SANKEN SI

1-1-1 Linear Regulator ICs
SI-3000ZD Series Surface-Mount, Low Dropout Voltage Linear Regulator ICs
■Features
■Absolute Maximum Ratings
• Compact surface-mount package (TO263-5)
Parameter
(Ta=25°C)
Symbol
Ratings
Unit
VIN*1
10
V
Output Control Terminal Voltage
VC
6
V
DC Output Current
IO*1
3.0
A
• Low circuit current at output OFF: Iq (OFF) ≤ 1µA
Power Dissipation
PD*3
3
W
• Built-in overcurrent and thermal protection
circuits
Junction Temperature
Tj
–30 to +125
°C
Operating Ambient Temperature
Top
–30 to +85
°C
Storage Temperature
Tstg
–40 to +125
°C
Thermal Resistance (Junction to Ambient Air)
θ j-a
33.3
°C/W
Thermal Resistance (Junction to Case)
θ j-c
3
°C/W
DC Input Voltage
• Output current: 3.0A
• Low dropout voltage: VDIF ≤ 0.6V (at IO = 3.0A)
■Applications
• Secondary stabilized power supply (local
power supply)
■Recommended Operating Conditions
Parameter
Symbol
Input Voltage
Ratings
*2
VIN
Output Current
Unit
to 6*1
IO
0 to 3
A
Top (a)
–20 to +85
°C
Operating Junction Temperature
Top (j)
–20 to +100
°C
Output Voltage Variable Range
VOADJ
1.2 to 5
V
Operating Ambient Temperature
Remarks
V
Only for SI-3011ZD. Refer to the block diagram.
*1: VIN (max) and IO (max) are restricted by the relation PD = (VIN - VO) × IO.
*2: Set the input voltage to 2.4V or higher when setting the output voltage to 2.0V or lower (SI-3011ZD).
*3: When mounted on glass-epoxy board of 40 × 40mm (copper laminate area 100%).
■Electrical Characteristics
(Ta=25°C, VC=2V unless otherwise specified)
Ratings
Parameter
Symbol
SI-3011ZD (Variable type)
min.
Output Voltage
(Reference Voltage VADJ for SI-3011ZD)
min.
1.100
1.122
3.234
VIN=VO+1V, IO=10mA
VDIF
1
Conditions
RREJ
Conditions
*4
VC, IH
Control Voltage (Output OFF)*3
VC, IL
VC
Control Current(Output ON)
Terminal
Control Current(Output OFF)
VIN=5V, VC=0V
±0.3
±0.3
Tj=0 to 100°C
Tj=0 to 100°C
60
60
VIN=VO+1V, f=100 to 120HZ, IO=0.1A
VIN=5V, f=100 to 120HZ, IO=0.1A
0.8
100
100
VC=2.7V
–5
0
VC=0V
VC=2.7V
–5
0
VC=0V
mV
V
mA
µA
A
2
0.8
mV
dB
VIN=5V
2
V
mV/ °C
3.2
IC, IH
IC, IL
1.5
1
VIN=VO+1V
Conditions
Conditions
1
VIN=5V, IO=0A, VC=2V
3.2
Conditions
Control Voltage (Output ON)*3
1.5
VIN=VO+1V, VC=0V
∆VO/∆Ta
IS1
0.6
IO=3A
1
Conditions
Current*2
VIN=5V, IO=0 to 3A
VIN=VO+1V, IO=0A, VC=2V
Iq (OFF)
Ripple Rejection
40
0.6
Iq
Temperature Coefficient
of Output Voltage
10
IO=3A (VO=2.5V)
Conditions
Circuit Current at Output OFF
3.366
VIN=4.5 to 5.5V, IO=10mA
VIN=3.3V, IO=0 to 3A (VO=2.5V)
Conditions
Quiescent Circuit Current
3.300
40
Conditions
Dropout Voltage
max.
VIN=5V, IO=10mA
VIN=3.3 to 5V, IO=10mA (VO=2.5V)
∆VOLOAD
Unit
typ.
