 IC, IH 40 Control Current (Output ON) Control Current (Output OFF) Conditions IC, IL Conditions 2.0 VC=2V 0 VC=0V µA mA VIN=VO +1V ON)*2 Control Voltage (Output Terminal dB VIN=VO +1V , f=100 to 120HZ( VO=3.3V) Conditions IS1 mV/ °C 55 Ripple Rejection Overcurrent Protection Starting Current*1 mV VIN=VO +1V, IO=1 to 250mA( V O=3.3V) Conditions Circuit Current at Output OFF mV 20 Load Regulation Quiescent Circuit Current V 10 VIN=VO+1 to VO+5V, IO=10mA( VO=3.3V) Conditions Temperature Coefficient of Reference Voltage V 0.3 Line Regulation VC Unit typ. –5 V µA µA *1: Is1 is specified at the 5% drop point of output voltage VO on the condition that VIN = 3.3 V, and IO = 10 mA. *2: Output is OFF when the output control terminal (VC terminal) is open. Each input level is equivalent to LS-TTL level. Therefore, the device can be driven directly by LS-TTLs. 66 ICs SI-3000LU Series ■External Dimensions (SOT89-5) (Unit : mm) 4.5±0.05 1.6±0.05 4.2±0.05 r w e 4.2±0.05 4.3±0.05 2.5±0.05 4.7±0.05 q Plastic Mold Package Type Flammability: UL94V-0 Product Mass: Approx. 0.05g 1.5±0.05 1.5±0.05 0.4±0.05 1.5±0.05 4.2±0.05 Pin Assignment q ADJ w GND e VC r VIN t VO 0.1±0.05 5 ±0.0 ) .0 ( φ1 0.4±0.03 0.90±0.1 4.2±0.05 0.90±0.1 0.40 4.2±0.05 t ■Block Diagram SI-3012LU VIN 4 5 VO VC 3 1 ADJ TSD + – 2 GND REF ■Typical Connection Diagram SI-3012LU + CIN 5 4 R1 3 1 2 VIN CO: Output capacitor (10 µF or larger) For SI-3000LU series, Co has to be a low ESR capacitor such as a ceramic capacitor. CIN: Input capacitor (10 µF approx.) Setting of SI-3012LU output voltage (recommended voltage: 1.5 V to 15 V) R1 and R2: Resistors for output setting The output voltage can be set by connecting R1 and R2 as shown in the diagram on the left. R2: 100 kΩ is recommended R1=(VO–VADJ)/(VADJ/R2) VO ADJ R2 GND Load VIN • VC ■Reference Data Copper Laminate Area vs Power Dissipation Tj=100°C PCB size 40×40 1 Power Dissipation PD (W) Ta=25°C 0.9 Ta=40°C 0.8 Ta=60°C Ta=85°C 0.7 0.6 Case temperature Tc measurement point 0.5 0.4 0.3 • A monolithic ICs mounts an inner frame stage that is connected to the GND pin (pin 2). Therefore, enlarging the copper laminate area connected to the GND pin improves heat radiation effect. • Obtaining the junction temperature Measure the temperature TC at the lead part of the GND pin (pin 2) with a thermocouple, etc. Then, substitute this value in the following formula to obtain the junction temperature. T j =PD ×θ j–c+Tc ( θ j–c=5° C/W) 0.2 0.1 0 10 100 1000 Copper Laminate Area (mm2) ICs 67