10
Conditions
Load Regulation
*1:
*2:
*3:
*4:
1.078
Conditions
max.
∆VOLINE
Line Regulation
Overcurrent Protection Starting
VO (VADJ)
SI-3033ZD
typ.
V
µA
µA
Set the input voltage to 2.4V or higher when setting the output voltage to 2.0V or lower.
IS1 is specified at the –5% drop point of output voltage VO under the condition of Output Voltage parameter.
Output is OFF when the output control terminal (VC terminal) is open. Each input level is equivalent to LS-TTL level. Therefore, the device can be driven directly by LS-TTLs.
These products cannot be used for the following applications because the built-in foldback-type overcurrent protection may cause errors during start-up stage.
(1) Constant current load (2) Positive and negative power supply (3) Series-connected power supply (4) VO adjustment by raising ground voltage
26
ICs
SI-3000ZD Series
■External Dimensions (TO263-5)
(Unit : mm)
±0.2
10.0
(8.0)
±0.2
1.2
4.5
+0.10
1.3 –0.05
(2×R0.45)
(6.8)
(3°)
±0.3
Pin Assignment
q VC
w VIN
e GND (Common to the rear side of product)
r VO
t Sense
(ADJ for SI-3011ZD)
±0.1
±0.2
(R0.3)
±0.2
4.9
2.54
±0.3
2.0
2.4
(R0.3)
(0.75)
±0.2
15.30
9.2±
±0.3
15.3
±0.15
0.10
(3°)
(3°)
4.9
±0.10
0.88
±0.2
(4.6)
±0.2
±0.2
φ1.5 Dp:
(4.4)
±0.2
3-R0.3
9.2
(15°)
(1.75)
(0.40)
Case temperature
measurement point
0~6°
(0.5)
±0.1
±0.1
0.8
±0.25
)
(1.7
±0.25
(1.7
)
1
2
3
4
9.9
0.8
±0.25
(1.7
)
±0.25
(1.7
)
5
±0.2
(3°)
(3°)
Plastic Mold Package Type
Flammability: UL94V-0
Product Mass: Approx. 1.48g
2-R0.3
10.0
0.1
±0.02
■Block Diagram
SI-3011ZD
VIN
2
4
*
R3
Drive
ON/
OFF
1
TSD
OCP
AMP1
5
-
+
+
REF
R1
+
CIN
VC
CIN: Input capacitor (Approx. 10µF)
CO: Output capacitor (47µF or larger)
The output voltage may oscillate if a low ESR type capacitor
(such as a ceramic capacitor) is used for the output capacitor in
the SI-3000ZD Series.
VO
+
ADJ
CO
-
R2
+
3
GND
SI-3033ZD
VIN
2
4
R1, R2: Output voltage setting resistors
The output voltage can be set by connecting R1 and R2 as shown
at left.
The recommended value for R2 is 10kΩ or 11kΩ.
VO
+
5
CIN
VC
ON/
OFF
1
TSD
OCP
AMP1
-
+
SENSE
+
REF
+
Drive
R1= (VO–VADJ) / (VADJ/R2)
*: Insert R3 in case of setting VO to VO ≤ 1.8V. The recommended
value for R3 is 10kΩ.
CO
+
3
GND
■Reference Data
Copper Laminate Area (on Glass-Epoxy Board) vs.
Thermal Resistance (from Junction to Ambient Temperature) (Typical Value)
Junction to Ambient Temperature
Thermal Resistance θ j-a (°C/W)
55
• A higher heat radiation effect can be achieved by enlarging the copper laminate
area connected to the inner frame to which a monolithic IC is mounted.
• Obtaining the junction temperature
Measure GND terminal temperature TC with a thermocouple, etc. Then substitute
this value in the following formula to obtain the junction temperature.
50
When Using Glass-Epoxy Board of 40 × 40 mm
45
40
Tj=PD×θ j–C+TC
PD= (VIN–VO)•IOUT
35
30
0
200
400
600
800
1000
1200
1400
1600
1800
Copper Laminate Area (mm2)
ICs
27